Heat conduction module and vehicle-mounted charger

Abstract

The utility model provides a heat conduction module and a vehicle-mounted charger, the heat conduction module is used for assisting heat dissipation of a power assembly, and the heat conduction module is arranged on one side of the power assembly. The heat-conducting module comprises a heat-conducting plate, the heat-conducting plate comprises a first heat-conducting layer, a second heat-conducting layer and a third heat-conducting layer which are stacked, and the heat transfer coefficient of the first heat-conducting layer and the heat transfer coefficient of the third heat-conducting layer are larger than the heat transfer coefficient of the second heat-conducting layer. The heat conduction module provided by the utility model is arranged on one surface of the power assembly, so that the heat transfer efficiency of the power assembly is improved, and the working temperature of the power assembly is reduced. Meanwhile, due to the design of the first heat conduction layer, the second heat conduction layer and the third heat conduction layer, the heat conduction rate of the heat conduction module is improved on the premise that the power assembly is insulated from other parts, and the working temperature of the power assembly is further reduced.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology, specifically relating to heat conduction modules and on-board chargers. Background Technology

[0002] On-board chargers are used for power conversion in electric vehicles and are an important component of electric vehicles. An on-board charger typically includes multiple power modules, which in turn include multiple power transistors. These power transistors generate a large amount of heat during operation, causing the power modules to overheat; however, existing power modules have poor heat dissipation performance. Utility Model Content

[0003] In view of this, the first aspect of this application provides a thermally conductive module for assisting in the heat dissipation of a power component, the thermally conductive module being disposed on one side of the power component. The thermally conductive module includes a thermally conductive plate, the thermally conductive plate including a first thermally conductive layer, a second thermally conductive layer, and a third thermally conductive layer stacked together, wherein the heat transfer coefficients of the first thermally conductive layer and the third thermally conductive layer are greater than the heat transfer coefficient of the second thermally conductive layer.

[0004] The thermally conductive module provided in the first aspect of this application improves the heat transfer efficiency of the power component and reduces its operating temperature by being installed on one side of the power component. Simultaneously, the design of the first, second, and third thermally conductive layers, while ensuring insulation between the power component and other components, also increases the thermal conductivity of the thermally conductive module, further reducing the operating temperature of the power component.

[0005] Wherein, the orthographic projection of the first thermal conductive layer on the power component and the orthographic projection of the third thermal conductive layer on the power component are located within the orthographic projection of the second thermal conductive layer on the power component.

[0006] The power component includes a circuit board and a plurality of power transistors. The plurality of power transistors are disposed on the side of the circuit board away from the heat-conducting plate. The first heat-conducting layer abuts against the power component. The orthographic projection of the plurality of power transistors on the circuit board is located within the orthographic projection of the first heat-conducting layer on the circuit board.

[0007] Wherein, the area of ​​the first thermally conductive layer projected onto the circuit board is equal to the area of ​​the plurality of power transistors projected onto the circuit board.

[0008] The power component includes a circuit board and a power transistor. The circuit board has a through hole. The first thermal conductive layer abuts against the circuit board. The thermal conductive plate also includes a fourth thermal conductive layer. The fourth thermal conductive layer is disposed in the through hole and abuts against the power transistor and the first thermal conductive layer.

[0009] The heat-conducting module further includes a connector for connecting the heat-conducting plate and the power component. The connector is located at one end of the heat-conducting plate and the power component. The connector, the second heat-conducting layer, and the power component are connected by a first mating groove and a first mating part, with the first mating part located within the first mating groove.

[0010] The heat-conducting module further includes a connector for fixing to the bottom wall of the outer shell. The connector and the bottom wall are engaged by a second mating groove and a second mating part, and the second mating part is fixed in the second mating groove.

[0011] The heat-conducting module further includes a connector for connecting the heat-conducting plate and the power component. The connector includes a bottom wall at one end of the heat-conducting plate and the power component, and a first side wall on the side of the power component facing away from the heat-conducting plate. The first side wall is bent and connected to the bottom wall.

[0012] The connector further includes two second sidewalls, which are disposed at opposite ends of the first sidewall, and the first sidewall and the two second sidewalls enclose a receiving space, with the end of the power component disposed within the receiving space.

[0013] The second aspect of this application provides an on-board charger, which includes a power component, a heat dissipation channel, and a heat-conducting module as provided in the first aspect of this application. The heat-conducting module is used to conduct heat from the power component to the heat dissipation channel and is disposed between the power component and the heat dissipation channel.

[0014] The on-board charger provided in the second aspect of this application uses the heat-conducting module provided in the first aspect of this application, which enables the heat generated by the power components to be conducted to the heat dissipation channel more quickly, increases the heat dissipation efficiency of the power components, thereby reducing the overall temperature of the on-board charger and extending the service life of the on-board charger. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0016] Figure 1 This is a three-dimensional structural diagram of the heat-conducting module in one embodiment of this application.

[0017] Figure 2 for Figure 1 The exploded view of the heat-conducting module shown.

[0018] Figure 3This is a three-dimensional structural diagram of the power component and the heat-conducting module in one embodiment of this application.

[0019] Figure 4 for Figure 3 The diagram shows a three-dimensional structure of the power components and thermal conductive modules from another perspective.

[0020] Figure 5 for Figure 4 The diagram shows a partial enlarged view of the power components and thermal conductive modules.

[0021] Figure 6 This is an exploded view of the power component and the heat-conducting module in one embodiment of this application.

[0022] Figure 7 This is a cross-sectional schematic diagram of the power component, heat-conducting module, and heat dissipation channel in one embodiment of this application.

[0023] Figure 8 This is a cross-sectional schematic diagram of the power component, heat-conducting module, and heat dissipation channel in another embodiment of this application.

[0024] Figure 9 This is a cross-sectional schematic diagram of the power component and the heat-conducting module in one embodiment of this application.

[0025] Figure 10 This is a three-dimensional structural diagram of the connector in one embodiment of this application.

[0026] Figure 11 This is a cross-sectional schematic diagram of the power component and the heat-conducting module in another embodiment of this application.

[0027] Figure 12 This is an exploded view of the second mating part and the second mating groove in one embodiment of this application.

[0028] Figure 13 This is an exploded view of an on-board charger according to one embodiment of this application.

[0029] Label Explanation:

[0030] Thermal conductive module-1, on-board charger-2, heat dissipation channel-3, outer shell-4, thermal conductive plate-10, first thermal conductive layer-11, second thermal conductive layer-12, third thermal conductive layer-13, fourth thermal conductive layer-14, connector-20, first mating groove-21, first mating part-22, second mating groove-23, second mating part-24, first side wall-25, second side wall-26, power component-30, circuit board-31, power transistor-32. Detailed Implementation

[0031] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

[0032] In view of this, in order to solve the above problems, this application provides a thermally conductive module. Please refer to it. Figures 1-7 , Figure 1 This is a three-dimensional structural diagram of the heat-conducting module in one embodiment of this application. Figure 2 for Figure 1 The exploded view of the heat-conducting module shown. Figure 3 This is a three-dimensional structural diagram of the power component and the heat-conducting module in one embodiment of this application. Figure 4 for Figure 3 The diagram shows a three-dimensional structure of the power components and thermal conductive modules from another perspective. Figure 5 for Figure 4 The diagram shows a partial enlarged view of the power components and thermal conductive modules. Figure 6 This is an exploded view of the power component and the heat-conducting module in one embodiment of this application. Figure 7 This is a cross-sectional schematic diagram of the power component, heat-conducting module, and heat dissipation channel in one embodiment of this application.

[0033] The heat-conducting module 1 provided in this embodiment is used to assist the power component 30 in heat dissipation. The heat-conducting module 1 is disposed on one side of the power component 30. The heat-conducting module 1 includes a heat-conducting plate 10. The heat-conducting plate 10 includes a first heat-conducting layer 11, a second heat-conducting layer 12, and a third heat-conducting layer 13 stacked together. The heat transfer coefficients of the first heat-conducting layer 11 and the third heat-conducting layer 13 are greater than the heat transfer coefficient of the second heat-conducting layer 12.

[0034] The heat-conducting module 1 is mainly used to assist in the heat dissipation of electronic devices, including but not limited to mobile phones, computer hosts, vehicle batteries, and on-board chargers 2. This embodiment only illustrates the application of the heat-conducting module 1 to the on-board charger 2.

[0035] The on-board charger 2 is an important component of an electric vehicle, mainly used to convert the current and voltage inside the vehicle, such as converting alternating current to direct current or high-voltage electricity to low-voltage electricity. The on-board charger 2 generally includes multiple power components 30, and the power components 30 include multiple power transistors 32 packaged on the surface of a circuit board 31.

[0036] The power transistor 32 generates a large amount of heat during operation, causing the overall temperature of the power component 30 and the on-board charger 2 to rise rapidly. Currently, heat dissipation is typically achieved by adding a heat dissipation channel 3 inside the on-board charger 2. The power component 30 can be attached to the surface of the heat dissipation channel 3, allowing its heat to be conducted to the channel 3 promptly. However, the power component 30 has a poor thermal conductivity; when directly attached to the heat dissipation channel 3, its heat dissipation efficiency is low, resulting in a high temperature for the on-board charger 2 and potentially affecting circuit safety.

[0037] The heat-conducting module 1 provided in this embodiment includes a heat-conducting plate 10, which is disposed on one side of the power component 30 and is used to support the power component 30 to assist in heat dissipation. The heat-conducting plate 10 includes a first heat-conducting layer 11, a second heat-conducting layer 12, and a third heat-conducting layer 13, and the first heat-conducting layer 11, the second heat-conducting layer 12, and the third heat-conducting layer 13 are stacked. The heat transfer coefficient of the second heat-conducting layer 12 is less than that of the first heat-conducting layer 11 and the third heat-conducting layer 13. The first heat-conducting layer 11 is used to contact the power component 30 and conduct heat to the second heat-conducting layer 12. Optionally, the material of the first heat-conducting layer 11 includes, but is not limited to, metal, graphene, etc. The second heat-conducting layer 12 is used to conduct heat to the third heat-conducting layer 13. At the same time, the second heat-conducting layer 12 is also an insulating layer, so that the third heat-conducting layer 13 is insulated from the first heat-conducting layer 11. Optionally, the material of the second heat-conducting layer 12 includes, but is not limited to, ceramic, graphene, etc. The third thermally conductive layer 13 is used to connect other heat dissipation structures and conduct the heat from the second thermally conductive layer 12 to other heat dissipation structures. Optionally, the material of the third thermally conductive layer 13 includes, but is not limited to, metal, graphene, etc. Optionally, the connection method of the first thermally conductive layer 11, the second thermally conductive layer 12, and the third thermally conductive layer 13 includes, but is not limited to, thermally conductive adhesive bonding, soldering, plug-in connection, etc.

[0038] In related technologies, power components are generally directly attached to a heat dissipation structure for heat dissipation. Since the side of the power component facing the heat dissipation structure is usually not flat, the contact between the power component and the heat dissipation structure is not tight, resulting in poor heat dissipation efficiency. Of course, some solutions add a ceramic heat-conducting plate between the power component and the heat dissipation structure, ensuring insulation between the power component and the heat dissipation structure while achieving tighter contact. However, the heat dissipation efficiency of the ceramic heat-conducting plate is low and difficult to meet the heat dissipation requirements of the power component. In this embodiment, by adding a first heat-conducting layer 11 and a third heat-conducting layer 13 with a heat transfer coefficient greater than that of the second heat-conducting layer 12 on both sides of the second heat-conducting layer 12, the speed at which heat from the power component 30 is transferred to the second heat-conducting layer 12 is accelerated, and the speed at which heat from the second heat-conducting layer 12 is transferred to the heat dissipation structure is also accelerated. This ensures that the heat generated by the power component 30 can be conducted to the heat dissipation structure in a timely manner, preventing the temperature of the power component 30 from becoming too high.

[0039] In summary, this embodiment improves the heat transfer efficiency of the power component 30 and reduces its operating temperature by installing a heat-conducting module 1 on one side of the power component 30. Simultaneously, the design of the first heat-conducting layer 11, the second heat-conducting layer 12, and the third heat-conducting layer 13, while ensuring insulation of the power component 30 from other components, also increases the heat conduction rate of the heat-conducting module 1, further reducing the operating temperature of the power component 30.

[0040] Please refer to this again. Figures 6-7 In this embodiment, the orthographic projection of the first heat-conducting layer 11 on the power component 30 and the orthographic projection of the third heat-conducting layer 13 on the power component 30 are located within the orthographic projection of the second heat-conducting layer 12 on the power component 30.

[0041] As can be seen from the above, the second heat-conducting layer 12, while having a heat transfer function, can also ensure that the first heat-conducting layer 11 and the third heat-conducting layer 13 are mutually insulated, thereby making the power component 30 mutually insulated from the heat dissipation structure. Based on this, in this embodiment, the orthographic projection of the first heat-conducting layer 11 on the power component 30 and the orthographic projection of the third heat-conducting layer 13 on the power component 30 can be within the orthographic projection of the second heat-conducting layer 12 on the power component 30.

[0042] In other words, the area of ​​the second heat-conducting layer 12 is larger than the areas of the first heat-conducting layer 11 and the third heat-conducting layer 13, and the first heat-conducting layer 11 and the third heat-conducting layer 13 are both within the coverage area of ​​the second heat-conducting layer 12, that is, the edges of the first heat-conducting layer 11 and the third heat-conducting layer 13 do not protrude from the second heat-conducting layer 12. This avoids the first heat-conducting layer 11 and the third heat-conducting layer 13 from directly contacting each other across the second heat-conducting layer 12, thereby preventing the power component 30 from directly conducting heat dissipation structure.

[0043] Please refer to this again. Figures 6-7 In this embodiment, the power component 30 includes a circuit board 31 and a plurality of power transistors 32. The plurality of power transistors 32 are disposed on the side of the circuit board 31 away from the heat-conducting plate 10. The first heat-conducting layer 11 abuts against the power component 30. The orthographic projection of the plurality of power transistors 32 on the circuit board 31 is located within the orthographic projection of the first heat-conducting layer 11 on the circuit board 31.

[0044] The power assembly 30 includes a circuit board 31 and multiple power transistors 32. The circuit board 31 is used to mount components, and the power transistors 32 are used to form a voltage conversion circuit. The multiple power transistors 32 are disposed on the side of the circuit board 31 opposite to the heat-conducting plate 10; in other words, the power transistors 32 are disposed on one side of the circuit board 31, and the heat-conducting plate 10 is disposed on the other side. The first heat-conducting layer 11 abuts against the power assembly 30. Alternatively, the second and third heat-conducting layers 12 can be understood as being further away from the power assembly 30 than the first heat-conducting layer 11. The projection of the multiple power transistors 32 onto the circuit board 31 is within the area of ​​the projection of the first heat-conducting layer 11 onto the circuit board 31. In other words, the contact area between the first heat-conducting layer 11 and the circuit board 31 is larger than the contact area between the power transistors 32 and the circuit board 31. Simultaneously, the power transistors 32 are positioned corresponding to the first heat-conducting layer 11. This allows the heat emitted by the power transistors 32 to be promptly conducted to the first heat-conducting layer 11 located directly opposite the circuit board 31, thereby improving the heat dissipation effect of the heat-conducting module 1.

[0045] Please refer to this as well. Figure 6 , Figure 8 , Figure 8 This is a cross-sectional schematic diagram showing the power component, thermal module, and heat dissipation channel in conjunction in another embodiment of this application. In this embodiment, the area of ​​the first thermally conductive layer 11 projected onto the circuit board 31 is equal to the area of ​​the plurality of power transistors 32 projected onto the circuit board 31.

[0046] As described above, the projected area of ​​the multiple power transistors 32 onto the circuit board 31 is within the area of ​​the projected area of ​​the first thermally conductive layer 11 onto the circuit board 31. Based on this, this embodiment allows the projected area of ​​the first thermally conductive layer 11 onto the circuit board 31 to be equal to the projected area of ​​the multiple power transistors 32 onto the circuit board 31. In other words, the contact area between the first thermally conductive layer 11 and the circuit board 31 is equal to the contact area between the power transistors 32 and the circuit board 31, and each power transistor 32 is positioned directly opposite the first thermally conductive layer 11. This reduces the area of ​​the first thermally conductive layer 11 without affecting heat dissipation, thereby lowering the design cost of the thermal module 1.

[0047] Please refer to this as well. Figure 6 , Figure 9 , Figure 9 This is a cross-sectional schematic diagram of the power component and the heat-conducting module in one embodiment of this application. In this embodiment, the power component 30 includes a circuit board 31 and a power transistor 32. The circuit board 31 has a through hole, and the first heat-conducting layer 11 abuts against the circuit board 31. The heat-conducting plate 10 also includes a fourth heat-conducting layer 14, which is disposed in the through hole and abuts against the power transistor 32 and the first heat-conducting layer 11.

[0048] The power assembly 30 includes a circuit board 31 and a power transistor 32. The circuit board 31 is used to mount components, and the power transistor 32 is used to form a voltage-to-current conversion circuit. The circuit board 31 has a through hole, meaning that the circuit board 31 has a through hole that extends through both of its opposite sides. A first thermally conductive layer 11 abuts against the circuit board 31, meaning that the second thermally conductive layer 12 and the third thermally conductive layer 13 are further away from the power assembly 30 than the first thermally conductive layer 11. The heat-conducting plate 10 also includes a fourth thermally conductive layer 14, and the fourth thermally conductive layer 14 is disposed within the through hole, meaning that the fourth thermally conductive layer 14 is disposed within the through hole extending through the circuit board 31. The fourth thermally conductive layer 14 connects the power transistor 32 and the first thermally conductive layer 11; in other words, the through hole is disposed between the power transistor 32 and the first thermally conductive layer 11, with one end of the fourth thermally conductive layer 14 abutting against the power transistor 32 and the other end abutting against the first thermally conductive layer 11.

[0049] This can also be understood as having a fourth thermally conductive layer 14 between the power transistor 32 and the first thermally conductive layer 11. The fourth thermally conductive layer 14 is disposed within a through-hole penetrating the circuit board 31. One side of the fourth thermally conductive layer 14 is connected to the power transistor 32, and the other side is connected to the first thermally conductive layer 11. This allows the heat generated by the power transistor 32 to be directly conducted to the first thermally conductive layer 11 through the fourth thermally conductive layer 14 and then to the heat dissipation structure, avoiding heat transfer only through the circuit board 31 to the first thermally conductive layer 11. This increases the thermal conductivity between the first thermally conductive layer 11 and the power transistor 32, resulting in better heat dissipation of the thermally conductive module 1.

[0050] Optionally, the material of the fourth thermal conductive layer 14 includes, but is not limited to, solder, copper, ceramic, etc. Further optionally, when the fourth thermal conductive layer 14 is solder, the through-hole can be directly filled when the power transistor 32 is soldered to the circuit board 31, so that the solder is placed between the power transistor 32 and the first thermal conductive layer 11. This makes the solder filling the through-hole during soldering the fourth thermal conductive layer 14, reducing the difficulty of setting the fourth thermal conductive layer 14.

[0051] Please refer to this as well. Figures 1-4 , Figure 10 , Figure 10 This is a three-dimensional structural diagram of the connector in one embodiment of this application. In this embodiment, the heat-conducting module 1 further includes a connector 20, which is used to fix the heat-conducting plate 10 and the power component 30. The connector 20 is disposed at one end of the heat-conducting plate 10 and the power component 30. The connector 20, the second heat-conducting layer 12, and the power component 30 are engaged with a first mating part 22 through a first mating groove 21. The first mating part 22 is disposed in the first mating groove 21.

[0052] The heat-conducting module 1 also includes a connector 20, which is used to fix the heat-conducting plate 10 and the power component 30. The connector 20 is disposed at one end of the heat-conducting plate 10 and the power component 30, or it can be understood that the connector 20 is disposed on the outer side of the same edge of the heat-conducting plate 10 and the power component 30. The connector 20, the second heat-conducting layer 12, and the power component 30 are engaged with a first mating part 22 through a first mating groove 21, and the first mating part 22 is disposed within the first mating groove 21.

[0053] Specifically, the second heat-conducting layer 12 and the power component 30 may each have a first mating portion 22, and the connector 20 may have a first mating groove 21. The first mating portions 22 of the second heat-conducting layer 12 and the power component 30 are inserted into the first mating groove 21 of the connector 20, thereby connecting the heat-conducting plate 10 and the power component 30. Alternatively, the connector 20 may have a protruding first mating portion 22, and the second heat-conducting layer 12 and the power component 30 may each have a first mating groove 21. The first mating portion 22 of the connector 20 may be inserted into both the second heat-conducting layer 12 and the first mating groove 21 of the power component 30, thereby connecting and fixing the heat-conducting plate 10 and the power component 30. By providing the connector 20 and connecting the connector 20, the heat-conducting plate 10, and the power component 30 through the first mating groove 21 and the first mating portion 22, the connection between the heat-conducting module 1 and the power component 30 is made tighter, and the heat dissipation effect is better.

[0054] Please refer to Figure 12 , Figure 12 This is an exploded view of the second mating part and the second mating groove in one embodiment of this application. In this embodiment, the heat-conducting module 1 also includes a connector 20, which is used to fix to the bottom wall of the outer shell 4. The connector 20 and the bottom wall are mated by the second mating groove 23 and the second mating part 24, and the second mating part 24 is fixed in the second mating groove 23.

[0055] In this embodiment, the connector 20 can also be used to fix the heat-conducting module 1 to the bottom wall of the housing 4. The housing 4 is the overall housing 4 of the on-board charger 2, which is used to install various components. The connector 20 and the bottom wall are connected by a second mating groove 23 and a second mating part 24, and the second mating part 24 is inserted into the second mating groove 23.

[0056] Specifically, the bottom wall of the outer casing 4 can have a second mating groove 23, and the side of the connector 20 facing the bottom wall of the outer casing 4 can have a second mating portion 24. The second mating portion 24 of the connector 20 can be inserted into the second mating groove 23 of the bottom wall of the outer casing 4, thereby fixing the connector 20 to the bottom wall of the outer casing 4. Alternatively, the bottom wall of the outer casing 4 can have a second mating portion 24, and the side of the connector 20 facing the bottom wall of the outer casing 4 can have a second mating groove 23. The second mating portion 24 of the outer casing 4 can be inserted into the second mating groove 23 of the connector 20, thereby fixing the connector 20 to the bottom wall of the outer casing 4. In this embodiment, by fixing the connector 20 to the bottom wall of the outer casing 4, the position of the heat-conducting module 1 inside the outer casing 4 is fixed, facilitating the installation of the heat-conducting module 1.

[0057] Please refer to this as well. Figure 3 , Figures 10-11 , Figure 11 This is a cross-sectional schematic diagram of the power component and the heat-conducting module in another embodiment of this application. In this embodiment, the heat-conducting module 1 further includes a connector 20, which is used to connect the heat-conducting plate 10 and the power component 30. The connector 20 includes a bottom wall at one end of the heat-conducting plate 10 and the power component 30, and a first side wall 25 on the side of the power component 30 facing away from the heat-conducting plate 10. The first side wall 25 is bent and connected to the bottom wall.

[0058] As described above, the heat-conducting module 1 also includes a connector 20. The connection method and location of the connector 20 have been explained in detail above and will not be repeated here. In this embodiment, the connector 20 includes a bottom wall located at one end of the heat-conducting plate 10 and the power component 30, and a first side wall 25 located on the side of the power component 30 facing away from the heat-conducting plate 10. In other words, the connector 20 comprises two parts: a bottom wall and a first side wall 25. The bottom wall is located on the outer side of the edge of the heat-conducting plate 10 and the power component 30, and the first side wall 25 is located on the side of the power component 30 where the power tube 32 is located. The first side wall 25 is bent to connect to the bottom wall, meaning that the first side wall 25 is also located at the edge of the power component 30 in the same direction as the bottom wall, and the first side wall 25 is connected to the bottom wall. By providing a first sidewall 25 on the side of the power component 30 away from the heat-conducting plate 10, the first sidewall 25 can restrict the position of the power component 30, thereby making the heat-conducting plate 10 and the power component 30 more tightly connected and achieving better heat dissipation.

[0059] Please refer to this again. Figure 3 , Figures 10-11 In this embodiment, the connector 20 further includes two second sidewalls 26, which are disposed at opposite ends of the first sidewall 25, and the first sidewall 25 and the two second sidewalls 26 enclose a receiving space, and the end of the power component 30 is disposed within the receiving space.

[0060] As described above, the connector 20 includes a bottom wall disposed on the outer edge of the power assembly 30 and a first sidewall 25 disposed on the side of the power assembly 30 away from the heat-conducting plate 10. Based on this, this embodiment may further include two second sidewalls 26, which are respectively disposed at both ends of the first sidewall 25 along its extension direction. Simultaneously, the two second sidewalls 26 are also respectively disposed on the outer sides of two other adjacent sides of the power assembly 30. Thus, the first sidewall 25 and the two second sidewalls 26 enclose a receiving space, and the end of the power assembly 30 facing the connector is disposed within this receiving space.

[0061] In this embodiment, two second sidewalls 26 are added to the opposite ends of the first sidewall 25. In addition to limiting the position of the power component 30 in the arrangement direction of the power component 30 and the heat-conducting plate 10, this also limits the position of the power component 30 perpendicular to the arrangement direction of the power component 30 and the heat-conducting plate 10. This improves the limiting effect of the connector 20 on the power component 30, resulting in a better connection between the heat-conducting module 1 and the power component 30, and preventing the heat-conducting module 1 from separating from the power component 30.

[0062] Please refer to Figure 13 , Figure 13 This is an exploded view of an on-board charger according to one embodiment of this application. This embodiment provides an on-board charger 2, which includes a power component 30, a heat dissipation channel 3, and a heat-conducting module 1 as provided in the above embodiment of this application. The heat-conducting module 1 is used to conduct heat from the power component 30 to the heat dissipation channel 3, and the heat-conducting module 1 is disposed between the power component 30 and the heat dissipation channel 3.

[0063] The on-board charger 2 includes a power component 30, a heat dissipation channel 3, and a heat-conducting module 1 as provided in the above embodiments of this application, wherein the heat-conducting module 1 is disposed between the power component 30 and the heat dissipation channel 3. That is, one side of the heat-conducting module 1 abuts against the heat dissipation channel 3, and the other side abuts against the power module. When the on-board charger 2 is operating, a large amount of heat is generated in the power component 30 due to the high-voltage current passing through the circuit. In this embodiment, the heat-conducting module 1 can be disposed on the side of the power module facing the heat dissipation channel 3, thereby accelerating the heat conduction between the heat dissipation channel 3 and the power component 30.

[0064] By using the heat-conducting module 1 provided in this application, the heat generated by the power component 30 can be conducted to the heat dissipation channel 3 more quickly, which increases the heat dissipation efficiency of the power component 30, thereby reducing the overall temperature of the on-board charger 2 and extending the service life of the on-board charger 2.

[0065] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. Moreover, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0067] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0068] The foregoing has provided a detailed description of the embodiments of this application, elucidating and explaining the principles and implementation methods of this application. These descriptions are merely for the purpose of aiding understanding the method and core ideas of this application. However, the content of this specification should not be construed as a limitation of this application. Those skilled in the art can make various modifications and variations to this application without departing from its spirit and scope. These modifications and variations fall within the scope of the claims of this application and their equivalents.

Claims

1. A heat conducting module for assisting heat dissipation of a power assembly, characterized in that, The heat conduction module is arranged on one side of the power assembly, and the heat conduction module comprises a heat conduction plate, the heat conduction plate comprises a first heat conduction layer, a second heat conduction layer and a third heat conduction layer arranged in layers, and the heat transfer coefficient of the first heat conduction layer and the heat transfer coefficient of the third heat conduction layer are greater than the heat transfer coefficient of the second heat conduction layer.

2. The heat-conducting module of claim 1, wherein The orthographic projection of the first heat conduction layer on the power assembly and the orthographic projection of the third heat conduction layer on the power assembly are located in the orthographic projection of the second heat conduction layer on the power assembly.

3. The heat-conducting module of claim 1, wherein The power assembly comprises a circuit board and a plurality of power tubes, the plurality of power tubes are arranged on the side of the circuit board away from the heat conduction plate, the first heat conduction layer abuts against the power assembly, and the orthographic projection of the plurality of power tubes on the circuit board is located in the orthographic projection of the first heat conduction layer on the circuit board.

4. The thermally conductive module of claim 3, wherein, The area of the orthographic projection of the first heat conduction layer on the circuit board is equal to the area of the orthographic projection of the plurality of power tubes on the circuit board.

5. The thermally-conductive module of claim 1, wherein, The power assembly comprises a circuit board and a power tube, the circuit board has a through hole, the first heat conduction layer abuts against the circuit board, the heat conduction plate further comprises a fourth heat conduction layer, the fourth heat conduction layer is arranged in the through hole, and the fourth heat conduction layer abuts against the power tube and the first heat conduction layer.

6. The thermally-conductive module of claim 1, wherein, The heat conduction module further comprises a connecting piece, the connecting piece is used for connecting the heat conduction plate and the power assembly, the connecting piece is arranged at one end of the heat conduction plate and the power assembly, the connecting piece and the second heat conduction layer and the power assembly are matched through a first matching groove and a first matching part, and the first matching part is arranged in the first matching groove.

7. The thermally-conductive module of claim 1, wherein, The heat conduction module further comprises a connecting piece, the connecting piece is used for being fixed to the bottom wall of the shell, the connecting piece and the bottom wall are matched through a second matching groove and a second matching part, and the second matching part is fixed in the second matching groove.

8. The thermally-conductive module of claim 1, wherein, The heat conduction module further comprises a connecting piece, the connecting piece is used for connecting the heat conduction plate and the power assembly, the connecting piece comprises a bottom wall arranged at one end of the heat conduction plate and the power assembly, and a first side wall arranged on the side of the power assembly away from the heat conduction plate, and the first side wall is connected to the bottom wall in a bent mode.

9. The thermally-conductive module of claim 8, wherein, The connecting piece further comprises two second side walls, the two second side walls are arranged at opposite ends of the first side wall, and the first side wall and the two second side walls surround to form a containing space, and the end part of the power assembly is arranged in the containing space.

10. An on-board charger, characterized by, The vehicle-mounted charger comprises a power assembly, a heat dissipation channel and the heat conduction module according to any one of claims 1-9, the heat conduction module is used for conducting heat from the power assembly to the heat dissipation channel, and the heat conduction module is arranged between the power assembly and the heat dissipation channel.

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