LED lamp bead
By introducing a heat sink column and heat sink layer heat dissipation structure into the LED beads, the problem of poor heat dissipation of the planar substrate is solved, the heat dissipation efficiency is improved and the service life of the LED beads is extended.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-13
AI Technical Summary
In existing small-pitch LED devices, the planar substrate structure leads to poor heat dissipation, and the heat accumulation affects chip performance and shortens lifespan.
A heat dissipation structure consisting of heat sink pillars and a heat sink layer is adopted. Heat is conducted to the heat sink layer through the corresponding heat sink pillars and pads. The copper pillars enhance the mechanical strength of the substrate and expand the heat dissipation channels.
It improves heat dissipation efficiency, reduces operating temperature, reduces performance degradation and failures caused by high temperature, and extends the lifespan of LED beads.
Smart Images
Figure CN223993859U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED technology, and in particular to an LED lamp bead. Background Technology
[0002] In current small-pitch LED devices, a flat BT substrate is used as the support structure.
[0003] It is worth noting that this substrate has a planar structure. As LED display technology continues to advance towards higher resolution, the size of the LED chips is gradually decreasing. In this context, to achieve higher resolution and clearer display effects, the number of RGB chips required per unit area is also increasing. However, during the operation of the LED chips, the planar substrate structure has certain limitations in heat dissipation, resulting in a large amount of heat generated that cannot be dissipated effectively and promptly. This heat accumulation severely impacts chip performance, leading to a sharp decline in chip lifespan. Utility Model Content
[0004] In view of the above situation, it is necessary to provide an LED chip that addresses the problem of poor heat dissipation in existing LED chips.
[0005] An LED lamp bead includes a substrate and a heat sink assembly embedded in the substrate. A front assembly and a back assembly are respectively disposed on opposite sides of the substrate. The front assembly includes a die-bonding region with a plurality of pads for bonding light-emitting chips. The heat sink assembly includes a plurality of heat sink pillars and a heat sink layer. The heat sink pillars correspond to the positions of the pads. The heat sink layer is disposed within the substrate, with opposite ends of the heat sink layer located outside the substrate. The heat sink layer has a heat sink area. The opposite ends of the heat sink pillars abut against the pads and the heat sink area, respectively. The front assembly is electrically connected to the back assembly through the substrate.
[0006] The beneficial effects of this utility model are:
[0007] By placing heat sink pillars between the front-side component and the heat sink layer, with the pillars corresponding to the pads, the heat generated by the LED chip can be rapidly conducted to the heat sink layer. This heat dissipation structure greatly improves the efficiency of heat transfer from the LED chip to the outside, effectively reducing the operating temperature of the LED chip. The heat sink layer and pillars also reduce warping that may occur during the baking process, preventing encapsulation cracking and chip compression. Lower operating temperatures slow down the aging process of the LED chips, reducing performance degradation and the probability of failure caused by high temperatures, thus significantly extending the lifespan of the LED chips.
[0008] Furthermore, a plurality of first through holes are provided on the periphery of the substrate, and copper pillars are sleeved in the first through holes, with the opposite ends of the copper pillars protruding out of the first through holes.
[0009] Furthermore, a plurality of heat sink holes are provided around the periphery of the heat sink area, and the heat sink area is connected to one of the heat sink holes.
[0010] Furthermore, the front-side component also includes several wire bonding areas and several second vias. The wire bonding areas are electrically connected to the die-bonding area via bonding wires. The second vias are disposed on the periphery of the die-bonding area and the wire bonding area. The die-bonding area is electrically connected to one of the second vias, and the wire bonding area is electrically connected to the remaining second vias.
[0011] Furthermore, the rear assembly includes a plurality of LED pins and a plurality of third through holes, the third through holes being disposed on the periphery of the LED pins and electrically connected to the LED pins.
[0012] Furthermore, the positions of the first through hole, the second through hole, the third through hole, and the heat sink hole correspond.
[0013] Furthermore, an encapsulating adhesive layer is provided on the front component. Attached Figure Description
[0014] Figure 1 This is a side view of the LED lamp bead of this utility model;
[0015] Figure 2 This is a structural schematic diagram of the front component of this utility model;
[0016] Figure 3 This is a schematic diagram of the structure of the heat sink layer of this utility model;
[0017] Figure 4 This is a schematic diagram of the structure of the back panel component of this utility model.
[0018] In the diagram: 1. Substrate; 11. Copper pillar; 2. Heat sink assembly; 21. Heat sink layer; 211. Heat sink area; 212. Heat sink hole; 22. Heat sink pillar; 3. Front assembly; 31. Die bonding area; 311. Pad; 3111. Light-emitting chip; 32. Wire bonding area; 33. Second via; 34. Bonding wire; 35. Encapsulating adhesive layer; 4. Back assembly; 41. LED pin; 42. Third via. Detailed Implementation
[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. Furthermore, the various embodiments of the invention, the features within those embodiments, and the features of the embodiments may be freely combined without obvious conflict or contradiction.
[0022] One type of LED light bead, such as Figure 1 As shown, it includes a substrate 1 and a heat sink assembly 2.
[0023] Specifically, such as Figures 1 to 4 As shown, a front assembly 3 and a back assembly 4 are respectively disposed on opposite sides of the substrate 1. Multiple first through holes (not shown) are provided on the periphery of the substrate 1. Copper pillars 11 are fitted inside the first through holes, with their opposite ends protruding outside the first through holes. The second through hole 33 of the front assembly 3 communicates with the third through hole 42 of the back assembly 4 through the first through holes. The copper pillars 11 fitted inside the first through holes not only serve as electrical connections but also enhance the mechanical strength of the substrate 1 to a certain extent. The copper pillars 11, distributed on the periphery of the substrate 1, provide support and reinforcement, preventing deformation or damage to the substrate 1 due to external forces during use, thus improving the reliability and service life of the substrate 1. Furthermore, the heat generated by the light-emitting chip 3111 is conducted to the LED pins 41 of the back assembly 4 via the copper pillars 11, thereby expanding the heat dissipation channel and increasing the heat dissipation area, and improving the service life of the LED beads.
[0024] Specifically, the front component 3 includes a die-bonding area 31, multiple wire bonding areas 32, and multiple second vias 33. The die-bonding area 31 has bonding pads 311 for bonding the light-emitting chip 3111. The wire bonding areas 32 are electrically connected to the die-bonding area 31 via bonding wires 34. The second vias 33 are located around the die-bonding area 31 and the wire bonding areas 32. The die-bonding area 31 is electrically connected to one of the second vias 33, and the wire bonding area 32 is electrically connected to the remaining second vias 33. An encapsulating adhesive layer 35 is provided on the front component 3. The back component 4 includes multiple LED pins 41 and multiple third vias 42. The third vias 42 are located around the LED pins 41 and are electrically connected to them. Through one of the third vias 42 in the back component 4 (specifically...) Figure 4 The third through hole 42 in the upper right corner is connected to the positive terminal of the external power supply, and the first through hole is connected via one of the second through holes 33 (corresponding to...). Figure 2 The second through-hole 33 in the upper right corner is connected to the bonding area 32. This bonding area 32 is electrically connected to the positive terminals of the three light-emitting chips 3111 bonded to the die-bonding area 31 via bonding wires 34, thus forming a common positive terminal. At the same time, the other three third through-holes 42 of the back assembly 4 are connected to the negative terminal of the external power supply, and then connected to the die-bonding area 31 and the other two bonding areas 32 respectively through the first through-hole and the other three second through-holes 33. The two bonding areas 32 are electrically connected to the two light-emitting chips 3111 bonded to the die-bonding area 31 via bonding wires 34. The negative terminal of the other light-emitting chip 3111 is bonded to the die-bonding area 31 with silver paste to form a separate negative terminal connection, thus constructing a complete current transmission path for the three light-emitting chips 3111. Through this layout design, signal interference is effectively reduced and resistance loss is reduced, thereby ensuring that the light-emitting chip 3111 can stably obtain power and emit light. An encapsulating adhesive layer 35 is provided on the front component 3, which can protect the light-emitting chip 3111, the bonding area 32 and related circuits from damage caused by external environmental factors (such as moisture, dust, etc.). Moreover, this layout allows the encapsulating adhesive layer 35 to cover the required area more evenly, improving the encapsulation quality.
[0025] Specifically, the heat sink assembly 2 includes a heat sink layer 21 and multiple heat sink pillars 22. The heat sink pillars 22 correspond to the positions of the pads 311. The heat sink layer 21 is provided inside the substrate 1, and the two opposite ends of the heat sink layer 21 are located outside the substrate 1. The heat sink layer 21 has a heat sink area 211. The two opposite ends of the heat sink pillars 22 abut against the pads 311 and the heat sink area 211, respectively. Multiple heat sink holes 212 are provided around the periphery of the heat sink area 211, and the heat sink area 211 is connected to one of the heat sink holes 212. The heat sink area 211 and the multiple heat sink pillars 22 in the heat sink assembly 2 work together to provide multiple heat dissipation conduction paths for the heat generated by the light-emitting chip 3111. The heat sink pillar 22 is positioned corresponding to the pad 311. A through hole is opened at the bottom of the corresponding pad on the substrate, so that the two ends of the heat sink pillar 22 respectively abut against the pad 311 and the heat sink area 211. It can directly receive and conduct heat generated from the light-emitting chip 3111, and can quickly guide the heat to the heat sink area 211 to further dissipate the heat. This effectively accelerates the speed at which heat is transferred from the light-emitting chip 3111 to the external environment, and greatly improves the heat dissipation efficiency of the entire component.
[0026] Specifically, the positions of the first through hole, the second through hole 33, the third through hole 42, and the heat sink hole 212 correspond. This arrangement ensures an effective connection between the front component 3, the heat sink layer 21, the substrate 1, and the back component 4.
[0027] This invention utilizes a heat sink 22 positioned between the front component 3 and the heat sink layer 21, with the heat sink 22 corresponding to the pad 311. This allows heat generated by the light-emitting chip 3111 to be rapidly conducted to the heat sink layer 21. This dual heat dissipation structure significantly improves the efficiency of heat transfer from the light-emitting chip 3111 to the outside, effectively reducing the operating temperature of the LED beads. By incorporating the heat sink layer 21 and the heat sink 22, warping that may occur during the baking process can be reduced, preventing encapsulation cracking and chip compression. The lower operating temperature slows down the aging rate of the LED beads, reducing performance degradation and the probability of failure due to high temperatures, thus significantly extending the lifespan of the LED beads. The copper pillars 11, distributed around the periphery of the substrate 1, provide support and reinforcement, preventing deformation or damage to the substrate 1 during use, thereby improving the reliability and lifespan of the substrate 1. Furthermore, the heat generated by the light-emitting chip is conducted to the LED pins 41 of the back component 4 via the copper pillars 11, thereby expanding the heat dissipation channel and increasing the heat dissipation area.
[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0029] The embodiments described above are merely illustrative of the implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. An LED lamp bead, characterized in that: The application relates to a substrate and a heat sink assembly embedded in the substrate, opposite surfaces of the substrate are respectively provided with a front surface assembly and a back surface assembly, the front surface assembly comprises a die bonding area, a plurality of pads are arranged in the die bonding area, the pads are used for binding light emitting chips, the heat sink assembly comprises a plurality of heat sink columns and a heat sink layer, the heat sink columns correspond to positions of the pads, the heat sink layer is arranged in the substrate, and opposite ends of the heat sink layer are located outside the substrate, a heat sink area is arranged on the heat sink layer, and opposite ends of the heat sink columns are respectively in contact with the pads and the heat sink area, and the front surface assembly is electrically connected with the back surface assembly through the substrate.
2. The LED lamp bead of claim 1, wherein: A plurality of first through holes are arranged on the periphery of the substrate, copper columns are sleeved in the first through holes, and opposite ends of the copper columns protrude outside the first through holes.
3. The LED lamp bead of claim 2, wherein: A plurality of heat sink holes are arranged on the periphery of the heat sink area, and the heat sink area is connected with one of the heat sink holes.
4. The LED lamp bead of claim 3, wherein: The front surface assembly further comprises a plurality of wire bonding areas and a plurality of second through holes, the wire bonding areas are electrically connected with the die bonding area through bonding wires, the second through holes are arranged on the periphery of the die bonding area and the wire bonding areas, the die bonding area is electrically connected with one of the second through holes, and the wire bonding areas are electrically connected with the remaining second through holes.
5. The LED lamp bead of claim 4, wherein: The back surface assembly comprises a plurality of LED pins and a plurality of third through holes, the third through holes are arranged on the periphery of the LED pins and are electrically connected with the LED pins.
6. The LED lamp bead of claim 5, wherein: The first through holes correspond to positions of the second through holes, the third through holes and the heat sink holes.
7. The LED lamp bead of claim 4, wherein: A packaging adhesive layer is arranged on the front surface assembly.