Wireless multi-axis vibration detection device

Abstract

The utility model discloses a wireless multi-axis vibration detection device. The wireless multi-axis vibration detection device comprises an MEMS (Micro Electro Mechanical System) chip and a piezoelectric sensor core body, the signal output end of the piezoelectric sensor core body is electrically connected to the Bluetooth controller through the Z-axis conditioning circuit and the first ADC module in sequence, and the MEMS chip is electrically connected to the Bluetooth controller through the second ADC module; a radio frequency module is integrated in the Bluetooth controller, and the radio frequency module is electrically connected with a peripheral radio frequency circuit and an antenna in sequence. According to the device, the piezoelectric sensor and the special signal conditioning circuit are introduced, and the wireless communication module is integrated, so that high-precision and broadband real-time acquisition and wireless transmission of mechanical vibration quantity are realized, and the application effects of equipment fault prediction and preventive maintenance are achieved.

Description

TECHNICAL FIELD

[0001] The application relates to a multi-axis vibration detection device integrated with a wireless communication function and capable of improving measurement stability, and belongs to the technical field of industrial monitoring equipment. BACKGROUND

[0002] A vibration sensor is also called a vibration detector or a vibration meter, and its function is to accurately receive the mechanical vibration quantity (displacement, speed or acceleration, etc.) of a measured object and convert the mechanical vibration quantity into an electrical signal (current or voltage, etc.) output or display. The core application scenarios of the vibration sensor include industrial machinery monitoring, power equipment state monitoring, building infrastructure health assessment and medical device operation state detection, etc.

[0003] At present, the vibration sensors available on the market mainly include wired and wireless forms. Taking the currently popular wireless vibration sensor as an example, a MEMS chip is usually used as the core element for realizing the multi-axis (X / Y / Z axis) vibration data acquisition function in such a wireless vibration sensor, but due to the design and application of the MEMS chip itself, the sensitivity of the Z-axis direction is about 30% lower than that of the X / Y-axis direction, which also leads to the fact that the vibration detection error of such a wireless vibration sensor in the vertical direction is significant, the signal crosstalk in the high-frequency vibration scene is serious, and the measurement stability is seriously insufficient.

[0004] In addition to the above technical problems, the above wireless vibration sensor is usually modified from a more basic wired vibration sensor, and a discrete design is mostly adopted inside such a sensor, that is, a Bluetooth module connected with an MCU (Microcontroller Unit) is added to realize wireless data transmission. The wireless vibration sensor based on the above design often has problems of high hardware cost and high device power consumption (standby current > 10 mA) in actual application. In addition, the discrete design also leads to the fact that the PCB area of such a wireless vibration sensor generally increases by about 40%, and it is difficult to realize the miniaturization of the device, thereby further limiting the application range of such a wireless vibration sensor.

[0005] Therefore, how to propose a multi-axis vibration detection device integrated with a wireless communication function and capable of improving measurement stability has become a problem to be solved by the technical personnel in the field. SUMMARY

[0006] In order to better adapt to various industrial monitoring scenes, and to realize equipment fault prediction and preventive maintenance by high-precision real-time collection and wireless transmission of mechanical vibration quantity, the application provides a wireless multi-axis vibration detection device with good measurement stability.

[0007] The application provides a wireless multi-axis vibration detection device.

[0008] The wireless multi-axis vibration detection device comprises a MEMS chip for collecting mechanical vibration amounts of X and Y axes of a target device and a piezoelectric sensor core for collecting a mechanical vibration amount of a Z axis of the target device; a signal output end of the piezoelectric sensor core is sequentially connected to a Bluetooth controller through a Z-axis conditioning circuit and a first ADC module; the MEMS chip is connected to the Bluetooth controller through a second ADC module; the Bluetooth controller is integrated with a radio frequency module for generating wireless communication signals and realizing wireless interaction; the radio frequency module is sequentially connected with a peripheral radio frequency circuit and an antenna.

[0009] By adopting the above technical scheme, the piezoelectric sensor core and the corresponding conditioning circuit are used to collect and process the mechanical vibration amount of the Z axis of the target device, and the piezoelectric material is very sensitive to force and acceleration change and can provide very high sensitivity, so that the problem of significant detection error of the mechanical vibration amount of the Z axis direction in the prior art is effectively solved. Moreover, the piezoelectric sensor core used in the present application can work in a very wide frequency range and can maintain good performance from low frequency to high frequency, so that it can be applied to various application scenarios, including dynamic and static measurement.

[0010] In addition, the Bluetooth controller in the present application integrates the functions of device control and Bluetooth communication, compared with the prior art which realizes wireless data transmission by adding a Bluetooth module connected with an MCU, the present application significantly reduces the size of the PCB, reduces the hardware cost, and effectively reduces the energy consumption, thereby improving the efficiency and market competitiveness of the whole device.

[0011] Preferably, the X-axis signal output end of the MEMS chip is connected to the first signal input end of the second ADC module through an X-axis conditioning circuit, and the Y-axis signal output end of the MEMS chip is connected to the second signal input end of the second ADC module through a Y-axis conditioning circuit.

[0012] By adopting the above technical scheme, the MEMS chip and the corresponding conditioning circuit are used to collect and process the mechanical vibration amounts of the X and Y axes of the target device, thereby ensuring the function of the device for detecting the mechanical vibration amounts of multiple axes. This setting also effectively avoids the problem of low sensitivity of the MEMS chip in the Z axis direction, thereby ensuring the accuracy of the mechanical vibration amount collected by the MEMS chip.

[0013] Preferably, the wireless multi-axis vibration detection device further comprises a power distribution network module for supplying power to each part of the device; an input end of the power distribution network module is electrically connected with an external power supply circuit, a first output end of the power distribution network module is electrically connected with a power supply input end of the first ADC module and a power supply input end of the second ADC module respectively, a second output end of the power distribution network module is electrically connected with a power supply input end of the Bluetooth controller, a core power supply end of the piezoelectric sensor core and a chip power supply end of the MEMS chip respectively, and a third output end of the power distribution network module is electrically connected with a power supply input end of the X-axis conditioning circuit, a power supply input end of the Y-axis conditioning circuit and a power supply input end of the Z-axis conditioning circuit respectively.

[0014] By adopting the above technical solution, the specific setting and adaptation mode of the power supply part in the present scheme are defined, which provides a premise and foundation for the long-term stable operation of the subsequent device.

[0015] Preferably, the wireless multi-axis vibration detection device further comprises a voltage reference network module for realizing local voltage regulation; an input end of the voltage reference network module is electrically connected with a fourth output end of the power distribution network module, a first output end of the voltage reference network module is electrically connected with a reference voltage access end of the piezoelectric sensor core and a reference voltage input end of the Z-axis conditioning circuit respectively, and a second output end of the voltage reference network module is electrically connected with the chip power supply end of the MEMS chip.

[0016] By adopting the above technical solution, the voltage reference network module is used to provide high-precision calibration support for the conversion process of the multi-axis analog signal to digital signal in the present scheme, which further ensures the detection accuracy of the entire device.

[0017] Preferably, the voltage reference network module is integrated with a voltage reference chip for generating a reference voltage; an IN end of the voltage reference chip is electrically connected to a third output end of the power distribution network module; a power input first filter capacitor and a power input second filter capacitor are arranged in parallel between the input end of the voltage reference chip and the third output end of the power distribution network module; one end of each of the power input first filter capacitor and the power input second filter capacitor is respectively electrically connected to the input end of the voltage reference chip and the third output end of the power distribution network module; the other end of each of the power input first filter capacitor and the power input second filter capacitor is commonly electrically connected to AGND; an OUT end of the voltage reference chip is electrically connected to a third end of the piezoelectric sensor core interface; a reference power output first filter capacitor and a reference power output second filter capacitor are arranged in parallel between the output end of the voltage reference chip and the third end of the piezoelectric sensor core interface; one end of each of the reference power output first filter capacitor and the reference power output second filter capacitor is respectively electrically connected to the output end of the voltage reference chip and the third end of the piezoelectric sensor core interface; the other end of each of the reference power output first filter capacitor and the reference power output second filter capacitor is commonly electrically connected to AGND; and a GND end of the voltage reference chip is electrically connected to AGND.

[0018] Preferably, a first end of the piezoelectric sensor core interface is electrically connected to a second output end of the power distribution network module; a second end of the piezoelectric sensor core interface is electrically connected to a Z-axis mechanical vibration quantity access end of a target device; and a fourth end of the piezoelectric sensor core interface is electrically connected to AGND.

[0019] By adopting the above technical solution, the specific arrangement and connection relationship between the voltage reference network module and the piezoelectric sensor core in the present scheme are defined, and the normal operation of the piezoelectric sensor core is ensured.

[0020] Preferably, the Z-axis conditioning circuit comprises a differential operational amplifier as the core of signal processing, the first output end of the voltage reference network module is sequentially connected to the IN+ port of the differential operational amplifier through the first conditioning resistor, the second conditioning resistor and the third conditioning resistor, the signal output end of the piezoelectric sensor core is sequentially connected to the IN- port of the differential operational amplifier through the fourth conditioning resistor, the fifth conditioning resistor and the sixth conditioning resistor, the IN+ port is connected to the OUT- port of the differential operational amplifier through the second conditioning capacitor, the IN- port is connected to the OUT+ port of the differential operational amplifier through the third conditioning capacitor, the OUT- port is sequentially connected to the first signal input end of the first ADC module through the seventh conditioning resistor and the eighth conditioning resistor, one end of the second conditioning capacitor is connected to the third conditioning resistor, and the other end is connected to the seventh conditioning resistor, and the OUT+ port is sequentially connected to the second signal input end of the first ADC module through the ninth conditioning resistor and the tenth conditioning resistor.

[0021] Preferably, a first connection site is arranged between the second conditioning resistor and the third conditioning resistor, a second connection site is arranged between the second conditioning capacitor and the seventh conditioning resistor, a third connection site is arranged between the seventh conditioning resistor and the eighth conditioning resistor, one end of the eleventh conditioning resistor is connected to the first connection site, and the other end is connected to the second connection site, one end of the fourth conditioning capacitor is connected to the third connection site, and the other end is connected to AGND.

[0022] Preferably, a fourth connection site is arranged between the fifth conditioning resistor and the sixth conditioning resistor, a fifth connection site is arranged between the third conditioning capacitor and the ninth conditioning resistor, a sixth connection site is arranged between the ninth conditioning resistor and the tenth conditioning resistor, one end of the twelfth conditioning resistor is connected to the fourth connection site, and the other end is connected to the fifth connection site, one end of the first conditioning capacitor is connected to the first connection site, and the other end is connected to the fourth connection site, one end of the fifth conditioning capacitor is connected to the sixth connection site, and the other end is connected to AGND, one end of the sixth conditioning capacitor is connected to the third connection site, and the other end is connected to the sixth connection site.

[0023] Preferably, the VC port of the differential operational amplifier is electrically connected to the first output end of the voltage reference network module, the VS+ port of the differential operational amplifier is electrically connected to the third output end of the power distribution network module, and the VS- port of the differential operational amplifier is electrically connected to AGND. Preferably, the VC port of the differential operational amplifier is electrically connected to the first output end of the voltage reference network module, the VS+ port of the differential operational amplifier is electrically connected to the third output end of the power distribution network module, and the VS- port of the differential operational amplifier is electrically connected to AGND.

[0024] By adopting the technical scheme, the specific arrangement and connection relationship of the Z-axis conditioning circuit are defined, the core architecture of the entire Z-axis conditioning circuit adopts a three-stage signal processing module to realize high-fidelity signal transmission, and the differential operational amplifier is taken as a processing center to build a complete anti-interference signal link.

[0025] In summary, the present application at least has the following beneficial effects:

[0026] The device of the present application realizes high-precision, wide-frequency real-time acquisition and wireless transmission of mechanical vibration by introducing a piezoelectric sensor, a special signal conditioning circuit, and an integrated wireless communication module, and achieves the application effect of equipment fault prediction and preventive maintenance.

[0027] Meanwhile, the device of the present application further reduces the hardware volume, controls the hardware cost, and reduces the energy consumption by multiplexing the functions of the Bluetooth controller and optimizing the circuit structure, thereby greatly expanding the applicability of the scheme and improving the overall market competitiveness of the device. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a connection circuit schematic diagram of a wireless multi-axis vibration detection device according to an embodiment of the present application;

[0029] Figure 2 is a connection circuit schematic diagram of a local circuit according to an embodiment of the present application;

[0030] Figure 3 is a connection circuit schematic diagram of a Z-axis conditioning circuit according to an embodiment of the present application;

[0031] The components include: 1. Voltage reference chip; 201. First power input filter capacitor; 202. Second power input filter capacitor; 3. Piezoelectric sensor core interface; 401. First reference power output filter capacitor; 402. Second reference power output filter capacitor; 5. Differential operational amplifier; 601. First resistor of conditioning circuit; 602. Second resistor of conditioning circuit; 603. Third resistor of conditioning circuit; 604. Fourth resistor of conditioning circuit; 605. Fifth resistor of conditioning circuit; 606. Sixth resistor of conditioning circuit. Resistors; 607, Seventh resistor of the conditioning circuit; 608, Eighth resistor of the conditioning circuit; 609, Ninth resistor of the conditioning circuit; 610, Tenth resistor of the conditioning circuit; 611, Eleventh resistor of the conditioning circuit; 612, Twelfth resistor of the conditioning circuit; 701, First filter capacitor of the conditioning circuit; 702, Second filter capacitor of the conditioning circuit; 703, Third filter capacitor of the conditioning circuit; 704, Fourth filter capacitor of the conditioning circuit; 705, Fifth filter capacitor of the conditioning circuit; 706, Sixth filter capacitor of the conditioning circuit. Detailed Implementation

[0032] This application provides a wireless multi-axis vibration detection device. To make the objectives, technical solutions and advantages of this application clearer, the embodiments of this application will be described in further detail below.

[0033] The following describes a specific embodiment of this application in further detail with reference to the accompanying drawings.

[0034] like Figure 1 As shown, a wireless multi-axis vibration detection device includes a MEMS chip for acquiring the mechanical vibration of a target device along the X and Y axes, and a piezoelectric sensor core for acquiring the mechanical vibration of the target device along the Z axis. This embodiment utilizes a piezoelectric sensor element. Because piezoelectric materials are highly sensitive to changes in force and acceleration, the piezoelectric sensor core can provide very high sensitivity, detecting even minute vibrations. Furthermore, the piezoelectric sensor core can operate over a wide frequency range, maintaining good performance from low to high frequencies, making it suitable for various applications, including dynamic and static measurements.

[0035] The signal output terminal of the piezoelectric sensor core is electrically connected to the Bluetooth controller via a Z-axis conditioning circuit and a first ADC module. The MEMS chip is electrically connected to the Bluetooth controller via a second ADC module. Specifically, the X-axis signal output terminal of the MEMS chip is electrically connected to the first signal input terminal of the second ADC module via an X-axis conditioning circuit, and the Y-axis signal output terminal of the MEMS chip is electrically connected to the second signal input terminal of the second ADC module via a Y-axis conditioning circuit.

[0036] The radio frequency module is sequentially electrically connected with a peripheral radio frequency circuit and an antenna.

[0037] The wireless multi-axis vibration detection device also comprises a power distribution network module for supplying power to each part of the device and a voltage reference network module for realizing local voltage regulation.

[0038] The input end of the power distribution network module is electrically connected with an external power supply circuit, the first output end of the power distribution network module is respectively electrically connected with the power supply input end of the first ADC module and the power supply input end of the second ADC module, the second output end of the power distribution network module is respectively electrically connected with the power supply input end of the Bluetooth controller, the core power supply end of the piezoelectric sensor core and the chip power supply end of the MEMS chip, and the third output end of the power distribution network module is respectively electrically connected with the power supply input end of the X-axis conditioning circuit, the power supply input end of the Y-axis conditioning circuit and the power supply input end of the Z-axis conditioning circuit.

[0039] The input end of the voltage reference network module is electrically connected with the fourth output end of the power distribution network module, the first output end of the voltage reference network module is respectively electrically connected with the reference voltage access end of the piezoelectric sensor core and the reference voltage input end of the Z-axis conditioning circuit, the second output end of the voltage reference network module is electrically connected with the chip power supply end of the MEMS chip, and in addition, the second output end of the voltage reference network module is respectively electrically connected with the reference voltage input end of the X-axis conditioning circuit and the reference voltage input end of the Y-axis conditioning circuit.

[0040] It can be seen from the above technical solution description that the wireless multi-axis vibration detection device described in the embodiment realizes the functions of data acquisition, processing and wireless transmission of vibration data in a hierarchical design. The current from the external power supply circuit is distributed to each part of the device after being stabilized by the power distribution network module. The multi-axis (X / Y / Z-axis) analog signals collected by the MEMS chip and the piezoelectric sensor core are amplified and filtered by the corresponding conditioning circuit, then input into the corresponding ADC module to be converted into digital signals, and the voltage reference network module provides high-precision calibration support. The digital signals are then transmitted to the radio frequency module in the Bluetooth controller, optimized by the peripheral radio frequency circuit, and sent wirelessly through the antenna. The wireless multi-axis vibration detection device described in the embodiment integrates signal conditioning, analog-to-digital conversion, reference calibration and low-power wireless communication, and realizes end-to-end processing from mechanical signal sensing to wireless data link.

[0041] As shown in Figure 2 The voltage reference network module is integrated with a voltage reference chip 1 for generating a reference voltage.

[0042] The IN end (input end) of the voltage reference chip 1 is electrically connected to the third output end of the power distribution network module. A power input first filter capacitor 201 and a power input second filter capacitor 202 are connected in parallel between the input end of the voltage reference chip 1 and the third output end of the power distribution network module. One end of each of the power input first filter capacitor 201 and the power input second filter capacitor 202 is electrically connected to the input end of the voltage reference chip 1 and the third output end of the power distribution network module, respectively. The other end of each of the power input first filter capacitor 201 and the power input second filter capacitor 202 is commonly electrically connected to AGND (analog ground).

[0043] The OUT end (output end) of the voltage reference chip 1 is electrically connected to the third end of the piezoelectric sensor core interface 3. A reference power output first filter capacitor 401 and a reference power output second filter capacitor 402 are connected in parallel between the output end of the voltage reference chip 1 and the third end of the piezoelectric sensor core interface 3. One end of each of the reference power output first filter capacitor 401 and the reference power output second filter capacitor 402 is electrically connected to the output end of the voltage reference chip 1 and the third end of the piezoelectric sensor core interface 3, respectively. The other end of each of the reference power output first filter capacitor 401 and the reference power output second filter capacitor 402 is commonly electrically connected to AGND.

[0044] The GND end (ground end) of the voltage reference chip 1 is electrically connected to AGND.

[0045] In the embodiment, the power supply of the whole piezoelectric sensor core is 3.3V, an external 1.024V reference voltage is adopted, the first end of the piezoelectric sensor core interface 3 is electrically connected to the second output end of the power distribution network module, the second end of the piezoelectric sensor core interface 3 is electrically connected to the Z-axis mechanical vibration quantity access end of the target device, and the fourth end of the piezoelectric sensor core interface 3 is electrically connected to AGND. In addition, the piezoelectric sensor core interface 3 further comprises an EP port (edge port) for connecting an external terminal and realizing extended connection.

[0046] As shown in Figure 3 The core architecture of the Z-axis conditioning circuit adopts a three-stage signal processing module to realize high-fidelity signal transmission. The Z-axis conditioning circuit takes the differential operational amplifier 5 as the signal processing center and constructs a complete anti-interference signal link.

[0047] The first output end of the voltage reference network module is electrically connected to the IN+ port (same direction input port) of the differential operational amplifier 5 in sequence through the conditioning circuit first resistor 601, the conditioning circuit second resistor 602 and the conditioning circuit third resistor 603. The signal output end of the piezoelectric sensor core is electrically connected to the IN- port (reverse input port) of the differential operational amplifier 5 in sequence through the conditioning circuit fourth resistor 604, the conditioning circuit fifth resistor 605 and the conditioning circuit sixth resistor 606.

[0048] The conditioning circuit first resistor 601 and the conditioning circuit second resistor 602 constitute a precision bias network, which provides a 1.25V reference voltage for the differential operational amplifier 5. This design has double advantages. On the one hand, it effectively suppresses common-mode interference by balancing input impedance. On the other hand, it avoids the power noise introduced by traditional single-ended bias, so that the common-mode rejection ratio (CMRR) of the whole circuit is improved to more than 120dB.

[0049] The resistor network composed of the conditioning circuit fourth resistor 604, the conditioning circuit fifth resistor 605 and the conditioning circuit sixth resistor 606 can realize gain dynamic configuration, and the amplification factor follows the formula Av=1+2*26 / (27||30). This topology structure allows 20-60dB dynamic range adjustment by adjusting the resistance ratio while ensuring gain accuracy.

[0050] The IN+ port is electrically connected to the OUT- port (negative output end) of the differential operational amplifier 5 through the conditioning circuit second filter capacitor 702, and the IN- port is electrically connected to the OUT+ port (positive output end) of the differential operational amplifier 5 through the conditioning circuit third filter capacitor 703.

[0051] The OUT- port is electrically connected to the first signal input end of the first ADC module in sequence through the seventh resistor 607 and the eighth resistor 608 of the conditioning circuit, and outputs the negative phase part of the Z-axis output signal in the running process, one end of the second filter capacitor 702 of the conditioning circuit is electrically connected to the third resistor 603 of the conditioning circuit, and the other end is electrically connected to the seventh resistor 607 of the conditioning circuit, the OUT+ port is electrically connected to the second signal input end of the first ADC module in sequence through the ninth resistor 609 and the tenth resistor 610 of the conditioning circuit, and outputs the positive phase part of the Z-axis output signal in the running process, one end of the third filter capacitor 703 of the conditioning circuit is electrically connected to the sixth resistor 606 of the conditioning circuit, and the other end is electrically connected to the ninth resistor 609 of the conditioning circuit. Subsequently, by combining the positive and negative phase Z-axis output signals output by the differential operational amplifier 5, common mode noise can be suppressed, and the Z-axis mechanical vibration of the target device can be more accurately obtained, realizing high-fidelity signal transmission.

[0052] The second filter capacitor 702 of the conditioning circuit, the third filter capacitor 703 of the conditioning circuit, the seventh resistor 607 of the conditioning circuit, and the ninth resistor 609 of the conditioning circuit together constitute a second-order Butterworth low-pass filter, and the cutoff frequency is set to fc=1 / (2π√(32343738)). The filter can achieve a decay slope of 40dB / dec for high-frequency interference above 20kHz while retaining effective vibration signals of 0-5kHz, and is particularly suitable for long-distance transmission scenarios in industrial environments.

[0053] In order to further clarify the connection relationship, the concept of connection site is introduced in the circuit structure of the embodiment, specifically as follows: a first connection site is provided between the second resistor 602 of the conditioning circuit and the third resistor 603 of the conditioning circuit, a second connection site is provided between the second filter capacitor 702 of the conditioning circuit and the seventh resistor 607 of the conditioning circuit, a third connection site is provided between the seventh resistor 607 of the conditioning circuit and the eighth resistor 608 of the conditioning circuit, a fourth connection site is provided between the fifth resistor 605 of the conditioning circuit and the sixth resistor 606 of the conditioning circuit, a fifth connection site is provided between the third filter capacitor 703 of the conditioning circuit and the ninth resistor 609 of the conditioning circuit, and a sixth connection site is provided between the ninth resistor 609 of the conditioning circuit and the tenth resistor 610 of the conditioning circuit.

[0054] One end of the eleventh resistor 611 of the conditioning circuit is electrically connected to the first connection site, and the other end is electrically connected to the second connection site. One end of the twelfth resistor 612 of the conditioning circuit is electrically connected to the fourth connection site, and the other end is electrically connected to the fifth connection site.

[0055] One end of the first filter capacitor 701 of the conditioning circuit is electrically connected to the first connection site, and the other end is electrically connected to the fourth connection site. One end of the fourth filter capacitor 704 of the conditioning circuit is electrically connected to the third connection site, and the other end is electrically connected to AGND. One end of the fifth filter capacitor 705 of the conditioning circuit is electrically connected to the sixth connection site, and the other end is electrically connected to AGND. One end of the sixth filter capacitor 706 of the conditioning circuit is electrically connected to the third connection site, and the other end is electrically connected to the sixth connection site.

[0056] In addition to the above connection relationship, the connection relationship of other ports of the differential operational amplifier 5 is as follows. The VC port (common-mode voltage control port) of the differential operational amplifier 5 is electrically connected to the first output end of the voltage reference network module. The VS+ port (positive power supply port) of the differential operational amplifier 5 and The VS- port (negative power supply port) of the differential operational amplifier 5 is electrically connected to AGND.

[0057] The Z-axis conditioning circuit layout in the embodiment adopts star grounding technology, and the selection of all electrical elements in the Z-axis conditioning circuit follows the low temperature coefficient (±15ppm / ℃) and high precision (±0.1%) standards. The actual measurement data shows that the Z-axis conditioning circuit design in the embodiment can make the signal link signal-to-noise ratio (SNR) reach 78dB, which is 21dB higher than the traditional design, and fully meets the stringent requirements of industrial vibration monitoring in various environments.

[0058] Finally, it should be understood that "multiple" referred to herein refers to two or more. "And / or", which describes the association relationship of the associated objects, means that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist together, and B exists alone. The character " / " generally represents that the associated objects before and after it are in an "or" relationship.

[0059] The above are the preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, any equivalent changes made on the basis of the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A wireless multi-axis vibration detection device, characterized in that: The device includes a MEMS chip for acquiring mechanical vibration data along the X and Y axes of a target device, and a piezoelectric sensor core for acquiring mechanical vibration data along the Z axis of the target device. The signal output terminal of the piezoelectric sensor core is electrically connected to a Bluetooth controller via a Z-axis conditioning circuit and a first ADC module. The MEMS chip is electrically connected to the Bluetooth controller via a second ADC module. The Bluetooth controller integrates a radio frequency module for generating wireless communication signals and enabling wireless interaction. The radio frequency module is electrically connected to peripheral radio frequency circuits and an antenna.

2. The wireless multi-axis vibration detection device according to claim 1, characterized in that: The X-axis signal output terminal of the MEMS chip is electrically connected to the first signal input terminal of the second ADC module through an X-axis conditioning circuit, and the Y-axis signal output terminal of the MEMS chip is electrically connected to the second signal input terminal of the second ADC module through a Y-axis conditioning circuit.

3. The wireless multi-axis vibration detection device according to claim 2, characterized in that: It also includes a power distribution network module for supplying power to various parts of the device; the input terminal of the power distribution network module is electrically connected to an external power supply circuit, the first output terminal of the power distribution network module is electrically connected to the power supply input terminal of the first ADC module and the power supply input terminal of the second ADC module, the second output terminal of the power distribution network module is electrically connected to the power supply input terminal of the Bluetooth controller, the core power supply terminal of the piezoelectric sensor core and the chip power supply terminal of the MEMS chip, and the third output terminal of the power distribution network module is electrically connected to the power supply input terminal of the X-axis conditioning circuit, the power supply input terminal of the Y-axis conditioning circuit and the power supply input terminal of the Z-axis conditioning circuit.

4. The wireless multi-axis vibration detection device according to claim 3, characterized in that: It also includes a voltage reference network module for implementing local voltage regulation; the input terminal of the voltage reference network module is electrically connected to the fourth output terminal of the power distribution network module, the first output terminal of the voltage reference network module is electrically connected to the reference voltage input terminal of the piezoelectric sensor core and the reference voltage input terminal of the Z-axis conditioning circuit, and the second output terminal of the voltage reference network module is electrically connected to the chip power supply terminal of the MEMS chip.

5. The wireless multi-axis vibration detection device according to claim 4, characterized in that: The voltage reference network module integrates a voltage reference chip (1) for generating a reference voltage; the IN terminal of the voltage reference chip (1) is electrically connected to the third output terminal of the power distribution network module; a first power input filter capacitor (201) and a second power input filter capacitor (202) are connected in parallel between the input terminal of the voltage reference chip (1) and the third output terminal of the power distribution network module; one end of each of the first power input filter capacitor (201) and the second power input filter capacitor (202) is electrically connected to the input terminal of the voltage reference chip (1) and the third output terminal of the power distribution network module, respectively; the other end of each of the first power input filter capacitor (201) and the second power input filter capacitor (202) is electrically connected to AGND; the voltage reference... The OUT terminal of the reference chip (1) is electrically connected to the third terminal of the piezoelectric sensor core interface (3). A reference power output first filter capacitor (401) and a reference power output second filter capacitor (402) are connected in parallel between the output terminal of the voltage reference chip (1) and the third terminal of the piezoelectric sensor core interface (3). One end of the reference power output first filter capacitor (401) and the reference power output second filter capacitor (402) are respectively electrically connected to the output terminal of the voltage reference chip (1) and the third terminal of the piezoelectric sensor core interface (3). The other end of the reference power output first filter capacitor (401) and the reference power output second filter capacitor (402) are both electrically connected to AGND. The GND terminal of the voltage reference chip (1) is electrically connected to AGND.

6. The wireless multi-axis vibration detection device according to claim 5, characterized in that: The first end of the piezoelectric sensor core interface (3) is electrically connected to the second output end of the power distribution network module, the second end of the piezoelectric sensor core interface (3) is electrically connected to the Z-axis mechanical vibration input end of the target device, and the fourth end of the piezoelectric sensor core interface (3) is electrically connected to AGND.

7. The wireless multi-axis vibration detection device according to claim 4, characterized in that: The Z-axis conditioning circuit includes a differential operational amplifier (5) serving as the signal processing center. The first output terminal of the voltage reference network module is electrically connected to the IN+ port of the differential operational amplifier (5) via the first resistor (601), the second resistor (602), and the third resistor (603) of the conditioning circuit. The signal output terminal of the piezoelectric sensor core is electrically connected to the IN- port of the differential operational amplifier (5) via the fourth resistor (604), the fifth resistor (605), and the sixth resistor (606) of the conditioning circuit. The IN+ port is electrically connected to the OUT- port of the differential operational amplifier (5) via the second filter capacitor (702) of the conditioning circuit. The IN- port is electrically connected to the OUT- port of the differential operational amplifier (5) via the third filter capacitor (703) of the conditioning circuit. The OUT+ port of the differential operational amplifier (5) is electrically connected to the first signal input terminal of the first ADC module through the seventh resistor (607) and the eighth resistor (608) of the conditioning circuit in sequence. One end of the second filter capacitor (702) of the conditioning circuit is electrically connected to the third resistor (603) of the conditioning circuit, and the other end is electrically connected to the seventh resistor (607) of the conditioning circuit. The OUT+ port is electrically connected to the second signal input terminal of the first ADC module through the ninth resistor (609) and the tenth resistor (610) of the conditioning circuit in sequence. One end of the third filter capacitor (703) of the conditioning circuit is electrically connected to the sixth resistor (606) of the conditioning circuit, and the other end is electrically connected to the ninth resistor (609) of the conditioning circuit.

8. The wireless multi-axis vibration detection device according to claim 7, characterized in that: A first connection point is provided between the second resistor (602) and the third resistor (603) of the conditioning circuit. A second connection point is provided between the second filter capacitor (702) and the seventh resistor (607) of the conditioning circuit. A third connection point is provided between the seventh resistor (607) and the eighth resistor (608) of the conditioning circuit. One end of the eleventh resistor (611) of the conditioning circuit is electrically connected to the first connection point and the other end is electrically connected to the second connection point. One end of the fourth filter capacitor (704) of the conditioning circuit is electrically connected to the third connection point and the other end is electrically connected to AGND.

9. The wireless multi-axis vibration detection device according to claim 8, characterized in that: A fourth connection point is provided between the fifth resistor (605) and the sixth resistor (606) of the conditioning circuit. A fifth connection point is provided between the third filter capacitor (703) and the ninth resistor (609) of the conditioning circuit. A sixth connection point is provided between the ninth resistor (609) and the tenth resistor (610) of the conditioning circuit. One end of the twelfth resistor (612) of the conditioning circuit is electrically connected to the fourth connection point and the other end is electrically connected to the fifth connection point. One end of the first filter capacitor (701) of the conditioning circuit is electrically connected to the first connection point and the other end is electrically connected to the fourth connection point. One end of the fifth filter capacitor (705) of the conditioning circuit is electrically connected to the sixth connection point and the other end is electrically connected to AGND. One end of the sixth filter capacitor (706) of the conditioning circuit is electrically connected to the third connection point and the other end is electrically connected to the sixth connection point.

10. The wireless multi-axis vibration detection device according to claim 7, characterized in that: The VC port of the differential operational amplifier (5) is electrically connected to the first output terminal of the voltage reference network module, and the VS+ port of the differential operational amplifier (5) and The ports are electrically connected to the third output terminal of the power distribution network module, and the VS- port of the differential operational amplifier (5) is electrically connected to AGND.

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