Duplexer compatible circuit, bonding pad, printed circuit board and electronic equipment

Abstract

The utility model discloses a duplexer compatible circuit, a bonding pad, a printed circuit board and electronic equipment, and belongs to the technical field of power electronics. The duplexer compatible circuit comprises a first duplexer, a second duplexer and a matching circuit, the packaging size of the first duplexer is different from that of the second duplexer, and a common end antenna interface of the first duplexer and a common end antenna interface of the second duplexer are electrically connected with the first end of the matching circuit. The transmitting output end of the first duplexer and the transmitting output end of the second duplexer are electrically connected with the second end of the matching circuit, and the receiving input end of the first duplexer and the receiving input end of the second duplexer are electrically connected with the third end of the matching circuit. According to the invention, the duplexers of different sizes are stacked in the same circuit, so that the printed circuit board obtained through the packaging design of the circuit can be compatible with the duplexers of different packaging sizes, the problem of incapability of adaption or compatibility is not caused, and the problem that the production efficiency is affected by insufficient material supply is solved.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to duplexer compatible circuits, pads, printed circuit boards and electronic equipment. Background Technology

[0002] Because different types of duplexers have different package sizes, if different types of duplexer packages are replaced during the production process, it will lead to incompatibility or other problems, and may also cause insufficient material supply, affecting production efficiency. Utility Model Content

[0003] The main purpose of this application is to provide a duplexer-compatible circuit, pads, printed circuit board, and electronic device, aiming to solve the technical problem of how to be compatible with different duplexer package sizes.

[0004] To achieve the above objectives, this application provides a duplexer compatible circuit, which includes: a first duplexer, a second duplexer, and a matching circuit. The first duplexer and the second duplexer have different package sizes. The common antenna interface of the first duplexer and the common antenna interface of the second duplexer are electrically connected to a first terminal of the matching circuit. The transmit output terminal of the first duplexer and the transmit output terminal of the second duplexer are electrically connected to a second terminal of the matching circuit. The receive input terminal of the first duplexer and the receive input terminal of the second duplexer are electrically connected to a third terminal of the matching circuit.

[0005] In one embodiment, the matching circuit includes:

[0006] The first π-type matching unit is electrically connected to the common end antenna interface of the first duplexer and the common end antenna interface of the second duplexer.

[0007] The second π-type matching unit is electrically connected to the transmit output terminal of the first duplexer and the transmit output terminal of the second duplexer.

[0008] In addition, to achieve the above objectives, this application also provides a duplexer compatible pad for mounting duplexer compatible circuits as described above. The duplexer compatible pad includes a compatible mounting area for mounting the first duplexer and / or the second duplexer. The area of ​​the compatible mounting area is greater than or equal to the area of ​​the larger package size of the first duplexer and the second duplexer.

[0009] In one embodiment, the duplexer compatible pad includes a first package pad and a second package pad. The first package pad is used for mounting the first duplexer, and the second package pad is used for mounting the second duplexer. The first package pad and the second package pad are stacked in the compatible pad area.

[0010] In one embodiment, the first package pad and the second package pad have the same reference coordinate origin and the same coordinate position in the printed circuit board layout.

[0011] In one embodiment, the pad types of the first package pad include a first left column pad, a first right column pad, a first antenna pad, and a first ground pad, and the pad types of the second package pad include a second left column pad, a second right column pad, a second antenna pad, and a second ground pad. The pad types and the number of pads of the first package pad and the second package pad correspond to each other.

[0012] In one embodiment, the package size of the first left column pad, the first right column pad, the first antenna pad, and the first ground pad is larger than the package size of the second left column pad, the second right column pad, the second antenna pad, and the second ground pad, respectively.

[0013] In one embodiment, the x-coordinate of the right edge of the first left column pad is the same as the x-coordinate of the right edge of the second left column pad;

[0014] The x-coordinate of the left edge of the first right column pad is the same as the x-coordinate of the left edge of the second right column pad;

[0015] The top left sub-pad in the first left column of pads, the first antenna pad, the top right sub-pad in the first right column of pads, the top left sub-pad in the second left column of pads, the second antenna pad, and the top right sub-pad in the second right column of pads have the same vertical coordinate at their bottom edges;

[0016] The top edges of the lower left sub-pad in the first left column of pads, the lower right sub-pad in the first right column of pads, the lower left sub-pad in the second left column of pads, and the lower right sub-pad in the second right column of pads have the same vertical coordinate.

[0017] Furthermore, to achieve the above objectives, this application also provides a printed circuit board, which includes a circuit board body and duplexer-compatible pads as described above disposed on the circuit board body.

[0018] In addition, to achieve the above objectives, this application also provides an electronic device, which includes the duplexer-compatible circuit described above.

[0019] This application discloses a duplexer compatible circuit, pads, printed circuit board, and electronic device. The duplexer compatible circuit includes a first duplexer, a second duplexer, and a matching circuit. The first and second duplexers have different package sizes. The common antenna interface of the first and second duplexers is electrically connected to a first terminal of the matching circuit. The transmit output terminals of the first and second duplexers are electrically connected to a second terminal of the matching circuit. The receive input terminals of the first and second duplexers are electrically connected to a third terminal of the matching circuit. By stacking duplexers of different sizes in the same circuit, this application enables the printed circuit board designed using this circuit to be compatible with duplexers of different package sizes. In the event of different types of duplexer package replacements during production, it avoids incompatibility issues and overcomes the problem of insufficient material supply affecting production efficiency. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a duplexer compatible circuit provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the structure of a duplexer compatible pad provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of the first package pad in a duplexer compatible pad provided in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of the second package pad in a duplexer compatible pad provided in an embodiment of this application;

[0025] Figure 5 This is a detailed layout diagram of a duplexer compatible pad provided in an embodiment of this application.

[0026] Explanation of icon numbers:

[0027] 100, First duplexer; 200, Second duplexer; 300, Matching circuit; ANT, Common antenna interface; TX, Transmit output; RX, Receive input; 10, First package pad; 20, Second package pad; 11, First left column pad; 12, First right column pad; 13, First antenna pad; 14, First ground pad; 21, Second left column pad; 22, Second right column pad; 23, Second antenna pad; 24, Second ground pad.

[0028] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0030] As electronic devices become more functional and integrated, they are trending towards miniaturization and thinner designs. Consequently, the semiconductor devices used in these devices are also becoming smaller. The advantages of miniaturization are twofold: firstly, it allows for the inclusion of products within limited space on a PCB (Printed Circuit Board); secondly, smaller size allows for the use of fewer wafers, thus reducing costs.

[0031] Currently, the main package types for duplexers include the 1814 package (device dimensions 1.8mm x 1.4mm), the 1612 package (device dimensions 1.6mm x 1.2mm), and the upcoming 1411 package (device dimensions 1.4mm x 1.1mm). Among them, the 1612 package is currently the mainstream duplexer package, while the 1814 package is gradually being abandoned by various manufacturers. With the development trend of new products, major duplexer companies are also launching new duplexer products in the 1411 package size.

[0032] Currently, the mainstream duplexer package size is 1612, which differs from the future mainstream duplexer package size, 1411. If the current mainstream 1612 package is still used for duplexer packaging in the production process, it will lead to problems in adapting to technological development. In severe cases, it may cause production to stop as soon as mass production begins, resulting in project board modification and project delays. However, 1411 packaged devices are expensive and have limited material availability. If quality problems occur, it is not easy to find other devices to replace them. Therefore, it is not advisable to adopt the future mainstream package size for packaging in advance.

[0033] Based on this, this application proposes a duplexer compatible circuit, pads, printed circuit board, and electronic device. The duplexer compatible circuit includes a first duplexer, a second duplexer, and a matching circuit. The first and second duplexers have different package sizes. The common antenna interface of the first and second duplexers is electrically connected to the first terminal of the matching circuit. The transmit output terminal of the first and second duplexers is electrically connected to the second terminal of the matching circuit. The receive input terminal of the first and second duplexers is electrically connected to the third terminal of the matching circuit. By stacking duplexers of different sizes in the same circuit, this application enables the printed circuit board designed using this circuit to be compatible with duplexers of different package sizes. This satisfies current needs and adapts to technological development trends, avoiding the risk of insufficient material supply affecting production efficiency.

[0034] The duplexer compatible circuit, pads, printed circuit board, and electronic equipment provided in this application are specifically described through the following embodiments. First, the duplexer compatible circuit is described.

[0035] This application provides a duplexer compatible circuit, referring to... Figure 1 , Figure 1 This is a schematic diagram of a duplexer compatible circuit provided in an embodiment of this application. The duplexer compatible circuit includes:

[0036] The first duplexer 100, the second duplexer 200, and the matching circuit 300 have different package sizes. The common antenna interface ANT of the first duplexer 100 and the common antenna interface ANT of the second duplexer 200 are electrically connected to the first terminal of the matching circuit 300. The transmit output terminal TX of the first duplexer 100 and the transmit output terminal TX of the second duplexer 200 are electrically connected to the second terminal of the matching circuit 300. The receive input terminal RX of the first duplexer 100 and the receive input terminal RX of the second duplexer 200 are electrically connected to the third terminal of the matching circuit 300.

[0037] In this embodiment, the design of the duplexer compatible circuit can be implemented when drawing the PCB schematic. Specifically, during the schematic design stage, the first duplexer 100 and the second duplexer 200 with different package sizes are designed into the same path, so that the common antenna interface ANT, the transmit output terminal TX, and the receive input terminal RX of the two duplexers are connected together. This allows the circuit to be compatible with duplexers of different package sizes. The matching circuit 300 may include electrical components such as inductors and capacitors. Its first, second, and third terminals are different, indicating that the connection positions of the common antenna interface ANT, the transmit output terminal TX, and the receive input terminal RX of the duplexer are different. The specific implementation of the matching circuit 300 can be flexibly adjusted according to actual needs, and this embodiment does not limit it.

[0038] As an example, in this embodiment, the package size of the first duplexer 100 can be 1612, and the package size of the second duplexer 200 can be 1411.

[0039] In this embodiment, by designing a duplexer compatible circuit that is compatible with both 1612 and 1411 packages, it is possible to select products and devices with long lifecycles for iteration. For example, a lower-cost 1612 package duplexer can be used in the early stages of a product development. Once the 1411 package becomes mainstream, the 1612 package can be replaced with a 1411 package duplexer to ensure supply, making the use of packaging materials more flexible. At the same time, this embodiment can also avoid the risk of project board modification due to the discontinuation of a certain type of packaged device. In addition, if the 1411 packaged device is found to have problems, it can be replaced with a more mature 1612 package duplexer for verification and debugging. The project's material supply is more guaranteed, and reliable and lower-cost materials can be selected for duplexer packaging, which can also avoid the risk of project board modification and enhance the project's compatibility with packaging materials.

[0040] In some feasible embodiments, the matching circuit 300 described above may include:

[0041] The first π-type matching unit is electrically connected to the common end antenna interface of the first duplexer and the common end antenna interface of the second duplexer.

[0042] The second π-type matching unit is electrically connected to the transmit output terminal of the first duplexer and the transmit output terminal of the second duplexer.

[0043] In this embodiment, both the first π-type matching unit and the second π-type matching unit can be implemented by combining inductor and capacitor elements, or they can be implemented by using only inductor elements. This embodiment does not limit this.

[0044] Furthermore, this application embodiment also provides a duplexer compatible pad for mounting duplexer compatible circuits proposed in the above embodiments. The duplexer compatible pad includes a compatible mounting area for mounting a first duplexer 100 and / or a second duplexer 200. The area of ​​the compatible mounting area is greater than or equal to the area of ​​the larger package size of the first duplexer 100 and the second duplexer 200.

[0045] In this embodiment, based on the schematic diagram of the duplexer compatible circuit provided in the above embodiment, the netlist can be exported to a PCB file. The PCB file can be used to realize the PCB layout and routing of related components. The duplexer compatible pad provided in this embodiment can be obtained based on the PCB file. In order to be compatible with the first duplexer 100 and the second duplexer 200 with different package sizes, the area of ​​the compatible surface mount area of ​​the duplexer compatible pad needs to meet the requirement that the larger package size of the first duplexer 100 and the second duplexer 200 can be surface mounted normally. Therefore, the area of ​​the compatible surface mount area can be set according to the area of ​​the larger package size of the two to meet the above conditions.

[0046] Reference Figure 2 In some feasible embodiments, the duplexer compatible pad includes a first package pad 10 and a second package pad 20. The first package pad 10 is used for mounting a first duplexer 100, and the second package pad 20 is used for mounting a second duplexer 200. The first package pad 10 and the second package pad 20 are stacked in the compatible pad area.

[0047] In this embodiment, by Figure 2 As can be seen, the duplexer compatible pad includes package pads corresponding to two package sizes. Taking the first duplexer 100 using a 1612 package and the second duplexer 200 using a 1411 package as an example, the duplexer compatible pad can support the surface mount of the first duplexer 100 using a 1612 package based on the first package pad 10, and can also support the surface mount of the second duplexer 200 using a 1411 package based on the second package pad 20. This makes the use of materials more flexible. For electronic products with long life cycle, it can avoid the risk of board modification due to material discontinuation. In practical applications, the optimal material can be flexibly selected according to the cost, performance, quality and supply stability of the device. It can use a wider range of materials and avoid the risk caused by insufficient material supply due to large project shipment volume. At the same time, it can better balance performance and cost.

[0048] In some feasible embodiments, the first package pad 10 and the second package pad 20 have the same reference coordinate origin and the same coordinate position in the printed circuit board layout.

[0049] In this embodiment, when designing the package pads for two duplexers with different package sizes, the reference coordinate origin (0,0) of both must be set to be consistent. Otherwise, it will be inconvenient to align the positions of the different package pads in the compatible surface mount area during PCB layout. That is, the center of symmetry of the first package pad 10 and the center of symmetry of the second package pad 20 are both the center of symmetry of the compatible surface mount area. When laying out components on the PCB, setting the coordinate positions of the first package pad 10 and the second package pad 20 to be the same can ensure that the device package center values ​​of duplexers with different package sizes are the same. Even if the duplexer is replaced for surface mount, it will not affect the surface mount production line.

[0050] For ease of understanding and explanation, in the accompanying drawings corresponding to this embodiment and subsequent embodiments, the horizontal distance of each rectangle represents the length, and the vertical distance represents the width.

[0051] In this embodiment, when the package size of the first duplexer 100 is 1612 and the package size of the second duplexer 200 is 1411, the area of ​​the compatible surface mount area can be the same as the package size of the first duplexer 100, which is 1.6mm * 1.2mm = 1.92mm². At the same time, in order to be compatible with the two duplexers with different package sizes for surface mount, the duplexer compatible pads include a first package pad 10 (1600um in length and 1200um in width) corresponding to the 1612 package and a second package pad 20 (1400um in length and 1100um in width) corresponding to the 1411 package.

[0052] Reference Figure 3 In some feasible embodiments, the pad type of the first package pad 10 may include: a first left column pad 11, a first right column pad 12, a first antenna pad 13 and a first ground pad 14, wherein the first left column pad 11 and the first right column pad 12 each include a plurality of sub-pads;

[0053] The lengths of the first left column pad 11, the first right column pad 12, the first antenna pad 13, and the first ground pad 14 are 370µm. The widths of the sub-pads of the first left column pad 11, the sub-pads of the first right column pad 12, and the first antenna pad 13 are 260µm. The width of the first ground pad 14 is 710µm.

[0054] The distance between the left edge of the first left column pad 11 and the left edge of the compatible patch area is 20µm; the distance between the right edge of the first left column pad 11 and the left edge of the first antenna pad 13 and the first ground pad 14 is 225µm; the distance between the top edge of the first left column pad 11 and the top edge of the compatible patch area is 20µm; and the distance between the bottom edge of the first left column pad 11 and the bottom edge of the compatible patch area is 20µm.

[0055] The distance between the right edge of the first right column pad 12 and the right edge of the compatible patch area is 20µm; the distance between the left edge of the first right column pad 12 and the right edge of the first antenna pad 13 and the first ground pad 14 is 225µm; the distance between the top edge of the first right column pad 12 and the top edge of the compatible patch area is 20µm; and the distance between the bottom edge of the first right column pad 12 and the bottom edge of the compatible patch area is 20µm.

[0056] The distance between the top edge of the first antenna pad 13 and the top edge of the compatible patch area is 20µm, and the distance between the bottom edge of the first antenna pad 13 and the top edge of the first ground pad 14 is 190µm.

[0057] The distance between the first ground pad 14 and the bottom edge of the compatible surface mount area is 20µm.

[0058] In this embodiment, the first left column pad 11 and the first right column pad 12 each include three sub-pads. The spacing between the three sub-pads in the same column is 190um, which is the same as the distance between the bottom edge of the first antenna pad 13 and the top edge of the first ground pad 14. The bottom sub-pads of the first left column pad 11 and the first right column pad 12 are used to solder the transmit output terminal TX and the receive input terminal RX of the first duplexer 100, respectively. The first antenna pad 13 is used to solder the common antenna interface ANT of the first duplexer 100, and the first ground pad 14 is used to isolate the signal.

[0059] Reference Figure 4 In some feasible embodiments, the pad type of the second package pad 20 may include: a second left column pad 21, a second right column pad 22, a second antenna pad 23, and a second ground pad 24, wherein the second left column pad 21 and the second right column pad 22 each include a plurality of sub-pads;

[0060] The lengths of the second left column pad 21, the second right column pad 22, the second antenna pad 23, and the second ground pad 24 are 240µm. The widths of the sub-pads of the second left column pad 21, the sub-pads of the second right column pad 22, and the second antenna pad 23 are 180µm. The width of the second ground pad 24 is 590µm.

[0061] The distance between the left edge of the second left column pad 21 and the left edge of the compatible patch area is 150um; the distance between the right edge of the second left column pad 21 and the left edge of the second antenna pad 23 and the second ground pad 24 is 290um; the distance between the top edge of the second left column pad 21 and the top edge of the compatible patch area is 100um; and the distance between the bottom edge of the second left column pad 21 and the bottom edge of the compatible patch area is 100um.

[0062] The distance between the right edge of the second right column pad 22 and the right edge of the compatible patch area is 150um; the distance between the left edge of the second right column pad 22 and the right edge of the second antenna pad 23 and the second ground pad 24 is 290um; the distance between the top edge of the second right column pad 22 and the top edge of the compatible patch area is 100um; and the distance between the bottom edge of the second right column pad 22 and the bottom edge of the compatible patch area is 100um.

[0063] The distance between the top edge of the second antenna pad 23 and the top edge of the compatible patch area is 100um, and the distance between the bottom edge of the second antenna pad 23 and the top edge of the second ground pad 24 is 230um.

[0064] The distance between the second ground pad 24 and the bottom edge of the compatible patch area is 100um.

[0065] In this embodiment, the second left column pad 21 and the second right column pad 22 each include three sub-pads. The spacing between the three sub-pads in the same column is 230µm, which is the same as the distance between the bottom edge of the second antenna pad 23 and the top edge of the second ground pad 24. The bottom pads in the second left column pad 21 and the second right column pad 22 are used to solder the transmit output terminal TX and the receive input terminal RX of the second duplexer 200, respectively. The second antenna pad 23 is used to solder the common antenna interface ANT of the second duplexer 200. The second ground pad 24 is used to isolate the signal.

[0066] based on Figure 3 and Figure 4 As can be seen, in this embodiment, the pad types and number of the first and second package pads correspond to each other, and the package sizes of the first left column pad 11, the first right column pad 12, the first antenna pad 13 and the first ground pad 14 are larger than the package sizes of the second left column pad 21, the second right column pad 22, the second antenna pad 23 and the second ground pad 24, respectively.

[0067] Reference Figure 5 In some feasible embodiments, the abscissa of the right edge of the first left column pad 11 is the same as the abscissa of the right edge of the second left column pad 21.

[0068] The x-coordinate of the left edge of the first right column pad 12 is the same as the x-coordinate of the left edge of the second right column pad 22;

[0069] The top left sub-pad in the first left column pad 11, the first antenna pad 13, the top right sub-pad in the first right column pad 12, the top left sub-pad in the second left column pad 21, the second antenna pad 23, and the top right sub-pad in the second right column pad 22 have the same bottom edge ordinate.

[0070] The top edges of the lower left sub-pad in the first left column pad 11, the lower right sub-pad in the first right column pad 12, the lower left sub-pad in the second left column pad 21, and the lower right sub-pad in the second right column pad 22 have the same vertical coordinate.

[0071] Depend on Figure 5 As can be seen, this embodiment provides a specific example of mapping the pad types of the first package pad 10 and the second package pad 20 to the compatible surface mount area. Based on this duplexer compatible pad, the production process can be compatible with first duplexers and second duplexers of different package sizes, which can not only adapt to technological development, but also avoid the problem of insufficient material supply affecting production efficiency.

[0072] Since the duplexer compatible pad proposed in this embodiment includes the duplexer compatible circuit proposed in the above embodiments, it has the beneficial effects of the above embodiments. For details on the circuit design and working principle of the duplexer compatible circuit, please refer to the duplexer compatible circuits provided in the above embodiments. They will not be described in detail here, and all are within the protection scope of this embodiment.

[0073] Furthermore, this application also provides a printed circuit board, which includes a circuit board body and duplexer compatible pads provided in the above embodiments disposed on the circuit board body.

[0074] Since the printed circuit board proposed in this embodiment includes the duplexer compatible pads proposed in the above embodiments, it has the beneficial effects of the above embodiments. For details on the specific layout design and principle of the duplexer compatible pads, please refer to the duplexer compatible pads provided in the above embodiments. They will not be described in detail here, and all are within the protection scope of this embodiment.

[0075] In addition, this application also provides an electronic device, which includes the printed circuit board provided in the above embodiments.

[0076] Since the electronic device proposed in this embodiment includes the printed circuit board proposed in the above embodiments, it has the beneficial effects of the above embodiments. For details on the specific working process and principle of the printed circuit board, please refer to the printed circuit boards provided in the above embodiments. They will not be repeated here, and all are within the protection scope of this embodiment.

[0077] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0078] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B.

[0079] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0080] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0081] It should be noted that the technical solutions of the various embodiments of this application can be combined with each other, but only if they are implemented by those skilled in the art. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this application.

[0082] The above are merely optional embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A duplexer compatible circuit, characterized in that, The duplexer compatible circuit includes: a first duplexer, a second duplexer, and a matching circuit. The first duplexer and the second duplexer have different package sizes. The common antenna interface of the first duplexer and the common antenna interface of the second duplexer are electrically connected to the first terminal of the matching circuit. The transmit output terminal of the first duplexer and the transmit output terminal of the second duplexer are electrically connected to the second terminal of the matching circuit. The receive input terminal of the first duplexer and the receive input terminal of the second duplexer are electrically connected to the third terminal of the matching circuit.

2. The duplexer compatible circuit as described in claim 1, characterized in that, The matching circuit includes: The first π-type matching unit is electrically connected to the common end antenna interface of the first duplexer and the common end antenna interface of the second duplexer. The second π-type matching unit is electrically connected to the transmit output terminal of the first duplexer and the transmit output terminal of the second duplexer.

3. A duplexer compatible pad, characterized in that, The duplexer compatible pad is used for mounting the duplexer compatible circuit according to claim 1 or 2. The duplexer compatible pad includes a compatible mounting area for mounting the first duplexer and / or the second duplexer. The area of ​​the compatible mounting area is greater than or equal to the area of ​​the larger package size of the first duplexer and the second duplexer.

4. The duplexer compatible pad as described in claim 3, characterized in that, The duplexer compatible pad includes a first package pad and a second package pad. The first package pad is used for mounting the first duplexer, and the second package pad is used for mounting the second duplexer. The first package pad and the second package pad are stacked in the compatible mounting area.

5. The duplexer compatible pad as described in claim 4, characterized in that, The first package pad and the second package pad have the same reference coordinate origin and the same coordinate position in the printed circuit board layout.

6. The duplexer compatible pad as described in claim 5, characterized in that, The first package pads include a first left column pad, a first right column pad, a first antenna pad, and a first ground pad. The second package pads include a second left column pad, a second right column pad, a second antenna pad, and a second ground pad. The pad types and numbers of the first and second package pads correspond to each other.

7. The duplexer compatible pad as described in claim 6, characterized in that, The package sizes of the first left column pad, the first right column pad, the first antenna pad, and the first ground pad are respectively larger than the package sizes of the second left column pad, the second right column pad, the second antenna pad, and the second ground pad.

8. The duplexer compatible pad as described in claim 7, characterized in that, The x-coordinate of the right edge of the first left column pad is the same as the x-coordinate of the right edge of the second left column pad; The x-coordinate of the left edge of the first right column pad is the same as the x-coordinate of the left edge of the second right column pad; The top left sub-pad in the first left column of pads, the first antenna pad, the top right sub-pad in the first right column of pads, the top left sub-pad in the second left column of pads, the second antenna pad, and the top right sub-pad in the second right column of pads have the same vertical coordinate at their bottom edges; The top edges of the lower left sub-pad in the first left column of pads, the lower right sub-pad in the first right column of pads, the lower left sub-pad in the second left column of pads, and the lower right sub-pad in the second right column of pads have the same vertical coordinate.

9. A printed circuit board, characterized in that, The printed circuit board includes a circuit board body and duplexer compatible pads disposed on the circuit board body as described in any one of claims 3 to 8.

10. An electronic device, characterized in that, The electronic device includes the printed circuit board as described in claim 9.

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