Heat sink, power assembly, and electrical device

Abstract

The application relates to a heat dissipation device, a power assembly and an electrical equipment. The heat dissipation device comprises a heat dissipation body and an end plate assembly. The heat dissipation body defines a heat dissipation groove extending along a first direction, the heat dissipation groove being used for accommodating a heating element. The heat dissipation body has a heat dissipation channel, the heat dissipation channel being arranged on the peripheral side of the heat dissipation groove, and a cooling medium flows through the heat dissipation channel. The end plate assembly is arranged at the end of the heat dissipation groove along the first direction. At least one end plate assembly comprises an inner end plate and an outer end plate. The inner end plate and the outer end plate are arranged on the heat dissipation body in a stacked manner along the first direction. An accommodation space is defined between the inner end plate and the outer end plate and is communicated with the heat dissipation channel. The application is beneficial to improving the convenience of welding, reducing the difficulty of welding, facilitating the welding of firm welding points, reducing the risk of liquid leakage, and improving the cooling performance of the heat dissipation device.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to a heat dissipation device, power component, and electrical equipment. Background Technology

[0002] Energy storage converters are widely used in both distributed and centralized energy storage systems, serving as the core equipment for AC / DC conversion within these systems. Cooling is a critical factor affecting the performance of energy storage converters. The fabrication of energy storage converters in related technologies is relatively difficult, especially welding, which is prone to defects such as liquid leakage, thus easily leading to a decrease in cooling performance. Utility Model Content

[0003] Based on this, a heat dissipation device, a power component, and an electrical device are provided to improve the ease of manufacturing the heat dissipation device, the power component, and the electrical device, reduce the welding difficulty, improve the quality of the finished product, reduce the risk of leakage, and improve the cooling performance.

[0004] According to one aspect of this application, a heat dissipation device is provided, the heat dissipation device comprising:

[0005] A heat sink body defines a heat sink extending along a first direction, the heat sink being used to house a heat-generating element; the heat sink body has a heat dissipation channel disposed around the periphery of the heat sink, and a cooling medium flows within the heat dissipation channel; and

[0006] An end plate assembly is disposed at the end of the heat dissipation groove along the first direction. At least one end plate assembly includes an inner end plate and an outer end plate, which are stacked on the heat dissipation body along the first direction. A receiving space communicating with the heat dissipation channel is defined between the inner end plate and the outer end plate.

[0007] In one embodiment, the heat dissipation body includes a base plate, a first side plate, and a second side plate. The first side plate and the second side plate are located on opposite sides of the base plate along a second direction and together with the base plate define the heat dissipation groove. At least two of the base plate, the first side plate, and the second side plate are provided with the heat dissipation channel.

[0008] The heat dissipation device further includes a separator disposed within the receiving space of the end plate assembly to divide the receiving space of the end plate assembly into at least two sub-spaces, and the at least two sub-spaces sequentially connect each of the heat dissipation channels.

[0009] In one embodiment, the heat dissipation channel includes a first heat dissipation channel, a second heat dissipation channel, a third heat dissipation channel, and a fourth heat dissipation channel. The first heat dissipation channel is disposed within the first side plate, the second heat dissipation channel is disposed within the bottom plate, the third heat dissipation channel is disposed within the second side plate, and the fourth heat dissipation channel is disposed within both the first and second side plates. A first end of the first heat dissipation channel is used to connect to the output end of an external heat exchanger, and a second end of the first heat dissipation channel is connected to the second end of the second heat dissipation channel. A first end of the second heat dissipation channel is connected to the first end of the third heat dissipation channel, and a second end of the third heat dissipation channel is connected to the second end of the fourth heat dissipation channel. A first end of the fourth heat dissipation channel is used to connect to the input end of the external heat exchanger.

[0010] In one embodiment, the heat dissipation channel includes a fifth heat dissipation channel and a sixth heat dissipation channel. One of the fifth heat dissipation channel and the sixth heat dissipation channel is disposed on the first side plate, and the other of the fifth heat dissipation channel and the sixth heat dissipation channel is disposed on the second side plate. The first end of the fifth heat dissipation channel is used to connect to the output end of the external heat exchanger, and the second end of the fifth heat dissipation channel is connected to the first end of the sixth heat dissipation channel. The second end of the sixth heat dissipation channel is used to connect to the input end of the external heat exchanger.

[0011] In one embodiment, a separator is disposed on the inner end plate, and the outer end plate is provided with a limiting channel that exposes only a portion of the corresponding separator, the inner sidewall of the limiting channel abutting against at least a portion of the outer sidewall of the corresponding separator.

[0012] In one embodiment, the base plate, the first side plate, and the second side plate are integrally formed.

[0013] In one embodiment, the outer end plate of the end plate assembly is provided with an inlet and an outlet communicating with the receiving space.

[0014] In one embodiment, the heat dissipation device further includes a top sealing plate, which has wire holes and potting holes. The wire holes are used for the wires of the heat-generating element in the heat dissipation tank to pass through, and the potting holes are used for injecting thermally conductive adhesive into the heat dissipation tank.

[0015] In one embodiment, the first side plate and / or the second side plate has a heat dissipation mounting surface on the side opposite to the heat dissipation groove, the heat dissipation mounting surface being used to mount the working unit.

[0016] In one embodiment, the inner end plate is disposed within the heat dissipation groove, and the outer end plate is disposed on the end face of the heat dissipation body.

[0017] According to another aspect of this application, a power component is provided, including the heat dissipation device in any of the above embodiments, and the power component further includes a working unit disposed on the outer periphery of the heat dissipation device.

[0018] In one embodiment, the heating element is configured as an inductor, the working unit includes a capacitor and a power board, and the inductor is disposed within the heat sink;

[0019] The heat dissipation device has at least one heat dissipation mounting surface on the side opposite to the heat dissipation groove, and the power board is attached to at least one of the heat dissipation mounting surfaces;

[0020] The capacitor is mounted on the power board and is located on one side of the outer wall of the base plate of the heat dissipation device.

[0021] According to another aspect of this application, an electrical device is provided, including the power component of any of the above embodiments.

[0022] According to another aspect of this application, an electrical device is provided, including the heat dissipation device in any of the above embodiments.

[0023] The aforementioned heat dissipation device, through the arrangement of an end plate assembly comprising an inner end plate and an outer end plate at at least one end of the heat dissipation body, allows the inner end plate to be connected to the heat dissipation body first, followed by the outer end plate. Particularly when welding the end plate assembly to the heat dissipation body, the welding torch is difficult to insert into the heat dissipation groove and align with the connection point between the heat dissipation body and the end plate assembly. Even if the welding torch is inserted into the heat dissipation groove, the limited space within the groove makes it difficult to align the torch at the appropriate angle to the connection point, resulting in a weak weld and low weld strength. This application, however, employs a design that splits the end plate into an inner and outer end plate, using the area between the inner and outer end plates as a flow channel for the cooling medium. This allows the inner end plate to be welded to the heat dissipation body from the outside using a welding torch, followed by the placement of the outer end plate, and then welding it to the heat dissipation body from the outside using the same welding torch. This solves the problem of the welding torch being difficult to insert into the heat sink and aim at the connection between the heat sink body and the end plate assembly, thereby improving the ease of welding, reducing the difficulty of welding, making it easier to weld strong welds, reducing the risk of leakage, and improving the cooling performance of the heat dissipation device. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the heat dissipation device in one embodiment of this application.

[0025] Figure 2 This is a schematic diagram of the structure of the first endplate assembly in one embodiment of this application.

[0026] Figure 3This is a schematic diagram of the structure of the second endplate assembly in one embodiment of this application.

[0027] Figure 4 This is a schematic diagram of the structure of the heat dissipation body in one embodiment of this application.

[0028] Figure 5 This is a schematic diagram of the power component in one embodiment of this application.

[0029] Figure 6 This is a schematic diagram of the structure of an electrical device in one embodiment of this application.

[0030] Figure 7 This is a schematic diagram of the heat exchanger in one embodiment of this application.

[0031] Explanation of icon numbers:

[0032] 10. Heat dissipation device;

[0033] 1. Heat sink body; 11. First heat dissipation channel; 12. Second heat dissipation channel; 13. Third heat dissipation channel; 14. Fourth heat dissipation channel; 15. Base plate; 161. First side plate; 162. Second side plate; 17. Heat dissipation mounting hole; 18. Top sealing plate; 181. Cable routing hole; 182. Glue potting hole;

[0034] 21. Inner end plate; 22. Outer end plate;

[0035] 23. First separator; 24. First subspace; 25. Second subspace; 26. Third subspace; 27. Limiting channel;

[0036] 33. Second partition; 34. Fourth subspace; 35. Fifth subspace;

[0037] 41. Liquid inlet; 42. Liquid outlet; 51. Heating element; 52. Power board; 53. Capacitor; 6. Heat sink; 61. Inlet; 62. Outlet; 63. Heat sink fins; 71. Connecting pipe; 72. Disconnecting pipe; 73. Intermediate pipe; 74. Housing; 8. Air-cooled component; 9. Fan;

[0038] F1, first direction; F2, second direction; F3, third direction. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] Internal cooling of various electrical equipment is a key factor affecting its performance. Taking energy storage converters as an example, the fabrication of energy storage converters in related technologies is relatively difficult, especially welding, which is prone to defects such as leakage, which can easily lead to a decrease in their cooling performance.

[0046] Based on this, this application provides a heat dissipation device, power component, and electrical equipment, which have advantages such as better heat dissipation efficiency, lower noise, simple manufacturing process, and better ability to cope with harsh environments.

[0047] See Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 This is a schematic diagram of the structure of the heat dissipation device 10 in one embodiment of this application. Figure 2 This is a schematic diagram of the structure of the first endplate assembly in one embodiment of this application. Figure 3 This is a schematic diagram of the structure of the second endplate assembly in one embodiment of this application.

[0048] The heat dissipation device 10 provided in this application includes a heat dissipation body 1 and an end plate assembly. The heat dissipation body 1 defines a heat dissipation groove extending along a first direction F1. The heat dissipation groove is used to accommodate a heat-generating element 51. The heat dissipation body 1 has multiple heat dissipation channels, which are disposed around the periphery of the heat dissipation groove. Cooling medium flows through the heat dissipation channels for heat dissipation of the heat-generating element 51, including but not limited to, within the heat dissipation groove. In this embodiment, multiple inductors can be placed in the heat dissipation groove, i.e., multiple heat-generating elements 51 can be provided, and the heat-generating elements 51 can be configured as inductors, simultaneously dissipating heat from multiple inductors. Furthermore, the heat dissipation channels being disposed around the periphery of the heat dissipation groove can effectively improve the heat dissipation efficiency for multiple inductor components, providing a guarantee for the stable operation of electronic equipment.

[0049] An end plate assembly is disposed at the end of the heat dissipation body along a first direction F1. At least one end plate assembly includes an inner end plate 21 and an outer end plate 22, which are stacked on top of each other on the heat dissipation body 1 along the first direction F1. A receiving space communicating with a heat dissipation channel is defined between the inner end plate 21 and the outer end plate 22. Thus, the receiving space allows for the convergence of multiple heat dissipation channels, eliminating the need for each heat dissipation channel to be individually connected to an external heat exchanger, facilitating the entry and exit of the cooling medium. Furthermore, it makes the entire heat dissipation device 10 more compact, simplifying the structure and saving costs. It also facilitates the maintenance and cleaning of the heat dissipation channels, extending the service life of the heat dissipation device 10.

[0050] Furthermore, it is understandable that when welding the end plate assembly to the heat sink 1, the welding torch is difficult to extend into the heat sink groove and aim at the connection point between the heat sink 1 and the end plate assembly. Or even if the welding torch is extended into the heat sink groove, the limited space within the heat sink groove makes it difficult to aim the welding torch at the connection point between the heat sink 1 and the end plate assembly at a suitable angle, making it difficult to weld a strong weld point, resulting in low weld strength.

[0051] This application employs a design that splits the end plate into an inner end plate 21 and an outer end plate 22. This allows the inner end plate 21 to be welded to the heat sink body 1 from the outside using a welding torch, followed by the outer end plate 22, which is then welded to the heat sink body 1 from the outside using the same welding torch. This solves the problem of the welding torch being difficult to insert into the heat sink groove and align with the connection point between the heat sink body 1 and the end plate assembly, thereby improving the ease of welding, facilitating the formation of strong weld points, and enhancing the cooling performance of the heat sink device 10.

[0052] The end plate assembly of the heat dissipation device 10 in this application is designed to achieve the convergence of multiple heat dissipation channels, making the overall structure of the heat dissipation device 10 more compact. Furthermore, the design of splitting the assembly into an inner end plate 21 and an outer end plate 22 allows for step-by-step welding when connecting the end plate assembly to the heat dissipation body 1, reducing welding difficulty, simplifying the welding process, improving production efficiency, and enhancing the overall structural strength and reliability of the heat dissipation device 10, ensuring its stability and efficient heat dissipation performance during long-term use.

[0053] In some embodiments of this application, the inner end plate 21 is disposed within the heat dissipation groove, while the outer end plate is disposed on the end face of the heat dissipation body. The peripheral edge of the inner end plate can be welded to the wall of the heat dissipation groove, i.e., the inner end plate 21 is first welded to the heat dissipation groove from the outside using a welding gun, while the peripheral edge of the outer end plate can be welded to the end face of the heat dissipation body, i.e., the outer end plate 22 is welded to the end face of the heat dissipation body 1 from the outside using a welding gun. This solves the problem of the welding gun being difficult to insert into the heat dissipation groove to align with the connection between the heat dissipation body 1 and the end plate assembly, thereby improving the ease of welding, facilitating the formation of strong weld points, and improving the cooling performance of the heat dissipation device 10.

[0054] In some embodiments of this application, the number of end plate assemblies is one, and one end plate assembly is disposed at one end of the heat dissipation body. The end plate assembly includes an inner end plate and an outer end plate. In this case, the welding difficulty on that side of the heat dissipation device can be reduced and the reliability can be enhanced. In other embodiments, the number of end plate assemblies is two, that is, one end plate assembly is disposed at each end of the heat dissipation body in the first direction F1. Each end plate assembly includes an inner end plate and an outer end plate. In this case, the welding difficulty at both ends of the heat dissipation device is reduced and the reliability is enhanced.

[0055] The cooling medium of this application can be a liquid medium such as coolant, and the material can be water plus antifreeze and additives. The antifreeze can be ethylene glycol or propylene glycol, and the additives can be at least one of corrosion inhibitors, scale inhibitors, corrosion inhibitors and antifoaming agents.

[0056] In some embodiments, the heating element 51 of this application may be an inductor, such as a reactor, without further limitation.

[0057] In some embodiments, see Figure 1 , Figure 2 and Figure 3 and in conjunction with reference Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of the heat dissipation body 1 in one embodiment of this application.

[0058] The heat dissipation body 1 includes a base plate 15, a first side plate 161 and a second side plate 162. The first side plate 161 and the second side plate 162 are located on opposite sides of the base plate 15 along the second direction F2 and together with the base plate 15 define a heat dissipation groove. Through the joint action of the base plate 15 and the two side plates, a stable heat dissipation groove frame is formed, which can effectively fix and support the heat-generating element 51, and at the same time provide a good channel for the circulation of the cooling medium, ensuring the structural stability and heat dissipation efficiency of the heat dissipation device 10.

[0059] Furthermore, at least two of the base plate 15, the first side plate 161, and the second side plate 162 are provided with heat dissipation channels. This facilitates the full circulation of the cooling medium around the heat dissipation slot, enabling the cooling medium to dissipate heat more evenly and fully onto the heat dissipation slot, further improving the overall performance of the heat dissipation device 10 and enhancing the cooling effect.

[0060] In some embodiments, the base plate 15, the first side plate 161, and the second side plate 162 are integrally formed. This integral structural design can effectively reduce the splicing and assembly processes of the base plate 15 and the side plates, reduce the risk of structural instability caused by loosening or wear at the connection points, thereby improving the structural stability and reliability of the heat dissipation body 1, giving it higher rigidity and strength.

[0061] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation device 10 also includes a separator, which is disposed within the receiving space of the end plate assembly to divide the receiving space of the end plate assembly into at least two sub-spaces, and the at least two sub-spaces connect each heat dissipation channel in sequence. In this way, by connecting multiple heat dissipation channels in series through the separated sub-spaces, the cooling medium forms a complete circulation system within the heat dissipation device 10, achieving more uniform and efficient heat dissipation.

[0062] In some embodiments, the outer end plate 22 of the end plate assembly is provided with an inlet 41 and an outlet 42 communicating with the receiving space. The inlet 41 and the outlet 42 are respectively connected to the receiving space and the external environment. Thus, the receiving space can be connected to the output end of the external heat exchanger through the inlet 41, and connected to the input end of the external heat exchanger through the outlet 42. This achieves the circulation of the cooling medium.

[0063] In some embodiments, the heat dissipation device 10 includes two end plate assemblies, which are respectively disposed at both ends of the heat dissipation body 1 along the first direction F1. There is a configuration where one end plate assembly has a separator, while the other end plate assembly does not. That is, in one embodiment where one end plate assembly has no separator, and the cooling medium is improved solely by stacking an inner end plate 21 and an outer end plate 22, the cooling medium flows from one end of at least one heat dissipation channel to the other, passes through the receiving space defined between the inner end plate 21 and the outer end plate 22, and then flows back to the starting end from another at least one heat dissipation channel, achieving a round-trip flow of the cooling medium.

[0064] Alternatively, multiple sub-spaces can be provided on the two end plate assemblies at both ends along the first direction F1, in conjunction with multiple heat dissipation channels, to achieve multiple back-and-forth circulation of the cooling medium. This allows the cooling medium to flow fully within the heat dissipation channels and exchange heat fully with the heat-generating element 51, thereby cooling the heat-generating element 51 within the heat dissipation slot. No further restrictions are imposed here.

[0065] In some embodiments, the heat dissipation channel extends along a first direction F1 and has a first end and a second end opposite to each other along the first direction F1. The cooling medium flows from one end of the first end and the second end of the heat dissipation channel to the other end within the heat dissipation channel, thereby achieving sufficient cooling of the heat dissipation tank.

[0066] In some embodiments, continue reading Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the heat dissipation channels include a first heat dissipation channel 11, a second heat dissipation channel 12, a third heat dissipation channel 13, and a fourth heat dissipation channel 14. The first heat dissipation channel 11 is used to connect to the output end of the external heat exchanger; specifically, the first end of the first heat dissipation channel 11 is connected to the liquid inlet 41, thus connecting to the output end of the external heat exchanger. The second end of the first heat dissipation channel 11 is connected to the second end of the second heat dissipation channel 12; the first end of the second heat dissipation channel 12 is connected to the first end of the third heat dissipation channel 13; the second end of the third heat dissipation channel 13 is connected to the second end of the fourth heat dissipation channel 14; and the first end of the fourth heat dissipation channel 14 is used to connect to the input end of the external heat exchanger. Specifically, the first end of the fourth heat dissipation channel 14 is connected to the liquid outlet 42, thus connecting to the input end of the external heat exchanger.

[0067] Furthermore, it can be understood that by using two end plate assemblies and corresponding two separators, the series design between the first heat dissipation channel 11, the second heat dissipation channel 12, the third heat dissipation channel 13, and the fourth heat dissipation channel 14 is achieved. This allows the cooling medium to flow sequentially through each heat dissipation channel and fully cover the periphery of each heat-generating element 51 in the heat dissipation slot. The medium circulates along the first direction F1 within the first heat dissipation channel 11, the second heat dissipation channel 12, the third heat dissipation channel 13, and the fourth heat dissipation channel 14, forming a complete circulation system within the heat dissipation device 10. This fully absorbs the heat generated by the heat-generating elements 51 at different locations within the heat dissipation slot, thereby achieving a more efficient and uniform heat dissipation effect. This further enhances the overall performance of the heat dissipation device 10, bringing the overall heat dissipation performance of the entire heat dissipation device 10 to its optimal state.

[0068] In some embodiments, such as Figure 4 As shown, the first heat dissipation channel 11 is disposed in the first side plate 161, the second heat dissipation channel 12 is disposed in the bottom plate 15, the third heat dissipation channel 13 is disposed in the second side plate 162, and the fourth heat dissipation channel 14 is disposed in the first side plate 161 and the second side plate 162. In this way, multiple heat dissipation channels are disposed on the periphery of the heat dissipation slot to improve the heat dissipation effect of the heat dissipation slot.

[0069] In some embodiments, the base plate 15 is provided with a plurality of second heat dissipation channels 12, which are spaced apart from each other along the second direction F2. This allows the cooling medium to be evenly distributed within the base plate 15, fully absorbing heat from the bottom of the heat dissipation groove, improving the heat dissipation capacity of the base plate 15, and further enhancing the heat dissipation effect of the entire heat dissipation device 10.

[0070] The first side plate 161 is provided with multiple first heat dissipation channels 11 and multiple fourth heat dissipation channels 14. The multiple fourth heat dissipation channels 14 are located on one side of the multiple first heat dissipation channels 11 along the third direction F3, and the multiple first heat dissipation channels 11 are spaced apart from each other along the third direction F3, and the multiple fourth heat dissipation channels 14 are spaced apart from each other along the third direction F3. In this way, multiple heat dissipation paths are formed in the side plate, so that the cooling medium can more comprehensively cover the side plate area, effectively absorb the heat near the side plate, improve the heat dissipation efficiency of the side plate, and thus further improve the heat dissipation performance of the entire heat dissipation device 10.

[0071] The second side plate 162 is provided with multiple third heat dissipation channels 13 and multiple fourth heat dissipation channels 14. The multiple fourth heat dissipation channels 14 are located on one side of the multiple third heat dissipation channels 13 along the third direction F3, and the multiple third heat dissipation channels 13 are spaced apart from each other along the third direction F3, and the multiple fourth heat dissipation channels 14 are also spaced apart from each other along the third direction F3. Among them, the first direction F1, the second direction F2, and the third direction F3 intersect each other in pairs. This structure makes the heat dissipation channel layout in the two side plates more balanced, ensuring that the cooling medium can flow evenly in the two side plates, fully absorbing heat from different directions, and further enhancing the heat dissipation uniformity and overall heat dissipation capacity of the heat dissipation device 10.

[0072] In this embodiment, the spacing between the two side plates along the second direction F2 can be determined according to the actual heat dissipation requirements of the product. This embodiment does not impose specific limitations, so that it has a suitable size and can be adapted to heat-generating elements 51 of various sizes.

[0073] In some embodiments, the heat dissipation channels include a fifth heat dissipation channel and a sixth heat dissipation channel (not shown). One of the fifth and sixth heat dissipation channels is disposed on the first side plate 161, and the other is disposed on the second side plate 162. The first end of the fifth heat dissipation channel is used to connect to the output end of an external heat exchanger, and the second end of the fifth heat dissipation channel is connected to the first end of the sixth heat dissipation channel. The second end of the sixth heat dissipation channel is used to connect to the input end of the external heat exchanger. In this way, the cooling medium flows from the first end of the sixth heat dissipation channel to the second end, and then from the second end of the fifth heat dissipation channel to the first end, thus realizing that the coolant flows back and forth within the heat dissipation device 10. This eliminates the need for a separator in the second end plate assembly at the connection between the second ends of the fifth and sixth heat dissipation channels. Compared with embodiments that provide a first heat dissipation channel 11, a second heat dissipation channel 12, a third heat dissipation channel 13, and a fourth heat dissipation channel 14, this embodiment has a relatively simple structure, which is beneficial for cost savings.

[0074] In some embodiments, continue reading Figure 1 , Figure 2 and Figure 3As shown, the heat dissipation device 10 also includes two partitions, namely a first partition 23 and a second partition 33. The first partition 23 is disposed within the receiving space of the first end plate assembly and divides the receiving space of the first end plate assembly into a first sub-space 24, a second sub-space 25, and a third sub-space 26. The first sub-space 24 connects the liquid inlet 41 and the first end of the first heat dissipation channel 11. The second sub-space 25 connects the first end of the second heat dissipation channel 12 and the first end of the third heat dissipation channel 13. The third sub-space 26 connects the first end of the fourth heat dissipation channel 14 and the liquid outlet 42. The second partition 33 is disposed within the receiving space of the second end plate assembly and divides the receiving space of the second end plate assembly into a fourth sub-space 34 and a fifth sub-space 35. The fourth sub-space 34 connects the second end of the first heat dissipation channel 11 and the second end of the second heat dissipation channel 12. The fifth sub-space 35 connects the second end of the third heat dissipation channel 13 and the second end of the fourth heat dissipation channel 14. This effectively guides the flow direction of the cooling medium between the various heat dissipation channels, enabling the cooling medium to circulate along a preset path. It also makes the structure of the entire heat dissipation system more compact and orderly, facilitating manufacturing and maintenance, while improving the reliability and stability of the heat dissipation device 10.

[0075] Cooling medium enters the first subspace 24 through inlet 41, then flows from the first subspace 24 into the first end of the first heat dissipation channel 11, and then flows through the first end of the first heat dissipation channel 11 to the second end. Cooling medium flowing out from the second end of the first heat dissipation channel 11 enters the fourth subspace 34, and then flows from the fourth subspace 34 into the second end of the second heat dissipation channel 12, and then flows through the second end of the second heat dissipation channel 12 to the first end. Cooling medium flowing out from the first end of the second heat dissipation channel 12 enters the second subspace 25, and then flows through the second subspace 25 into the first end of the third heat dissipation channel 13, and then flows from the first end of the third heat dissipation channel 13 to the second end. Cooling medium flowing out from the second end of the third heat dissipation channel 13 enters the fifth subspace 35, and then flows from the fifth subspace 35 into the second end of the fourth heat dissipation channel 14, and then flows through the second end of the fourth heat dissipation channel 14 to the first end. Subsequently, the cooling medium flows from the first end of the fourth heat dissipation channel 14 into the third subspace 26, and then flows out from the outlet 42 within the third subspace 26, thus achieving reciprocating circulation of the cooling medium within multiple heat dissipation channels. This allows the cooling medium to fully absorb heat within the heat dissipation device 10, maximizing its heat dissipation effect, while avoiding problems such as localized overheating or uneven heat dissipation of the cooling medium, effectively improving the cooling efficiency and performance of the entire heat dissipation device 10.

[0076] In some embodiments, continue reading Figure 1 , Figure 2and Figure 3 As shown, the separator is disposed on the inner end plate 21 of the corresponding end plate assembly. The separator can be welded to the side of the inner end plate 21 facing the outer end plate 22, or it can be integrally formed with the inner end plate 21 during its fabrication, such as using a die-casting process. This allows the separator to be positioned between the inner end plate 21 and the outer end plate 22, thus isolating the corresponding subspace. No further restrictions are imposed here.

[0077] The outer end plate 22 has a limiting channel 27 that exposes only a portion of the corresponding partition. The inner wall of the limiting channel 27 abuts against at least a portion of the outer wall of the corresponding partition. Thus, the limiting channel 27 limits the abutment of the partition, preventing it from fully abutting against the inner wall of the outer end plate 22 facing the inner end plate 21. It is understood that if the partition were directly and fully abutting against the inner wall of the outer end plate 22, the welding torch would be difficult to insert into the narrow gap between the inner end plate 21 and the outer end plate 22, making welding between the partition and the outer end plate 22 difficult. Consequently, when the cooling medium flow rate is high, or when the heat dissipation device 10 is used for a long time, the outer end plate 22 is prone to deformation and outward protrusion, creating a gap between it and the partition. This prevents the partition from separating the various sub-spaces, thus affecting the flow channel design of the cooling medium.

[0078] The present application provides a limiting channel 27 on the outer end plate 22, so that the corresponding separator can be exposed from the limiting channel 27. In this way, the separator and the corresponding outer end plate 22 can be welded from the outside by a welding gun, making the welding process simple and reliable and improving the convenience of welding.

[0079] In this embodiment, a sealing element can also be provided between the inner wall of the limiting channel 27 and the corresponding outer wall of the corresponding separator to further improve the isolation effect between the various subspaces.

[0080] In some embodiments, in conjunction with reference Figure 1 , Figure 2 and Figure 3 and in conjunction with reference Figure 5 As shown, Figure 5 This is a schematic diagram of the power component in one embodiment of this application.

[0081] The first side plate 161 and / or the second side plate 162 have a heat dissipation mounting surface on the side facing away from the heat dissipation groove. That is, the first side plate 161 and the second side plate 162 each have a heat dissipation mounting surface on the side facing away from the heat dissipation groove, or one of the first side plate 161 and the second side plate 162 has a heat dissipation mounting surface on the side facing away from the heat dissipation groove.

[0082] It is understood that if the first side panel 161 has a heat dissipation channel, then the side of the first side panel 161 facing away from the heat dissipation groove has a heat dissipation mounting surface; if the first side panel 161 does not have a heat dissipation channel, then the first side panel 161 does not have a heat dissipation mounting surface. Similarly, if the second side panel 162 has a heat dissipation channel, then the side of the second side panel 162 facing away from the heat dissipation groove has a heat dissipation mounting surface; if the second side panel 162 does not have a heat dissipation channel, then the second side panel 162 does not have a heat dissipation mounting surface.

[0083] The heat dissipation mounting surface is provided with multiple heat dissipation mounting holes 17 for mounting the working unit. The working unit can be mounted on the heat dissipation mounting surface through the heat dissipation mounting holes 17. In this way, while the cooling medium in the heat dissipation channel is used to cool the heat-generating element 51 in the heat dissipation slot, the cooling medium can also be used to cool the working unit on the heat dissipation mounting surface, thereby improving the utilization rate of the cooling medium.

[0084] In this embodiment, the working unit includes a power board 52 and other accessories on the power board 52 such as capacitors 53 and power devices. The power board 52 and the capacitors 53 and power devices on it are cooled by a cooling medium, which helps to make full use of the cooling medium for heat exchange and improve the utilization rate of the cooling medium.

[0085] The power board 52 in this application can be a circuit board (PCB), and there are no further restrictions. Power semiconductor devices, such as insulated gate bipolar transistors (IGBTs), can also be mounted on the power board 52, and there are no further restrictions.

[0086] In some embodiments of this application, the power semiconductor devices disposed on the power board 52 are attached to the heat dissipation mounting surface so as to effectively dissipate heat from the high-heat power semiconductor devices using the heat dissipation device 10.

[0087] In this embodiment, the power board 52 is mounted parallel to the corresponding heat dissipation mounting surface, which helps save space, reduces the overall thickness, and facilitates miniaturization. Furthermore, two working units can be installed, with the two power boards 52 of each unit mounted one-to-one on the two heat dissipation mounting surfaces of the two side plates. This allows the number of power boards 52 to be set according to requirements, while also maximizing the use of the cooling medium and saving installation space.

[0088] In this embodiment, if the size of the power board 52 is relatively larger than the size of the heat dissipation mounting surface, the capacitor 53 can be positioned where the power board 52 extends beyond the heat dissipation body 1, and the capacitor 53 is located on the side of the power board 52 facing the heat dissipation body 1, so as to make full use of the angle between the power board 52 and the heat dissipation body 1 and save installation space. If the size of the power board 52 is relatively larger than the size of the heat dissipation mounting surface, the power board 52 can extend beyond the heat dissipation body 1 along the side of the bottom plate 15 of the heat dissipation body 1, such as... Figure 5 As shown, this positions capacitor 53 between power board 52 and base plate 15 of heat sink 1. This allows capacitor 53 to be cooled by the cooling medium flowing through the heat dissipation channels of base plate 15, lowering the ambient temperature within the heat sink and aiding in heat dissipation. Simultaneously, it also facilitates fuller utilization of the cooling medium within each heat dissipation channel, improving the cooling medium utilization rate.

[0089] In some embodiments, such as Figure 1 The heat dissipation device 10 also includes a top sealing plate 18, which has a wire passage hole 181 and an adhesive filling hole 182. The wire passage hole 181 is used for the wires of the heating element 51 in the heat dissipation tank to pass through, thereby effectively managing the wires of the heating element 51 and ensuring that the wires can be safely led out of the heat dissipation tank. The adhesive filling hole 182 is used to fill the heat dissipation tank with thermally conductive adhesive. The thermally conductive adhesive enhances the heat conduction efficiency between the heat dissipation device 10 and the heating element 51, further improving the heat dissipation performance of the heat dissipation device 10.

[0090] The heat sink 1, the two end plate assemblies and the top sealing plate 18 together enclose the heat-generating element 51. The heat sink 1, the two end plate assemblies and the top sealing plate 18 can all be made of metal, so as to achieve electromagnetic compatibility shielding (EMC shielding) for the heat-generating element 51, such as the reactor, reducing electromagnetic interference to surrounding equipment and improving its own anti-interference ability during operation.

[0091] See Figure 5 As shown, this application also provides a power component, including the heat dissipation device 10 in any of the above embodiments. The power component also includes a working unit, which is disposed on the outer periphery of the heat dissipation device 10 to cool and dissipate heat using the cooling medium inside the heat dissipation device 10, thereby making full use of the cooling medium and improving the heat dissipation efficiency of the cooling medium.

[0092] In some embodiments, continue reading Figure 5As shown, the heating element 51 is configured as an inductor, and the working unit includes a power board 52 and a capacitor 53. The inductor is disposed within the heat sink. The heat dissipation device 10 has at least one heat dissipation mounting surface on the side opposite to the heat sink, and the power board 52 is attached to at least one heat dissipation mounting surface. The capacitor 53 is disposed on the power board 52 and is located on one side of the outer wall of the base plate 15 of the heat dissipation device 10. Thus, while cooling the heating element 51 in the heat sink using the cooling medium in the heat dissipation channel, the power board 52 and capacitor 53 on the heat dissipation mounting surface can also be cooled using the cooling medium, improving the utilization rate of the cooling medium.

[0093] In some embodiments, the thickness direction of the power board 52 is parallel to the second direction F2, and the heat dissipation mounting surface is perpendicular to the second direction F2, so that the board surface of the power board 52 is mounted on the corresponding heat dissipation mounting surface in parallel with the corresponding heat dissipation mounting surface, which helps to save space.

[0094] In some embodiments, the heat dissipation device 10 has two heat dissipation mounting surfaces opposite each other along the second direction, and two power boards 52 can be correspondingly arranged and mounted on the two heat dissipation mounting surfaces respectively. The number of power boards 52 can also be designed according to the needs of the power components, so that the power boards 52 are simply placed on the heat dissipation mounting surfaces around the heat dissipation device 10, thereby making full use of the cooling medium, saving installation space, and meeting the design requirements of the power boards 52 of the power components.

[0095] In some embodiments, the power board 52 has an extension of the heat sink 10 extending along a third direction F3. A capacitor 53 is disposed between the power board 52 and the heat sink 10, and the projection of the capacitor 53 along a second direction F2 is located within the projection range of the extension along the second direction F2. The projection of the capacitor 53 along a third direction F3 is also within the projection range of the heat sink 10 along a third direction F3. This facilitates efficient cooling of the capacitor 53 on the power board 52 using the cooling medium while saving space required for capacitor 53 installation, thus enabling miniaturized design of the power components.

[0096] In particular, the extension of the power board 52 can extend the heat dissipation device 10 from the base plate 15 side along the third direction F3, so that the capacitor 53 is located between the power board 52 and the base plate 15 of the heat dissipation body 1. In this way, the capacitor 53 can be cooled by the cooling medium flowing through the heat dissipation channel of the base plate 15. This is beneficial to further make full use of the cooling medium in each heat dissipation channel and improve the utilization rate of the cooling medium.

[0097] In some embodiments, see Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of an electrical device in one embodiment of this application. This application also provides an electrical device including the heat dissipation device 10 or power component from any of the above embodiments. The electrical device includes an energy storage converter, meaning the electrical device can be an energy storage converter.

[0098] The electrical equipment includes a housing 74, an inlet pipe 71, an outlet pipe 72, and an intermediate pipe 73. The inlet pipe 71, outlet pipe 72, and intermediate pipe 73 are all located on the outer wall of the housing 74. The inlet pipe 71 connects to the inlet 61 of the radiator 6, the intermediate pipe 73 connects to the outlet 62 of the radiator 6 and the liquid inlet 41 of the heat dissipation device 10, and the outlet pipe 72 connects to the outlet 42 of the heat dissipation device 10. Furthermore, the inlet pipe 71 connects to the output end of the external heat exchanger, and the outlet pipe 72 connects to the input end of the external heat exchanger, thus achieving the circulation of the cooling medium among the external heat exchanger, radiator 6, and heat dissipation device 10. A pump or proportional valve can also be installed on the circulation pipeline between the inlet pipe 71 and the outlet pipe 72 to further circulate the cooling medium; however, no further restrictions are imposed here.

[0099] In this embodiment, the electrical equipment also includes a support accessory, which is used to install the heat dissipation device 10 and its power board 52 and working unit inside the housing 74, thereby improving the installation stability of the heat dissipation device 10 and its power board 52 and working unit.

[0100] In some embodiments, see Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of the radiator 6 in one embodiment of this application. The electrical equipment also includes the radiator 6, which is used to dissipate heat from the interior of the housing 74. The radiator 6 includes an inlet 61, an outlet 62, and a plurality of heat sinks 63. The inlet 61 and the outlet 62 are respectively connected to the internal space of the heat sinks 63, and the internal space of the heat sinks 63 is used to contain the cooling medium. The inlet 61 is used to connect to an external heat exchanger, and the outlet 62 is used to connect to the containing space through the liquid inlet 41 of the heat dissipation device 10. The cooling medium, after being cooled by the external heat exchanger, circulates sequentially through the inlet 61, the heat sinks 63, the outlet 62, the liquid inlet 41, the containing space, and the liquid outlet 42, so that the cooled medium in the radiator 6 dissipates heat from the interior of the housing 74.

[0101] In this embodiment, the radiator 6 can be covered by a sheet metal shell, and then an air-cooling component 8 can be installed on the sheet metal shell. The air-cooling component 8 is used to blow air, and the radiator 6 can cool the air blown out by the air-cooling component 8, thereby dissipating heat from the inside of the housing 74. The air-cooling component 8 can be an axial flow fan, and there are no further restrictions on its use.

[0102] In this embodiment, both the inlet 61 and the outlet 62 are equipped with water nozzles including rubber ring sealing groove structures. The connection between the corresponding intermediate pipe 73 and the outlet 62 is realized through the corresponding water nozzles, and the connection between the corresponding access pipe 71 and the inlet 61 is realized through the corresponding water nozzles. Moreover, the rubber ring sealing groove structure of the water nozzles is beneficial for sealing the connection and preventing the leakage of cooling medium.

[0103] In this embodiment, the radiator 6 further includes two liquid collectors, which are respectively connected to both ends of the heat sink 63 for collecting the cooling medium in the multiple heat sinks 63. One of the two liquid collectors is also connected to a water nozzle at the inlet 61, and the other of the two liquid collectors is also connected to a water nozzle at the outlet 62, so that the cooling medium enters the multiple heat sinks 63 for heat dissipation before being centrally output.

[0104] In this embodiment, the electrical equipment further includes a fan 9 and an air duct baffle. The fan 9 is located on the side of the heat dissipation device 10 away from the heat sink 6 and the air-cooling component 8 along the first direction F1, and is used to blow air towards the heat dissipation device 10. The air duct baffle is disposed between the circuit board assembly and the heat dissipation device 10. The fan 9 can be the structure of the air-cooling component 8, and no further restrictions are imposed here.

[0105] Continue reading Figure 6 As shown, the electrical equipment also includes, but is not limited to, circuit board assemblies, capacitors 53, inductors, contactors, circuit breakers, resistive elements, and the aforementioned power components, all housed within the enclosure 74. The circuit board assembly is located on one side of the heat dissipation device 10 along the third direction F3, while the heat sink 6 and the air-cooling component 8 are located on one side of the circuit board assembly along the first direction F1. The external heat exchanger dissipates heat from the cooling medium. After the cooling medium flows to the heat sink 6, the cooling medium inside the heat sink 6 dissipates heat from the air blown out by the air-cooling component 8, causing the dissipated air to flow towards the circuit board assembly and dissipate heat from the circuit board assembly.

[0106] Understandable, in conjunction with reference Figure 6As indicated by the wind direction arrows, this configuration ensures that the air blown out by the air-cooling component 8 flows along the first direction F1 towards the circuit board assembly, reaching the end of the circuit board assembly furthest from the air-cooling component 8 along the first direction F1. At this point, the air is blocked by the inner wall of the housing 74 and the air duct baffle, moving downwards and then, driven by the fan 9, moving along the first direction F1 towards the heat dissipation device 10. It then moves back towards the air-cooling component 8, again blocked by the inner wall of the housing 74, and is driven again by the air-cooling component 8, causing the air to flow along the first direction F1 towards the circuit board assembly. Thus, the air-cooling section only requires the air-cooling component 8 and the fan 9 to achieve overall air cooling within the housing 74. Through the air blown out by the air-cooling component 8, combined with the turbulent cooling effect of the fan 9, the main heat-generating components inside the machine can efficiently transfer their heat to the heat sink 6, where it is then carried away by the circulating cooling medium, achieving efficient heat dissipation for the main heat-generating components. This ingenious overall heat dissipation design reduces the use of air cooling and helps reduce noise.

[0107] The heat dissipation device 10, power components, and electrical equipment of this application adopt a design that splits the end plates into an inner end plate 21 and an outer end plate 22. This allows the inner end plate 21 to be welded to the heat dissipation body 1 from the outside using a welding torch, followed by the placement of the outer end plate 22, which is then welded to the heat dissipation body 1 from the outside using the same welding torch. This solves the problem of the welding torch being difficult to insert into the heat dissipation groove and align with the connection between the heat dissipation body 1 and the end plate assembly, thus improving welding convenience and the formation of strong weld points, thereby enhancing the cooling performance of the heat dissipation device 10. Furthermore, the heat dissipation body 1, the two end plate assemblies, and the top sealing plate 18 achieve four-sided heat dissipation and EMC shielding for the reactor. Simultaneously, mounting the working unit to the outer wall of the heat dissipation device 10 enables the reuse of the cooling medium within the device, reduces the overall thickness of the power component, increases its dimensional density, and facilitates its miniaturization design. Furthermore, the main power components of the electrical equipment in this application, namely the working units, are attached to the outer wall of the water-cooled heat dissipation device 10 for heat dissipation, while the heat of the remaining components is dissipated through the built-in air-cooled components 8 and the fan 9, which effectively solves the overall heat problem.

[0108] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device includes: A heat sink body defines a heat sink extending along a first direction, the heat sink being used to house a heat-generating element; the heat sink body has a heat dissipation channel disposed around the periphery of the heat sink, and a cooling medium flows within the heat dissipation channel; and An end plate assembly is disposed at the end of the heat dissipation groove along the first direction. At least one end plate assembly includes an inner end plate and an outer end plate, which are stacked on the heat dissipation body along the first direction. A receiving space communicating with the heat dissipation channel is defined between the inner end plate and the outer end plate.

2. The heat dissipating device according to claim 1, wherein The heat dissipation body includes a base plate, a first side plate, and a second side plate. The first side plate and the second side plate are located on opposite sides of the base plate along a second direction and together with the base plate define the heat dissipation groove. At least two of the base plate, the first side plate, and the second side plate are provided with the heat dissipation channel. The heat dissipation device further includes a separator disposed within the receiving space of the end plate assembly to divide the receiving space of the end plate assembly into at least two sub-spaces, and the at least two sub-spaces sequentially connect each of the heat dissipation channels.

3. The heat dissipating device according to claim 2, wherein The heat dissipation channels include a first heat dissipation channel, a second heat dissipation channel, a third heat dissipation channel, and a fourth heat dissipation channel. The first heat dissipation channel is disposed within the first side plate, the second heat dissipation channel is disposed within the bottom plate, the third heat dissipation channel is disposed within the second side plate, and the fourth heat dissipation channel is disposed within both the first and second side plates. The first end of the first heat dissipation channel is used to connect to the output end of an external heat exchanger, and the second end of the first heat dissipation channel is connected to the second end of the second heat dissipation channel. The first end of the second heat dissipation channel is connected to the first end of the third heat dissipation channel, and the second end of the third heat dissipation channel is connected to the second end of the fourth heat dissipation channel. The first end of the fourth heat dissipation channel is used to connect to the input end of the external heat exchanger.

4. The heat dissipating device of claim 2, wherein The heat dissipation channel includes a fifth heat dissipation channel and a sixth heat dissipation channel. One of the fifth heat dissipation channel and the sixth heat dissipation channel is disposed on the first side plate, and the other of the fifth heat dissipation channel and the sixth heat dissipation channel is disposed on the second side plate. The first end of the fifth heat dissipation channel is used to connect to the output end of the external heat exchanger, the second end of the fifth heat dissipation channel is connected to the second end of the sixth heat dissipation channel, and the first end of the sixth heat dissipation channel is used to connect to the input end of the external heat exchanger.

5. The heat dissipating device of claim 2, wherein The separator is disposed on the inner end plate, and the outer end plate is provided with a limiting channel that exposes only a portion of the corresponding separator. The inner sidewall of the limiting channel abuts against at least a portion of the outer sidewall of the corresponding separator.

6. The heat dissipating device of claim 2, wherein The base plate, the first side plate, and the second side plate are integrally formed.

7. The heat dissipating device of claim 1, wherein The outer end plate of the end plate assembly is provided with an inlet and an outlet that are connected to the accommodating space.

8. The heat dissipating device of claim 1, wherein, The heat dissipation device also includes a top sealing plate, which has wire holes and glue-filling holes. The wire holes are used for the wires of the heat-generating element in the heat dissipation tank to pass through, and the glue-filling holes are used for filling the heat dissipation tank with thermally conductive adhesive.

9. The heat dissipation device according to claim 2, characterized in that, The first side plate and / or the second side plate have a heat dissipation mounting surface on the side opposite to the heat dissipation groove, and the heat dissipation mounting surface is used to install the working unit.

10. The heat dissipation device according to claim 1, characterized in that, The inner end plate is disposed within the heat dissipation groove, and the outer end plate is disposed on the end face of the heat dissipation body.

11. A power component, characterized in that, The power component includes a heat dissipation device as described in any one of claims 1 to 10, and the power component further includes a working unit disposed on the outer periphery of the heat dissipation device.

12. The power component according to claim 11, characterized in that, The heating element is configured as an inductor, the working unit includes a capacitor and a power board, and the inductor is disposed within the heat sink; The heat dissipation device has at least one heat dissipation mounting surface on the side opposite to the heat dissipation groove, and the power board is attached to at least one of the heat dissipation mounting surfaces; The capacitor is mounted on the power board and is located on one side of the outer wall of the base plate of the heat dissipation device.

13. An electrical device, characterized in that, Includes the power components as described in any one of claims 11 to 12.

14. An electrical device, characterized in that, Includes the heat dissipation device as described in any one of claims 1 to 10.

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