Dispensing device for processing semiconductor lighting device

Abstract

The utility model discloses a dispensing device for processing a semiconductor lighting device, which relates to the technical field of semiconductor processing and comprises a machine tool, one end of the top of the machine tool is fixedly connected with a placing table, the other end of the top of the machine tool is fixedly connected with a three-axis moving device, and one end of the three-axis moving device is fixedly connected with a supporting arm. One end of the supporting arm is fixedly connected with a mounting base, and a main rubber pipe bin is inserted into the top of the mounting base through a positioning mechanism. According to the machine tool provided by the utility model, on the basis of preventing residual glue from dripping after use, the influence on use caused by solidification of the glue at the pipe orifice is prevented, so that the problems that the residual glue in the pipe of the existing dispensing device for processing the semiconductor lighting device drips due to gravity after glue is discharged, unnecessary cleaning work is caused, and the working efficiency is improved are solved. And when the dispensing pipe is not used for a long time, air enters the pipe orifice, so that the glue is solidified in the pipe, and the use of the dispensing pipe is influenced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and specifically to a dispensing device for processing semiconductor lighting devices. Background Technology

[0002] Semiconductor lighting devices are a type of device that uses semiconductor materials to emit light. Semiconductor chips are an important component of semiconductor devices. During the production process, adhesive is applied to the surface of the semiconductor chip to form a sealed coating, preventing external environmental factors such as air, moisture, and dust from entering the chip and reducing its reliability and performance.

[0003] Existing dispensing devices for semiconductor lighting device processing apply adhesive to the chip surface by extruded through a dispensing tube. However, after dispensing, the adhesive residue in the tube may drip due to gravity, potentially landing on the chip surface or workbench, causing unnecessary cleaning. Furthermore, air can enter the tube opening when the device is not in use for extended periods, causing the adhesive to solidify inside the tube. Utility Model Content

[0004] In view of the problems existing in the current dispensing device for semiconductor lighting device processing, this utility model is proposed.

[0005] Therefore, the purpose of this utility model is to provide a dispensing device for semiconductor lighting device processing, which solves the problems of existing dispensing devices for semiconductor lighting device processing where residual glue in the tube drips due to gravity after dispensing, causing unnecessary cleaning work, and air entering the tube opening when not in use for a long time, causing the glue to solidify inside the tube and affecting the use of the dispensing tube.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A dispensing device for processing semiconductor lighting devices includes a machine tool. A placement table is fixedly connected to one end of the top of the machine tool, and a three-axis moving device is fixedly connected to the other end of the top of the machine tool. A support arm is fixedly connected to one end of the three-axis moving device, and a mounting base is fixedly connected to one end of the support arm. A main glue tube compartment is inserted into the top of the mounting base through a positioning mechanism. A glue outlet is threadedly connected to the bottom of the main glue tube compartment, and a drive cover compartment is threadedly connected to the top of the main glue tube compartment. An inlet connecting pipe is fixedly connected to the top of the support arm, and a first delivery hose is fixedly connected between the inlet connecting pipe and the main glue tube compartment.

[0008] A cleaning plug tube is slidably connected inside the cavity of the drive cover chamber. A first cylinder is fixedly connected to the first drive cover chamber. One end of the cleaning plug tube is engaged with the dispensing nozzle, and the other end of the cleaning plug tube is fixedly connected to the bottom of the first cylinder. An air pump is fixedly connected to one end of the top of the three-axis moving device. A second delivery hose is fixedly connected between the output end of the air pump and the cleaning plug tube. A pressure applying mechanism is provided at the other end of the cavity of the drive cover chamber. A controller is fixedly connected to one end of the top of the machine tool.

[0009] Preferably, the positioning mechanism includes an installation port, a positioning plate, and a positioning port. The top of the mounting base has an installation port, the main hose compartment is inserted into the installation port, and positioning plates are fixedly connected to both ends of the installation port. Positioning ports are opened at both ends of the tube wall of the positioning plate, and the positioning plates at both ends are inserted into the corresponding positioning ports.

[0010] Preferably, the pressure applying mechanism includes a second cylinder and an annular piston plate. The second cylinder is fixedly connected to the other end of the top of the drive cover chamber. The annular piston plate is slidably connected to one end of the cleaning plug tube. One end of the second cylinder passes through the bottom of the drive cover chamber and is fixedly connected to the top end of the annular piston plate.

[0011] Preferably, the cleaning plug tube includes a hollow tube, a connecting tube, a hollow plug, and a conical plug. One end of the hollow tube passes through the drive cover chamber and is fixedly connected to the connecting tube. The other end of the hollow tube is fixedly connected to the hollow plug. The conical plug is fixedly connected to the tube wall of the hollow plug, and the conical plug engages with the dispensing nozzle.

[0012] Furthermore, an annular ultraviolet reinforcement lamp is fixedly connected to the bottom of the mounting base through an opening, and sealing rubber gaskets are fixedly connected to both ends of the main hose compartment.

[0013] Preferably, the main hose compartment, the dispensing nozzle, the drive cover compartment, the cleaning plug tube, and the surface of the annular piston plate are all provided with a ceramic anti-stick coating.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] 1. This utility model utilizes a mounting base set at one end of the support arm, which is conveniently inserted and positioned with the main hose compartment through a positioning mechanism. The main hose compartment is snapped and fixed in the mounting base by a dispensing nozzle connected to the bottom. The dispensing nozzle and drive cover are threadedly connected to the main hose compartment, which facilitates installation and easy disassembly for maintenance.

[0016] 2. This utility model utilizes a cleaning plug tube that slides within the drive cover chamber. By extending and compressing, residual glue is expelled. Then, gas delivered by an air pump and a second delivery hose sprays the remaining glue from one end of the cleaning plug tube onto the point where glue needs to be applied. Simultaneously, the nozzle is snapped shut and sealed in a static state to prevent excess air from entering the chamber and causing the glue to solidify inside.

[0017] 3. This utility model utilizes a connecting pipe located at the top of a hollow tube to deliver gas into the hollow tube cavity via a second conveying hose. The gas then exits through a conical plug, spraying out any residual glue within the conical plug and preventing it from solidifying and clogging. The conical plug effectively blocks the glue outlet, preventing air from entering when not in use. The hollow plug also squeezes out any residual glue at the outlet of the glue outlet. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a partial structural cross-sectional view of the present invention;

[0021] Figure 3 This is a partially enlarged cross-sectional view of the present invention;

[0022] Figure 4 This invention relates to a ring-shaped ultraviolet-enhanced lamp.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Machine tool; 2. Placement table; 3. Three-axis moving device; 4. Support arm; 5. Mounting base; 6. Main hose compartment; 7. Dispensing nozzle; 8. Drive cover compartment; 9. Inlet connecting pipe; 10. First delivery hose; 11. Cleaning plug pipe; 12. First cylinder; 13. Air pump; 14. Second delivery hose; 15. Controller; 16. Mounting port; 17. Positioning plate; 18. Positioning port; 19. Second cylinder; 20. Annular piston plate; 21. Hollow tube; 22. Connecting pipe; 23. Hollow plug; 24. Conical plug; 25. Annular ultraviolet reinforcement lamp; 26. Sealing rubber gasket. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0026] This utility model discloses a dispensing device for processing semiconductor lighting devices.

[0027] This utility model provides, for example Figure 1-4 The dispensing device for semiconductor lighting device processing shown includes a machine tool 1. A placement table 2 is fixedly connected to one end of the top of the machine tool 1. A three-axis moving device 3 is fixedly connected to the other end of the top of the machine tool 1. A support arm 4 is fixedly connected to one end of the three-axis moving device 3. A mounting base 5 is fixedly connected to one end of the support arm 4. A main glue tube compartment 6 is inserted into the top of the mounting base 5 through a positioning mechanism. A glue outlet 7 is threadedly connected to the bottom of the main glue tube compartment 6. A drive cover compartment 8 is threadedly connected to the top of the main glue tube compartment 6. An inlet connecting pipe 9 is fixedly connected to the top of the support arm 4. A first delivery hose 10 is fixedly connected between the inlet connecting pipe 9 and the main glue tube compartment 6.

[0028] A cleaning plug tube 11 is slidably connected inside the cavity of the drive cover chamber 8. A first cylinder 12 is fixedly connected to the first part of the drive cover chamber 8. One end of the cleaning plug tube 11 is snapped into the dispensing nozzle 7, and the other end of the cleaning plug tube 11 is fixedly connected to the bottom of the first cylinder 12. An air pump 13 is fixedly connected to the top of the three-axis moving device 3. A second delivery hose 14 is fixedly connected between the output end of the air pump 13 and the cleaning plug tube 11. A pressure applying mechanism is provided at the other end of the cavity of the drive cover chamber 8. A controller 15 is fixedly connected to the top of the machine tool 1. The three-axis moving device 3 is used to facilitate the movement of the dispensing equipment at one end. The mounting base 5 is used to facilitate insertion and positioning with the main glue tube chamber 6 through a positioning mechanism. The dispensing nozzle 7 is connected to the bottom to snap and fix the main glue tube chamber 6 in the mounting base 5. The dispensing nozzle 7, which is threadedly connected to the main glue tube chamber 6, and the drive cover chamber 8 facilitate installation and easy disassembly for maintenance. For maintenance, the glue inlet connecting pipe 9 is connected to the glue delivery pipe, and then the glue is delivered to the main glue tube chamber 6 through the first delivery hose 10. The glue is squeezed out by the pressure mechanism to perform the dispensing work. The cleaning plug tube 11 is used to squeeze out the residual glue through extension and compression. Then, the air pump 13 and the second delivery hose 14 deliver the gas to spray out the residual glue at one end of the cleaning plug tube 11 and drip it onto the current dispensing point. At the same time, the dispensing nozzle 7 is clamped and sealed in the static state to prevent excess air from entering the chamber and causing the glue to solidify in the chamber. The controller 15 is used to facilitate the control of the device. This solves the problems of the existing dispensing device for semiconductor lighting device processing, where the glue residue in the tube after dispensing drips due to gravity, causing unnecessary cleaning work, and the glue solidifying in the tube when not in use for a long time, which affects the use of the dispensing tube.

[0029] To facilitate installation and prevent rotation of the main hose compartment 6, such as Figure 2 and 3 As shown, the positioning mechanism includes an installation port 16, a positioning plate 17, and a positioning port 18. The top of the mounting base 5 has an installation port 16, and the main hose compartment 6 is inserted into the installation port 16. The two ends of the installation port 16 are fixedly connected to the positioning plate 17. The two ends of the pipe wall of the positioning plate 17 have positioning ports 18. The two end positioning plates 17 are inserted into the corresponding positioning ports 18. The installation port 16 facilitates the insertion and installation of the main hose compartment 6 into the installation port 16. The positioning plate 17 is inserted into the positioning port 18 to position the main hose compartment 6 during installation and prevent the main hose compartment 6 from rotating.

[0030] In order to apply pressure and expel the glue from the tube, such as Figure 2 and 3 As shown, the pressure-applying mechanism includes a second cylinder 19 and an annular piston plate 20. The second cylinder 19 is fixedly connected to the other end of the top of the drive cover chamber 8. The annular piston plate 20 is slidably connected to one end of the cleaning plug tube 11. One end of the second cylinder 19 passes through the bottom of the drive cover chamber 8 and is fixedly connected to the top end of the annular piston plate 20. By using the annular piston plate 20, the glue in the tube is squeezed out by the push of the second cylinder 19.

[0031] To prevent residual glue from hardening and clogging, and to clean the outlet of nozzle 7, such as Figure 1-3 As shown, the cleaning plug tube 11 includes a hollow tube 21, a connecting tube 22, a hollow plug 23, and a conical plug 24. One end of the hollow tube 21 passes through the drive cover chamber 8 and is fixedly connected to the connecting tube 22. The other end of the hollow tube 21 is fixedly connected to the hollow plug 23. The conical plug 24 is fixedly connected to the wall of the hollow plug 23. The conical plug 24 is engaged with the glue nozzle 7. Using the connecting tube 22, gas is delivered to the cavity of the hollow tube 21 through the second delivery hose 14 and discharged into the conical plug 24, spraying out the residual glue in the conical plug 24 to prevent the residual glue from solidifying and clogging. Using the conical plug 24, the glue nozzle 7 is blocked to prevent air from entering when not in use. Using the hollow plug 23, the residual glue at the outlet of the glue nozzle 7 is squeezed out.

[0032] To accelerate the adhesive curing time and to seal and protect the connections at both ends of the main adhesive tube 6, such as... Figure 2-4As shown, a ring-shaped ultraviolet curing lamp 25 is fixedly connected to the bottom of the mounting base 5 through an opening, and sealing rubber gaskets 26 are fixedly connected to both ends of the main glue tube compartment 6. By using the ultraviolet curing lamp 25, the curing time of some materials can be accelerated by ultraviolet irradiation, and the sealing rubber gaskets 26 are used to seal and protect the connection at both ends of the main glue tube compartment 6.

[0033] To avoid sticking with glue, such as Figure 1-3 As shown, the main hose chamber 6, the dispensing nozzle 7, the drive cover chamber 8, the cleaning plug tube 11, and the annular piston plate 20 are all provided with a ceramic anti-stick coating. The ceramic anti-stick coating is used to prevent the main hose chamber 6, the dispensing nozzle 7, the drive cover chamber 8, the cleaning plug tube 11, and the annular piston plate 20 from sticking to the glue.

[0034] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A dispensing device for processing a semiconductor lighting device, comprising a machine tool (1), characterized in that The top end of the machine tool (1) is fixedly connected with a placing table (2), the other end of the top of the machine tool (1) is fixedly connected with a three-axis moving device (3), one end of the three-axis moving device (3) is fixedly connected with a supporting arm (4), one end of the supporting arm (4) is fixedly connected with a mounting seat (5), the top of the mounting seat (5) is inserted with a main rubber pipe bin (6) through a positioning mechanism, the bottom of the main rubber pipe bin (6) is threadedly connected with a glue outlet nozzle (7), the top of the main rubber pipe bin (6) is threadedly connected with a driving cover bin (8), the top of the supporting arm (4) is fixedly connected with a glue inlet connecting pipe (9), the glue inlet connecting pipe (9) and the main rubber pipe bin (6) are fixedly connected with a first conveying hose (10). The cavity of the driving cover bin (8) is slidably connected with a cleaning plug pipe (11), the first end of the cleaning plug pipe (11) is clamped with the glue outlet nozzle (7), the other end of the cleaning plug pipe (11) is fixedly connected with the bottom of the first air cylinder (12), the top of the three-axis moving device (3) is fixedly connected with an air pump (13), the output end of the air pump (13) and the cleaning plug pipe (11) are fixedly connected with a second conveying hose (14), the other end of the cavity of the driving cover bin (8) is provided with a pressure applying mechanism, the top of the machine tool (1) is fixedly connected with a controller (15).

2. The point gluing device for processing semiconductor lighting devices according to claim 1, wherein The positioning mechanism comprises a mounting port (16), a positioning plate (17) and a positioning port (18), the top of the mounting seat (5) is provided with a mounting port (16), the main rubber pipe bin (6) is inserted with the mounting port (16), the two ends of the mounting port (16) are fixedly connected with a positioning plate (17), the pipe wall of the positioning plate (17) is provided with a positioning port (18) at both ends, and the two ends of the positioning plate (17) are inserted with the corresponding positioning port (18).

3. The point gluing device for processing semiconductor lighting devices according to claim 1, wherein The pressure applying mechanism comprises a second air cylinder (19) and an annular piston plate (20), the other end of the cavity of the driving cover bin (8) is fixedly connected with a second air cylinder (19), one end of the cleaning plug pipe (11) is slidably connected with an annular piston plate (20), one end of the second air cylinder (19) penetrates through the bottom of the driving cover bin (8) and is fixedly connected with the other end of the top of the annular piston plate (20).

4. The point gluing device for processing semiconductor lighting devices according to claim 1, wherein The cleaning plug pipe (11) comprises a hollow pipe (21), a connecting pipe (22), a hollow plug (23) and a conical plug block (24), one end of the hollow pipe (21) penetrates through the driving cover bin (8) and is fixedly connected with a connecting pipe (22), the other end of the hollow pipe (21) is fixedly connected with a hollow plug (23), the pipe wall of the hollow plug (23) is fixedly connected with a conical plug block (24), and the conical plug block (24) is clamped with the glue outlet nozzle (7).

5. The point gluing device for processing semiconductor lighting devices according to claim 1, wherein The bottom of the mounting seat (5) is fixedly connected with an annular ultraviolet reinforcing lamp (25) through an opening, and the two ends of the main rubber pipe bin (6) are fixedly connected with sealing rubber gaskets (26).

6. The point gluing device for processing semiconductor lighting devices according to claim 1, wherein The cavities of the main hose cartridge (6), the glue outlet nozzle (7), the driving cover cartridge (8), the cleaning plug pipe (11) and the surface of the annular piston plate (20) are provided with ceramic anti-sticking coating.

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