Circuit board substrate printing clamp

Abstract

The utility model provides a circuit board substrate printing clamp which comprises a base assembly, a tray assembly and a sliding block assembly, the base assembly comprises a vacuum base, and a plurality of vacuum through holes are formed in the vacuum base; the tray assembly is installed on the base assembly and comprises a tray body. The tray body is connected with the vacuum base in a sealed mode and provided with an adsorption through hole communicated with the vacuum through hole and a sliding long hole formed around the adsorption through hole, the adsorption through hole can adsorb a circuit board substrate in a vacuum mode to achieve fixation, the sliding long hole can be provided with an adjustable sliding block in a matched mode, and a clamping frame for positioning the circuit board substrate is formed. And the position of the adjustable sliding block in the sliding long hole can be conveniently adjusted by utilizing the locking mechanism, so that the adjustable sliding block is adaptive to circuit board substrates with different sizes. Printing positioning of various circuit board substrates can be achieved, the operation requirements of substrates of various sizes in the laboratory stage are met, reliable adsorption positioning is carried out, equipment manufacturers are helped to carry out product proofing more quickly, cost waste is reduced, and the production period is shortened.

Description

Technical Field

[0001] This application relates to the field of circuit board printing equipment technology, and more specifically, to a circuit board substrate printing fixture. Background Technology

[0002] Currently, in the PCB printing industry, different printing fixtures need to be customized according to the products produced on the production line. Therefore, multiple printing fixtures are needed in the laboratory stage to meet the production of various samples. This forces design companies to design different printing fixtures for customers to make samples, resulting in extended prototyping cycles and high fixture costs. In existing PCB printing manufacturing processes, such as the PCB fixing fixture disclosed in Chinese Patent CN107484353A, the clamping structure is fixed and can only achieve positioning and printing of PCBs of a single size. It cannot be adapted to PCB substrates of multiple sizes, which leads to long fixture design time in the laboratory stage, delayed work cycles, and high fixture manufacturing costs. Utility Model Content

[0003] This application provides a circuit board substrate printing fixture to solve the problem that existing circuit board printing fixtures cannot be adapted to circuit board substrates of different sizes, resulting in extended work cycles and increased fixture costs.

[0004] A circuit board substrate printing fixture according to this application includes:

[0005] A base assembly, comprising a vacuum base having several vacuum through holes;

[0006] A tray assembly is mounted on a base assembly and includes a tray body; the tray body and the vacuum base are sealed together and are provided with an adsorption through hole communicating with the vacuum through hole and a sliding elongated hole arranged around the adsorption through hole;

[0007] The slider assembly is mounted on the tray assembly and includes multiple sets of adjustable sliders and locking mechanisms. The adjustable sliders are slidably mounted in the sliding elongated holes, and the locking mechanisms lock or unlock the adjustable sliders.

[0008] In some embodiments, multiple sets of vacuum through holes and adsorption through holes are arranged in alignment, and each set of vacuum through holes and adsorption through holes is arranged in an X-shape; four sliding elongated holes are provided around each set of adsorption through holes on the tray body, and the four sliding elongated holes are respectively arranged in two relatively perpendicular directions.

[0009] In some embodiments, an X-shaped sealing ring is provided around each set of vacuum through holes on the base assembly, and the X-shaped sealing ring is pressed between the vacuum base and the tray body.

[0010] In some embodiments, the lower end of the vacuum base is provided with a suction chamber that communicates with each vacuum through hole; the base assembly also includes a cavity sealing ring, which is disposed around the suction chamber.

[0011] In some embodiments, the base is provided with fixing grooves corresponding to both the X-shaped sealing ring and the cavity sealing ring, and the X-shaped sealing ring and the cavity sealing ring are respectively bonded and fixed in the corresponding fixing grooves.

[0012] In some embodiments, the vacuum base and the tray body are provided with aligned positioning holes at the center and at least one edge, and positioning pins are inserted into the positioning holes.

[0013] In some embodiments, the adjustable slider includes a guide block and fins. The guide block is sized to match the sliding elongated hole and extends into the sliding elongated hole, sliding along the sliding elongated hole. The fins are disposed above the guide block and extend to both sides, with the fins covering the upper part of the sliding elongated hole.

[0014] In some embodiments, a locking groove is provided at the bottom of the sliding elongated hole; the locking mechanism is a locking bolt, which is threadedly connected to the lower end of the guide block, and the end cap of the locking bolt is wider than the opening of the locking groove.

[0015] In some embodiments, the bottom surface of the vacuum base is provided with a plurality of magnet fixing holes, and a perforated magnet is provided in the magnet fixing hole. The perforated magnet is fixedly installed in the magnet fixing hole by fixing bolts.

[0016] In some embodiments, the surface of the tray body is provided with a plurality of substrate placement grooves, each substrate placement groove covering the area where the adsorption through hole and the sliding elongated hole are located.

[0017] The circuit board substrate printing fixture using the technical solution of this application includes a base assembly, a tray assembly, and a slider assembly. The base assembly includes a vacuum base with several vacuum through holes. The tray assembly is mounted on the base assembly and includes a tray body. The tray body and the vacuum base are sealed together and have adsorption through holes communicating with the vacuum through holes and sliding elongated holes surrounding the adsorption through holes. The adsorption through holes can vacuum adsorb and fix the circuit board substrate, while the sliding elongated holes can be used to install adjustable sliders to form a clamping frame for positioning the circuit board substrate. A locking mechanism allows for convenient adjustment of the position of the adjustable slider within the sliding elongated holes, thus adapting it to circuit board substrates of different sizes. This application can achieve printing positioning of various circuit board substrates, meeting the operational needs of various sizes of substrates in the laboratory stage, and providing reliable adsorption positioning. This helps equipment manufacturers to produce samples faster, reduce cost waste, and shorten production cycles. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the overall structure of the circuit board substrate printing fixture according to an embodiment of this application is shown;

[0021] Figure 2 An exploded view of the circuit board substrate printing fixture according to an embodiment of this application is shown;

[0022] Figure 3 A schematic diagram of the tray assembly structure of the circuit board substrate printing fixture according to an embodiment of this application is shown;

[0023] Figure 4 A schematic diagram of the slider assembly structure of the circuit board substrate printing fixture according to an embodiment of this application is shown;

[0024] Figure 5 A schematic diagram of the top surface of the base assembly of the circuit board substrate printing fixture according to an embodiment of this application is shown;

[0025] Figure 6 A schematic diagram of the bottom surface of the base assembly of the circuit board substrate printing fixture according to an embodiment of this application is shown;

[0026] The above figures include the following reference numerals:

[0027] 10. Base assembly; 11. Vacuum base; 111. Vacuum through hole; 112. Suction chamber; 113. Positioning hole one; 114. Magnet fixing hole; 12. X-shaped sealing ring; 13. Cavity sealing ring; 14. Positioning pin; 15. Perforated magnet; 16. Fixing bolt; 20. Tray assembly; 21. Tray body; 22. Adsorption through hole; 23. Sliding elongated hole; 231. Locking groove; 24. Positioning hole two; 25. Substrate placement groove; 30. Slider assembly; 31. Adjustable slider; 311. Guide block; 312. Fin; 32. Locking bolt. Detailed Implementation

[0028] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0030] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0031] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0032] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0033] Figures 1 to 6 An embodiment of the circuit board substrate printing fixture of this application is illustrated schematically.

[0034] like Figures 1 to 6As shown, this application discloses a circuit board substrate printing fixture, which includes: a base assembly 10, which includes a vacuum base 11 with a plurality of vacuum through holes 111; a tray assembly 20, which is mounted on the base assembly 10 and includes a tray body 21. The tray body 21 and the vacuum base 11 are sealed together and are provided with adsorption through holes 22 communicating with the vacuum through holes 111 and sliding elongated holes 23 surrounding the adsorption through holes 22; and a slider assembly 30, which is mounted on the tray assembly 20 and includes multiple sets of adjustable sliders 31 and a locking mechanism. The adjustable sliders 31 are slidably mounted in the sliding elongated holes 23 one-to-one, and the locking mechanism locks or unlocks the adjustable sliders 31.

[0035] Through the above structural design, the tray body 21 and the vacuum base 11 cooperate with each other to achieve vacuum adsorption and fixation of the circuit board substrate. At the same time, the slider assembly 30 located above the tray body 21 can also be conveniently slidably adjusted to change the size of the frame for positioning the circuit board substrate, conveniently and flexibly adapting to circuit board substrates of different sizes, realizing printing positioning of various circuit board substrates, meeting the needs of various sizes of substrates in the laboratory stage, helping equipment manufacturers to produce product samples faster, thereby reducing the waste of production costs of printing fixtures and significantly shortening the production cycle in the laboratory stage.

[0036] In some embodiments of this application, such as Figures 1 to 6 As shown, in the printing fixture of this embodiment, multiple sets of vacuum through-holes 111 and adsorption through-holes 22 are aligned, thereby simultaneously adsorbing and fixing multiple (e.g., four) circuit board substrates, improving the efficiency of circuit board printing. (Reference) Figure 3 , Figure 5 and Figure 6 As shown, each set of vacuum through-holes 111 and adsorption through-holes 22 is arranged in an X-shape, aligned with each other to form adsorption channels for the circuit board substrate. Due to their X-shaped arrangement, the adsorption channels are widely distributed, ensuring a firm and uniform adsorption of the circuit board substrate, thus improving printing quality. Figure 1 and Figure 3 As shown, four sliding elongated holes 23 are provided around each set of adsorption through holes 22 on the tray body 21. The four sliding elongated holes 23 are respectively arranged in two relatively perpendicular directions to achieve reliable positioning of the circuit board substrate in all directions.

[0037] In some embodiments of this application, such as Figure 5 As shown, on the base assembly 10, an X-shaped sealing ring 12 is provided around each set of vacuum through holes 111. The X-shaped sealing ring 12 is pressed between the vacuum base 11 and the tray body 21 to achieve a stable fit between the vacuum base 11 and the tray body 21 and prevent air leakage.

[0038] In some embodiments of this application, such as Figure 6 As shown, the lower end face of the vacuum base 11 is provided with a suction chamber 112 that connects to each vacuum through hole 111. The suction chamber 112 is used to connect to an external vacuum pumping device, thereby providing negative pressure to each vacuum through hole 111 to achieve the function of adsorbing the substrate. To ensure a leak-proof seal between the vacuum base 11 and the vacuum pumping device's worktable, such as... Figure 6 As shown, the base assembly 10 also includes a cavity sealing ring 13, which surrounds the suction cavity 112 and serves to seal the vacuum base 11 against the worktable of the vacuum equipment.

[0039] In some embodiments of this application, reference is made to Figure 5 and Figure 6 As shown, the vacuum base 11 is provided with fixing grooves for both the X-type sealing ring 12 and the cavity sealing ring 13. The X-type sealing ring 12 and the cavity sealing ring 13 are respectively bonded and fixed in the corresponding fixing grooves to fix their positions, which facilitates the assembly and use of the printing fixture.

[0040] In some embodiments of this application, reference is made to Figure 4 As shown, the adjustable slider 31 includes a guide block 311 and fins 312. The guide block 311 is sized to match the sliding elongated hole 23 and can extend into the sliding elongated hole 23 and slide along the sliding elongated hole 23. The fins 312 are disposed above the guide block 311 and extend to both sides. The fins 312 are attached to the upper part of the sliding elongated hole 23 to form a clamping frame for positioning the circuit board substrate, thereby realizing the positioning and accommodation of circuit board substrates of different sizes.

[0041] In some embodiments of this application, reference continues to be made to Figure 4 As shown, a locking groove 231 is provided at the bottom of the sliding elongated hole 23. The locking groove 231 serves two purposes: firstly, to support the guide block 311 of the adjustable slider 31, and secondly, to cooperate with the locking mechanism to lock the adjustable slider 31. In the embodiments of this application, as... Figure 4 As shown, the locking mechanism is a locking bolt 32, which is threaded to the lower end of the guide block 311. The end cap of the locking bolt 32 is wider than the opening of the locking groove 231. By tightening the locking bolt 32, the position of the adjustable slider 31 relative to the sliding elongated hole 23 can be fixed to match circuit board substrates of different sizes.

[0042] In some embodiments of this application, such as Figure 1 , Figure 3 and Figure 5 As shown, the vacuum base 11 and the tray body 21 are provided with aligned positioning holes (i.e., positioning hole one 113 and positioning hole two 24) at the center and at at least one edge position. Positioning pins 14 are inserted into the positioning holes to determine the position of the tray body 21 relative to the vacuum base 11.

[0043] In some embodiments of this application, such as Figure 2 and Figure 6 As shown, the bottom surface of the vacuum base 11 is provided with a plurality of magnet fixing holes 114, and a perforated magnet 15 is disposed in the magnet fixing hole 114. The perforated magnet 15 is fixedly installed in the magnet fixing hole 114 by fixing bolts 16, for adsorbing and fixing the vacuum base 11 to the worktable of the vacuum pumping equipment. In the embodiment of this application, from Figure 6 It can be seen that the magnet fixing holes 114 and the perforated magnets 15 are distributed around the bottom surface of the vacuum base 11 to ensure that the magnetic attraction force is sufficient and the force is balanced.

[0044] In some embodiments of this application, such as Figure 3 As shown, the surface of the tray body 21 is provided with several substrate placement grooves 25, each covering the area where the adsorption through hole 22 and the sliding elongated hole 23 are located. In this embodiment, the substrate placement grooves 25 provide recessed accommodating space for accommodating the circuit board substrate, and can also provide extra space to accommodate impurities such as solder paste scattered during the printing process, protecting the circuit board substrate during the printing process and improving printing quality.

[0045] Combination Figures 1 to 6 The working principle of the embodiments of this application is explained as follows:

[0046] In the circuit board printing process, the vacuum base 11 of this application is fixed to the worktable of the vacuum equipment by adsorption using a perforated magnet 15 at its bottom end, and its suction chamber 112 is connected to the vacuum equipment. The tray body 21 is positioned on the vacuum base 11 by positioning pins 14, and its adsorption through hole 22 is connected to the vacuum through hole 111 of the vacuum base 11, forming an X-shaped adsorption area for adsorbing and fixing the circuit board substrate. Multiple X-shaped sealing rings 12 achieve a sealed fit between the tray body 21 and the vacuum base 11, isolating external air and preventing leakage. Around each X adsorption area of ​​the tray body 21, an adjustable slider 31 is fixed at a specific position of the sliding elongated hole 23 by locking bolts 32 to form a positioning frame for positioning the circuit board substrate, used to match the size of the circuit board substrate to be printed.

[0047] When printing circuit boards of other sizes are required, the tray body 21 of this application can be removed, and the locking bolt 32 can be loosened to allow the adjustable slider 31 to slide relative to the sliding elongated hole 23. The position of the adjustable slider 31 is determined by calculation, and the distance between the adjustable slider 31 and the rear end of the sliding elongated hole 23 is adjusted using tools such as vernier calipers. After adjusting the distance, the locking bolt 32 is turned to fix it, thus completing the adjustment of the printing fixture to adapt it to the new size of the circuit board substrate.

[0048] In summary, the circuit board substrate printing fixture of this application includes a base assembly, a tray assembly, and a slider assembly. The base assembly includes a vacuum base with a plurality of vacuum through holes. The tray assembly is mounted on the base assembly and includes a tray body. The tray body and the vacuum base are sealed together and have adsorption through holes communicating with the vacuum through holes and sliding elongated holes surrounding the adsorption through holes. The adsorption through holes can vacuum adsorb and fix the circuit board substrate, while the sliding elongated holes can be used to install an adjustable slider to form a clamping frame for positioning the circuit board substrate. The locking mechanism can easily adjust the position of the adjustable slider within the sliding elongated holes, thereby adapting it to circuit board substrates of different sizes. The tray body and the vacuum base cooperate to achieve vacuum adsorption and fixation of the circuit board substrate. At the same time, the slider assembly located above the tray body can also be easily slidably adjusted to change the size of the frame for fixing the circuit board substrate, conveniently and flexibly adapting to circuit board substrates of different sizes, realizing circuit board substrate printing positioning, meeting the needs of various sizes of substrates in the laboratory stage, and helping equipment manufacturers to produce samples faster, thereby reducing the waste of production costs for printing fixtures and significantly shortening the laboratory production cycle.

[0049] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board substrate printing jig characterized by, The application relates to a vacuum adsorption device, which comprises the following components: a base assembly (10) comprising a vacuum base (11) provided with a plurality of vacuum through holes (111); a tray assembly (20) mounted on the base assembly (10) and comprising a tray body (21); the tray body (21) is sealingly connected with the vacuum base (11) and is provided with adsorption through holes (22) communicating with the vacuum through holes (111) and sliding long holes (23) arranged around the adsorption through holes (22); a sliding block assembly (30) mounted on the tray assembly (20) and comprising a plurality of groups of matched adjustable sliding blocks (31) and locking mechanisms; the adjustable sliding blocks (31) are slidingly installed in the sliding long holes (23) in a one-to-one correspondence; and the locking mechanisms lock or unlock the adjustable sliding blocks (31).

2. The circuit board substrate printing fixture of claim 1, wherein, The vacuum through holes (111) and the adsorption through holes (22) are arranged in multiple groups in alignment, and each group of the vacuum through holes (111) and the adsorption through holes (22) is arranged in an X-shaped cross mode; four sliding long holes (23) are arranged around each group of the adsorption through holes (22) on the tray body (21), and the four sliding long holes (23) are arranged in two directions perpendicular to each other.

3. The circuit board substrate printing fixture of claim 2, wherein, An X-shaped sealing ring (12) is arranged around each group of the vacuum through holes (111) on the base assembly (10), and the X-shaped sealing ring (12) is arranged in a pressing mode between the vacuum base (11) and the tray body (21).

4. The circuit board substrate printing fixture of claim 3, wherein, The lower end of the vacuum base (11) is provided with an air suction cavity (112) communicating with the vacuum through holes (111); and the base assembly (10) further comprises a cavity sealing ring (13) arranged around the air suction cavity (112).

5. The circuit board substrate printing fixture of claim 4, wherein, The vacuum base (11) is provided with fixing grooves corresponding to the X-shaped sealing ring (12) and the cavity sealing ring (13), and the X-shaped sealing ring (12) and the cavity sealing ring (13) are respectively adhesively fixed in the corresponding fixing grooves.

6. The circuit board substrate printing fixture of claim 1, wherein, The adjustable sliding block (31) comprises a guide block (311) and a fin (312); the guide block (311) is matched in size with the sliding long hole (23), extends into the sliding long hole (23) and slides along the sliding long hole (23); and the fin (312) is arranged above the guide block (311) and extends to both sides, and the fin (312) is attached above the sliding long hole (23).

7. The circuit board substrate printing fixture of claim 6, wherein, The bottom of the sliding long hole (23) is provided with a locking groove (231); the locking mechanism is a locking bolt (32) which is threadedly connected to the lower end of the guide block (311), and the end cap of the locking bolt (32) is wider than the slot of the locking groove (231).

8. The circuit board substrate printing fixture of claim 1, wherein, The central position and at least one edge position of the vacuum base (11) and the tray body (21) are provided with aligned positioning holes, and a positioning pin (14) is inserted into the positioning hole.

9. The circuit board substrate printing fixture of claim 1, wherein, The bottom surface of the vacuum base (11) is provided with a plurality of magnet fixing holes (114), and a hole magnet (15) is arranged in each magnet fixing hole (114), and the hole magnet (15) is fixedly installed in the magnet fixing hole (114) through a fixing bolt (16).

10. The circuit board substrate printing fixture of claim 1, wherein, The surface of the tray body (21) is provided with a plurality of substrate placing grooves (25), and each substrate placing groove (25) covers the area where the adsorption through hole (22) and the sliding long hole (23) are located.

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