Refrigeration helmet structure

Abstract

The utility model discloses a refrigeration helmet structure, which comprises a shell and a top cushion layer, and is characterized in that the top cushion layer is positioned by a bayonet arranged on the inner side of the shell to form an air supply cavity, a plurality of buffer layer hollows are arranged on the top cushion layer, and a liner liner matched with the top cushion layer is arranged on the inner side of the top cushion layer. And the liner liner is provided with liner hollows matched with the buffer layer hollows. The top cushion layer is positioned through the design of the bayonet in the shell, and the air supply cavity is directly formed, so that cold air cooled by the semiconductor refrigeration module can be uniformly supplied into the helmet through the cavity, energy loss is reduced, the refrigeration effect of the helmet is ensured, a wearer feels comfortable, the structure is simple, and assembly and maintenance are easy.

Description

Technical Field

[0001] This utility model relates to helmet technology, and in particular to a cooling helmet structure. Background Technology

[0002] Helmets are widely used as essential protective gear in everyday life, such as when riding motorcycles, electric bikes, and bicycles, as well as in workplaces like factories and construction sites. However, in summer or during strenuous physical activity, helmets can hinder heat dissipation from the head. Since the head is a concentrated area for heat dissipation, this can lead to feelings of heat and stuffiness. Consequently, some people are unwilling to wear helmets due to insufficient comfort, creating safety hazards. This problem is particularly prominent in helmet use and urgently needs to be addressed.

[0003] Currently, ventilated or cooled helmets typically rely on direct fan airflow or radiant cooling via semiconductor cooling chips. This cannot guarantee uniform airflow within the helmet, resulting in poor ventilation or cooling performance. Therefore, a new design solution is needed to combine semiconductor cooling with ventilation, delivering cool air evenly into the helmet and ensuring effective cooling and ventilation. Summary of the Invention

[0004] The purpose of this invention is to solve the above-mentioned problems and provide a cooling helmet structure. Through the special structure of the helmet shell and the cushioning pad, an air supply cavity is formed, which can effectively ensure that the cold air from the semiconductor cooling module is evenly delivered into the helmet, thereby effectively improving the cooling effect and enhancing the head comfort of the rider.

[0005] The above-mentioned technical problems of this utility model are mainly solved by the following technical solution: a cooling helmet structure, including a shell and a top pad, characterized in that the top pad, which is positioned by a snap-fit ​​on the inner side of the shell, forms an air supply cavity, the top pad is provided with a plurality of buffer layer perforations, and an inner liner pad that cooperates with the top pad is provided on the inner side of the top pad, the inner liner pad being provided with pad perforations that cooperate with the buffer layer perforations.

[0006] In the aforementioned cooling helmet structure, preferably, the latches provided on the inner side of the shell include a front latch located at the front of the shell and a tail latch located at the rear of the shell.

[0007] In the aforementioned cooling helmet structure, preferably, the front end latch is a U-shaped one-way slot structure, and the top padding layer has a folded edge, which is sealed to the front end latch.

[0008] In the aforementioned cooling helmet structure, preferably, the tail end latch has an H-shaped double slot structure, wherein one slot is sealed to the edge of the top padding layer, and the other slot is sealed to the bottom padding layer.

[0009] In the aforementioned cooling helmet structure, preferably, the shell also includes goggles and a chin guard, with the chin guard having a breathing hole.

[0010] In the aforementioned cooling helmet structure, preferably, the tail end latch extends to the goggle pivot position.

[0011] In the aforementioned cooling helmet structure, preferably, a temperature control module is provided at the rear of the shell, and the end of the air supply cavity is connected to the air supply channel of the cooling module.

[0012] In the aforementioned cooling helmet structure, preferably, the shell is a full-face helmet structure, and the bottom padding layer also includes a padding portion located inside the chin protection section.

[0013] This technical solution is designed based on a full-face helmet structure, utilizing semiconductor cooling to deliver air into the helmet's interior. The top padding layer is positioned using a snap-fit ​​design on the inner side of the shell, forming an air delivery cavity. This avoids the complexities, energy loss, and increased weight associated with using a custom double-layer shell to create an air delivery cavity. Furthermore, the top padding layer and inner liner are ergonomically designed with perforations to ensure even airflow within the helmet.

[0014] Compared with the prior art, the beneficial effects of this utility model are: by using the design of the internal snap-fit ​​of the shell to position the top pad and directly form the air supply cavity, the cold air cooled by the semiconductor cooling module can be evenly delivered to the inside of the helmet through the cavity, reducing energy loss, ensuring the cooling effect of the helmet, making the wearer feel comfortable, and the structure is simple and easy to assemble and maintain. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall cross-sectional structure of this utility model.

[0016] Figure 2 yes Figure 1 A magnified schematic diagram of the structure at point A in the middle.

[0017] Figure 3 yes Figure 1 A magnified schematic diagram of the structure at point B in the middle.

[0018] Figure 4 This is a schematic diagram of the external structure of this utility model.

[0019] Figure 5 This is a schematic diagram of a different type of bayonet arrangement structure on the inner side of the shell of this utility model.

[0020] In the diagram: 1-shell, 101-air supply cavity, 102-breathing hole, 103-front bayonet, 104-tail bayonet, 2-temperature control module, 3-top padding, 301-buffered layer cutout, 4-inner liner, 401-liner cutout, 5-bottom padding, 6-goggles. Detailed Implementation

[0021] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0022] This embodiment describes a cooling helmet structure, such as... Figure 1 As shown, the helmet includes a full-face helmet shell 1, a top pad 3 located inside the shell 1, a snap-fit ​​mechanism on the inner side of the shell 1, and a temperature control module 2 located at the rear of the shell 1. The top pad 3 is positioned by the snap-fit ​​mechanism on the inner side of the shell 1, forming an air supply cavity 101 between the two. The end of the air supply cavity 101 is directly connected to the air supply channel of the cooling module 2 to deliver cold air.

[0023] The shell 1 is made of materials such as carbon fiber or fiberglass, and the helmet has a visor 6 at the front. Figure 4 As shown, a chin guard is provided below the goggles 6, and a breathing hole 102 is provided in the chin guard.

[0024] The temperature control module 2 is the heat source for the helmet's cooling and heating functions in this embodiment. The temperature control module is integrally formed or assembled on the rear of the helmet shell 1. Cooling is provided by semiconductor cooling, and the positive and negative terminals of the power supply can be switched in winter to achieve the heating function.

[0025] The top pad 3 has multiple buffer layer cutouts 301, and the inner liner 4 that matches the top pad 3 is provided on the inner side of the top pad 3. The inner liner 4 also has multiple pad cutouts 401 that match the buffer layer cutouts 301.

[0026] Furthermore, the bayonet provided inside the housing 1 has two main structural forms: one is the front bayonet 103 located at the front and front side of the housing, and the other is the tail bayonet 104 located at the rear and rear side of the housing, such as... Figure 5 As shown. The front-end bayonet 103 is a U-shaped unidirectional slot structure, as... Figure 2 As shown, the top pad 3 has a folded edge on its side, mainly to form an air supply cavity 101 with the inner wall of the housing 1. The folded edge and the front end latch 103 are sealed together by an adhesive bonding process. The rear end latch 104 has an H-shaped double-slot structure, as shown... Figure 3As shown, one side of the slot and the edge of the top pad 3 are sealed by an interference fit, while the other side of the slot and the bottom pad 5 are sealed by a non-fixed connection process. The bottom pad 5 also includes a padding part located inside the chin protection section. The connection between the bottom pad 3 and the tail end slot 104 is generally a non-fixed connection to ensure the ease of disassembly of the bottom pad 3, which is beneficial for the cooling module 2 to be repaired through the inspection port opened inside the helmet.

[0027] Furthermore, the tail end latch 104 extends to the position near the pivot of the goggles 6 to accommodate the overall installation of the bottom pad 5. Then, in areas where the bottom pad 5 is not required, it changes to a U-shaped front end latch 103, which can effectively fix the top pad 3.

[0028] The top padding layer 3 and the bottom padding layer 5 are made of materials such as EPS, which can be squeezed and deformed when the helmet is impacted, absorbing the impact force and reducing the impact on the head. Considering wearing comfort, the top padding layer 3 and the bottom padding layer 5 can also be made of materials such as velvet, and the range of the cutouts in the inner liner padding 4 can also be more flexible, but the main principle is not to block the air vents formed by the cutouts in the top padding layer 3.

[0029] Working principle and usage:

[0030] By setting the front end bayonet 103 and the rear end bayonet 104 in the shell 1, the top pad 3 is fixed, so that the inner wall of the shell 1 and the top pad 3 directly form the air supply cavity 101. The cold air cooled by the semiconductor cooling module 2 is evenly delivered to the inside of the helmet through the cavity, reducing the loss of cold energy and ensuring the cooling effect of the helmet.

[0031] To fully illustrate the application of this embodiment, only one example, temperature control module 2, will be given here for a brief explanation.

[0032] The temperature control module 2 in this device is integrated with the housing 1 and can have an independent casing. Its air supply duct is directly connected to the air supply cavity 101 formed by the housing 1 and the top pad 3. The temperature control module 2 has an air supply chamber, a ventilation chamber, a control chamber, and a power supply chamber. The casing is equipped with a fresh air inlet, a heat dissipation inlet, and an air supply duct. The fresh air inlet is located at the bottom of the casing, the heat dissipation inlet is located on the outside of the casing relative to the housing 1, and the air supply duct is located at the top of the housing 1. A thermoelectric cooler is disposed between the air supply chamber and the ventilation chamber. The thermoelectric cooler has cooling fins on the side facing the air supply chamber and heat dissipation fins on the side facing the ventilation chamber. A centrifugal fan is installed between the air supply chamber and the fresh air inlet, and an axial fan is installed in the ventilation chamber. The air supply duct is connected to the air supply cavity. Fresh air is introduced into the air supply chamber by a centrifugal fan. The fresh air undergoes heat exchange between the cooling fins and the semiconductor cooling chip. The cooled air then enters the air supply cavity 101 through the air supply duct and is evenly distributed inside the helmet shell 1 to cool the inside of the helmet. At the hot end of the semiconductor cooling chip, an axial flow fan expels the heat absorbed by the heat dissipation fins from the shell.

[0033] The helmet in this embodiment can also be a half helmet, a 3 / 4 helmet, an off-road helmet, etc., but its technical solution can be inspired by this solution and is within the protection scope of this solution.

[0034] The above embodiments are illustrative of the present invention and not intended to limit the present invention. The described embodiments are merely some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

Claims

1. A refrigeration headgear structure comprising a shell (1), a top cushion (3), characterised in that, The air supply cavity (101) is formed by a bayonet positioning top pad layer arranged inside the shell, the top pad layer is provided with a plurality of buffer layer hollows (301), and an inner liner gasket (4) matched with the top pad layer is arranged inside the top pad layer, and the inner liner gasket is provided with gasket hollows (401) matched with the buffer layer hollows.

2. A cooling headgear structure according to claim 1, wherein The bayonet arranged inside the shell (1) comprises a front end bayonet (103) located at the front part of the shell and a tail end bayonet (104) located at the rear part of the shell.

3. A cooling headgear structure according to claim 2, wherein, The front end bayonet (103) is a U-shaped one-way clamping groove structure, the top pad layer (3) is provided with a folded edge at the edge part, and the folded edge part is sealingly matched with the front end bayonet.

4. A cooling headgear structure according to claim 2, wherein The tail end bayonet (104) is an H-shaped double clamping groove structure, one side clamping groove is sealingly matched with the edge part of the top pad layer (3), and the other side clamping groove is sealingly matched with the bottom pad layer (5).

5. A cooling headgear structure according to claim 2 or 3 or 4, wherein, The shell (1) further comprises a goggle (6) and a chin protection part, and the chin protection part is provided with a breathing hole (102).

6. A cooling headgear structure according to claim 5, wherein, The tail end bayonet (104) extends to the position of the rotating shaft of the goggle (6).

7. A refrigeration headgear structure according to claim 1 wherein The rear part of the shell (1) is provided with a temperature control module (2), and the tail end of the air supply cavity (101) is in communication with an air supply channel of the refrigeration module.

8. A cooling headgear structure according to claim 4, wherein, The shell (1) is a full helmet structure, and the bottom pad layer (5) further comprises a gasket part located inside the chin protection part.

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