Thermal control device and phased array laser test equipment

Abstract

The utility model relates to the technical field of aerospace thermal control, in particular to a thermal control device and phased array laser test equipment. The thermal control device is used for temperature control of phased array laser test equipment, the phased array laser test equipment comprises a phased array target single machine used for receiving laser and a signal processing unit used for detecting state information of the phased array target single machine, and the thermal control device comprises a heat dissipation boss which is in a frustum shape, the top face of the heat dissipation boss is used for installing the phased array target single machine, and the signal processing unit is used for detecting state information of the phased array target single machine. The heat dissipation boss is provided with a heat dissipation mechanism used for reducing the temperature of the heat dissipation boss. The top surface of the temperature control board is used for mounting a signal processing unit, and the temperature control board is provided with a temperature control mechanism for controlling the temperature of the temperature control board so as to stabilize the temperature of the signal processing unit. Through the thermal control device provided by the invention, a relatively good heat dissipation effect on the phased array target single machine mounted on the top surface of the thermal control device is realized, temperature control on a signal processing unit is realized, and the heat dissipation efficiency, the safety of a phased array laser test and the accuracy of a test result are improved.

Description

Technical Field

[0001] This disclosure relates to the field of aerospace thermal control technology, specifically to a thermal control device and a phased array laser testing equipment. Background Technology

[0002] Phased array payloads for space applications are widely used in satellite communications due to their unique technological advantages. However, with the continuous advancement of laser weapon technology, and considering that laser weapons, as part of anti-satellite strategies, can weaken enemy satellite capabilities by directly damaging or disabling targets using high-energy laser beams, Chinese aerospace technology units have conducted a series of anti-satellite destruction studies and simulated laser damage tests in a ground-based vacuum environment—the phased array laser test. During the phased array laser test, both the phased array target and the signal processing unit are placed in a cold, vacuum simulated environment. The high-density energy of the laser beam causes the temperature of the phased array target to rise rapidly in a very short time, achieving the simulated effect. However, the laser beam reflected from the phased array target has a significant impact on the surrounding environment and the thermal control system of the signal processing unit. Specifically, the phased array target is susceptible to secondary thermal effects from nearby devices, leading to poor accuracy in the test results. Furthermore, the signal processing unit of the phased array laser test equipment is highly sensitive to temperature and has low heat dissipation efficiency. The reflected laser beam and thermal radiation can easily cause temperature instability in the signal processing unit, affecting the accuracy of the test results. Utility Model Content

[0003] To overcome the problems existing in the related technologies, an exemplary embodiment of this disclosure provides a thermal control device in a first aspect for temperature control of a phased array laser testing equipment. The phased array laser testing equipment includes: a phased array target unit for receiving laser light, and a signal processing unit for detecting the status information of the phased array target unit. The thermal control device includes: a heat dissipation boss, which is frustoconical in shape, with its top surface used to mount the phased array target unit, and the heat dissipation boss is provided with a heat dissipation mechanism for reducing the temperature of the heat dissipation boss; and a temperature control plate, with its top surface used to mount the signal processing unit, and the temperature control plate is provided with a temperature control mechanism for controlling the temperature of the temperature control plate to stabilize the temperature of the signal processing unit.

[0004] In some embodiments, the heat dissipation mechanism includes: a first flow channel disposed within the heat dissipation boss, one end of the first flow channel having a first inlet for receiving low-temperature fluid, and the other end having a first outlet for discharging the low-temperature fluid passing through the first flow channel.

[0005] In some embodiments, the temperature control mechanism includes: a second flow channel disposed within the temperature control plate, a second inlet at one end of the second flow channel for receiving low-temperature fluid flowing out from the first outlet, and a second outlet at the other end of the second flow channel for discharging fluid passing through the second flow channel.

[0006] In some embodiments, the temperature control mechanism further includes: a temperature-sensitive flow control valve connected to a first outlet and its other end connected to a second inlet via a connecting pipe; a hot fluid pipe connected to the temperature-sensitive flow control valve for introducing high-temperature fluid into the temperature-sensitive flow control valve; wherein the temperature-sensitive flow control valve is used to allow low-temperature fluid and / or high-temperature fluid to flow into the second flow channel to control the temperature of the fluid flowing into the second flow channel.

[0007] In some embodiments, the temperature control mechanism further includes a heating element disposed on the outer surface of the signal processing unit to control the temperature of the signal processing unit.

[0008] In some embodiments, the thermal control device further includes: a gasket, installed on the top surface of the heat dissipation boss, for mounting the phased array target unit, so that the phased array target unit and the heat dissipation boss are spaced apart.

[0009] In some embodiments, the outer surface of the heat dissipation boss is formed with one or more thermal control coatings for heat dissipation.

[0010] Secondly, this disclosure also provides a phased array laser testing device, which includes: a thermal control device as described in the first aspect, used to control the temperature of the phased array laser testing device during the phased array laser test; a phased array target unit, installed on the top surface of the heat dissipation boss, used to receive laser light; and a signal processing unit, located on the side of the phased array target unit and installed on the top surface of the temperature control plate, used to detect the status information of the phased array target unit.

[0011] In some embodiments, the heat dissipation mechanism includes a first flow channel disposed within a heat dissipation boss. One end of the first flow channel has a first inlet for receiving cryogenic fluid, and the other end has a first outlet for discharging the cryogenic fluid passing through the first flow channel. The temperature control mechanism includes a second flow channel disposed within a temperature control plate. One end of the second flow channel has a second inlet for receiving cryogenic fluid flowing out from the first outlet, and the other end of the second flow channel has a second outlet for discharging fluid passing through the second flow channel. The phased array laser testing equipment includes a confluence valve with an inlet and an outlet. The inlet is connected to the first inlet for inputting cryogenic fluid into the first inlet; the outlet is connected to the second outlet for discharging the cryogenic fluid discharged from the second outlet to the outside of the second flow channel.

[0012] In some embodiments, a heat insulation layer is provided on the outer surface of the signal processing unit to reduce temperature fluctuations of the signal processing unit.

[0013] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure.

[0014] The thermal control device provided in this disclosure can effectively dissipate heat from the phased array target mounted on its top surface through the heat dissipation protrusion and its heat dissipation mechanism, avoiding the secondary thermal effects of nearby devices on the phased array target and effectively improving the accuracy of the test results. The temperature control board and its temperature control mechanism can achieve temperature control of the signal processing unit, ensuring its temperature remains stable and effectively improving the stability and accuracy of the signal processing unit's operation, thus improving the accuracy of the test results. The thermal control device provided in this disclosure can effectively improve the heat dissipation effect on the phased array target and increase heat dissipation efficiency. Simultaneously, the thermal control device provided in this disclosure provides better temperature control for the signal processing unit, improving the safety of phased array laser testing and the accuracy of the test results. Attached Figure Description

[0015] This disclosure can be better understood by describing exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, in which:

[0016] Figure 1 This is a schematic diagram of a phased array laser test apparatus including a thermal control device, as shown in an exemplary embodiment of a disclosed publication;

[0017] Figure 2 This is a schematic diagram of the heat dissipation boss and the single-unit mounting structure of the phased array target, according to an exemplary embodiment disclosed in a book.

[0018] Figure 3 This is a top view of a phased array laser testing device including a thermal control device, as shown in an exemplary embodiment of a disclosed document;

[0019] Figure 4 This is a cross-sectional view of a heat dissipation boss shown according to an exemplary embodiment of a disclosed document;

[0020] Figure 5 This is a cross-sectional view of a heat dissipation boss shown according to another exemplary embodiment disclosed;

[0021] Figure 6 This is a cross-sectional view of a temperature control panel shown according to another exemplary embodiment disclosed;

[0022] Figure 7 This is a schematic diagram of the installation structure of the temperature control board and the signal processing unit, as shown in another exemplary embodiment disclosed.

[0023] Figure label:

[0024] 110. Heat dissipation boss; 111. First flow channel; 112. Gasket; 120. Temperature control board; 121. Second flow channel; 122. Temperature-sensing flow control valve; 123. Hot fluid pipeline; 124. Heating element; 210. Phased array target unit; 220. Signal processing unit; 221. Insulation layer; 230. Test bench; 240. Laser transmission plate; 250. Side wall baffle. Detailed Implementation

[0025] The following describes specific embodiments of this disclosure. It should be noted that, in order to maintain brevity, this specification cannot provide a detailed description of all features of the actual embodiments. It should be understood that, in the actual implementation of any embodiment, just as in any engineering or design project, various specific decisions are often made to achieve the developer's specific goals and to meet system-related or business-related constraints, and this can change from one embodiment to another. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content of this disclosure, changes in design, manufacturing, or production based on the technical content disclosed herein are merely conventional technical means and should not be construed as insufficient content of this disclosure.

[0026] Unless otherwise defined, the technical or scientific terms used in this specification shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this utility model patent application specification do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms "a" or "an" and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" and similar terms mean that the element or object preceding "comprising" or "including" encompasses the element or object listed following "comprising" or "including" and its equivalents, and do not exclude other elements or objects. The terms "connected" or "linked" and similar terms are not limited to physical or mechanical connections, nor are they limited to direct or indirect connections.

[0027] Phased array laser testing equipment may include a test bench. The test bench can be used to mount phased array targets, enabling phased array laser testing to be conducted on the test bench. A laser transmission plate is installed along the laser path on the test bench to limit the laser beam. The phased array target is installed at the end of the laser path. Sidewall baffles may be installed on the phased array target to isolate the test area of ​​the phased array laser test from the installation area of ​​signal processing and other related equipment. The signal processing unit can be located on the side of the phased array target, outside the sidewall baffle, thus protecting the signal processing unit by blocking the laser beam in the test area of ​​the phased array laser testing equipment. However, due to the extremely high energy of the laser in phased array laser testing, the laser beam is reflected within the test area, causing the reflected beam and thermal radiation to affect the signal processing unit. This results in temperature changes in the signal processing unit, and since the thermal control of the signal processing unit is poor, it is difficult to maintain a relatively stable temperature, affecting the working efficiency and accuracy of the signal processing unit. Furthermore, since a signal processing unit can include multiple signal processors, thermal coupling between these processors can cause temperature variations within the unit, making temperature control difficult. For a single phased array target, which can be mounted on a platform at the end of the laser beam path, the platform and sidewall baffles are prone to overheating when exposed to reflected laser light and thermal radiation. This can cause secondary thermal effects on the phased array target mounted on it, resulting in poor accuracy in phased array laser testing.

[0028] To overcome the above-mentioned technical problems, such as Figure 1 As shown, an exemplary embodiment of this disclosure provides a thermal control device for temperature control of a phased array laser test equipment. The phased array laser test equipment may include: a phased array target unit for receiving laser light, and a signal processing unit for detecting the status information of the phased array target unit. The thermal control device may include: a heat dissipation boss 110 and a temperature control plate 120.

[0029] Heat dissipation boss 110, such as Figure 1 , Figure 2As shown, the device is frustoconical in shape, with its top surface used to mount the phased array target unit. The heat dissipation protrusion 110 is equipped with a heat dissipation mechanism to reduce its temperature. The heat dissipation protrusion 110 can be located at the end of the laser beam path in the phased array laser testing equipment to mount the phased array target unit, thus ensuring the safe conduct of the phased array laser test. The heat dissipation protrusion 110 can be frustoconical, with its top surface (the smaller end face) facing the laser emission direction, allowing the phased array target unit to be mounted on its top surface and receive the laser beam for phased array laser testing. The heat dissipation protrusion 110 can be equipped with a heat dissipation mechanism. By reducing the temperature of the heat dissipation protrusion 110, it can cool down the heat dissipation protrusion 110 in a timely manner when it is subjected to laser irradiation, laser reflected light irradiation, and the thermal radiation of the laser. This effectively avoids the heat dissipation protrusion 110 overheating and causing secondary thermal effects on the phased array target unit, thereby effectively reducing the error of the phased array laser test and improving the accuracy of the phased array laser test.

[0030] Temperature control board 120, such as Figure 1 , Figure 3 As shown, the top surface is used to mount the signal processing unit. The temperature control board 120 is equipped with a temperature control mechanism to control the temperature of the temperature control board 120, thereby stabilizing the temperature of the signal processing unit. The temperature control board 120 can be a plate-shaped device, and the top surface dimension of the temperature control board 120 can be larger than the bottom surface dimension of the signal processing unit, allowing the top surface of the temperature control board 120 to be used for mounting the signal processing unit. The temperature control board 120 can be equipped with a temperature control mechanism capable of heating or cooling. By raising or lowering the temperature of the temperature control board 120, the temperature of the signal processing unit mounted on the top surface of the temperature control board 120 is adjusted. Through the temperature adjustment and control of the temperature control board 120, the temperature of the signal processing unit can be kept stable, thereby ensuring the safe operation of the signal processing unit and effectively reducing the error of the phased array laser test, improving the accuracy of the phased array laser test. Specifically, the temperature control board 120 can achieve temperature control through an electronic temperature control structure. The temperature control board 120 can also be equipped with physical temperature control devices, using semiconductor refrigeration or water circulation heat conduction to achieve temperature regulation.

[0031] According to the thermal control device provided in this embodiment, the heat dissipation protrusion 110 enables the phased array target unit to dissipate heat accumulated on the surface of the heat dissipation protrusion 110 due to direct or indirect laser radiation while receiving high-energy laser irradiation. This avoids accuracy deviations caused by heat in the phased array target unit installed on the heat dissipation protrusion 110. The temperature control board 120 effectively overcomes the problem of temperature fluctuations in the signal processing unit caused by the combined effects of laser thermal radiation and thermal coupling between various signal processors. The temperature control board 120, through its built-in temperature control mechanism such as a semiconductor thermoelectric cooling module, a water cooling circulation system, or an electronic constant temperature control system, achieves precise temperature control of the board surface, thereby maintaining the signal processing unit installed on it within a stable operating temperature range. The temperature control board 120 not only improves the reliability and response speed of the signal processing module but also reduces signal offset and processing errors caused by temperature changes, improving the accuracy of overall experimental data and enhancing the stability of the phased array laser experimental equipment. The thermal control device provided in this embodiment significantly improves the thermal stability, system reliability, and accuracy of test results of the phased array laser testing equipment under high-energy laser environment.

[0032] In some embodiments, such as Figure 4 , Figure 5 As shown, the heat dissipation mechanism may include: a first flow channel 111 disposed within the heat dissipation protrusion 110. One end of the first flow channel 111 has a first inlet for receiving cryogenic fluid, and the other end has a first outlet for discharging the cryogenic fluid that has passed through the first flow channel 111. The heat dissipation mechanism of the heat dissipation protrusion 110 may include the first flow channel 111 located inside the heat dissipation protrusion 110. One end of the first flow channel 111 may have a first inlet, through which fluid can enter the first flow channel 111. Cryogenic fluid can be injected into the first flow channel 111 through the first inlet. Specifically, the cryogenic fluid may be ethanol, liquid ammonia, acetone, etc., which have a low temperature and can achieve a better cooling effect. The other end of the first flow channel 111 may have a first outlet. The cryogenic fluid enters the first flow channel 111 through the first inlet and can flow along the first flow channel 111 to cool the heat dissipation protrusion 110. Subsequently, the cryogenic fluid can flow out of the first flow channel 111 through the first outlet. A low-temperature fluid can be continuously supplied to the first flow channel 111 from an external fluid source, thereby ensuring that the temperature of the fluid entering the first flow channel 111 remains at a low level, which improves the heat dissipation effect of the heat dissipation mechanism and effectively enhances its heat dissipation efficiency. The first flow channel 111 can be a flow channel extending along the inner wall structure of the heat dissipation boss 110, and the flow path of the first flow channel 111 can be U-shaped, thus ensuring the first flow channel 111... Figure 4 , Figure 5As shown, the first flow channel 111 may also include multiple sets of parallel branch flow channels, such that the first flow channel 111 includes a first series flow channel connected to the first inlet. The first series flow channel can extend along the side of the heat dissipation boss 110, such that the inclination angle of the first series flow channel is the same as the inclination angle of the side of the heat dissipation boss 110. The first series flow channel can extend outward at different heights to form multiple parallel branch flow channels, and each branch flow channel can extend along the inner wall of the heat dissipation boss 110. The low-temperature fluid in each branch flow channel can eventually flow to the second series flow channel connected to the first outlet, so that the low-temperature fluid can flow along the second series flow channel to the first outlet, and finally flow out from the first outlet to the outside of the first flow channel 111, thus completing the cooling of the heat dissipation boss 110. Therefore, the heat dissipation effect of the first flow channel 111 on the heat dissipation protrusion 110 can be effectively improved, so that the heat dissipation protrusion 110 can have a good heat dissipation effect at different heights on its side. This makes the cooling effect of the first flow channel 111 on the heat dissipation protrusion 110 significant, and effectively avoids the heat dissipation protrusion 110 generating a secondary thermal effect on the phased array target. As a result, the accuracy of phased array laser testing can be effectively improved.

[0033] According to the thermal control device provided in this embodiment, by setting a first flow channel 111 inside the heat dissipation protrusion 110, a liquid-cooled heat dissipation mechanism is provided inside the heat dissipation protrusion 110, which can achieve more efficient and precise temperature control, and further improve the thermal stability and reliability of the phased array laser test equipment in high-temperature environments. Through the first flow channel 111, the external low-temperature fluid can continuously circulate in the first flow channel 111, thereby rapidly absorbing heat and removing heat from the surface of the heat dissipation protrusion 110 under the high-temperature working environment of the phased array target, thus avoiding affecting the temperature of the phased array target. Through the first flow channel 111 provided in this embodiment, the uniformity of contact between the low-temperature fluid and the heat dissipation protrusion 110 and the heat exchange efficiency are improved, avoiding uneven local heat dissipation, effectively preventing the heat dissipation protrusion 110 from generating secondary thermal effects on the phased array target under high heat load, which could lead to inaccurate test results, further improving the accuracy of laser test results, and effectively improving the stability of phased array laser tests.

[0034] In some embodiments, such as Figure 6As shown, the temperature control mechanism may include a second flow channel 121 disposed within the temperature control plate 120. One end of the second flow channel 121 has a second inlet for receiving cryogenic fluid flowing out from the first outlet, and the other end of the second flow channel 121 has a second outlet for discharging fluid passing through the second flow channel 121. The temperature control mechanism of the temperature control plate 120 may include a second flow channel located inside the temperature control plate 120. One end of the second flow channel may have a second inlet, allowing cryogenic fluid flowing out from the first outlet of the first flow channel 111 to enter the second flow channel 121 through the second inlet. The cryogenic fluid may be ethanol, liquid ammonia, acetone, etc., which have low temperatures and can achieve better cooling effects. Since the temperature control plate needs to control the temperature of the signal processing unit, the signal processing unit not only needs cooling but also requires maintaining a stable temperature when necessary. Therefore, to avoid excessive cooling of the signal processing unit, the second inlet of the second flow channel 121 can be connected to the first outlet, allowing the cryogenic fluid passing through the first flow channel 111 to enter the second flow channel 121. After flowing through the first flow channel 111, the cryogenic fluid effectively cools the heat dissipation protrusion 110, thereby causing the temperature of the cryogenic fluid to rise slightly before entering the second flow channel 121. This achieves better temperature control and prevents the signal processing unit from overcooling and malfunctioning due to excessively low fluid temperature. The other end of the second flow channel 121 can be provided with a second outlet. The cryogenic fluid enters the second flow channel 121 through the second inlet and flows along the second flow channel 121, cooling the temperature control board. The fluid then flows out through the second outlet to the outside of the second flow channel 121. The second flow channels 121 of the temperature control board 120 can be connected in series, allowing the second flow channels 121 to form a serpentine shape along the interior of the temperature control board 120, ensuring that the second flow channels 121 completely cover the interior of the temperature control board 120 and achieving better temperature control. like Figure 6 As shown, the second flow channel 121 of the temperature control board 120 may also include two branch flow channels. The branch flow channels of the second flow channel 121 can form a crisscrossing heat dissipation network, thereby enabling the second flow channel 121 to completely cover the interior of the temperature control board 120 and achieve better temperature control. The second inlet and the second outlet can be located on the same side of the second flow channel 121, thereby better reducing the flow resistance within the second flow channel 121 and saving internal space of the phased array test equipment.

[0035] According to the thermal control device provided in this disclosure, by setting a second flow channel 121 inside the temperature control plate 120, high-precision temperature control of the temperature control plate 120 can be achieved, thereby further realizing stable temperature control of the signal processing unit, thus ensuring the operational reliability and measurement accuracy of the signal processing system in phased array laser experiments. By directly connecting the outlet of the first flow channel 111 of the heat dissipation protrusion 110 to the second inlet of the second flow channel 121, the low-temperature fluid can be reused to balance the temperature control effect. By introducing the low-temperature fluid, which has already completed heat dissipation in the first flow channel 111 and whose temperature has risen, into the second flow channel 121, the excessively low temperature can be effectively avoided from causing overcooling of the signal processing unit, resulting in temperature fluctuations, improving temperature control accuracy and system adaptability, and keeping the signal processing unit's operating environment within a suitable temperature range. The structure of the second flow channel 121 can improve the coverage and residence time of the fluid in the plate, achieve more sufficient heat exchange, effectively improve the heat conduction efficiency, make the overall temperature of the temperature control plate 120 more balanced and stable, effectively balance the dynamic needs between "cooling" and "temperature control", and significantly improve the overall stability and measurement accuracy of the phased array laser test equipment in high heat environment.

[0036] In some embodiments, such as Figure 3 As shown, the temperature control mechanism may also include: a temperature-sensing flow control valve 122 and a hot fluid pipeline 123.

[0037] A temperature-sensitive flow control valve 122 is connected to the first outlet, and its other end is connected to the second inlet via a connecting pipe. The temperature-sensitive flow control valve 122 can be a three-way valve; specifically, it can be a two-inlet, one-outlet three-way valve. The first inlet of the temperature-sensitive flow control valve 122 can be connected to the first outlet, the second inlet can be connected to the hot fluid pipe 123, and the outlet can be connected to the second inlet via a connecting pipe. The temperature-sensitive flow control valve 122 can effectively limit the temperature of the fluid entering the second flow channel 121 from the second inlet. Since the temperature control mechanism needs to control the temperature of the temperature control board 120, it is necessary to further control the temperature of the signal processing unit. Simultaneously, it is necessary to avoid the temperature of the temperature control board 120 becoming too high or too low due to excessive cooling or heating of the fluid in the second flow channel 121, which would affect the operational stability of the signal processing unit. Therefore, a temperature threshold range can be preset for the temperature-sensing flow control valve 122 according to the operating temperature requirements of the signal processing unit. When the temperature of the fluid flowing out of the first outlet and into the temperature-sensing flow control valve 122 is within the temperature threshold range, it can be determined that the current fluid temperature meets the operating temperature requirements of the signal processing unit, and the temperature-sensing flow control valve 122 can be opened to allow the fluid flowing out of the first outlet to enter the second flow channel 121. When the temperature of the fluid flowing out of the first outlet and into the temperature-sensing flow control valve 122 is not within the temperature threshold range, it can be determined that the current fluid temperature does not meet the operating temperature requirements of the signal processing unit, and the temperature-sensing flow control valve 122 can be closed to prevent fluid that does not meet the temperature requirements from entering the second flow channel 121.

[0038] A hot fluid line 123 is connected to a temperature-sensitive flow control valve 122 for introducing high-temperature fluid into the valve. The temperature-sensitive flow control valve 122 can also allow low-temperature and / or high-temperature fluids to flow into a second flow channel 121 to control the temperature of the fluid flowing into the second flow channel 121. The hot fluid line 123 can be connected to the temperature-sensitive flow control valve 122, which can be a three-way valve with two inlets and one outlet. The first inlet of the temperature-sensitive flow control valve 122 can be connected to the first outlet, the second inlet can be connected to the hot fluid line 123, and the outlet can be connected to the second inlet. Because the temperature control mechanism needs to control the temperature of the temperature control board 120, it further stabilizes the temperature of the signal processing unit, preventing temperature fluctuations that could cause the signal processing unit to stop working and affect the safety of the experiment, or cause errors in signal processing that could affect the accuracy of the test results. Therefore, the temperature-sensitive flow control valve 122 can be selectively opened based on the temperature of the fluid flowing out of the first outlet to ensure that the fluid temperature entering the second flow channel 121 is suitable. If the temperature of the fluid flowing out of the first outlet does not meet the requirements, causing the temperature-sensitive flow control valve 122 to fail to open, a hot fluid pipeline 123 can be provided to ensure fluid flow in the second flow channel 121 and achieve temperature control of the temperature control board 120 and its corresponding signal processing unit. The hot fluid pipeline 123 can be connected to the second inlet end of the temperature-sensitive flow control valve 122. If the temperature of the fluid flowing out of the first outlet is too low and does not meet the requirements, causing the temperature-sensitive flow control valve 122 to fail to open, hot fluid can be supplied to the temperature-sensitive flow control valve 122 through the hot fluid pipeline 123. When the hot fluid enters the temperature-sensing flow control valve 122, it can mix with the low-temperature fluid flowing out from the first outlet to form a mixed fluid whose temperature meets the requirements of the temperature control mechanism. This causes the temperature control valve to open, and the mixed fluid enters the second flow channel 121 through the temperature control valve, thereby achieving temperature control of the temperature control board 120 and its corresponding signal processing unit. In some embodiments, the outer surface of the hot fluid pipeline 123 can be covered with heat-insulating materials such as aluminized film, polyester mesh, or polyurethane foam to achieve heat insulation and prevent the heat from the hot fluid pipeline 123 from affecting the nearby temperature control board 120 and heat dissipation bosses 110 and other structures.

[0039] According to the thermal control device provided in this embodiment, by setting a temperature-sensing flow control valve 122 and a hot fluid pipeline 123, dynamic temperature control and temperature correction can be achieved for the fluid entering the second flow channel 121, ensuring that the fluid entering the second flow channel 121 is always within the temperature range that meets the stable operating requirements of the signal processing unit. The temperature-sensing flow control valve 122 can be a three-way valve structure with two inlets and one outlet. Its first inlet end is connected to the outlet of the first flow channel 111, its second inlet end is connected to the hot fluid pipeline 123, and its outlet end is connected to the inlet of the second flow channel 121. By setting the temperature-sensing flow control valve 122, it is possible to automatically determine whether to open the temperature-sensing flow control valve 122 based on the real-time monitored fluid temperature, selectively allowing the fluid flowing out of the first flow channel 111 to be introduced into the second flow channel 121. When the temperature of the cryogenic fluid from the first flow channel 111 does not meet the temperature control requirements, a high-temperature fluid can be introduced into the temperature-sensing flow control valve 122 through the hot fluid pipeline 123 to mix with the cryogenic fluid, thereby achieving temperature regulation and ultimately generating a mixed fluid that meets the temperature control requirements. This ensures that the temperature in the second flow channel 121 remains within a suitable range, achieving stable control of the signal processing unit's environment. Covering the hot fluid pipeline 123 with a thermal insulation layer significantly enhances its thermal shielding capability, reduces heat diffusion and radiation, and prevents the hot fluid from affecting surrounding equipment as it flows through the hot fluid pipeline 123, thus improving the overall stability of the phased array laser testing equipment and the accuracy of the test results.

[0040] In some embodiments, such as Figure 7 As shown, the temperature control mechanism may further include a heating element 124, which is disposed on the outer surface of the signal processing unit to control the temperature of the signal processing unit. Because the temperature of the fluid flowing out of the first outlet is low, the temperature of the fluid entering the second flow channel 121 may be too low, or if the hot fluid supplied by the hot fluid pipe 123 is insufficient, the temperature of the mixed fluid entering the second flow channel 121 may be low. All of these situations may lead to excessive heat dissipation from the temperature control board 120 to the signal processor, causing the temperature of the signal processing unit to drop, resulting in the signal processing unit malfunctioning or exhibiting significant errors. Therefore, according to the heat output and thermal control requirements of the signal processing unit, a heating element 124 can be disposed on the outer surface of the signal processing unit to compensate for the temperature of the signal processing unit and ensure that the temperature of the signal processing unit remains stable. Specifically, the heating element 124 can be an adhesive-backed heating element 124 that is directly pasted onto the surface of the signal processing unit, or an adhesive-free heating element 124 that is pasted with silicone rubber. Both can effectively achieve temperature compensation for the signal processing unit and ensure that the heating element 124 is stable and does not fall off on the outer surface of the signal processing unit, thereby improving the installation stability of the heating element 124.

[0041] According to the thermal control device provided in this embodiment, by setting a heating element 124 on the outer surface of the signal processing unit, active temperature compensation and regulation of the signal processing unit can be achieved. When the temperature of the low-temperature fluid flowing out from the first outlet is low, or the amount of hot fluid provided by the hot fluid pipeline 123 is insufficient or the temperature is low, resulting in the temperature of the mixed fluid entering the second flow channel 121 still being lower than the set temperature threshold, even if the temperature-sensing flow control valve 122 has performed mixing temperature control, the temperature control board 120 may still "over-cool" the signal processing unit due to insufficient overall heat energy. At this time, the signal processing unit may experience problems such as work stoppage, response delay, or signal inaccuracy due to low operating temperature. By setting the heating element 124 as an active heating element, it can directly act on the signal processing unit to achieve precise temperature compensation and regulation, ensuring that its operating temperature is always within a stable range. The heating element 124 can adopt different structural forms according to specific application scenarios and equipment shapes. The installation of various specifications of heating elements 124 on the surface of the signal processing unit has good stability and can effectively regulate the temperature of the signal processing unit. The heating element 124 can respond quickly and actively increase the surface temperature of the signal processing unit to compensate for heat loss caused by insufficient temperature control, avoid the influence of temperature on the signal processing unit, effectively ensure the accuracy of test data, and significantly improve the stability and reliability of the phased array laser test equipment.

[0042] In some embodiments, such as Figure 2As shown, the thermal control device may further include: a gasket 112, installed on the top surface of the heat dissipation protrusion 110, for mounting the phased array target unit, so that the phased array target unit and the heat dissipation protrusion 110 are spaced apart. When the phased array target unit is directly installed on the top surface of the heat dissipation protrusion 110, the heat dissipation protrusion 110 is easily subjected to the thermal radiation of the laser, causing its temperature to rise. Since the phased array target unit is in direct contact with the heat dissipation protrusion 110, the heat generated by the laser acting on the surface of the heat dissipation protrusion 110 can easily interfere with the phased array target unit. Therefore, a gasket 112 can be provided between the heat dissipation protrusion 110 and the phased array target unit to avoid direct contact. Specifically, the heat dissipation protrusion 110 can be a frustum, and gaskets 112 can be provided at the four corners of the top surface of the heat dissipation protrusion 110, with the phased array target unit mounted on the gaskets 112. The gasket 112 can be made of polyimide, which has good high-temperature resistance and high insulation properties. This ensures the safety of the phased array target installation while preventing direct contact between the heat dissipation boss 110 and the target unit. Furthermore, the gasket 112 should be thicker than 5mm to ensure an appropriate distance between the phased array target unit and the surface of the heat dissipation boss 110. Insufficient gasket thickness would result in a small distance between the two surfaces, causing heat generated on the surface of the heat dissipation boss 110 to affect the temperature of the phased array target unit and thus the test results.

[0043] According to the thermal control device provided in this disclosure, a gasket 112 installed on the top surface of the heat dissipation protrusion 110 serves as a mounting base for the phased array target unit, effectively achieving thermal isolation between the phased array target unit and the heat dissipation protrusion 110. Since laser irradiation can significantly increase the surface temperature of the heat dissipation protrusion 110, if the phased array target unit is directly mounted on the top surface of the heat dissipation protrusion 110, heat will be transferred to the bottom of the target unit through contact conduction, thereby interfering with its operational stability and causing test data errors. By setting the gasket 112 structure on the top surface of the heat dissipation protrusion 110, direct contact between the heat dissipation protrusion 110 and the phased array target unit can be effectively avoided, achieving a better heat insulation effect, thereby improving the operational stability and test accuracy of the target unit in the laser testing environment. By setting the gasket 112 between the phased array target unit and the heat dissipation protrusion 110, the heat generated by laser irradiation on the surface of the heat dissipation protrusion 110 can be effectively reduced, preventing heat from affecting the accuracy of the test data of the phased array target unit.

[0044] In some embodiments, one or more thermal control coatings are formed on the outer surface of the heat dissipation protrusion 110 for heat dissipation. Since the heat dissipation protrusion 110 generates significant heat after being irradiated by a laser, the residual heat can affect the results of the phased array laser test. Therefore, a thermal control coating can be formed on the outer surface of the heat dissipation protrusion 110 to effectively prevent the residual heat from affecting the results of the phased array laser test. Specifically, a black anodized layer can be formed on the outer surface of the heat dissipation protrusion 110 to effectively improve its heat dissipation efficiency. Alternatively, a thermal control coating such as SR107 cured black paint, 618-M black paint, or S956 black paint can be applied to the outer surface of the heat dissipation protrusion 110 to further improve its heat dissipation efficiency and effectively prevent the heat generated by laser irradiation from affecting the results of the phased array laser test.

[0045] According to the phased array laser testing equipment provided in this embodiment, a thermal control coating is formed on the outer surface of the heat dissipation protrusion 110, which can effectively improve the heat dissipation efficiency of the heat dissipation protrusion 110 and further reduce the impact of residual heat on the surface of the heat dissipation protrusion 110 on the phased array target, thus preventing interference with the phased array laser test results. According to this embodiment, by forming a black anodized layer on the surface of the heat dissipation protrusion 110, or by coating it with a special thermal control coating material such as SR107 cured black paint, 618-M black paint, or S956 black paint, heat can be quickly absorbed and released, preventing heat accumulation on the surface of the heat dissipation protrusion 110 from affecting the phased array target. Through this embodiment, the thermal balance of the heat dissipation protrusion 110 and its surrounding environment can be better maintained, thereby ensuring the temperature stability of the entire phased array laser testing equipment and improving the accuracy of the test results.

[0046] Based on the same inventive concept, such as Figure 1 As shown, this disclosure also provides a phased array laser testing device, which may include: a thermal control device as described in any of the foregoing embodiments, a phased array target unit 210, and a signal processing unit 220.

[0047] A thermal control device is used to control the temperature of the phased array laser testing equipment during the phased array laser test. The top surface of the heat dissipation protrusion 110 of the thermal control device can face the direction of the laser source, so that the phased array target unit 210, after being installed on the heat dissipation protrusion 110, can face the direction of the laser source for easy laser reception. The heat dissipation protrusion 110 achieves good heat dissipation, preventing the heat generated by the laser irradiation on the heat dissipation protrusion 110 from having a thermal effect on the phased array target unit 210 and affecting the accuracy of the test data. The heat dissipation protrusion 110 effectively improves the test accuracy of the phased array target unit 210. The top of the temperature control plate 120 of the thermal control device can be used to install the signal processing unit 220. The temperature control plate 120 controls the temperature of the signal processing unit 220, preventing malfunctions or errors caused by overheating or undercooling, ensuring the stable temperature of the signal processing unit 220, thereby further improving the stability and accuracy of the test data during the phased array laser test.

[0048] The phased array target unit 210 is mounted on the top surface of the heat dissipation boss 110 and is used to receive laser light. For example... Figure 1 , Figure 2 As shown, the phased array target unit 210 can be mounted on the top surface of the heat dissipation boss 110, with the phased array target unit 210 facing the laser source direction to ensure that the phased array target unit 210 can receive the laser and realize phased array laser testing. The heat dissipation boss 110 effectively reduces the secondary thermal effects on the phased array target unit 210 from the heat dissipation boss 110 and other equipment, thereby ensuring that the phased array target unit 210 is only affected by the laser, thus effectively improving the accuracy of the experimental data from the phased array laser test.

[0049] The signal processing unit 220 is located to the side of the phased array target unit 210 and mounted on the top surface of the temperature control plate 120. It is used to detect the status information of the phased array target unit 210. Because the signal processing unit 220 has high temperature sensitivity, its temperature needs to be kept stable to ensure its normal operation. The signal processing unit 220 can be positioned to the side of the phased array target unit 210, maintaining a certain distance from it. This effectively avoids the influence of laser light and its reflected light on the signal processing unit 220, while ensuring that the signal processing unit 220 can detect the status information of the phased array target unit 210 in real time with high accuracy. The signal processing unit 220 can be mounted on the top surface of the temperature control plate 120, which controls the temperature of the signal processing unit 220, ensuring its temperature stability.

[0050] In other embodiments, such as Figure 1As shown, the phased array laser testing equipment may also include a test bench 230, which can be constructed from aluminum alloy profiles. The test bench 230 can be fixed and positioned using profile corner pieces and locking screws. Two laser transmission plates 240 can be installed on the laser beam path of the test bench 230. These laser transmission plates 240 allow the laser to pass through, thus limiting the laser beam path and preventing other types of light from irradiating the phased array target unit 210, which could affect the test results of the phased array laser test. The phased array target unit 210 is installed at the end of the laser path. A side wall baffle 250 can be installed on the phased array target unit 210 to isolate the test area of ​​the phased array laser test from the area where signal processing and other related equipment are located.

[0051] Furthermore, the bottom surface of the signal processing unit 220, i.e. the surface on which the signal processing unit 220 is mounted, can be coated with thermal grease or indium foil and fixed to the temperature control board 120 by clamping screws, thereby effectively enhancing heat transfer and enabling the temperature control board 120 to better control the temperature of the signal processing unit 220, ensuring better temperature control effect and further improving the accuracy of phased array laser test results.

[0052] The phased array laser testing equipment provided in this embodiment can achieve cooling and temperature control of the phased array target unit 210 and the signal processing unit 220 through a thermal control device, maintaining the temperature stability of the phased array laser testing equipment, avoiding errors or shutdowns caused by overcooling or overheating, and improving the reliability of the phased array laser testing equipment. Simultaneously, by controlling the temperature of the phased array target unit 210 and the signal processing unit 220, the accuracy of the test data of the phased array laser testing equipment can be effectively improved, its measurement precision can be enhanced, and it has high anti-interference capabilities.

[0053] In some embodiments, such as Figure 4 , Figure 5 as well as Figure 6 As shown, the heat dissipation mechanism may include a first flow channel 111 disposed within the heat dissipation protrusion 110. One end of the first flow channel 111 is provided with a first inlet for receiving low-temperature fluid, and the other end is provided with a first outlet for discharging the low-temperature fluid passing through the first flow channel 111. The temperature control mechanism may include a second flow channel 121 disposed within the temperature control plate 120. One end of the second flow channel 121 is provided with a second inlet for receiving at least the low-temperature fluid flowing out from the first outlet, and the other end of the second flow channel 121 is provided with a second outlet for discharging the fluid passing through the second flow channel 121. The phased array laser test equipment may include a confluence valve.

[0054] A confluence valve is provided with an inlet and an outlet. The inlet is connected to the first inlet for introducing cryogenic fluid into the first inlet; the outlet is connected to the second outlet for discharging the cryogenic fluid discharged from the second outlet to the outside of the second flow channel 121. Since phased array laser experiments need to be conducted in a vacuum environment, they are generally performed in a vacuum tank or vacuum test chamber to ensure better experimental results and accurate experimental data. The heat dissipation and temperature control mechanisms require externally introduced fluid to dissipate heat and control the temperature of the phased array target unit 210 and the signal processing unit 220. Therefore, a confluence valve can be installed on the side wall of the vacuum tank or vacuum test chamber. The confluence valve has good sealing properties with the vacuum tank or vacuum test chamber, maintaining a vacuum environment inside the vacuum tank or vacuum test chamber. The confluence valve can be provided with an inlet for introducing fluid into the first flow channel 111, and can also be provided with an outlet for recovering the fluid flowing out of the second flow channel 121. By setting a confluence valve, the closed circulation of the fluid medium in the heat dissipation mechanism and the temperature control mechanism can be ensured, so that the phased array laser test has good airtightness.

[0055] The phased array laser testing equipment provided in this embodiment can achieve fluid inflow and outflow without disrupting the vacuum by setting a confluence valve on the side wall of the test chamber or tank and ensuring its good airtightness. The confluence valve not only ensures the sealing of the phased array laser testing equipment during testing but also guarantees the accuracy of test data, effectively reducing interference from the external environment and making the phased array laser testing equipment more efficient and reliable. This embodiment enables the phased array laser testing equipment to operate stably for extended periods under high heat load and vacuum conditions, effectively ensuring the stability and data accuracy of the phased array laser test.

[0056] In some embodiments, such as Figure 3 As shown, a heat insulation layer 221 is provided on the outer surface of the signal processing unit 220 to reduce temperature fluctuations. The heat insulation layer 221 effectively reduces the temperature fluctuations caused by heat generated by laser radiation. Specifically, the heat insulation layer 221 can be an aluminized thin film or a polyester mesh heat insulation layer. Since a single layer of heat insulation 221 has a small thickness and its heat insulation effect is not significant, multiple layers of heat insulation 221 can be provided on the outer surface of the signal processing unit 220 to achieve better heat insulation and avoid temperature fluctuations caused by laser radiation heat. Specifically, the number of heat insulation layers 221 can be greater than or equal to 20 layers to ensure better heat insulation for the signal processing unit 220 and maintain temperature stability.

[0057] According to the phased array laser testing equipment provided in this embodiment, by setting a heat insulation layer 221 on the outer surface of the signal processing unit 220, external heat radiation can be effectively shielded, significantly reducing the direct impact of external heat conduction on the signal processing unit 220. By setting multiple layers of heat insulation 221, the signal processing unit 220 can be effectively protected, most of the heat radiation can be isolated, and the layers are closely attached to the surface of the signal processing unit 220 to form a continuous and uniform heat insulation barrier, keeping the temperature of the signal processing unit 220 stable. This avoids processing errors, data drift, or phased array laser testing equipment failures caused by temperature fluctuations of the signal processing unit 220, thereby improving the operational stability and testing accuracy of the phased array laser testing equipment.

[0058] According to the phased array laser testing equipment provided in this disclosure, a phased array target with 128 elements and a heat dissipation of 185W is used for testing, along with a signal processing unit including an integrated electronic unit and an RF signal processor. The heat dissipation of the integrated electronic unit and the RF signal processor are 88W and 16W, respectively. Through the thermal control device provided in this disclosure, including thermal compensation and pre-embedded heat dissipation pipes, the influence of high heat dissipation fluctuations in the phased array target unit is effectively overcome, maintaining the temperature within a reasonable range. Specifically, the temperature control accuracy of the integrated electronic unit is ±1.5℃, and the temperature control accuracy of the RF signal processor is ±0.5℃. Simulation calculations show that the interference from residual laser heat on the phased array target unit is reduced by more than 65%. Actual testing verifies that the phased array laser testing equipment with a thermal control device provided in this disclosure can continuously maintain the temperature of each key component within the normal operating temperature range during long-term, high-intensity testing, avoiding overheating or overcooling, thereby improving the stability and lifespan of the phased array laser testing equipment and achieving higher testing accuracy.

[0059] This application uses specific terms to describe embodiments of the application. Terms such as "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0060] In the context of this application, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0061] Similarly, it should be noted that, in order to simplify the description of this application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of this application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of this application requires more features than those mentioned above. In fact, the embodiments have fewer features than all the features of the single embodiments disclosed above.

[0062] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the embodiments of this application.

Claims

1. A thermal control device, characterized in that, Temperature control for a phased array laser testing device, the phased array laser testing device comprising: a phased array target unit for receiving laser light, and a signal processing unit for detecting the status information of the phased array target unit, the thermal control device comprising: The heat dissipation boss is shaped like a frustum, and its top surface is used to mount the phased array target unit. The heat dissipation boss is provided with a heat dissipation mechanism to reduce the temperature of the heat dissipation boss. A temperature control board, with its top surface used to mount the signal processing unit, is provided with a temperature control mechanism to control the temperature of the temperature control board so as to stabilize the temperature of the signal processing unit.

2. The thermal control device according to claim 1, characterized in that, The heat dissipation mechanism includes: The first flow channel is disposed within the heat dissipation protrusion. One end of the first flow channel is provided with a first inlet for receiving low-temperature fluid, and the other end is provided with a first outlet for discharging the low-temperature fluid that has passed through the first flow channel.

3. The thermal control device according to claim 2, characterized in that, The temperature control mechanism includes: The second flow channel is disposed within the temperature control plate. One end of the second flow channel is provided with a second inlet, which is used to receive the low-temperature fluid flowing out from the first outlet. The other end of the second flow channel is provided with a second outlet, which is used to discharge the fluid that has passed through the second flow channel.

4. The thermal control device according to claim 3, characterized in that, The temperature control mechanism also includes: A temperature-sensitive flow control valve is connected to the first outlet, and its other end is connected to the second inlet via a connecting pipe; A hot fluid pipeline, connected to the temperature-sensing flow control valve, is used to introduce high-temperature fluid into the temperature-sensing flow control valve; The temperature-sensitive flow control valve is used to allow the low-temperature fluid and / or the high-temperature fluid to flow into the second flow channel, so as to control the temperature of the fluid flowing into the second flow channel.

5. The thermal control device according to claim 1, characterized in that, The temperature control mechanism also includes: A heating element is provided on the outer surface of the signal processing unit to control the temperature of the signal processing unit.

6. The thermal control device according to claim 1, characterized in that, The thermal control device also includes: A gasket is installed on the top surface of the heat dissipation boss for mounting the phased array target unit, so that the phased array target unit and the heat dissipation boss are spaced apart.

7. The thermal control device according to claim 1, characterized in that, The outer surface of the heat dissipation boss is covered with one or more thermal control coatings for heat dissipation.

8. A phased array laser testing device, characterized in that, The phased array laser testing equipment includes: The thermal control device as described in any one of claims 1-7 is used to control the temperature of the phased array laser testing equipment during a phased array laser test. A single phased array target is mounted on the top surface of the heat dissipation protrusion and is used to receive laser light. A signal processing unit is located on the side of the phased array target unit and installed on the top surface of the temperature control board, used to detect the status information of the phased array target unit.

9. The phased array laser testing equipment according to claim 8, characterized in that, The heat dissipation mechanism includes a first flow channel disposed within the heat dissipation protrusion. One end of the first flow channel has a first inlet for receiving low-temperature fluid, and the other end has a first outlet for discharging the low-temperature fluid that has passed through the first flow channel. A second flow channel is disposed within the temperature control plate. One end of the second flow channel has a second inlet for receiving the low-temperature fluid that has flowed out from the first outlet, and the other end of the second flow channel has a second outlet for discharging the fluid that has passed through the second flow channel. The phased array laser testing equipment includes: A confluence valve is provided with an inlet and an outlet, wherein the inlet is connected to the first inlet and is used to input cryogenic fluid into the first inlet; The liquid outlet is connected to the second outlet and is used to discharge the cryogenic fluid discharged from the second outlet to the outside of the second flow channel.

10. The phased array laser testing equipment according to claim 8, characterized in that, The outer surface of the signal processing unit is provided with a heat insulation layer to reduce temperature fluctuations of the signal processing unit.

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