Vehicle-mounted refrigerator for combined refrigeration of shared compressor and semiconductor

Abstract

The utility model discloses a vehicle-mounted refrigerator sharing a compressor and a semiconductor for combined refrigeration, and belongs to the technical field of refrigeration equipment. Comprising a box body assembly, an inner container assembly and a heat dissipation assembly, the inner container assembly is located in the box body assembly, and the heat dissipation assembly is fixedly installed at the bottom of the box body assembly and the bottom of the inner container assembly; the heat dissipation assembly is sequentially provided with a cold end heat dissipation fin, a cold conduction block, a TEC refrigeration sheet and a heat dissipation micro-channel fin from top to bottom, the heat dissipation assembly further comprises a refrigerant pipe, the refrigerant pipe is connected with a refrigerant circulation branch of a vehicle-mounted air conditioner compressor, and the refrigerant pipe penetrates through the heat dissipation micro-channel fin. The vehicle-mounted refrigerator is used for solving the problems of refrigeration efficiency, noise and vibration, and rapid and stable refrigeration of the vehicle-mounted refrigerator under various environmental conditions is achieved.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a vehicle refrigerator that uses a shared compressor and semiconductor combined refrigeration. Background Technology

[0002] With the rapid development of the automotive industry and the continuous improvement of people's living standards, car refrigerators, as an important in-vehicle device to enhance travel comfort, are gradually gaining popularity among consumers. However, due to the special characteristics of the in-vehicle environment, such as limited interior space, large temperature fluctuations, and unstable power supply, the design and manufacturing of car refrigerators face many challenges.

[0003] Currently, vehicle refrigerators mainly use compressor refrigeration and TEC refrigeration.

[0004] Compressor refrigeration technology is mature and has high refrigeration efficiency. It can quickly reduce the temperature inside the box to the set value and keep it stable. However, the compressor box is large in size and heavy in weight, and it will generate vibration and noise during operation, which will have a certain impact on the comfort of the vehicle environment.

[0005] Semiconductor refrigeration boasts advantages such as small size, light weight, vibration-free operation, and noiselessness, making it ideal for automotive environments. However, when using semiconductor refrigeration alone, its low cooling efficiency often necessitates prolonged operation to achieve the required low temperatures, increasing energy consumption and shortening the lifespan of the vehicle's battery. Furthermore, conventional semiconductor refrigerators dissipate heat generated by the external TEC (thermal energy dissipation device) through a fan, but automotive refrigerators are typically located inside the dashboard. In summer, the high ambient temperature inside the vehicle prevents the fan from effectively dissipating the heat, resulting in slow or even ineffective cooling of the refrigerator's interior. Consequently, the items inside fail to reach the ideal low temperature, affecting the taste and overall quality of the food or beverage.

[0006] In conclusion, existing car refrigerators have significant shortcomings in terms of cooling speed and user experience. Therefore, there is an urgent need for a new type of car refrigerator to meet users' pursuit of a high-quality in-car life. Utility Model Content

[0007] This invention provides a vehicle refrigerator that uses a shared compressor and semiconductor combined cooling system, which can solve the problems of cooling efficiency, noise and vibration in the prior art. It achieves rapid and stable cooling of the vehicle refrigerator under various environmental conditions, thereby improving user experience and product quality.

[0008] A vehicle refrigerator that uses a shared compressor and semiconductor combined cooling system includes a cabinet assembly, an inner liner assembly, and a heat dissipation assembly. The inner liner assembly is located inside the cabinet assembly, and the heat dissipation assembly is fixedly installed at the bottom of the cabinet assembly and the inner liner assembly.

[0009] The heat dissipation assembly is arranged from top to bottom as follows: cold end heat dissipation fins, cold conduction block, TEC cooling fins and heat dissipation microchannel fins. The heat dissipation assembly also includes a refrigerant pipe, which is connected to the refrigerant circulation branch of the vehicle air conditioning compressor and passes through the heat dissipation microchannel fins.

[0010] Furthermore, the enclosure assembly includes a detachably connected upper and lower enclosure shell, which are connected by snap-fit ​​connections.

[0011] Furthermore, the inner liner assembly includes an upper inner liner and a lower inner liner, which are connected by a snap-fit ​​connection.

[0012] Furthermore, a foamed layer cavity is formed between the box assembly and the inner liner assembly, and a foaming material injection port is provided on the outer shell of the box, with a pouring plug installed on the foaming material injection port.

[0013] Furthermore, the top of the inner liner assembly is integrated with a lamp housing, and an LED light panel is installed inside the lamp housing. The lamp housing and the inner liner adopt an integrated molding structure.

[0014] Furthermore, the cold end heat dissipation fins are fixedly installed on the upper surface of the bottom of the inner liner.

[0015] Furthermore, the outer shell of the housing is provided with a mounting groove for fixing the cooling block. The cooling block is arranged between the cold end face of the TEC cooling chip and the cold end heat dissipation fins. The TEC cooling chip is fixedly connected to the bottom of the housing. The heat dissipation microchannel fins are pressed tightly against the bottom of the TEC cooling chip. The heat dissipation microchannel fins and the hot end face of the TEC cooling chip form a planar contact.

[0016] Furthermore, the heat dissipation assembly also includes a fan bracket, which is disposed on one side of the heat dissipation microchannel fins. The fan bracket has a spare mounting hole for installing an axial fan for heat dissipation when the power consumption is low.

[0017] Furthermore, the refrigerant pipe includes two parallel pipes, which serve as the refrigerant inlet pipe and outlet pipe, respectively, penetrating the heat dissipation microchannel fins.

[0018] Furthermore, the heat dissipation microchannel fins are stepped, and the refrigerant pipes enter from one side of the heat dissipation microchannel fins and are arranged at the bottom of the lower heat dissipation microchannel fins.

[0019] The beneficial effects of this utility model are:

[0020] 1. In this utility model, the refrigerant pipe connects to the refrigerant circulation branch of the vehicle air conditioning compressor. Heat is dissipated through refrigerant circulation, which can more effectively remove heat compared to traditional fan cooling. The combined use of the cold end heat dissipation fins, cooling block, TEC cooling plate, heat dissipation microchannel fins and refrigerant pipe in the heat dissipation component ensures a fast and stable cooling effect under various environmental conditions. It solves the problems of low cooling efficiency and slow cooling when using TEC cooling alone, and provides a good low-temperature storage environment for the items in the box.

[0021] 2. This utility model combines TEC cooling chip cooling and refrigerant circulation heat dissipation. The semiconductor cooling part is small in size and light in weight, which greatly reduces the overall size and weight of the refrigerator and will not take up too much space in the vehicle. In addition, semiconductor cooling has no vibration and noise, which effectively reduces the impact of the refrigerator on the vehicle's interior environment during operation. Furthermore, the combined cooling method reduces energy consumption and dependence on the vehicle battery, adapting to the characteristics of unstable vehicle power supply. Attached Figure Description

[0022] Figure 1 A schematic diagram of the overall structure of a vehicle-mounted refrigerator with a shared compressor and semiconductor combined refrigeration system provided by this utility model;

[0023] Figure 2 A schematic diagram of the box assembly structure provided by this utility model;

[0024] Figure 3 A schematic diagram of the inner liner assembly structure provided by this utility model;

[0025] Figure 4 A schematic diagram of the heat dissipation component structure provided by this utility model;

[0026] Figure 5 A partial structural diagram of a vehicle-mounted refrigerator that uses a shared compressor and semiconductor combined refrigeration system, as provided by this utility model.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Cabinet assembly; 2. Inner liner assembly; 3. Heat dissipation assembly; 11. Upper cabinet shell; 12. Lower cabinet shell; 13. Casting plug; 21. Upper inner liner; 22. Lower inner liner; 23. Lamp housing; 24. LED light panel; 31. Cold end heat dissipation fins; 32. TEC cooling chip; 33. Refrigerant pipe; 34. Heat dissipation microchannel fins; 35. Cooling block; 36. Fan bracket. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] like Figures 1 to 5 As shown in the figure, the present invention provides a vehicle refrigerator with a shared compressor and semiconductor combined refrigeration, including a cabinet assembly 1, an inner liner assembly 2, and a heat dissipation assembly 3. The inner liner assembly 2 is located inside the cabinet assembly 1, and the heat dissipation assembly 3 is fixedly installed at the bottom of the cabinet assembly 1 and the inner liner assembly 2. The cabinet assembly 1 provides external protection and support structure for the entire refrigerator. The inner liner assembly 2 is the space in the refrigerator used to store items, and the temperature of its internal environment directly affects the preservation effect of the stored items. The heat dissipation assembly 3 is used to realize the refrigeration of the refrigerator.

[0031] Specifically, such as Figure 2 As shown, the cabinet assembly 1 includes a detachably connected upper cabinet shell 11 and lower cabinet shell 12. The upper cabinet shell 11 and lower cabinet shell 12 are matched by snap-fit. This detachable design facilitates the assembly, maintenance, and replacement of internal components of the refrigerator. A foam layer cavity is formed between the cabinet assembly 1 and the inner liner assembly 2. The upper cabinet shell 11 is provided with a foam material injection port, and a pouring plug 13 is installed on the foam material injection port. During the refrigerator manufacturing process, foam material is injected into the foam layer cavity through the foam material injection port. The foam layer formed after the foam material solidifies can play a good role in heat insulation and heat preservation, reducing the heat exchange between the inside and outside of the refrigerator, thereby reducing energy consumption.

[0032] Specifically, such as Figure 3 As shown, the inner liner assembly 2 includes an upper inner liner 21 and a lower inner liner 22, which are connected by snap-fit ​​connections. This connection method ensures the integrity and stability of the inner liner assembly 2. The top of the inner liner assembly 2 is integrated with a lamp housing 23, and an LED light panel 24 is installed inside the lamp housing 23. The lamp housing 23 and the upper inner liner 21 adopt an integrated molding structure. The function of the LED light panel is to provide lighting for the inside of the refrigerator. The integrated molding structure of the lamp housing 23 and the upper inner liner 21 not only enhances the connection strength, but also effectively prevents dust and moisture from entering the inside of the lamp housing 23, thus extending the service life of the LED light panel.

[0033] Specifically, such as Figure 4 and Figure 5As shown, the heat dissipation assembly 3 is arranged from top to bottom as follows: cold end heat dissipation fins 31, cooling blocks 35, TEC cooling plates 32, and heat dissipation microchannel fins 34. It also includes a refrigerant pipe 33. The cold end heat dissipation fins 31 are installed on the upper surface of the bottom of the inner liner 22 and fixed with screws. The lower liner 12 of the housing has mounting grooves for fixing the cooling blocks 35. In this embodiment, two cooling blocks 35 are provided, arranged between the cold end face of the TEC cooling plate 32 and the cold end heat dissipation fins 31. The TEC cooling plate 32 is installed at the bottom of the lower liner 12 and fixed with screws. The heat dissipation microchannel fins 34 are pressed tightly against the bottom of the TEC cooling plate 32, forming a planar contact with the hot end face of the TEC cooling plate 32. The refrigerant pipe 33 connects to the refrigerant circulation branch of the vehicle air conditioning compressor and includes two parallel pipes, which serve as the refrigerant inlet and outlet pipes, respectively, passing through the heat dissipation microchannel fins 34. The cold-end heat dissipation fins 31 absorb heat from the interior of the liner and rapidly transfer it away by increasing the heat dissipation area, thereby reducing the temperature inside the liner. The heat-conducting block 35 efficiently transfers the heat absorbed by the cold-end heat dissipation fins 31 to the cold end face of the TEC cooling chip 32, enabling the TEC cooling chip 32 to process the heat in a timely manner. The TEC cooling chip 32 is a refrigeration element based on the thermoelectric effect. When current passes through the TEC cooling chip 32, a temperature difference is generated at its two ends. The cold end face absorbs heat, and the hot end face releases heat, thereby achieving the purpose of cooling. The refrigerant circulates in the refrigerant pipe 33 under the action of the vehicle air conditioning compressor. When the refrigerant flows through the heat dissipation microchannel fins 34, it absorbs the heat on the heat dissipation microchannel fins 34 and dissipates the heat generated by the hot end face of the TEC cooling chip 32. The heat dissipation microchannel fins 34 are stepped, and the refrigerant pipe 33 enters from one side and is arranged at the bottom of the lower heat dissipation microchannel fins 34. This layout is conducive to full contact between the refrigerant and the heat dissipation microchannel fins 34, further improving the heat dissipation effect.

[0034] To improve heat dissipation efficiency and reduce energy consumption, the heat dissipation component 3 also includes a fan bracket 36. The fan bracket 36 is located on one side of the heat dissipation microchannel fins 34. The fan bracket 36 has a spare mounting hole for installing an axial fan for heat dissipation when the power consumption is low.

[0035] The working principle of this utility model is as follows.

[0036] The TEC cooling element 32 is a refrigeration element based on the thermoelectric effect. When current passes through the TEC cooling element 32, a temperature difference is generated across its two ends. The cold end absorbs heat, and the hot end releases heat. During refrigerator operation, the cold end heat dissipation fins 31 absorb heat from the inside of the liner, and the heat conduction block 35 efficiently transfers the heat absorbed by the cold end heat dissipation fins 31 to the cold end of the TEC cooling element 32. The TEC cooling element 32 continuously works, constantly transferring heat from the cold end to the hot end, thereby achieving the purpose of cooling and reducing the internal temperature of the liner.

[0037] Simultaneously, the vehicle's air conditioning compressor starts, and its refrigerant circulation branch branches into two parallel refrigerant pipes 33, namely the refrigerant inlet pipe and the outlet pipe, which pass through the heat dissipation microchannel fins 34. Under the action of the compressor, the refrigerant circulates in the refrigerant pipes 33. The heat generated by the hot end face of the TEC cooling chip is transferred to the heat dissipation microchannel fins 34 that are in plane contact with it. When the refrigerant flows through the heat dissipation microchannel fins 34, it absorbs the heat on the heat dissipation microchannel fins 34, realizing heat transfer. The heat dissipation microchannel fins 34 are stepped, and the refrigerant pipes 33 enter from one side and are arranged at a lower position, which is conducive to full contact between the two and improves the heat dissipation effect.

[0038] When the refrigerator is in low-power operation, an axial fan can be installed on the spare mounting hole of the fan bracket 36 on one side of the heat dissipation microchannel fins 34. The fan operation assists in heat dissipation, further reducing the temperature of the hot end face of the TEC cooling chip, improving heat dissipation efficiency and reducing energy consumption.

[0039] As heat is continuously absorbed from the inner liner, processed by the TEC cooling plate 32, and then dissipated by the refrigerant, the internal temperature of the inner liner continues to decrease, achieving the refrigerator's cooling function. During this process, the foam layer between the cabinet assembly 1 and the inner liner assembly 2 plays a role in heat insulation, reducing heat exchange between the inside and outside, while the LED light panel 24 integrated on the top of the inner liner assembly 2 provides lighting for users to take out and put in items, ensuring the refrigerator operates stably and efficiently.

[0040] The embodiments of this utility model have been described in detail above, but the content is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.

Claims

1. A vehicle-mounted refrigerator with shared compressor and semiconductor combination refrigeration, comprising a box assembly (1), an inner container assembly (2) and a heat dissipation assembly (3), characterized in that, The inner container assembly (2) is located in the box assembly (1), and the heat dissipation assembly (3) is fixedly installed at the bottom of the box assembly (1) and the inner container assembly (2). The heat dissipation assembly (3) is sequentially arranged from top to bottom as a cold end heat dissipation fin (31), a cold guide block (35), a TEC refrigeration sheet (32) and a heat dissipation micro-channel fin (34), and further comprises a refrigerant pipe (33) connected with a refrigerant circulation branch of a vehicle-mounted air conditioner compressor, which penetrates through the heat dissipation micro-channel fin (34).

2. The vehicle-mounted refrigerator of claim 1, wherein The box assembly (1) comprises a box upper shell (11) and a box lower shell (12) which are detachably connected by buckle matching.

3. The vehicle-mounted refrigerator of claim 2, wherein the compressor is shared by the refrigerator and the semiconductor. The inner container assembly (2) comprises an inner container upper (21) and an inner container lower (22) which are connected by buckle matching.

4. A vehicle refrigerator with a shared compressor and semiconductor combined refrigeration as described in claim 3, characterized in that, A foaming layer cavity is formed between the box assembly (1) and the inner container assembly (2), and the box upper shell (11) is provided with a foaming material injection port, on which a pouring cover (13) is installed.

5. The vehicle-mounted refrigerator of claim 3, wherein the compressor is shared by the refrigerator and the semiconductor. The inner container assembly (2) is integrated with a lamp shell (23) at the top, and the lamp shell (23) is internally installed with an LED lamp plate (24), and the lamp shell (23) and the inner container upper (21) are integrally formed.

6. The vehicle-mounted refrigerator of claim 3, wherein the compressor is a scroll compressor. The cold end heat dissipation fin (31) is fixedly installed on the upper surface of the bottom of the inner container lower (22).

7. The vehicle-mounted refrigerator of claim 6, wherein the compressor is a scroll compressor. The box lower shell (12) is provided with a mounting groove for fixing the cold guide block (35), the cold guide block (35) is arranged between the cold end surface of the TEC refrigeration sheet (32) and the cold end heat dissipation fin (31), the TEC refrigeration sheet (32) is fixedly connected at the bottom of the box lower shell (12), the heat dissipation micro-channel fin (34) is tightly pressed at the bottom of the TEC refrigeration sheet (32), and the heat dissipation micro-channel fin (34) is in plane contact with the hot end surface of the TEC refrigeration sheet (32).

8. The vehicle-mounted refrigerator of claim 1, wherein, The heat dissipation assembly (3) further comprises a fan bracket (36) arranged on one side of the heat dissipation micro-channel fin (34), and the fan bracket (36) is provided with a spare mounting hole for installing an axial flow fan for heat dissipation in low power consumption.

9. The vehicle-mounted refrigerator of claim 1 or 7, wherein The refrigerant pipe (33) comprises two parallel pipelines which are used as refrigerant inlet and outlet pipes and penetrate through the heat dissipation micro-channel fin (34).

10. The vehicle-mounted refrigerator of claim 9, wherein the compressor is a scroll compressor. The heat dissipation micro-channel fin (34) is in a stepped shape, and the refrigerant pipe (33) enters from one side of the heat dissipation micro-channel fin (34) and is arranged in parallel at the bottom of the lower heat dissipation micro-channel fin (34).

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