Ultrahigh-frequency miniature patch antenna

By printing metal layers on both sidewalls of the ceramic substrate and adjusting the notch design, the problem of excessive antenna length was solved, achieving miniaturization and ultra-wide bandwidth, making it suitable for complex installation environments.

CN223978101UActive Publication Date: 2026-03-06LINCHANG YANGZHOU MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202520707240.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-15
Publication Date
2026-03-06
Estimated Expiration
2035-04-15

AI Technical Summary

Technical Problem

Existing technologies do not utilize the two sides along the length when printing circuits on ceramic substrates, resulting in antennas that are too long and difficult to adapt to complex installation environments.

Method used

A second metal layer is printed on both sidewalls along the length of the ceramic substrate to connect the first and second metal layers, thereby shortening the antenna length. The resonant characteristics are changed by adjusting the length and width of the notch to achieve an ultra-wide bandwidth.

Benefits of technology

It achieves antenna miniaturization, adapts to complex installation environments, and extends the operating frequency band to 2.4GHz to 7GHz, making it suitable for communication systems such as WiFi and UWB.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an ultrahigh frequency miniature patch antenna. The ultrahigh frequency miniature patch antenna comprises a ceramic sealing plate, a ceramic substrate and a ceramic bottom plate which are arranged from top to bottom, one side of the bottom surface of the ceramic bottom plate is provided with a grounding bonding pad and a feed bonding pad, the grounding bonding pad and the feed bonding pad are respectively connected with a radiation circuit through metalized via holes, and the radiation circuit comprises a first metal layer connected with the metalized via holes. The first metal layer is printed on the bottom surface of the ceramic substrate, the two ends of the first metal layer in the length direction are connected with the second metal layer, the second metal layer is printed on the side wall of the ceramic substrate, the second metal layer is connected with the third metal layer, and the third metal layer is printed on the top surface of the ceramic substrate. The utility model solves the problem that the prior art is large in size and can not adapt to complex installation environments.
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Description

Technical Field

[0001] This utility model relates to the field of navigation and communication technology, and in particular to an ultra-high frequency miniature patch antenna. Background Technology

[0002] LTCC (Low Temperature Co-fired Ceramic) technology, with its excellent material properties (high dielectric constant, low dielectric loss) and ease of realizing three-dimensional structures (multilayer applications, vertical interconnects), has played a significant role in antenna miniaturization, wide bandwidth, and complete packaging. However, current circuit printing on ceramic substrates does not utilize the two sides along the length of the ceramic substrate, resulting in larger antenna lengths that cannot adapt to complex installation environments. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing a small-sized UHF miniature patch antenna that can adapt to complex installation environments.

[0004] To achieve the above objectives, the technical solution adopted by this utility model of ultra-high frequency miniature patch antenna is as follows:

[0005] An ultra-high frequency miniature patch antenna includes a ceramic cover plate, a ceramic substrate, and a ceramic base plate arranged from top to bottom. A grounding pad and a feed pad are provided on one side of the bottom surface of the ceramic base plate. The grounding pad and the feed pad are respectively connected to radiating lines through metallized vias. The radiating lines include a first metal layer connected to the metallized vias. The first metal layer is printed on the bottom surface of the ceramic substrate. The two ends of the first metal layer in the length direction are connected to a second metal layer. The second metal layer is printed on the side wall of the ceramic substrate. The second metal layer is connected to a third metal layer. The third metal layer is printed on the top surface of the ceramic substrate.

[0006] Preferably, a first notch is formed at the middle edge of the first metal layer, a second notch is formed at one side edge of the first metal layer, the second notch is located between the ground pad and the power supply pad and is on the same side as the first notch, a third notch is formed at the middle of the other side of the first metal layer, a fourth notch is formed at the middle of the upper side of the second metal layer, forming a first radiating arm and a second radiating arm on the upper part of the second metal layer, a fifth notch is formed at the middle of the third metal layer, the two ends of the fifth notch are connected to the fourth notch, the side of the fourth notch adjacent to the ground pad is connected to the fifth notch, the fifth notch is on the opposite side of the first notch, the fourth and fifth notches divide the third metal layer into a first strip layer, a second strip layer and a third strip layer, the two ends of the first strip layer are connected to the first radiating arms on both sides, one end of the second strip layer is connected to the second radiating arm on the same side, and one end of the third strip layer is connected to the second radiating arm on the same side.

[0007] Preferably, a fixing pad is provided on the other side of the bottom surface of the ceramic base plate.

[0008] Compared with the prior art, this utility model has the following advantages:

[0009] By utilizing the space on both sides of the ceramic substrate along its length, a second metal layer is printed to connect the first and second metal layers, thereby shortening the length of the ceramic substrate and further miniaturizing the antenna to adapt to complex installation environments. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of an ultra-high frequency miniature patch antenna.

[0011] Figure 2 This is a schematic diagram of the radial circuit structure.

[0012] Figure 3 This is the return loss diagram of this utility model.

[0013] Among them, 1 is a ceramic sealing plate, 2 is a ceramic substrate, 3 is a ceramic base plate, 4 is a grounding pad, 5 is a power supply pad, 6 is a fixing pad, 7 is a metallized via, 8 is a radiating line, 81 is a first metal layer, 811 is a first notch, 812 is a second notch, 813 is a third notch, 82 is a second metal layer, 821 is a fourth notch, 822 is a first radiating arm, 823 is a second radiating arm, 83 is a third metal layer, 831 is a fifth notch, 832 is a fifth notch, 833 is a first strip layer, 834 is a second strip layer, and 835 is a third strip layer. Detailed Implementation

[0014] The present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. After reading the present invention, any modifications of the present invention in various equivalent forms by those skilled in the art will fall within the scope defined by the appended claims.

[0015] like Figure 1-3As shown, an ultra-high frequency miniature patch antenna includes a ceramic cover plate 1, a ceramic substrate 2, and a ceramic base plate 3 arranged from top to bottom. A grounding pad 4 and a feed pad 5 are printed on the left side of the bottom surface of the ceramic base plate, and a fixing pad 6 is printed on the right side of the bottom surface of the ceramic base plate. The fixing pad improves the stability of the antenna structure and maintains the normal operation of the antenna. The feed pad is located between the grounding pad and the fixing pad. The grounding pad and the feed pad are connected to a radiating line 8 through metallized vias 7. The radiating line includes a first metal layer 81 connected to the metallized vias. The first metal layer is printed on the bottom surface of the ceramic substrate. A first notch 811 is formed at the middle edge of the first metal layer, located at the bottom front edge of the ceramic substrate. A second notch 812 is formed at the left edge of the first metal layer, located between the grounding pad and the feed pad and on the same side as the first notch. A third notch 81 is formed at the middle right side of the first metal layer. 3. The two ends of the first metal layer along its length are connected to the second metal layer 82. The second metal layer is printed on the sidewall of the ceramic substrate. A fourth notch 821 is opened in the middle of the upper side of the second metal layer. A first radiating arm 822 and a second radiating arm 823 are formed on the upper part of the second metal layer. The first and second radiating arms are connected to the third metal layer 83. The third metal layer is printed on the top surface of the ceramic substrate. A fifth notch 831 is opened in the middle of the third metal layer. The two ends of the fifth notch are connected to the fourth notch. The side of the fourth notch adjacent to the ground pad is connected to the fifth notch 832. The fifth notch is on the opposite side of the first notch. The fourth and fifth notches divide the third metal layer into a first strip layer 833, a second strip layer 834 and a third strip layer 835. The two ends of the first strip layer are connected to the first radiating arms on both sides. The left end of the second strip layer is connected to the second radiating arm on the left side. The right end of the third strip layer is connected to the second radiating arm on the right side.

[0016] The first, second, third, fourth, and fifth notches are all rectangular. The resonant characteristics of the antenna can be changed by adjusting the length and width of these notches, thereby increasing the antenna's operating bandwidth. This allows for the design of ultra-wideband antennas covering 2.4GHz and 3.8-7GHz, with applications spanning various communication systems such as WiFi and UWB.

Claims

1. An ultra-high frequency micro-patch antenna, characterized by: The ceramic bottom plate is provided with a grounding pad and a feeding pad on one side of the bottom surface, and the grounding pad and the feeding pad are connected with radiation lines through metallized vias, respectively.

2. The ultra-high frequency micro patch antenna according to claim 1, characterized in that: The middle edge of the first metal layer is provided with a first notch, one side edge of the first metal layer is provided with a second notch, the second notch is between the grounding pad and the feeding pad and is on the same side of the first notch, the other side middle of the first metal layer is provided with a third notch, the upper middle of the second metal layer is provided with a fourth notch, the first radiation arm and the second radiation arm are formed on the upper part of the second metal layer, the middle of the third metal layer is provided with a fifth notch, the two ends of the fifth notch are communicated with the fourth notch, the side of the fourth notch close to the grounding pad is communicated with the fifth notch, the fifth notch is on the opposite side of the first notch, and the fourth and fifth notches divide the third metal layer into a first strip layer, a second strip layer and a third strip layer.

3. The UHF micro patch antenna according to claim 2, characterized in that: The other side of the bottom surface of the ceramic bottom plate is provided with a fixing pad.