Precise forming die for high-speed connector

Abstract

The utility model discloses a precision forming die for a high-speed connector. The precision forming die comprises a die frame and an inner die assembly, the mold frame comprises a lower mold base, an upper mold base and an ejection mechanism, a lower concave cavity is concavely formed in the top surface of the lower mold base, the upper mold base is arranged right above the lower mold base in a manner of moving up and down, and an upper concave cavity is concavely formed in the bottom surface of the upper mold base; the inner die assembly comprises a lower die unit and an upper die unit; the lower heat insulation plate, the lower heating plate, the upper heat insulation plate and the upper heating plate are arranged in a matched mode, in the injection molding process, the lower heating plate and the upper heating plate are powered on and independently controlled, and the heat insulation effect of the lower heat insulation plate and the upper heat insulation plate is matched, so that the temperature of a cavity area is relatively balanced, and the temperature difference can be controlled within 2 DEG C; the temperature difference is avoided, so that the successive shrinkage of different parts of the plastic part caused by the temperature difference is avoided, the quality of the molded plastic part is effectively improved, the precise molding of a high-speed connector is further realized, the air tightness yield of a product is improved to 98% from the original 60%, and the product yield is greatly improved.

Description

Technical Field

[0001] This utility model relates to the technology of connector manufacturing, and in particular to a precision molding mold for high-speed connectors. Background Technology

[0002] "Lightweight Active" technology, proposed by Luxshare Precision Industry Co., Ltd. in Dongguan, primarily relies on the analysis of high-speed bare wire databases and photoelectric conversion technology. This technology employs "lightweight processing" techniques such as beamforming, time reconstruction, and direct chip drive to effectively restore signal quality in high-speed transmission links. Its aim is to reduce power consumption, extend transmission distance, and lower costs, providing comprehensive world-class interconnect technology solutions for data centers, wireless communication base stations, servers, switches, routers, and other electronic information and communication (ICT) applications.

[0003] As an innovation in the transmission link of the communication and network technology field, "lightweight active" technology redefines the interactive architecture of high-speed interconnection and continuously breaks through the technical barriers of "high speed" and "low power consumption". It helps the ICT industry achieve "light energy consumption", "light cost" and "light load", demonstrating huge industrialization potential. In the context of high-density data center layout, the lightweight active series of products significantly improves the application range of copper cables and expands the application scenarios of active copper cables through the upgrade of balanced amplification, retiming and digital signal processing technology of active chips. At the same time, the "lightweight active" technology concept optimizes passive copper cables to a finer wire diameter and a smaller bending radius, simplifying data center cabling work, greatly reducing system power consumption and cost, and ultimately achieving "light" load and "light" cost for the system.

[0004] High-speed connectors are one of the most common types of lightweight active products. Their main structure includes terminals and a plastic component molded and fixed together with the terminals. The molding of these high-speed connectors requires injection molds. During manufacturing, terminal strips are placed into the injection mold, and then molten plastic is injected to form the plastic component. In existing technology, the injection molds used for molding high-speed connectors cannot achieve uniform temperature control, resulting in a 20-30°C temperature difference between the upper and lower molds. This causes different parts of the plastic component in the high-speed connector to shrink sequentially, leading to significant molding quality issues and low product precision. Therefore, it is necessary to improve the current injection molds. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a high-speed connector precision molding mold that can effectively solve the problem of poor product molding quality caused by the inability of existing injection molds to achieve uniform temperature control.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A precision molding die for a high-speed connector includes a mold frame and an inner mold assembly;

[0008] The mold base includes a lower mold base, an upper mold base, and an ejector mechanism. The top surface of the lower mold base has a recessed cavity. The upper mold base is movably positioned directly above the lower mold base. The bottom surface of the upper mold base has a recessed cavity. A hot runner is provided inside the upper mold base. A sprue is provided at the center of the top surface of the upper mold base, and the sprue communicates with the hot runner. The ejector mechanism is located inside the lower mold base and has multiple ejector pins that can move up and down and extend into the recessed cavity.

[0009] The inner mold assembly includes a lower mold unit and an upper mold unit. The lower mold unit is detachably disposed in the lower cavity and includes a lower heat insulation plate, a lower heating plate, and a lower forming plate. The lower heating plate is stacked and fixed on the upper surface of the lower heat insulation plate, and the lower forming plate is stacked and fixed on the upper surface of the lower heating plate. The upper mold unit is detachably disposed in the upper cavity. The upper mold unit moves up and down with the upper mold base and can be closed or opened with the lower mold unit. The upper mold unit includes an upper heat insulation plate, an upper heating plate, and an upper forming plate. The upper heating plate is stacked and fixed on the lower surface of the upper heat insulation plate, and the upper forming plate is stacked and fixed on the lower surface of the upper heating plate. The lower surface of the upper forming plate and the upper surface of the lower forming plate form a cavity adapted to the high-speed connector. The hot runner communicates with the cavity, and the ejector pin extends into the cavity from bottom to top.

[0010] As a preferred embodiment, the lower heating plate includes a lower plate component, the upper and lower surfaces of which are recessed with lower conformal grooves, and each lower conformal heating tube is embedded in the lower conformal groove to achieve better uniform heating.

[0011] As a preferred embodiment, the upper heating plate includes an upper plate component, the upper and lower surfaces of which are recessed with upper conformal grooves, and each upper conformal heating tube is embedded in the upper conformal groove to achieve better uniform heating.

[0012] As a preferred embodiment, a junction box is fixed on the outer side of the mold frame. Both the lower heating plate and the upper heating plate are electrically connected to the junction box. The junction box controls the lower heating plate and the upper heating plate separately to better ensure a relatively uniform temperature in the cavity area.

[0013] As a preferred embodiment, the outer side of the lower forming plate is provided with a lower fixing part protruding outward, which is fixedly connected to the lower mold base by bolts, so as to make the disassembly and assembly of the lower mold unit easier.

[0014] As a preferred embodiment, the outer side of the upper forming plate is provided with an upper fixing part that protrudes outward. The upper fixing part is fixedly connected to the upper mold base by bolts, so as to make the disassembly and assembly of the lower mold unit easier.

[0015] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0016] By coordinating the lower heat insulation plate, lower heating plate, upper heat insulation plate, and upper heating plate, during the injection molding process, the lower and upper heating plates are energized and individually controlled. Combined with the heat insulation effect of the lower and upper heat insulation plates, this ensures a relatively uniform temperature in the cavity area, with the temperature difference controlled within 2°C. This prevents temperature variations that could cause different parts of the plastic part to shrink sequentially, effectively improving the quality of the molded plastic part. This, in turn, enables precision molding of high-speed connectors, increasing the product airtightness yield from 60% to 98%, significantly improving overall product yield. Furthermore, the lower and upper mold units are detachably located in the lower and upper recesses, respectively, allowing for the replacement of different inner mold components according to the needs of different products. This enables mold base sharing, bringing convenience to production operations.

[0017] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0018] Figure 1 This is a perspective view of a preferred embodiment of the present utility model;

[0019] Figure 2 This is a perspective view of another preferred embodiment of the present invention;

[0020] Figure 3 This is a cross-sectional schematic diagram of a preferred embodiment of the present invention;

[0021] Figure 4 This is an enlarged schematic diagram of the inner mold assembly in a preferred embodiment of the present invention;

[0022] Figure 5 This is an exploded view of the inner mold assembly in a preferred embodiment of the present invention;

[0023] Figure 6 This is a cross-sectional schematic diagram of the inner mold assembly in a preferred embodiment of the present invention.

[0024] Explanation of reference numerals in the attached diagram:

[0025] 10. Mold frame 11. Lower mold base

[0026] 12. Upper mold base 13. Ejection mechanism

[0027] 131. Top plate; 132. Ejector pin

[0028] 14. Junction box 101, recessed cavity

[0029] 102. Upper concave cavity; 103. Hot runner.

[0030] 104. Sprue 20. Inner mold assembly

[0031] 21. Lower mold unit 211. Lower heat insulation plate

[0032] 212. Lower heating plate 2121. Lower plate

[0033] 213. Lower forming plate; 2131. Lower fixing part

[0034] 22. Upper mold unit; 221. Upper heat insulation plate

[0035] 222. Upper heating plate 2221. Upper plate

[0036] 223. Upper forming plate; 2231. Upper fixing part

[0037] 201. Cavity; 202. Lower conforming groove

[0038] 203, Upper conformal groove 30, High-speed connector

[0039] 31. Terminal strip; 32. Plastic parts. Detailed Implementation

[0040] Please refer to Figures 1 to 6 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a mold frame 10 and an inner mold assembly 20.

[0041] The mold base 10 includes a lower mold base 11, an upper mold base 12, and an ejection mechanism 13. The lower mold base 11 has a recessed lower cavity 101 on its top surface. The upper mold base 12 is movably positioned directly above the lower mold base 11, and its bottom surface has a recessed upper cavity 102. The upper cavity 102 and the lower cavity 101 are vertically aligned and connected. A hot runner 103 is provided inside the upper mold base 12, and a sprue 104 is located at the center of its top surface, communicating with the hot runner 103. The ejection mechanism 13 is located inside the lower mold base 11 and includes a top plate 131 and multiple vertically movable ejector pins 132. The ejector pins 132 are driven by the top plate 131 to move vertically and extend into the lower cavity 102. In this embodiment, a junction box 14 is fixed to the outer surface of the mold base 10.

[0042] The inner mold assembly 20 includes a lower mold unit 21 and an upper mold unit 22. The lower mold unit 21 is detachably disposed in the lower cavity 101 and includes a lower heat insulation plate 211, a lower heating plate 212, and a lower forming plate 213. The lower heating plate 212 is stacked and fixed on the upper surface of the lower heat insulation plate 211, and the lower forming plate 213 is stacked and fixed on the upper surface of the lower heating plate 212. The upper mold unit 22 is detachably disposed in the upper cavity 102 and moves up and down with the upper mold base 12 relative to the lower mold unit 21. The upper mold unit 22, which can be configured to be either closed or open, includes an upper heat insulation plate 221, an upper heating plate 222, and an upper molding plate 223. The upper heating plate 222 is stacked and fixed to the lower surface of the upper heat insulation plate 221, and the upper molding plate 223 is stacked and fixed to the lower surface of the upper heating plate 222. The lower surface of the upper molding plate 223 and the upper surface of the lower molding plate 213 together form a cavity 201 adapted to the high-speed connector 30. The hot runner 103 communicates with the cavity 201, and the ejector pin 132 extends into the cavity 201 from bottom to top. Furthermore, there are at least two cavities 201, and each cavity 201 is provided with a hot runner 103 to achieve rapid injection molding.

[0043] In this embodiment, the lower heating plate 212 includes a lower plate 2121, the upper and lower surfaces of which are recessed with lower conformal grooves 202. Each lower conformal groove 202 is embedded with a lower conformal heating tube (not shown in the figure) to achieve better uniform heating. The upper heating plate 222 includes an upper plate 2221, the upper and lower surfaces of which are recessed with upper conformal grooves 203. Each upper conformal groove 203 is embedded with an upper conformal heating tube (not shown in the figure) to achieve better uniform heating. Furthermore, both the lower heating plate 212 and the upper heating plate 222 are electrically connected to the junction box 14. The junction box 14 controls the lower heating plate 212 and the upper heating plate 222 separately to better ensure a relatively uniform temperature in the cavity 201 area.

[0044] Furthermore, the outer side of the lower forming plate 213 protrudes outward with a lower fixing part 2131, which is fixedly connected to the lower mold base 11 by bolts (not shown in the figure), making the assembly and disassembly of the lower mold unit 21 easier. Also, the outer side of the upper forming plate 223 protrudes outward with an upper fixing part 2231, which is fixedly connected to the upper mold base 12 by bolts (not shown in the figure), making the assembly and disassembly of the upper mold unit 22 easier.

[0045] The working principle of this embodiment is described in detail below:

[0046] In use, firstly, the upper mold base 12 is moved upward to separate from the lower mold base 11. The upper mold unit 22 separates from the lower mold unit 21 as the upper mold base 12 moves upward. Next, the terminal strip 31 used to mold the high-speed connector 30 is placed on the surface of the lower molding plate 213. Then, the upper mold base 12 is moved downward to close with the lower mold base 11. The upper mold unit 22 closes with the lower mold unit 21 as the upper mold base 12 moves downward. After mold closing, injection molding begins, and molten plastic flows from the sprue. The material enters through 104 and flows into each cavity 201 through various hot runners 103. During injection molding, the lower heating plate 212 and the upper heating plate 222 are energized and individually controlled, and with the heat insulation effect of the lower heat insulation plate 211 and the upper heat insulation plate 221, the temperature of each cavity 201 area is relatively uniform, avoiding temperature differences that could cause different parts of the plastic part 32 to shrink sequentially. This effectively improves the quality of the molded plastic part and achieves precision molding of the high-speed connector 30. After the plastic part 32 cools and solidifies, the upper mold base 12 moves upward and separates from the lower mold base 11. The upper mold unit 22 moves upward with the upper mold base 12 and separates from the lower mold unit 21. Then, the ejection mechanism 13 moves upward to eject the molded high-speed connector 30 from the lower molding plate 213.

[0047] The key design feature of this invention is that by coordinating the lower heat insulation plate, lower heating plate, upper heat insulation plate, and upper heating plate, during the injection molding process, the lower and upper heating plates are energized and individually controlled. Combined with the heat insulation effect of the lower and upper heat insulation plates, this ensures a relatively uniform temperature in the mold cavity area, with the temperature difference controlled within 2°C. This prevents temperature variations that could cause different parts of the plastic part to shrink sequentially, effectively improving the quality of the molded plastic part. This, in turn, enables precision molding of high-speed connectors, increasing the product airtightness yield from 60% to 98%, significantly improving the overall product yield. Furthermore, the lower mold unit and upper mold unit are detachably located in the lower and upper recesses, respectively, allowing for the replacement of different inner mold components according to the needs of different products. This enables mold frame sharing, bringing convenience to production operations.

[0048] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A precision molding die for high speed connectors, characterized by: The mold frame comprises a mold base and an inner mold assembly. The mold base comprises a lower mold base, an upper mold base and an ejection mechanism. The top surface of the lower mold base is concave with a lower cavity. The upper mold base is movably arranged above the lower mold base. The bottom surface of the upper mold base is concave with an upper cavity. The upper mold base is provided with a hot runner. The top surface of the upper mold base is provided with a pouring gate which is communicated with the hot runner. The ejection mechanism is arranged in the lower mold base. The ejection mechanism comprises a plurality of ejector pins which are movably arranged in the lower cavity. The inner mold assembly comprises a lower mold unit and an upper mold unit. The lower mold unit is detachably arranged in the lower cavity. The lower mold unit comprises a lower heat insulation plate, a lower heating plate and a lower forming plate. The lower heating plate is fixed on the upper surface of the lower heat insulation plate. The lower forming plate is fixed on the upper surface of the lower heating plate. The upper mold unit is detachably arranged in the upper cavity. The upper mold unit is movably arranged with the upper mold base and the lower mold unit. The upper mold unit comprises an upper heat insulation plate, an upper heating plate and an upper forming plate. The upper heating plate is fixed on the lower surface of the upper heat insulation plate. The upper forming plate is fixed on the lower surface of the upper heating plate. The lower surface of the upper forming plate and the upper surface of the lower forming plate form a cavity which is adapted to the high-speed connector. The hot runner is communicated with the cavity. The ejector pins are arranged in the cavity from bottom to top.

2. The precision molding tool for high speed connectors of claim 1, wherein: The lower heating plate comprises a lower plate. The upper and lower surfaces of the lower plate are concave with lower profiled grooves. Each lower profiled groove is embedded with a lower profiled heating pipe.

3. The precision molding tool for high speed connectors of claim 1, wherein: The upper heating plate comprises an upper plate. The upper and lower surfaces of the upper plate are concave with upper profiled grooves. Each upper profiled groove is embedded with an upper profiled heating pipe.

4. The precision molding tool for high speed connectors of claim 1, wherein: The mold frame is provided with a junction box on the outer side. The lower heating plate and the upper heating plate are electrically connected with the junction box. The junction box controls the lower heating plate and the upper heating plate separately.

5. The precision molding tool for high speed connectors of claim 1, wherein: The lower forming plate is provided with a lower fixing part on the outer side. The lower fixing part is fixedly connected with the lower mold base by bolts.

6. The precision molding tool for high speed connectors of claim 1, wherein: The upper forming plate is provided with an upper fixing part on the outer side. The upper fixing part is fixedly connected with the upper mold base by bolts.

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