Conductive roller copper plating point improving device and conductive roller mechanism comprising same

Abstract

The utility model belongs to the field of electroplating, and particularly discloses a conductive roller copper plating point improving device and a conductive roller mechanism comprising the same. The device comprises a liquid receiving box, a copper foil electrode, a copper foil conductive clamp, an auxiliary cathode connecting busbar, a switching power supply and a third auxiliary cathode connecting busbar. The liquid receiving box is an open rectangular groove and located below the conductive roller, a copper foil electrode is arranged in the liquid receiving box, and a copper foil conductive clamp is connected with positive and negative electrodes of the conductive block and the copper foil electrode. And the switching power supply is connected with the copper foil electrode through the auxiliary cathode connecting busbar and is conducted with the conductive block through the third auxiliary cathode connecting busbar. The copper foil electrode and the conductive roller are equal in width, and the liquid receiving box is provided with a spraying pipeline to achieve liquid self-circulation. In addition, the liquid receiving box is made of a PVC material and has a specific thickness. The conductive roller mechanism further comprises a cross-shaped conductive block which is flexibly connected with the cathode of the electrolytic rectifier so as to be connected with the anode plate. According to the utility model, the uniformity and efficiency of copper plating are improved, and the device is suitable for improving the copper plating point of the conductive roller in copper foil production.

Description

Technical Field

[0001] This utility model belongs to the field of electroplating, and specifically discloses a device for improving copper plating points on a conductive roller and a conductive roller mechanism containing the device. Background Technology

[0002] In the production of electrolytic copper foil, the post-processing machine is a crucial surface treatment step. The conductive roller is the negative electrode carrier that bears the current from the electroplating tank. Positive charges move forward through the copper foil surface to the conductive roller, forming a conductive circuit. As the linear speed of the post-processing machine increases, the process current also increases. Generally, the conductive roller must carry a current of ≥8KA Amperes. The manufacturing process and material selection of the conductive roller are critical. Even slight defects or improper use can result in numerous copper plating spots on the surface of the conductive roller. This is because the copper foil passes through the conductive roller and is pressed tightly against it, causing surface pits and rendering the foil unusable. While the currently used Hastelloy alloy guide rollers largely avoid copper plating spots, these spots still appear over time. Therefore, improving the copper plating on the conductive roller is the technical challenge that this invention aims to address and solve.

[0003] CN217677855U discloses a conductive roller mechanism for a conductive device, disposed in a plating bath, including a first conductive roller, a second conductive roller, a third conductive roller, and a fourth conductive roller. The central axes of the first, second, third, and fourth conductive rollers are respectively located at the four vertices of the same rhombus. An electroplated copper film sequentially crosses the four conductive rollers, with the wrap angle of the electroplated copper film passing over each of the rollers being greater than 90°. The rhombus-shaped conductive roller mechanism provided by this invention ensures full contact between the electroplated copper film and the conductive rollers, significantly reducing the current density at the contact surface, lowering the heat generation rate, and preventing the electroplated copper film from being ablated and perforated due to heat.

[0004] CN112663119B discloses a device and method for preventing copper plating on a conductive roller in the field of manufacturing copper plating film. The conductive roller and the electroplating anode are respectively connected to the negative and positive output terminals of a first power source. After the conductive roller and the electroplating anode are energized, they electroplat the film product flowing through the plating bath. The conductive roller is connected to the positive output terminal of a second power source, and an auxiliary electrode connected to the negative output terminal of the second power source is used to electrolyze the conductive roller, so that copper deposition is avoided when the conductive roller electroplats the film product.

[0005] However, the above methods are relatively expensive or complicated to implement. Utility Model Content

[0006] To address the above problems, this utility model discloses a device for improving copper plating points on a conductive roller and a conductive roller mechanism containing the device.

[0007] The technical solution of this utility model is as follows:

[0008] A device for improving copper plating points on a conductive roller includes a liquid receiving box, copper foil electrodes, copper foil conductive clamps, auxiliary cathode connecting busbars, a switching power supply, and a third auxiliary cathode connecting busbar. The liquid receiving box is an open rectangular slot, arranged parallel to the bottom of the conductive roller. The copper foil electrodes are disposed in the liquid receiving box. One end of the copper foil conductive clamp is mounted on a conductive block, and the other end clamps the positive and negative terminals of the copper foil electrodes respectively. The switching power supply is disposed below the liquid receiving box. The switching power supply is connected to the positive and negative terminals of the copper foil electrodes through two auxiliary cathode connecting busbars. The switching power supply is also connected to the conductive block through a third auxiliary cathode connecting busbar.

[0009] Furthermore, in the aforementioned conductive roller copper plating point improvement device, the copper foil electrode has the same width as the conductive roller surface.

[0010] Furthermore, in the aforementioned conductive roller copper plating point improvement device, the liquid receiving box is connected to a spray pipe to achieve liquid self-circulation.

[0011] Furthermore, in the aforementioned conductive roller copper plating point improvement device, the width between the positive and negative electrodes of the copper foil electrode is 10 cm.

[0012] Furthermore, in the aforementioned conductive roller copper plating point improvement device, the liquid receiving box is made of PVC material with a thickness of 3mm.

[0013] This utility model also discloses a conductive roller mechanism for producing copper foil, which is equipped with the aforementioned conductive roller copper plating point improvement device.

[0014] Furthermore, in the aforementioned conductive roller mechanism for producing copper foil, the conductive block is a cross-shaped conductive block disposed on one side of the conductive roller.

[0015] Furthermore, in the aforementioned conductive roller mechanism for producing copper foil, the conductive roller is also connected to a cathode flexible connection of an electrolytic rectifier for connecting to the anode plate.

[0016] This utility model has the following beneficial effects:

[0017] This utility model discloses a device for improving copper plating spots on conductive rollers and a conductive roller mechanism containing the device. 1. The copper foil electrodes are of the same width as the conductive roller surface, and the positive and negative copper foil electrodes are evenly and stably spaced, making installation simple and maintenance easy. 2. The liquid receiving box is connected to the spray pipe, and the liquid inside the box circulates. 3. The current of the switching power supply is continuously adjustable, with start-stop linkage for convenient operation and control. Under the premise that the conductive roller completes the electroplating function, it can realize the electrolysis of the plating solution near the conductive roller, so as to balance the copper plating and electrolytic processes on the conductive roller, avoid copper residue on the conductive roller, and thus improve the quality of copper plating on the coated product. Furthermore, this utility model does not add any process steps to the electroplating process and does not affect the realization of the electroplating process. This utility model can remove copper plating spots online without stopping the machine, avoiding the problems of downtime and product scrapping, and effectively improving the normal use of the conductive roller.

[0018] Compared to CN217677855U, this utility model has a simple structure, low manufacturing cost, requires less structural modification, does not come into contact with the production product, and greatly reduces the impact on the product; compared to CN112663119B, this utility model has an innovative structure, uses environmentally friendly and self-made materials, and is easy to implement, which helps to prevent the formation of copper plating spots and improve the quality of products and the operational capacity of equipment in the post-processing section. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of a conductive roller copper plating point improvement device and a conductive roller structure including the above device disclosed in this utility model.

[0020] Figure 2 for Figure 1 Side view;

[0021] Figure 3 for Figure 1 Top view;

[0022] Figure 4 This is a schematic diagram of the positive and negative electrodes;

[0023] Figure 5 This is an exploded view of the device;

[0024] Figure 6 This is a partial view of the conductive clamp;

[0025] Figure 7 This is a schematic diagram of the back of the device;

[0026] The components include: 1. Conductive roller; 2. Liquid receiving box; 3. Copper foil electrode; 4. Copper foil conductive clamp; 5. Auxiliary cathode connecting busbar; 6. Electrolytic rectifier cathode flexible connection; 7. Conductive block; 8. Switching power supply; and 9. Third auxiliary cathode connecting busbar. Detailed Implementation

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0028] Example 1

[0029] like Figure 1-7 The device shown is for improving copper plating spots on a conductive roller, comprising a liquid receiving box 2, copper foil electrodes 3, copper foil conductive clamps 4, auxiliary cathode connecting busbars 5, a switching power supply 8, and a third auxiliary cathode connecting busbar 9. The liquid receiving box 2 is an open rectangular slot, arranged parallel to the conductive roller 1 directly below it. The copper foil electrodes 3 are disposed in the liquid receiving box 2. One end of the copper foil conductive clamp 4 is mounted on a conductive block 7, and the other end clamps the positive and negative terminals of the copper foil electrodes 3 respectively. The switching power supply 8 is disposed below the liquid receiving box 2. The switching power supply 8 is connected to the copper foil through two positive and negative auxiliary cathode connecting busbars 5. The positive and negative terminals of electrode 3; the switching power supply 8 is also connected to the conductive block 7 via a third auxiliary cathode busbar 9; preferably, the copper foil electrode 3 and the conductive roller 1 have the same width; furthermore, the liquid receiving box 2 is connected to a spray pipe to realize liquid self-circulation; in particular, the width between the positive and negative terminals of the copper foil electrode 3 is 10cm; preferably, the liquid receiving box 2 is made of 3mm thick PVC board, customized according to the length of the conductive roller 1 and the effective size below the conductive roller 1, and an opening pressure plate is welded at a position 10cm from the center of the liquid receiving box 2 to facilitate the pressing of the copper foil electrode 3.

[0030] When installing the copper foil electrode, simply press the copper foil electrode parallel and flat into the open pressure plate on both sides of the receiving box.

[0031] The working principle is as follows: The conductive roller copper plating improvement device applies a positive conductive electric field to the online conductive roller 1. The positive current output of the device's switching power supply 8 is connected in series with the inherent negative terminal of the conductive roller 1, and then connected to the positive terminal of the copper foil electrode 3 of the liquid receiving box 2 through a wire. The negative terminal of the device's switching power supply 8 is connected to the negative terminal of the copper foil electrode 3 of the liquid receiving box. A circuit is formed through the special electroplating solution in the liquid receiving box 2 (the liquid level in the liquid receiving box 2 exceeds the roller arc length by 5cm). That is, a positive voltage is applied to the arc surface of the conductive roller 1, which adsorbs the copper plating ions generated by the conductive roller 1 during production and onto the negative electrode, thereby realizing the online removal of copper plating points on the surface of the conductive roller 1, so that the conductive roller 1 in use can operate for a long time.

[0032] Example 2

[0033] like Figure 1-7The conductive roller mechanism shown is used for producing copper foil and is equipped with the copper plating point improvement device of the conductive roller described in Example 1. The conductive block 7 is a cross-shaped conductive block and is disposed on one side of the conductive roller 1. The conductive roller is also connected to the cathode flexible connection 6 of the electrolytic rectifier for connecting the anode plate.

[0034] The working principle is as follows: The conductive roller copper plating improvement device applies a positive conductive electric field to the online conductive roller 1. The positive current output of the device's switching power supply 8 is connected in series with the inherent negative terminal of the conductive roller 1, and then connected to the positive terminal of the copper foil electrode 3 of the liquid receiving box 2 through a wire. The negative terminal of the device's switching power supply 8 is connected to the negative terminal of the copper foil electrode 3 of the liquid receiving box. A circuit is formed through the special electroplating solution in the liquid receiving box 2 (the liquid level in the liquid receiving box 2 exceeds the roller arc length by 5cm). That is, a positive voltage is applied to the arc surface of the conductive roller 1, which adsorbs the copper plating ions generated by the conductive roller 1 during production and onto the negative electrode, thereby realizing the online removal of copper plating points on the surface of the conductive roller 1, so that the conductive roller 1 in use can operate for a long time.

[0035] The above are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of protection of the present utility model. Any simple equivalent changes and modifications made in accordance with the claims and content of the present utility model shall still fall within the scope of protection of the present utility model patent application.

Claims

1. A device for improving copper plating points on conductive rollers, characterized in that, The device comprises a liquid receiving box (2), a copper foil electrode (3), a copper foil conducting clamp (4), an auxiliary cathode connecting busbar (5), a switching power supply (8), and a third auxiliary cathode connecting busbar (9). The liquid receiving box (2) is an open rectangular groove, which is arranged in parallel below the conducting roller (1). The copper foil electrode (3) is arranged in the liquid receiving box (2). One end of the copper foil conducting clamp (4) is mounted on the conducting block (7), and the other end clamps the positive and negative poles of the copper foil electrode (3) respectively. The switching power supply (8) is arranged below the liquid receiving box (2). The switching power supply (8) is connected to the positive and negative poles of the copper foil electrode (3) through two auxiliary cathode connecting busbars (5). The switching power supply (8) is also connected to the conducting block (7) through a third auxiliary cathode connecting busbar (9).

2. The apparatus for improving copper plating of a conductive roller according to claim 1, wherein The copper foil electrode (3) has the same width as the conducting roller (1).

3. The apparatus for improving copper plating of a conductive roller according to claim 1, wherein The liquid receiving box (2) is connected with a spraying pipeline to realize liquid self-circulation.

4. The apparatus for improving copper plating of a conductive roller according to claim 1, wherein The width between the positive and negative poles of the copper foil electrode (3) is 10 cm.

5. The apparatus for improving copper plating of a conductive roller according to claim 1, wherein The liquid receiving box (2) is made of PVC with a thickness of 3 mm.

6. A conductive roll mechanism for producing a copper foil, characterized by, The conducting roller is mounted with the copper plating point improvement device according to any one of claims 1-5.

7. The conductive roll mechanism for producing a copper foil according to claim 6, wherein The conducting block (7) is a cross-shaped conducting block, which is arranged on one side of the conducting roller (1).

8. The conductive roll mechanism for producing a copper foil according to claim 6, wherein The conducting roller is also connected with an electrolytic rectifier cathode soft connection (6) for connecting the anode plate.

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