Automatic sheet wafer stripping device

Abstract

The utility model discloses a sheet wafer automatic stripping device, which comprises a support main body, a flat edge cutter head and a claw cutter head, the support main body depends on a rear telescopic electric cylinder as a power source to realize integral displacement, and the flat edge cutter head is detachably arranged on a front end fixing plate arranged at the front end of the support main body; a guide groove and a built-in telescopic electric cylinder are arranged in the support body, and a piston rod of the built-in telescopic electric cylinder extends to the guide groove and forms a linkage mechanism with a built-in fixing plate arranged in the guide groove. The claw tool bit is detachably mounted on the built-in fixing plate; a notch extending from the front end to the rear end of the support body is formed in the bottom of the support body, and the flushing nozzle is installed at the notch in the front end of the support body and located below the tool bit. A square groove hole used for being connected with a water pipe is formed in a groove opening in the rear end of the support body, and a flow control valve is arranged in the groove hole. According to the utility model, the problems of damage and fragmentation in the sheet wafer stripping process can be solved, and the stripping efficiency and the yield are improved.

Description

Technical Field

[0001] This utility model relates to an automated wafer stripping device, belonging to the field of semiconductor wafer stripping technology. Background Technology

[0002] In the semiconductor manufacturing field, wafer thickness is showing a clear trend towards thinner wafers. Compared to traditional thick wafers with a thickness of 400-800μm, thin wafers (100-400μm) offer significant advantages in technical performance: superior heat dissipation makes them stand out in high-power devices; good flexibility enables flexible electronics and wearable devices; thinner wafers reduce material consumption and manufacturing costs; and their high integration density meets the miniaturization and lightweighting requirements of modern electronic devices. These advantages have led to the widespread application of thin wafers in power devices, radio frequency devices, optoelectronic devices, flexible electronics, and sensors. In the future, with advancements in heterogeneous integration and advanced packaging technologies, their application prospects will be even broader.

[0003] In the semiconductor wafer fabrication field, chemical mechanical polishing (CMP) commonly employs a single-sided polishing process. This process first uses spin-coating to form a 10-20 μm thick microcrystalline wax layer on the wafer surface, which is then thermally cured at 180-200°C to form an adhesive film layer with nanoscale flatness. Subsequently, vacuum hot-pressing technology is used to bond the wafer wax film to a ceramic disk, utilizing the high-temperature adhesion properties of the wax layer to achieve gapless fixation between the wafer and the polishing disk.

[0004] However, the peeling process for thin wafers faces significant technical challenges: due to their thinness, their mechanical strength is significantly reduced. When using existing peeling tools, uneven force often leads to excessive local deformation of the wafer, making effective peeling impossible. This phenomenon not only easily causes surface damage but can also result in breakage. Therefore, developing a new peeling device and method that can effectively peel thin wafers while ensuring wafer integrity has become an urgent need. Summary of the Invention

[0005] The purpose of this invention is to provide an automated wafer stripping device for automatically stripping wafers from ceramic disks, effectively solving the problems of damage and breakage during wafer stripping, and improving stripping efficiency and yield.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An automated wafer stripping device is disclosed, comprising a support body and a flat-edge cutter head and a horn-shaped cutter head disposed at the front end of the support body.

[0008] The support body relies on a rear-mounted telescopic electric cylinder as a power source to achieve the overall displacement of the support body.

[0009] The flat-edged cutter head is detachably mounted on a front fixing plate located at the front end of the bracket body;

[0010] The main body of the bracket is equipped with a guide groove and a built-in telescopic electric cylinder. The piston rod of the built-in telescopic electric cylinder extends to the guide groove and forms a linkage mechanism with the built-in fixed plate set in the guide groove. The claw head is detachably installed on the built-in fixed plate.

[0011] A slot extending from the front end to the rear end of the support body is provided at the bottom of the support body. A water spray head is installed at the front slot of the support body and located below the blade. A slot for connecting a water pipe is provided at the rear slot of the support body, and a flow control valve is configured in the slot.

[0012] Preferably, the blades of both the flat-edged and horn-shaped blades are wedge-shaped.

[0013] Preferably, both the flat-edged cutter head and the horn-shaped cutter head have standard threaded interfaces at their rear ends, and are respectively installed in the threaded holes of the corresponding fixing plates using screws.

[0014] Preferably, the nozzle has a flared shape.

[0015] Compared with the prior art, the significant advantages of this utility model are as follows:

[0016] 1. The two-stage cutting method effectively disperses stress concentration and significantly improves the efficiency of the cutting blade through the synergistic action of the flat-edged blade and the horn-shaped blade.

[0017] 2. The blade of the scraper head adopts a wedge-shaped structure, which is conducive to the establishment of the initial peeling point and the expansion of the peeling surface.

[0018] 3. The nozzle is designed below the blade, making it easier for the water flow to cover the blade and form a protective water film. This reduces the direct mechanical stress on the wafer and significantly reduces the risk of damage and breakage.

[0019] 4. Automated stripping not only improves production efficiency, but also avoids quality problems caused by human error.

[0020] 5. The device has a simple structure, is easy to operate and maintain, and has wide applicability. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the wafer stripping device of this utility model.

[0022] Figure 2 for Figure 1 Side view of the machine without the claw head installed.

[0023] Figure 3 This is a schematic diagram of the flat-edge cutter head assembly of this utility model.

[0024] Figure 4 for Figure 3 Side view.

[0025] Figure 5 This is a schematic diagram of the structure of the ram's horn blade assembly of this utility model.

[0026] Figure 6 for Figure 5 Side view.

[0027] Figure 7 This is a schematic diagram of the overall structure of the nozzle of this utility model.

[0028] Reference numerals: 1. Support body; 2. Guide groove; 3. Rear telescopic electric cylinder; 4. Built-in telescopic electric cylinder; 5. Front fixing plate; 6. Built-in fixing plate; 7. Flat-edged cutter head; 8. Claw-shaped cutter head; 9. Groove; 10. Square slot; 11. Nozzle; 12. Valve; 13, 14. Threaded hole; 15, 16. Threaded interface; 17, 18. Blade; 19. Water pipe. Detailed Implementation

[0029] The specific embodiments of this utility model are described below with reference to the accompanying drawings. These specific embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. Any equivalent substitutions or improvements made by those skilled in the art within the technical framework disclosed in this utility model, based on the technical solution and core concept of this utility model, will not change the essence of the corresponding technical solution. Such modifications or substitutions all fall within the protection scope of this utility model.

[0030] For ease of technical understanding, the same or similar technical features are labeled with uniform component symbols in the accompanying drawings. The illustrated structures have been reasonably simplified and are not drawn to scale. The directional descriptions (such as up, down, front, back, left, right, etc.) used herein are only for illustrating the relative positional relationships of components, and such directional expressions should not be construed as limiting the scope of this utility model in any way.

[0031] like Figure 1 , 2 The automated wafer stripping device of this utility model includes a support body 1 and a flat-edge cutter head 7 and a horn-shaped cutter head 8 disposed at the front end of the support body 1.

[0032] The support body 1 serves as the core load-bearing structure. A front fixing plate 5 with threaded holes 13 at the front end of the support body 1 connects to the flat-edged cutter head 7; this connection is detachable. The overall displacement of the support body 1 is achieved by a rear-mounted telescopic electric cylinder 3 positioned at the rear of the support body 1. Inside the support body 1, there is a guide groove 2 and a built-in telescopic electric cylinder 4. Within the guide groove 2, there is a built-in fixing plate 6 with threaded holes 14, which connects to the claw cutter head 8 via the threaded holes 14; this connection is also detachable. The piston rod of the built-in telescopic electric cylinder 4 extends into the guide groove 2 and forms a linkage mechanism with the built-in fixing plate 6, thereby driving the claw cutter head 8.

[0033] A slot 9 extending from the front to the rear of the support body 1 is provided at the bottom of the support body 1. A water spray head 11 is installed at the front slot of the support body 1 and located below the cutter head, allowing water to be directly injected between the wafer and the ceramic disk, which facilitates the smooth entry of the wafer into the basket. A square slot 10 for connecting a water pipe is provided at the rear slot of the support body 1, and a flow control valve 12 is configured in the square slot 10. The water pipe 19 is led out from the upper rear of the support body, and the flow rate is adjusted by the flow control valve 12.

[0034] This invention employs an independent dual-blade design and achieves wafer separation through a two-stage cutting process. The first stage of cutting is performed by a flat-edge blade, with a rear-mounted telescopic cylinder 3 propelling the flat-edge blade 7 into the interface between the wafer and the ceramic disk to a depth of 2-3 mm. Once in place, the flat-edge blade 7 remains locked in position, successfully establishing the initial separation point. The second stage of cutting is performed by a horn-shaped blade, with a built-in telescopic cylinder 4 driving the horn-shaped blade 8 deeper into the gap between the wafer and the ceramic disk, gradually expanding the separation surface and ultimately achieving complete separation of the wafer. Therefore, the flat-edge blade design facilitates precise insertion between the wafer and the ceramic disk, provides space for the smooth cutting of the horn-shaped blade, and the two-stage cutting effectively disperses stress concentration, significantly improving wafer separation efficiency.

[0035] like Figure 3-6 As shown, the blades 17 and 18 of both the flat-edged cutter head 7 and the claw-horn cutter head 8 adopt a wedge-shaped structure, and both cutters are made of hydrophilic nylon material. The hydrophilic nylon cutter head helps to form a protective water film, effectively reducing the risk of cuts. Both the flat-edged cutter head 7 and the claw-horn cutter head 8 have standard threaded interfaces 15 and 16 at their rear ends, and the cutter head connection uses a screw locking method. This not only ensures the stability of the operation process but also allows for quick cutter head replacement, greatly improving work efficiency and equipment flexibility.

[0036] like Figure 7 As shown, the nozzle 11 has a trumpet shape. When the flushing assembly is activated, it can form a fan-shaped water flow to provide a water film protective layer and auxiliary thrust for the wafer, ensuring a smooth stripping process.

[0037] The core innovation of this utility model lies in the establishment of a "double-blade + two-stage shovel cutting" model. This model first creates the initial peeling point with a flat-edge blade, and then the horn blade performs progressive slit widening, combined with water flow impact to form a continuous dewaxing band, thereby effectively solving the damage and breakage problems in the peeling process of thin wafers, and significantly improving peeling efficiency and yield.

Claims

1. A wafer sheet automated peeling apparatus characterized by comprising: The peeling device comprises a support body, a flat blade head and a horn blade head arranged at the front end of the support body, wherein, The support body is displaced as a whole by a rear retractable electric cylinder as a power source; The flat blade head is detachably mounted on a front end fixed plate arranged at the front end of the support body; The support body is internally provided with a guide groove and a built-in retractable electric cylinder, the piston rod of the built-in retractable electric cylinder extends to the guide groove and forms a linkage mechanism with a built-in fixed plate arranged in the guide groove; the horn blade head is detachably mounted on the built-in fixed plate; A slot extending from the front end to the rear end of the support body is formed at the bottom of the support body, a water jet nozzle is mounted at the front end slot of the support body and located below the blade head; a slot hole for connecting a water pipe is arranged at the rear end slot of the support body, and a flow control valve is arranged in the slot hole.

2. The wafer-on-foil automated peeling apparatus according to claim 1, wherein The blade edges of the flat blade head and the horn blade head are both in wedge-shaped structure.

3. The wafer-on-foil automated peeling apparatus according to claim 1, wherein Standard threaded interfaces are arranged at the rear ends of the flat blade head and the horn blade head, and the flat blade head and the horn blade head are respectively mounted on the threaded holes of the corresponding fixed plates by screws.

4. The wafer-on-foil automated peeling apparatus according to claim 1, wherein The nozzle is in the shape of a horn mouth.

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