Network information security equipment
By designing a multi-layer heat dissipation structure on the hardware firewall device and utilizing a combination of fins, heat pipes, and heat sinks, the performance degradation and failure risk caused by high temperature in the hardware firewall are solved, achieving efficient heat dissipation and stable operation, and reducing maintenance costs.
Patent Information
- Application Number
- CN202520610305.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2035-04-01
AI Technical Summary
Hardware firewalls can overheat under prolonged high-intensity operation, affecting performance and lifespan, and may cause malfunctions, increasing maintenance costs and the risk of business interruption.
A network information security device was designed, which uses an aluminum alloy casing. The top cover is equipped with fins and a heat sink. Combined with heat pipes and heat dissipation holes, a multi-layer heat dissipation structure is formed, including heat exchange between the fins and the top cover, heat transfer through the heat pipes, and active heat dissipation by the heat sink, which enhances the heat dissipation effect. A magnetic dustproof mesh is used to prevent dust from entering.
It effectively improves the heat dissipation of the hardware firewall, ensures stable equipment operation, reduces the risk of failure, reduces maintenance costs, and increases processing speed.
Smart Images

Figure CN223978651U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of network security technology, and in particular to a network information security device. Background Technology
[0002] In today's digital age, network information security has become a key element in enterprise operations. As the primary line of defense for network security, the importance of hardware firewalls is self-evident. However, with the continuous growth of network traffic and the increasing complexity of attack methods, hardware firewalls need to operate at high intensity for extended periods. This leads to increased internal temperatures, which seriously affects their performance and lifespan. Prolonged high-temperature operation not only reduces the processing speed of hardware firewalls but may also cause hardware failures, increasing maintenance costs and the risk of business interruption. Utility Model Content
[0003] In order to solve the problems existing in the prior art, the present invention provides a network information security device.
[0004] The technical implementation scheme of this utility model is as follows: a network information security device includes a housing, the housing including an integrally formed bottom plate, a front side plate, a left side plate, a right side plate, and a top cover and a rear cover detachably disposed on the housing, a firewall motherboard is disposed inside the housing, and a processor and a processor housing are disposed on the firewall motherboard; horizontally extending fins are evenly disposed on the outer side of the top cover, and a vertical through mounting hole is formed on the top cover and the fins, and a heat sink is disposed at the mounting hole to dissipate heat from inside the housing.
[0005] More preferably, the heat sink is connected to the processor casing via a first heat pipe.
[0006] More preferably, at least one set of heat dissipation holes are provided on the front side plate, the left side plate, and the right side plate respectively.
[0007] More preferably, the back cover is made of aluminum alloy, and a second heat pipe extending horizontally is provided on the inner side of the back cover, the second heat pipe being connected to the processor casing.
[0008] More preferably, the outer side of the heat dissipation hole is recessed inward to form a concave area, and the concave area is provided with a magnetic dustproof mesh.
[0009] More preferably, one end of the fin is connected to the rear cover via a conductive sheet.
[0010] Compared with the prior art, the present invention has the following advantages:
[0011] 1. This utility model provides fins on the outside of the top cover. When the temperature inside the casing rises, the fins exchange heat with the outside air to achieve heat dissipation. In addition, by opening mounting holes on the top cover and using a radiator to expel heat from inside the casing, the heat dissipation effect is further improved.
[0012] 2. The heat sink of this utility model is connected to the processor casing through a first heat pipe, and the heat of the processor can be quickly transferred to the heat sink through the heat pipe to achieve rapid heat dissipation of the processor.
[0013] 3. This utility model improves heat dissipation efficiency by opening heat dissipation holes on the front panel and the left and right side panels respectively.
[0014] In addition, by installing magnetic dust filters at the heat dissipation holes, dust can be reduced from entering the casing, and the magnetic dust filters are easy to remove and clean.
[0015] 4. The back cover of this utility model is made of aluminum alloy, which has good thermal conductivity. The back cover is connected to the processor shell through a second heat pipe, and can achieve heat dissipation through multiple means in conjunction with the heat sink.
[0016] In addition, by connecting the fins to the rear cover, it is convenient for the heat on the fins to be transferred to the rear cover and discharged outside the chassis. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0018] Figure 2 This is a schematic diagram showing the disassembly of the top cover and radiator of this utility model.
[0019] Figure 3 This is a partial schematic diagram of the present invention.
[0020] The meanings of the labels in the attached diagram are as follows: 1. Chassis; 11. Base plate; 12. Front side plate; 13. Left side plate; 14. Right side plate; 15. Top cover; 16. Rear cover; 2. Firewall motherboard; 3. Processor casing; 4. Fins; 41. Mounting hole; 5. Heat sink; 6. Heat dissipation hole; 71. First heat pipe; 72. Second heat pipe; 8. Magnetic dust filter; 9. Conductive plate. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] like Figures 1 to 3 The network information security device shown includes a housing 1. The base plate 11, front side plate 12, left side plate 13, and right side plate 14 of the housing 1 are integrally formed, constituting a basic frame structure. A top cover 15 is detachably mounted on the top of this frame structure, and a rear cover 16 is mounted on the rear side. The top cover 15 and rear cover 16 are connected by screws, with corresponding screw holes machined into the frame structure. The housing 1 serves as the overall protective structure, and a firewall motherboard 2 is installed inside. This motherboard is equipped with a processor and a processor housing 3. The processor, as the core component of the firewall device, is responsible for processing various network data and security tasks, while the processor housing 3 protects the processor. Unlike existing technologies, this device features multiple horizontally extending fins 4 evenly distributed on the outer side of the top cover 15. These fins 4, together with the top cover 15, constitute a highly efficient heat dissipation structure. Since hot air flows upwards, the temperature near the top cover 1 is typically higher than other locations; therefore, the top cover 15 is the primary source of heat dissipation.
[0023] In a preferred embodiment, the housing 1 and the fins 4 are made of aluminum alloy or copper. The height of the fins 4 is between 1 / 5 and 1 / 3 of the height of the housing 1. The spacing between adjacent fins 4 is between 1 / 2 the height of the fins 4 or 1 times the height of the fins 4. The plane on which the fins 4 are located is basically parallel to the plane on which the left and right side plates are located. On the other hand, compared with setting the fins 4 on the entire housing 1, this device only sets the fins 4 on the top cover 1, which saves costs while the heat dissipation effect is basically the same.
[0024] Furthermore, to improve the heat dissipation efficiency within the casing 1, vertical through-holes 41 are provided on the top cover 15 and the fins 4. A heat sink 5 is installed at these through-holes 41. (See reference for details.) Figure 2 The heat sink 5 is an air-cooled heat sink with a height of about 25mm. The main function of the heat sink 5 is to dissipate the heat inside the casing 1. This equipment increases the heat dissipation area through the fins 4, and combined with the active heat dissipation of the heat sink 5, it effectively reduces the internal temperature of the casing 1 and ensures stable operation of the equipment.
[0025] In a preferred embodiment, the heat sink 5 is connected to the processor casing 3 via a first heat pipe 71. The first heat pipe 71 can efficiently transfer the heat generated by the processor from the processor casing 3 to the heat sink 5 and dissipate it, thereby accelerating heat dissipation and improving heat dissipation efficiency.
[0026] Furthermore, to further improve heat dissipation, at least one set of ventilation holes 6 are provided on the front panel 12, the left side panel 13, and the right side panel 14. The presence of at least one pair of opposing ventilation holes 6 facilitates airflow within the casing 1 and, in conjunction with the mounting holes 41 and the heatsink 5, forms convection, thereby optimizing the air intake channel and improving heat dissipation. Additionally, to prevent dust from entering the casing 1 through the ventilation holes 6, a recessed area is formed on the outer side of the ventilation holes 6. This recessed area is made of magnetic material, and a magnetic dust filter 8 is installed within it. See details for further information. Figure 3 The magnetic dustproof mesh 8 not only effectively blocks dust, but is also easy to disassemble and clean, ensuring that the ventilation performance of the heat dissipation holes 6 is not affected.
[0027] The rear cover 16 of this device is made of aluminum alloy, which has excellent thermal conductivity. A horizontally extending second heat pipe 72 is provided on the inner side of the rear cover 16, and this second heat pipe 72 is connected to the processor housing 3. Through the second heat pipe 72, the heat from the processor can be transferred to the rear cover 16, and then dissipated from the rear cover 16 to the external environment, further improving the overall heat dissipation capacity of the device. In addition, one end of the fins 4 is connected to the rear cover 16 via a conductive plate 9. The conductive plate 9 acts as a bridge for heat conduction, transferring heat from the fins 4 to the rear cover 16, fully utilizing the heat dissipation area of the rear cover 16, and enhancing the synergistic effect of the entire heat dissipation system. Since the rear cover 16 is basically installed on the outside of the device chassis during installation, it is made of high thermal conductivity aluminum alloy as an important heat-conducting component.
[0028] The working principle of this utility model is as follows: When the device is running, the processor generates a large amount of heat, which is first conducted out through the processor casing 3. The first heat pipe 71 quickly transfers the heat from the processor casing 3 to the heat sink 5, and then the heat sink 5 transfers it to the outside of the casing 1. At the same time, some of the heat is dissipated through the fins 4 of the top cover 15 of the casing 1. Furthermore, the second heat pipe 72 of the rear cover 16 also transfers the heat from the processor to the rear cover 16, and the heat is dissipated by utilizing the heat dissipation area of the rear cover 16.
[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A network information security device comprising a cabinet (1) including an integrally formed bottom plate (11), a front side plate (12), a left side plate (13), a right side plate (14), and a top cover (15) and a rear cover (16) detachably provided to the cabinet (1), characterized in that, The machine shell (1) is internally provided with a fireproof wall mainboard (2), and the fireproof wall mainboard (2) is provided with a processor and a processor shell (3); The outer side of the top cover (15) is uniformly provided with horizontally extending fins (4), and the top cover (15) and the fins (4) are jointly provided with vertically penetrating mounting holes (41), and the mounting holes (41) are provided with heat sinks (5) for discharging heat in the machine shell (1).
2. The network information security device of claim 1, wherein, The heat sink (5) is connected with the processor shell (3) through a first heat conduction pipe (71).
3. The network information security device of claim 1, wherein, At least one group of heat dissipation holes (6) are arranged on the front side plate (12), the left side plate (13) and the right side plate (14) respectively.
4. The network information security device of claim 1, wherein, The rear cover (16) is made of aluminum alloy, and the inner side of the rear cover (16) is provided with a horizontally extending second heat conduction pipe (72), and the second heat conduction pipe (72) is connected with the processor shell (3).
5. The network information security device of claim 3, wherein, The outer side of the heat dissipation hole (6) is inwardly recessed to form an inward recessed area, and the inward recessed area is provided with a magnetic dustproof screen (8).
6. The network information security device of claim 4, wherein, One end of the fin (4) is connected with the rear cover (16) through a conduction sheet (9).