Device facilitating gluing of semiconductor diode

Abstract

The utility model relates to the field of semiconductor manufacturing equipment, in particular to a semiconductor diode gluing device which comprises a base, a supporting frame is arranged on the base, a gluing machine is arranged on the upper portion of the supporting frame, a spraying assembly is arranged below the gluing machine, and a workbench is arranged below the spraying assembly. The support frame is arranged on the base, temperature control assemblies are arranged on the two sides of the support frame, a controller is arranged on the outer side of the support frame, and a temperature sensor is arranged at the upper end of the support frame, the temperature sensor, the controller, the temperature control assemblies and the like are arranged, the environment temperature is detected through the temperature sensor in the working process, and information is transmitted to the controller; and then the controller controls the temperature control assembly to work to heat or refrigerate the working area, so that the effect of changing the temperature of the working area is achieved, the adjustment of the environment temperature is realized, the proper viscosity of the glue solution can be kept under different environment conditions, and the effects of uniformity, firmness and the like of gluing are stable.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, concretely to a device for gluing semiconductor diodes. BACKGROUND

[0002] In the production process of semiconductor diodes, the gluing process plays a crucial role in ensuring the stable packaging of diodes and the stable performance of subsequent performance.

[0003] After searching, the Chinese patent with publication number CN217250250U discloses a device for gluing semiconductor diodes, which has the technical feature that multiple electromagnetic valves, multiple corrugated pipes, and multiple glue discharge pipes are arranged to simultaneously glue multiple semiconductor diodes, improving the efficiency of gluing and reducing the production cost of the factory.

[0004] The existing semiconductor diode gluing device is often disturbed by external environmental factors, especially temperature changes. The viscosity of the glue is sensitive to temperature, and changes in environmental temperature will change the viscosity of the glue, which will change the flowability, adhesion, and other gluing-related properties of the glue, ultimately affecting the uniformity and firmness of the gluing effect, and reducing the consistency and stability of product quality. Therefore, a new solution is needed to solve this problem. SUMMARY

[0005] The above background technology has the disadvantage that temperature changes will change the properties of the glue, such as viscosity, which will affect the gluing effect.

[0006] The utility model discloses a device for gluing semiconductor diodes, which comprises a base, a support frame is arranged on the base, a glue applicator is arranged on the upper part of the support frame, a spraying assembly is arranged below the glue applicator, a workbench is arranged below the spraying assembly, a temperature control assembly is arranged on both sides of the support frame, a controller is arranged on the outer side of the support frame, and a temperature sensor is arranged on the upper end of the support frame.

[0007] Further, the temperature control assembly comprises a support plate, two support plates are arranged, a refrigeration pipe and a heating pipe are arranged on each of the two support plates, a protective cover is arranged on the outer side of the refrigeration pipe and the heating pipe, and the protective cover is detachably connected to the support plate.

[0008] Further, a flow guide pipe is arranged on the side of the refrigeration pipe and the heating pipe that is away from each other, the flow guide pipe is installed on the support frame, and a fan is installed in the flow guide pipe.

[0009] Further, the spraying assembly comprises a fixing plate, the fixing plate is connected with the support frame through a hydraulic telescopic rod, a spray head is arranged on the fixing plate, a flow divider is arranged on the upper end of the spray head, and the flow divider is connected with the glue applying machine.

[0010] Further, a vertical rod is arranged on the base, one end of the vertical rod penetrates through the workbench, a fixing nut is arranged on the upper end of the vertical rod, the fixing nut is screwed with the vertical rod, a spring is sleeved on the vertical rod below the workbench, the lower end of the spring is fixedly connected with the vertical rod, and a gasket is arranged between the upper end of the spring and the workbench.

[0011] Further, a screw rod is arranged on the protective cover, the screw rod penetrates through the support plate, and a fixing cap is arranged on the screw rod and is screwed with the screw rod.

[0012] Further, a filter screen is arranged on the end, away from the support frame, of the flow guide pipe, and the filter screen is screwed with the flow guide pipe.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] 1、The temperature sensor, the controller and the temperature control assembly are arranged, the environmental temperature is detected through the temperature sensor in the working process, and the information is transmitted to the controller, then the controller controls the temperature control assembly to work, the working area is heated or refrigerated, the effect of changing the temperature of the working area is achieved, the adjustment of the environmental temperature is realized, the glue solution can keep appropriate viscosity under different environmental conditions, and then the uniformity, the firm degree and other effects of the gluing are stable.

[0015] 2、The filter screen, the vertical rod, the spring, the gasket and the fixing nut are arranged, the vertical rod part, the spring part and the gasket are matched with each other in the using process, so that the workbench has certain falling space, the pressure on the processing element is avoided to be too large when gluing, the processing element is prevented from being damaged, the position of work is limited by rotating the fixing nut on the vertical rod, the height of work is changed, and the application range of the device is improved. DRAWINGS

[0016] The drawings described herein are used to provide further understanding of the present application, constitute a part of the present application, the illustrative embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application.

[0017] Figure 1 It is a whole structure schematic view of the utility model;

[0018] Figure 2 It is a local explosion schematic view of the utility model;

[0019] Figure 3 It is the front view of the utility model;

[0020] Figure 4 It is the utility model's flow guide pipe section view.

[0021] In the figure: 1, base; 2, support frame; 3, workbench; 4, glue spreading machine; 5, fixed plate; 6, spray head; 7, hydraulic telescopic rod; 8, support plate; 9, refrigeration pipe; 10, heating pipe; 11, protective cover; 12, flow guide pipe; 13, fan; 14, filter screen; 15, vertical rod; 16, spring; 17, gasket; 18, fixed nut; 19, temperature sensor; 20, controller. DETAILED DESCRIPTION

[0022] The following will disclose multiple embodiments of the utility model with drawings, for the purpose of clear illustration, many details on the real object will be described in the following description. However, it should be understood that these details on the real object should not be used to limit the utility model. That is to say, in some embodiments of the utility model, these details on the real object are unnecessary. In addition, for the purpose of simplifying the drawing, some commonly used structures and components will be drawn in a simple schematic way in the drawing.

[0023] Please refer to Figure 1 、 Figure 3 The utility model discloses a convenient semiconductor diode gluing device, including base 1, be provided with support frame 2 on base 1, be provided with glue spreading machine 4 on the upper portion of support frame 2, be provided with spray assembly below glue spreading machine 4, and spray assembly includes fixed plate 5, is connected through hydraulic telescopic rod 7 between fixed plate 5 and support frame 2, and the four corners of fixed plate 5 are provided with guide rod, and guide rod is slidably arranged with support frame 2, is provided with spray head 6 on fixed plate 5, and the upper end of spray head 6 is provided with flow divider, and flow divider is connected with glue spreading machine 4, and workbench 3 is provided below spray assembly.

[0024] Please refer to Figure 3 As shown, vertical rod 15 is installed on base 1, one end of vertical rod 15 passes through workbench 3, and fixed nut 18 is arranged on the upper end of vertical rod 15, and fixed nut 18 is screw-connected with vertical rod 15, changes the height of fixed nut 18 by rotating on vertical rod 15 through fixed nut 18, realizes the restriction of workbench 3, and spring 16 is sleeved on vertical rod 15 below workbench 3.

[0025] Combine Figure 1 、 Figure 3As shown, the lower end of the spring 16 is fixedly connected with the vertical rod 15, and a gasket 17 is arranged between the upper end of the spring 16 and the workbench 3. When the pressure of the nozzle 6 on the semiconductor diode is too large, the workbench 3 is forced to descend and compress the spring 16, thereby avoiding damage to the semiconductor diode. The temperature control assembly is arranged on both sides of the support frame 2, and the temperature control assembly comprises a support plate 8.

[0026] As shown in Figure 1 , Figure 2 As shown, the two support plates 8 are respectively provided with a refrigeration pipe 9 and a heating pipe 10. The refrigeration pipe 9 and the heating pipe 10 are respectively connected with a corresponding air cooler and an air heater. The air cooler and the air heater work to send cold air or hot air into the corresponding refrigeration pipe 9 or heating pipe 10, so as to change the temperature of the refrigeration pipe 9 and the heating pipe 10. The outer side of the refrigeration pipe 9 and the heating pipe 10 is sleeved with a protective cover 11.

[0027] As shown in Figure 1 , Figure 2 The protective cover 11 is detachably connected with the support plate 8. The protective cover 11 is provided with a screw rod, the screw rod penetrates through the support plate 8, and a fixing cap is arranged on the screw rod and is threadedly connected with the screw rod. The side of the refrigeration pipe 9 and the heating pipe 10 away from each other is provided with a flow guide pipe 12, and the flow guide pipe 12 is installed on the support frame 2.

[0028] As shown in Figure 1 , Figure 4 A fan 13 is installed in the flow guide pipe 12. The fan 13 blows the temperature on the refrigeration pipe 9 or the heating pipe 10 to the working area, so as to change the stability of the working environment. A filter screen 14 is arranged at the end of the flow guide pipe 12 away from the support frame 2. The filter screen 14 blocks sundries in the air. The filter screen 14 is threadedly connected with the flow guide pipe 12. A controller 20 is arranged on the outer side of the support frame 2, and a temperature sensor 19 is arranged at the upper end of the support frame 2.

[0029] The implementation principle is that when gluing, the semiconductor diode is placed on the workbench 3, then the hydraulic telescopic rod 7 is controlled to work, the hydraulic telescopic rod 7 drives the fixed plate 5 to move downward, the fixed plate 5 drives the nozzle 6 to move together, and the nozzle 6 is moved to a position above the semiconductor diode, then the glue machine 4 works, the glue is sent into the nozzle 6 through the flow divider, and is sprayed on the semiconductor diode through the nozzle 6;

[0030] When the temperature sensor 19 senses that the ambient temperature is not at the preset value, the controller 20 works, the controller 20 blows to the refrigeration pipe 9 or the heating pipe 10, so that the processing area at the nozzle 6 and the workbench 3 always maintains at the preset temperature, thereby stabilizing the uniformity, firmness and other effects of the gluing.

[0031] The above merely describes the embodiments of the present application and is not intended to limit the present application. The present application can be changed and modified in various ways by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims

1. A device for applying adhesive to semiconductor diodes, comprising a base (1), characterized in that: A support frame (2) is provided on the base (1). A glue applicator (4) is provided on the upper part of the support frame (2). A spraying assembly is provided below the glue applicator (4). A workbench (3) is provided below the spraying assembly. Temperature control components are provided on both sides of the support frame (2). A controller (20) is provided on the outside of the support frame (2). A temperature sensor (19) is provided at the upper end of the support frame (2).

2. The device for applying adhesive to semiconductor diodes according to claim 1, characterized in that: The temperature control component includes a support plate (8), and there are two support plates (8). A cooling pipe (9) and a heating pipe (10) are respectively provided on the two support plates (8). A protective cover (11) is fitted on the outside of both the cooling pipe (9) and the heating pipe (10). The protective cover (11) is detachably connected to the support plate (8).

3. The device for applying adhesive to semiconductor diodes according to claim 2, characterized in that: A guide pipe (12) is provided on the side of the refrigeration pipe (9) and the heating pipe (10) that are far apart from each other. The guide pipe (12) is installed on the support frame (2), and a fan (13) is installed inside the guide pipe (12).

4. The device for applying adhesive to semiconductor diodes according to claim 1, characterized in that: The spraying assembly includes a fixing plate (5), which is connected to the support frame (2) via a hydraulic telescopic rod (7). A nozzle (6) is provided on the fixing plate (5), and a flow divider is provided at the upper end of the nozzle (6). The flow divider is connected to the glue applicator (4).

5. The device for applying adhesive to semiconductor diodes according to claim 1, characterized in that: A vertical rod (15) is installed on the base (1). One end of the vertical rod (15) passes through the workbench (3). A fixing nut (18) is provided at the upper end of the vertical rod (15). The fixing nut (18) is screwed to the vertical rod (15). A spring (16) is sleeved on the vertical rod (15) below the workbench (3). The lower end of the spring (16) is fixedly connected to the vertical rod (15). A washer (17) is provided between the upper end of the spring (16) and the workbench (3).

6. The device for applying adhesive to semiconductor diodes according to claim 2, characterized in that: A screw is provided on the protective cover (11), the screw passes through the support plate (8), and a fixing cap is provided on the screw, which is threadedly connected to the screw.

7. The device for applying adhesive to semiconductor diodes according to claim 3, characterized in that: A filter screen (14) is provided at one end of the guide pipe (12) away from the support frame (2), and the filter screen (14) is threadedly connected to the guide pipe (12).

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