Computer radiator with dual heat dissipation function
By combining the design of a semiconductor cooling chip and a heatsink, and optimizing the heat dissipation path, the problem of poor heat dissipation performance of existing computer heat sinks in high-temperature environments is solved, achieving a highly efficient dual heat dissipation effect.
Patent Information
- Application Number
- CN202520495971.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-03-20
AI Technical Summary
Existing computer coolers are not effective at dissipating heat in high-temperature environments, especially when hot air is introduced through cooling fans.
By combining a thermoelectric cooler with a cooling fan, the hot and cold ends of the thermoelectric cooler are utilized, and the heat dissipation path is optimized through the combination design of heat dissipation fins and fan blades to improve heat dissipation efficiency and prevent hot air from directly entering the chassis.
It significantly improves heat dissipation efficiency in high-temperature environments, ensures the normal operation of the semiconductor cooling chip, prevents hot air from directly entering the chassis, and enhances the overall heat dissipation effect.
Smart Images
Figure CN223966876U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer heat dissipation technology, specifically a computer heat sink with dual heat dissipation. Background Technology
[0002] In existing technology, cooling is achieved by installing a cooling fan inside the computer case.
[0003] When the ambient temperature is high, the cooling fan sends the warmer air into the computer case, creating an airflow for heat dissipation, but the cooling effect is poor.
[0004] Therefore, we propose a computer heatsink with dual heat dissipation. Utility Model Content
[0005] (a) Technical problems to be solved
[0006] To address the shortcomings of existing technologies, this utility model provides a dual-heat dissipation computer radiator that combines a cooling fan and a semiconductor cooling chip to cool the interior of the computer case, resulting in good cooling performance and effectively solving the problems mentioned in the background technology.
[0007] (II) Technical Solution
[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a computer heat sink with dual heat dissipation, including a rectangular mounting plate. A semiconductor cooling chip is fixedly mounted in the middle of the rectangular mounting plate, with the cooling surface of the semiconductor cooling chip facing down and the heating surface of the semiconductor cooling chip facing up. A second cooling fan is fixedly mounted in the middle of the left and right ends of the upper outer surface of the rectangular mounting plate. A guide frame is fixedly mounted in the lower outer surface of the rectangular mounting plate. A second heat dissipation fin is fixedly mounted in the lower outer surface of the semiconductor cooling chip. A first heat dissipation fin is fixedly mounted in the upper outer surface of the semiconductor cooling chip. A first cooling fan is fixedly mounted in the upper outer surface of the first heat dissipation fin. An exhaust port is opened in the middle of the lower outer surface of the guide frame.
[0009] Preferably, the upper part of the second cooling fan is provided with a cylinder, and the lower outer surface of the cylinder is fixedly connected to the upper outer surface of the rectangular mounting plate, and a filter screen is fixedly installed in the upper part of the inner cavity of the cylinder.
[0010] Preferably, wind deflectors are fixedly installed on the left and right sides of the outer surface of the rectangular mounting plate. There are two sets of wind deflectors, which are located on the left and right sides of the first heat dissipation fins. The two ends of the wind deflectors extend to the outside of the rectangular mounting plate along the longitudinal direction of the rectangular mounting plate.
[0011] Preferably, guide plates are fixedly installed on the left and right sides of the bottom of the inner cavity of the guide frame, and the guide plates are located below the second cooling fan.
[0012] Preferably, the fin plate of the first heat dissipation fin is installed in a direction parallel to the wind deflector.
[0013] Preferably, the fin plate of the second heat dissipation fin is installed in a direction perpendicular to the fin plate of the first heat dissipation fin.
[0014] (III) Beneficial Effects
[0015] Compared with the prior art, this utility model provides a computer heat sink with dual heat dissipation, which has the following beneficial effects:
[0016] 1. This dual-heat dissipation computer cooler improves heat dissipation efficiency by combining a second cooling fan with a semiconductor cooling chip.
[0017] 2. This dual-heat dissipation computer cooler, in order to ensure the normal operation of the semiconductor cooling chip, dissipates heat from the heating surface of the semiconductor cooling chip through heat dissipation fins and a first heat dissipation fan, and uses a baffle plate to block the airflow, preventing the exhaust hot air from directly entering the inside of the chassis through the position of the second heat dissipation fan, thus avoiding a reduction in heat dissipation effect. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of a dual-heat dissipation computer heat sink according to the present invention.
[0019] Figure 2 This is a partial structural diagram of a computer heat sink with dual heat dissipation according to the present invention.
[0020] Figure 3 This is a side cross-sectional view of the airflow guide frame in a dual-heat dissipation computer radiator according to the present invention.
[0021] Figure 4 This is a rendering of a dual-heat dissipation computer cooler of this invention installed on a computer case.
[0022] In the figure: 1. Rectangular mounting plate; 2. Semiconductor cooling chip; 3. First heat dissipation fin; 4. First heat dissipation fan; 5. Guide frame; 6. Cylinder; 7. Filter screen; 8. Second heat dissipation fin; 9. Second heat dissipation fan; 10. Baffle plate; 11. Exhaust port; 12. Guide plate. Detailed Implementation
[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0024] This embodiment is a computer heatsink with dual heat dissipation.
[0025] like Figure 1-4 As shown, the device includes a rectangular mounting plate 1. A thermoelectric cooler 2 is fixedly mounted in the middle of the rectangular mounting plate 1, with the cooling surface of the thermoelectric cooler 2 facing down and the heating surface of the thermoelectric cooler 2 facing up. Second cooling fans 9 are fixedly mounted in the middle of the left and right ends of the upper outer surface of the rectangular mounting plate 1. A flow guide frame 5 is fixedly mounted in the lower outer surface of the rectangular mounting plate 1. A second heat dissipation fin 8 is fixedly mounted in the lower outer surface of the thermoelectric cooler 2. A first heat dissipation fin 3 is fixedly mounted in the upper outer surface of the thermoelectric cooler 2. A first cooling fan 4 is fixedly mounted in the upper outer surface of the first heat dissipation fin 3. An exhaust port 11 is provided in the middle of the lower outer surface of the flow guide frame 5.
[0026] The upper part of the second cooling fan 9 is provided with a cylinder 6, and the lower outer surface of the cylinder 6 is fixedly connected to the upper outer surface of the rectangular mounting plate 1. A filter screen 7 is fixedly installed in the upper part of the inner cavity of the cylinder 6. Two sets of wind baffles 10 are fixedly installed on the left and right sides of the outer surface of the rectangular mounting plate 1. The two sets of wind baffles 10 are located on the left and right sides of the first cooling fin 3, and the two ends of the wind baffles 10 extend along the longitudinal direction of the rectangular mounting plate 1 to the outside of the rectangular mounting plate 1. Two guide plates 12 are fixedly installed on the left and right sides of the bottom of the inner cavity of the guide frame 5, and the guide plates 12 are located below the second cooling fan 9. The fin plate of the first cooling fin 3 is installed in a direction parallel to the wind baffle 10. The fin plate of the second cooling fin 8 is installed in a direction perpendicular to the fin plate of the first cooling fin 3.
[0027] It should be noted that this utility model is a dual-heat dissipation computer cooler. The semiconductor cooling chip 2 is a TEC1-12706 model, which utilizes the Peltier effect to generate hot and cold ends through current. During installation, a slot is cut into the upper part of the computer case, and then the rectangular mounting plate 1 is fixed to the upper part of the case with bolts. The effect is as described in the protective cover. Figure 4As shown, at this time, both the second heat dissipation fin 8 and the guide frame 5 are located in the upper part of the chassis cavity. The second heat dissipation fin 8 is fixed on the cooling surface of the thermoelectric cooler 2, with the cooling surface of the thermoelectric cooler 2 facing downwards. During heat dissipation, through the operation of the second cooling fan 9, external air enters the interior of the guide frame 5 through the position of the second cooling fan 9. Furthermore, the direction of the fin plate installation in the second heat dissipation fin 8 is parallel to the transverse direction of the rectangular mounting plate 1. Therefore, the air flows through the second heat dissipation fin 8 guided by the guide plate 12, and is cooled through the position of the second heat dissipation fin 8. After cooling, it enters the interior of the chassis through the exhaust port 11. To achieve cooling, the second cooling fan 9 is combined with the thermoelectric cooler 2 to improve heat dissipation efficiency. To ensure the normal operation of the thermoelectric cooler 2, a first heat dissipation fin 3 is installed on the upper part of the thermoelectric cooler 2, and a first cooling fan 4 is installed on the upper part of the first heat dissipation fin 3. The first heat dissipation fin 3 and the first cooling fan 4 dissipate heat from the heating surface of the thermoelectric cooler 2. The fin plate of the first heat dissipation fin 3 is installed along the longitudinal direction of the rectangular mounting plate 1, and the wind is blocked by the baffle plate 10 to prevent the exhaust hot air from directly entering the inside of the chassis through the position of the second cooling fan 9, thus avoiding a reduction in the heat dissipation effect.
[0028] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A computer heat sink with dual heat dissipation, comprising a rectangular mounting plate (1), characterized in that: A semiconductor cooling chip (2) is fixedly installed in the middle of the rectangular mounting plate (1), with the cooling surface of the semiconductor cooling chip (2) facing down and the heating surface of the semiconductor cooling chip (2) facing up. A second heat dissipation fan (9) is fixedly installed in the middle of both the left and right ends of the upper outer surface of the rectangular mounting plate (1). A flow guide frame (5) is fixedly installed in the lower outer surface of the rectangular mounting plate (1). A second heat dissipation fin (8) is fixedly installed in the lower outer surface of the semiconductor cooling chip (2). A first heat dissipation fin (3) is fixedly installed in the upper outer surface of the semiconductor cooling chip (2). A first heat dissipation fan (4) is fixedly installed in the upper outer surface of the first heat dissipation fin (3). An exhaust port (11) is opened in the middle of the lower outer surface of the flow guide frame (5).
2. The computer heat sink with dual heat dissipation according to claim 1, characterized in that: The upper part of the second cooling fan (9) is provided with a cylinder (6), and the lower outer surface of the cylinder (6) is fixedly connected to the upper outer surface of the rectangular mounting plate (1). A filter screen (7) is fixedly installed in the upper part of the inner cavity of the cylinder (6).
3. A computer heat sink with dual heat dissipation according to claim 2, characterized in that: Wind deflectors (10) are fixedly installed on the left and right sides of the outer surface of the rectangular mounting plate (1). There are two sets of wind deflectors (10). The two sets of wind deflectors (10) are located on the left and right sides of the first heat dissipation fin (3), and the two ends of the wind deflectors (10) extend along the longitudinal direction of the rectangular mounting plate (1) to the outside of the rectangular mounting plate (1).
4. A computer heat sink with dual heat dissipation according to claim 3, characterized in that: The guide plate (12) is fixedly installed on the left and right sides of the bottom of the inner cavity of the guide frame (5), and the guide plate (12) is located below the second heat dissipation fan (9).
5. A computer heat sink with dual heat dissipation according to claim 4, characterized in that: The direction in which the fin plate of the first heat dissipation fin (3) is installed is parallel to that of the baffle plate (10).
6. A computer heat sink with dual heat dissipation according to claim 5, characterized in that: The direction in which the fin plate of the second heat dissipation fin (8) is installed is perpendicular to the direction in which the fin plate of the first heat dissipation fin (3) is installed.