Air duct heat dissipation refrigeration fan

By embedding hot and cold semiconductors and using a high-speed airflow heat dissipation design in the fan's handheld part, the problem of stuffiness when holding a handheld fan is solved, resulting in improved cooling sensation and cost savings.

CN223976165UActive Publication Date: 2026-03-06SHENZHEN WEITESHIJIA TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-11
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

When holding a handheld fan for a long time, your palms can easily get hot and stuffy, affecting the user experience and cooling effect.

Method used

A handheld part is set on the fan housing, with embedded hot and cold semiconductors. The cooling effect is achieved by using conductive plates, and heat is dissipated by high-speed airflow to avoid heat accumulation.

Benefits of technology

It maintains a cool feel while being held, enhancing the cooling effect, and at the same time saving on the manufacturing cost of the heat dissipation mechanism.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223976165U_ABST
Patent Text Reader

Abstract

The utility model discloses an air channel heat dissipation refrigeration fan which comprises a shell, a handheld part is formed on the shell, an air passing channel is formed in the handheld part, a cold and hot semiconductor is embedded in the handheld part, a conduction piece is arranged on the outer surface of the handheld part, a radiator is arranged in the air passing channel, a fan blade group is arranged in the air passing channel, and a fan blade is arranged in the fan blade group. According to the portable fan, the handheld part is arranged on the fan body, a consumer can hold the handheld part by hand to achieve portable carrying and using, the conduction piece is arranged on the outer surface of the handheld part, the refrigeration effect is achieved after the conduction piece acts on the cold and hot semiconductors, and in the holding and using process of the consumer, the stuffiness feeling cannot be formed, and the consumer can carry the portable fan conveniently. On the contrary, the cooling effect of the fan can be improved through palm center refrigeration, meanwhile, the manufacturing cost of the heat dissipation mechanism can be saved on the premise that the blowing effect is not affected, and the manufacturing cost of the refrigeration fan is effectively saved.
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Description

Technical Field

[0001] This utility model relates to the field of fan technology, specifically to a duct cooling fan. Background Technology

[0002] Fans are common household appliances in our daily lives, used to cool off in hot weather. Due to their practical function, fans are widely used and therefore have strong market demand.

[0003] A handheld fan is a small fan with a handle attached to the main body. It can be carried around by holding the handle, and its portability makes it popular among consumers.

[0004] However, after prolonged use of handheld fans, consumers often experience stuffy and sweaty palms. This unpleasant sensation not only affects the user experience but also reduces the fan's cooling effect. This is because the palms are highly sensitive to temperature, and the information perceived is amplified by the brain, influencing the body's perception. If the palms feel stuffy, the subconscious mind tends to perceive a hot environment; conversely, if the palms feel cool, the subconscious mind tends to perceive a cool environment. Therefore, improving the unpleasant sensation caused by prolonged use of handheld fans is crucial for enhancing their effectiveness. Utility Model Content

[0005] The purpose of this utility model is to provide a cooling fan with a duct cooling system. A handheld part is provided on the fan body, allowing for portable use by the consumer. A conductive plate is provided on the outer surface of the handheld part. The conductive plate achieves a cooling effect through the interaction of hot and cold semiconductors. During use, the consumer will not experience stuffiness; instead, the cooling effect is enhanced by the cooling effect of the palm. Simultaneously, the heat generated during the energy exchange between the hot and cold semiconductors can be dissipated quickly by the high-speed airflow through the duct, preventing heat accumulation. Therefore, the manufacturing cost of the cooling mechanism can be reduced without affecting the airflow effect, effectively saving on the manufacturing cost of the cooling fan and solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a duct cooling fan, comprising a housing, a handle formed on the housing, an air duct formed inside the handle, an air inlet and an air outlet on the housing, the air inlet and air outlet respectively located at both ends of the air duct, both the air inlet and air outlet communicating with the air duct, a semiconductor mounting through hole on the handle, a hot and cold semiconductor embedded in the semiconductor mounting through hole, a conductive plate on the outer surface of the handle, the conductive plate being thermally connected to the cooling end of the hot and cold semiconductor, a heat sink being disposed inside the air duct, the heat sink being thermally connected to the heating end of the hot and cold semiconductor, and a drive fan blade assembly being disposed inside the air duct, the drive fan blade assembly guiding the air located at the air inlet through the heat sink and then blowing it outward from the air outlet.

[0007] Preferably, the drive fan blade assembly is positioned close to the air inlet.

[0008] Preferably, the radiator has multiple parallel heat dissipation fins integrally formed on it, and an air passage groove is formed between two adjacent heat dissipation fins, which extends along the length of the air passage.

[0009] Preferably, the housing contains a circuit board assembly and a battery. The fan blade assembly and the battery are electrically connected to the circuit board assembly. The battery is a flat battery pack. The circuit board assembly and the battery are both located inside the air duct and are close to the inner wall of the air duct.

[0010] Preferably, the circuit board assembly is electrically connected to a control button and a USB interface, which are disposed in a pre-set through hole in the housing and extend outward from the through hole.

[0011] Preferably, a guide vane is provided inside the air duct, which guides the airflow in the air duct to the air outlet.

[0012] Preferably, the air guide plate is a curved plate, and the side of the curved plate with a larger curvature faces the air outlet.

[0013] Preferably, the air outlet is covered with an air outlet cover.

[0014] Preferably, the housing includes a front shell and a rear shell that are connected to each other, and an air passage is formed between the front shell and the rear shell.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention features a handheld part on the fan body, allowing consumers to carry and use it conveniently by holding the hand. A conductive plate is located on the outer surface of the handheld part, which achieves a cooling effect through the interaction of hot and cold semiconductors. During use, consumers will not experience stuffiness; instead, the cooling effect is enhanced by the cooling sensation in their palm. Simultaneously, the heat generated during the energy exchange between the hot and cold semiconductors is dissipated quickly by the high-speed airflow through the air duct, preventing heat accumulation. Therefore, the manufacturing cost of the heat dissipation mechanism is reduced without affecting the airflow performance, effectively saving on the manufacturing cost of the cooling fan. Attached Figure Description

[0017] Figure 1 This is an exploded view of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the AA cross-section orientation of this utility model;

[0019] Figure 3 This is a cross-sectional view of the present invention (AA).

[0020] Figure 4 This is a schematic diagram of the structure of the present utility model. Figure 1 ;

[0021] Figure 5 This is a schematic diagram of the structure of the present utility model. Figure 2 .

[0022] In the diagram: 1. Housing; 11. Air inlet; 12. Air outlet; 13. Front housing; 14. Rear housing; 15. Air outlet cover; 16. Air guide plate; 17. Semiconductor mounting through hole; 2. Circuit board assembly; 21. Control button; 22. USB interface; 3. Battery; 4. Drive fan blade assembly; 5. Heat sink; 51. Air duct; 6. Hot and cold semiconductor; 7. Conductive plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5A cooling fan with a duct cooling system includes a housing 1, a handle formed on the housing 1, an air duct formed inside the handle, an air inlet 11 and an air outlet 12 on the housing 1, the air inlet 11 and the air outlet 12 being respectively located at both ends of the air duct and communicating with the air duct, a semiconductor mounting through hole 17 on the handle, a hot and cold semiconductor 6 embedded in the semiconductor mounting through hole 17, a conductive plate 7 on the outer surface of the handle, the conductive plate 7 being thermally connected to the cooling end of the hot and cold semiconductor 6, a heat sink 5 being disposed in the air duct, the heat sink 5 being thermally connected to the heating end of the hot and cold semiconductor 6, and a drive fan blade assembly 4 being disposed in the air duct, the drive fan blade assembly 4 being disposed near the air inlet 11, the drive fan blade assembly 4 guiding the air located on the air inlet 11 to flow through the heat sink 5 and then blown out from the air outlet 12.

[0025] The radiator 5 has multiple parallel heat dissipation fins integrally formed on it. An air passage 51 is formed between two adjacent heat dissipation fins. The air passage 51 extends along the length of the air passage. When the high-speed airflow generated by the fan blade assembly 4 passes through the radiator 5, the heat dissipation fins increase the contact area between the radiator 5 and the airflow. After the airflow penetrates the heat dissipation fins, it can carry away the heat from the radiator 5 more efficiently. Since the heat generated by the radiator 5 can be carried away by the high-speed airflow in time, the radiator 5 will not accumulate heat. Therefore, although the high-speed airflow is performing heat dissipation, the heat value carried per unit flow is low. Therefore, when the airflow acts on the human body, the human body can hardly feel the heat, thus not affecting the normal blowing effect of the fan.

[0026] The housing 1 houses a circuit board assembly 2 and a battery 3. Both the fan blade assembly 4 and the battery 3 are electrically connected to the circuit board assembly 2. The battery 3 is a flat battery pack. Both the circuit board assembly 2 and the battery 3 are located within an air duct, close to the inner wall of the air duct. The circuit board assembly 2 is electrically connected to a control button 21 and a USB interface 22. The control button 21 and the USB interface 22 are located in pre-set through holes in the housing and extend outwards from the through holes. The control button 21 is used to control and adjust the working state and mode of the fan blade assembly 4 and the heating / cooling semiconductor 6. The USB interface 22 can charge the battery 3 when connected to an external power source using a charging cable.

[0027] The housing 1 includes a front housing 13 and a rear housing 14 that are connected to each other. An air passage is formed between the front housing 13 and the rear housing 14. An air guide plate 16 is provided in the air passage. The air guide plate 16 guides the airflow in the air passage to the air outlet 12. The air guide plate 16 is a curved plate. The side of the curved plate with a larger curvature faces the air outlet 12. An air outlet cover 15 is provided on the air outlet 12.

[0028] In summary, this utility model features a handheld part on the fan body, allowing consumers to carry and use it conveniently by holding the hand. A conductive plate 7 is located on the outer surface of the handheld part. The conductive plate 7 achieves a cooling effect through the action of the heating and cooling semiconductor 5. During use, consumers will not experience stuffiness; instead, the cooling effect is enhanced by the cooling effect of their palm. Simultaneously, the heat generated during the energy exchange process of the heating and cooling semiconductor 5 can be dissipated promptly by the high-speed airflow through the air duct, preventing heat accumulation. Therefore, the manufacturing cost of the heat dissipation mechanism can be saved without affecting the airflow effect, effectively reducing the manufacturing cost of the cooling fan.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling fan for a wind tunnel, comprising a housing (1), characterised in that: The shell (1) is formed with a hand-held part, and a wind channel is formed inside the hand-held part.

2. A cooling fan according to claim 1, wherein: The wind fan blade group (4) is arranged close to the air inlet (11).

3. The fan of claim 1, wherein: The heat sink (5) is integrally formed with a plurality of heat dissipation fins arranged in parallel.

4. The fan of claim 1, wherein: The circuit board assembly (2) and the battery (3) are arranged in the shell (1).

5. According to claim 4 is a kind of air duct heat dissipation refrigeration fan, characterized by: The circuit board assembly (2) is electrically connected with a control button (21) and a USB interface (22).

6. A cooling fan as claimed in any one of claims 1, 3, 4, wherein: The wind guide plate (16) is arranged in the wind channel and guides the air flow in the wind channel to the air outlet (12).

7. The fan of claim 6, wherein: The air outlet (12) is covered with an air outlet cover (15).

8. The fan of claim 1 or 7, wherein: The shell (1) comprises a front shell (13) and a rear shell (14) which are connected with each other to form the wind channel.

9. A cooling fan as claimed in any one of claims 1, 4, 5, wherein: ​