Wireless temperature measurement system with solar panel as antenna

Abstract

The utility model relates to a wireless temperature measurement system using a solar panel as an antenna, belongs to the technical field of wireless temperature measurement, and realizes miniaturization and cost effectiveness of a temperature measurement module by integrating a monocrystalline silicon solar panel as a radiating antenna. The system is composed of a plurality of key modules including a power supply and signal emission module, a control module, a temperature acquisition module, an energy storage module and a temperature conversion and forwarding module. The modules work cooperatively, accurate acquisition, conversion and wireless transmission of temperature data are ensured, and power supply of the system is managed at the same time. Therefore, the antenna is not shielded by the structure of the temperature measuring device, the radiation performance of the temperature measuring device is remarkably improved, and the wireless transmitting distance of the module is greatly increased.

Description

TECHNICAL FIELD

[0001] The utility model relates to a wireless temperature measurement system with solar panel as antenna belongs to wireless temperature measurement technical field. BACKGROUND

[0002] In key industries such as electric power, chemical industry, petroleum and metallurgy, wireless temperature measurement technology has become a core measure to ensure safe operation of equipment and prevent accidents. In particular, in the field of electric power, it is particularly crucial to monitor the temperature anomalies at the power line joints in real time, which helps to provide early warning and quickly handle potential overheating risks, thereby ensuring the continuous stability of power supply. With the continuous evolution of technology, wireless temperature measurement systems are developing towards smaller and more integrated directions to cope with more complex and demanding application environments.

[0003] In the design of small wireless temperature measurement products powered by solar energy, in order to balance the size of the equipment, the built-in antenna has to be hidden under the solar panel. Since the solar panel itself is a large piece of metal, its presence will significantly weaken the radiation effect of the built-in antenna, thereby affecting the communication distance of the module.

[0004] The patent application file with publication number "CN108760062A" discloses a temperature sensor. The problems of this scheme are: although it is mentioned that the power module collects energy from the environment, and it is mentioned that a self-discharge circuit can be set to avoid the voltage of the energy storage module being too high, but there is a lack of specific intelligent energy management strategy, such as dynamically adjusting the working mode according to the light intensity or energy demand. UTILITY MODEL CONTENT

[0005] In order to solve the problems existing in the prior art, the utility model provides a wireless temperature measurement system with solar panel as antenna.

[0006] The technical scheme of the utility model is as follows:

[0007] A wireless temperature measurement system with solar panel as antenna, comprising a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module;

[0008] The output end of the temperature acquisition module is connected with the input end of the temperature conversion and forwarding module, the output end of the temperature conversion and forwarding module is connected with the input end of the power supply and signal transmission module, the control module is connected with the power supply and signal transmission module and the energy storage module respectively, and the output end of the power supply and signal transmission module is connected with the input end of the energy storage module and the input end of the temperature conversion and forwarding module respectively.

[0009] The temperature acquisition module outputs an electric signal to the temperature conversion and forwarding module according to the measured temperature, and the temperature conversion and forwarding module is used for converting the electric signal into a temperature result and forwarding it to the power supply and signal transmission module.

[0010] The single-crystal silicon solar panel of the power supply and signal transmitting module serves as a radiation antenna to transmit temperature results to a receiving device, and supplies power for the energy storage module, the control module, and the temperature conversion and forwarding module;

[0011] The energy storage module is configured to supply power for the control module and the temperature conversion and forwarding module;

[0012] The control module is configured to control the energy storage module to supply power for the control module and the temperature conversion and forwarding module, and control the power supply and signal transmitting module to charge the energy storage module.

[0013] As a preferred embodiment, the power supply and signal transmitting module further comprises a transient voltage suppression diode D6, a first MOS tube Q31, and a second ideal diode chip U11.

[0014] The negative electrode welding point J41 of the single-crystal silicon solar panel is connected to the temperature conversion and forwarding module, and grounded through a first inductor L22.

[0015] The positive electrode welding point J42 of the single-crystal silicon solar panel is connected to one end of a second inductor L23, the other end of the second inductor L23 is connected to the positive electrode of the transient voltage suppression diode D6, one end of a first capacitor C35, one end of a first resistor R16, and the input end VIN of the second ideal diode chip U11, the negative electrode of the transient voltage suppression diode D6 and the other end of the first capacitor C35 are grounded, the transient voltage suppression diode D6 is used to protect the circuit behind it from being damaged by static electricity, the ground end GND of the second ideal diode chip U11 is grounded, and the output end VOUT of the second ideal diode chip U11 is connected to the input end of the energy storage module and the input end of the control module.

[0016] The other end of the first resistor R16 is connected to the drain D1 of the first MOS tube Q31, the source S1 of the first MOS tube Q31 is grounded, the gate G1 of the first MOS tube Q31 is grounded through a second resistor R15 and connected to the output end of the control module.

[0017] As a preferred embodiment, the energy storage module comprises a lithium sub-battery BAT1, a super capacitor C34, and a first ideal diode chip U10.

[0018] The negative electrode of the lithium sub-battery BAT1 is grounded, and the positive electrode is connected to the input end VIN of the first ideal diode chip U10, and the ground end GND of the first ideal diode chip is grounded.

[0019] The negative electrode of the super capacitor C34 is grounded, and the positive electrode of the super capacitor C34 is connected to the output end VOUT of the second ideal diode chip U11.

[0020] The output end VOUT of the first ideal diode chip U10 and the positive pole of the super capacitor C34 are connected with the input end of the control module.

[0021] As a preferred embodiment, the control module comprises a first diode D5, a second MOS tube Q26 and a logic control chip U2.

[0022] The gate G1 of the first MOS tube Q31 is connected with the first output end PIN5 of the logic control chip U2.

[0023] The output end VOUT of the first ideal diode chip U10, the positive pole of the super capacitor C34 and the output end VOUT of the second ideal diode chip U11 are respectively connected with the second capacitor C33, the power input end VDD of the logic control chip U2, one end of the third resistor R14 and the source S1 of the second MOS tube Q26, the other end of the third resistor R14 and the gate G1 of the second MOS tube Q26 are connected with the second output end PIN12 of the logic control chip U2.

[0024] The drain D1 of the second MOS tube Q26 is connected with the positive pole of the first diode D5 and outputs the power supply, the negative pole of the first diode D5 is connected with the third output end PIN13 of the logic control chip U2.

[0025] The ground end GND of the logic control chip U2 is grounded.

[0026] The input end PIN11 of the logic control chip U2 is connected with the positive pole of the super capacitor.

[0027] As a preferred embodiment, the temperature acquisition module comprises a negative temperature coefficient thermistor R8.

[0028] One end of the negative temperature coefficient thermistor R8 is grounded, and the other end is respectively connected with one end of the fourth resistor R6 and one end of the fifth resistor R7.

[0029] The other end of the fourth resistor R6 and the other end of the fifth resistor R7 are connected with the input end of the temperature conversion and forwarding module.

[0030] As a preferred embodiment, the temperature conversion and forwarding module comprises a wireless transceiver SOC chip U13.

[0031] The first ADC channel end PB3 of the wireless transceiver SOC chip U13 is connected with the other end of the fifth resistor R7.

[0032] The second ADC channel end PB4 and the general input and output end PB5 of the wireless transceiver SOC chip U13 are connected with the other end of the fourth resistor R6.

[0033] The first internal digital part power supply end VDD1 of the wireless transceiver SOC chip U13 is grounded through the third capacitor C56 and connected to the power supply;

[0034] The internal real-time clock power supply end VBAT of the wireless transceiver SOC chip U13 is respectively grounded through the fourth capacitor C59 and connected to the power supply;

[0035] The internal analog part power supply end VDDA of the wireless transceiver SOC chip U13 is respectively grounded through the fifth capacitor C51 and connected to the power supply;

[0036] The second internal digital part power supply end VDD2 of the wireless transceiver SOC chip U13 is grounded through the sixth capacitor C55;

[0037] The feedback end VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 is respectively grounded through the seventh capacitor C49 and connected to the switching end VLXSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 through the third inductor L21;

[0038] The power supply end VDDSMPS of the internal switching power supply of the wireless transceiver SOC chip U13 is grounded through the eighth capacitor C54, and the ninth capacitor C60 is connected in parallel across the eighth capacitor C54;

[0039] The ground end VSSSMPS and the heat dissipation end EXP of the internal switching power supply of the wireless transceiver SOC chip U13 are grounded;

[0040] The power supply end VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 is grounded through the tenth capacitor C57;

[0041] The power supply end VDDRF of the second internal radio frequency part of the wireless transceiver SOC chip U13 is respectively connected to one end of the eleventh capacitor C53 and one end of the twelfth capacitor C50, and connected to the power supply, and the other end of the eleventh capacitor C53 and the other end of the twelfth capacitor C50 are grounded;

[0042] The power supply end VDDPA of the internal radio frequency amplifier of the wireless transceiver SOC chip U13 is respectively grounded through the thirteenth capacitor C61 and the fourteenth capacitor C62, and connected to the power supply end VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 and the feedback end VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip;

[0043] The input end OSC_IN of the external high-speed crystal oscillator of the wireless transceiving SOC chip U13 is connected with the frequency input end 1 of the four-pin passive crystal oscillator X3, the output end OSC_OUT of the external high-speed crystal oscillator of the wireless transceiving SOC chip U13 is connected with the frequency output end 3 of the four-pin passive crystal oscillator X3, and the first ground end 2 and the second ground end 4 of the four-pin passive crystal oscillator X3 are grounded.

[0044] The upgrade configuration end BOOT0 of the wireless transceiving SOC chip U13 is grounded through the sixth resistor R11, and the reset end NRST of the wireless transceiving SOC chip U13 is grounded through the sixteenth capacitor C58.

[0045] The output end VR_PA of the internal radio frequency amplifier power supply of the wireless transceiving SOC chip U13 is respectively grounded through the seventeenth capacitor C43 and the eighteenth capacitor C44, and is connected with one end of the fourth inductor L19 and the fifth inductor L18, the radio frequency signal output end RFO_LP of the wireless transceiving SOC chip U13 is connected with one end of the fifth inductor L18, the other end of the fifth inductor L18 is respectively connected with one end of the nineteenth capacitor C45 and is grounded through the twentieth capacitor C29, the twenty-first capacitor C46 is connected in parallel across the fifth inductor L18, the other end of the nineteenth capacitor C45 is respectively connected with one end of the twenty-second capacitor C47 and is grounded through the twenty-third capacitor C21, and the other end of the twenty-second capacitor C47 is respectively grounded through the seventh inductor L17 and is connected with the negative electrode welding point of the monocrystalline silicon solar panel.

[0046] The utility model has the following beneficial effects:

[0047] 1. The utility model creatively uses the monocrystalline silicon solar panel and the connecting wire as the radiation antenna of the temperature measurement module, thereby providing an open space and better size conditions for the antenna. In this way, the antenna is not shielded by the structure of the temperature measurement device itself, and the radiation performance is significantly improved, and the wireless transmission distance of the module is greatly increased. At the same time, this design realizes the miniaturization of the module while reducing the cost of the independent antenna, thereby achieving an optimized balance in performance and cost.

[0048] 2. The solar panel has dual functions of power supply and signal transmission, fully utilizes renewable energy, and intelligently manages the charge and discharge of the energy storage module (such as overcharge prevention, low voltage protection, etc.) through the control module, thereby ensuring stable operation of the system in insufficient light. BRIEF DESCRIPTION OF DRAWINGS

[0049] Figure 1 The utility model is a system module connection diagram.

[0050] Figure 2The power supply and signal transmitting module, the control module and the energy storage module are connected through the circuit connection diagram.

[0051] Figure 3 The temperature conversion and forwarding module and the temperature acquisition module are connected through the circuit connection diagram. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0053] It should be understood that the step numbers used herein are only for the convenience of description, and are not limited to the execution sequence of the steps.

[0054] It should be understood that the terms used in the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, unless otherwise clear from the context, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0055] The terms "comprise" and "include" indicate the presence of described features, whole, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, whole, steps, operations, elements, components and / or sets thereof.

[0056] The term "and / or" means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0057] Embodiment one:

[0058] In the present embodiment, the model of the second ideal diode chip U11 and the first ideal diode chip U10 is CH213K, the model of the lithium sub battery BAT1 is ER14250, the model of the first MOS tube Q31 and the second MOS tube Q26 is YF3400, the model of the transient voltage suppression diode D6 is SMF60CA, the model of the logic control chip U2 is SLG4AX43713, the model of the negative temperature coefficient thermistor R8 is B3950NTC, the model of the wireless transceiver SOC chip U13 is STM32WLE5C8UTR, and the model of the four-pin passive crystal oscillator X3 is 32MHZ_20ppm

[0059] Figure 1 In the present embodiment, the model of the second ideal diode chip U11 and the first ideal diode chip U10 is CH213K, the model of the lithium sub battery BAT1 is ER14250, the model of the first MOS tube Q31 and the second MOS tube Q26 is YF3400, the model of the transient voltage suppression diode D6 is SMF60CA, the model of the logic control chip U2 is SLG4AX43713, the model of the negative temperature coefficient thermistor R8 is B3950NTC, the model of the wireless transceiver SOC chip U13 is STM32WLE5C8UTR, and the model of the four-pin passive crystal oscillator X3 is 32MHZ_20ppm Figure 2RF is a network name indicating that there is a connection relationship, that is, the other end of the twenty-second capacitor C47 is connected with the negative electrode welding point of the monocrystalline silicon solar panel; VCC is also a network name indicating that the power supply output of the drain D1 of the second MOS tube Q26 is accessed; ADC, NTCctrl and VSMPS are all network names, and the network names with the same network name indicate that there is a connection relationship, BOOT indicates that the upgrade signal is accessed, and RESET indicates that the reset signal is accessed.

[0060] Referring to Figure 1 The utility model provides a wireless temperature measurement system with solar panel as antenna, including power supply and signal emission module, control module, temperature acquisition module, energy storage module and temperature conversion and retransmission module,

[0061] The output end of the temperature acquisition module is connected with the input end of the temperature conversion and retransmission module, and the output end of the temperature conversion and retransmission module is connected with the input end of the power supply and signal emission module, the control module is connected with the power supply and signal emission module and the energy storage module respectively, and the output end of the power supply and signal emission module is connected with the input end of the energy storage module and the input end of the temperature conversion and retransmission module respectively.

[0062] The temperature acquisition module outputs the electric signal to the temperature conversion and retransmission module according to the measured temperature, and the temperature conversion and retransmission module is used to convert the electric signal into temperature result and retransmit to the power supply and signal emission module.

[0063] The monocrystalline silicon solar panel of the power supply and signal emission module is used as radiating antenna to transmit the temperature result to the receiving equipment, and is used to power the energy storage module, the control module and the temperature conversion and retransmission module.

[0064] The energy storage module is used to power the control module and the temperature conversion and retransmission module.

[0065] The control module is used to control whether the energy storage module powers the control module and the temperature conversion and retransmission module, and whether the power supply and signal emission module charges the energy storage module.

[0066] Referring to Figure 2 As a preferred embodiment, the power supply and signal emission module further comprises a transient voltage suppression diode D6, a first MOS tube Q31 and a second ideal diode chip U11.

[0067] The negative electrode welding point J41 of the monocrystalline silicon solar panel is connected with the temperature conversion and retransmission module respectively, and grounded through the first inductor L22.

[0068] The positive electrode welding point J42 of the single crystal silicon solar panel is connected with one end of the second inductor L23, the other end of the second inductor L23 is connected with the positive electrode of the transient voltage suppression diode D6, one end of the first capacitor C35, one end of the first resistor R16 and the input end VIN of the second ideal diode chip U11 respectively, the negative electrode of the transient voltage suppression diode D6 and the other end of the first capacitor C35 are grounded, the ground end GND of the second ideal diode chip U11 is grounded, and the output end VOUT of the second ideal diode chip U11 is connected with the input end of the energy storage module and the input end of the control module respectively;

[0069] The other end of the first resistor R16 is connected with the drain D1 of the first MOS tube Q31, the source S1 of the first MOS tube Q31 is grounded, the gate G1 of the first MOS tube Q31 is grounded through the second resistor R15 and connected with the output end of the control module respectively.

[0070] As a preferred embodiment, the energy storage module comprises a lithium sub-battery BAT1, a super capacitor C34 and a first ideal diode chip U10;

[0071] The negative electrode of the lithium sub-battery BAT1 is grounded, and the positive electrode is connected with the input end VIN of the first ideal diode chip U10, and the ground end GND of the first ideal diode chip is grounded;

[0072] The negative electrode of the super capacitor C34 is grounded, and the positive electrode of the super capacitor C34 is connected with the output end VOUT of the second ideal diode chip U11;

[0073] The output end VOUT of the first ideal diode chip U10 and the positive electrode of the super capacitor C34 are connected with the input end of the control module.

[0074] As a preferred embodiment, the control module comprises a first diode D5, a second MOS tube Q26 and a logic control chip U2;

[0075] The gate G1 of the first MOS tube Q31 is connected with the first output end PIN5 of the logic control chip U2;

[0076] The output end VOUT of the first ideal diode chip U10, the positive electrode of the super capacitor C34 and the output end VOUT of the second ideal diode chip U11 are connected with the power input end VDD of the logic control chip U2, one end of the third resistor R14 and the source S1 of the second MOS tube Q26 through the second capacitor C33 respectively, and the other end of the third resistor R14 and the gate G1 of the second MOS tube Q26 are connected with the second output end PIN12 of the logic control chip U2;

[0077] The drain D1 of the second MOS Q26 is connected with the anode of the first diode D5 and the output power supply respectively, and the cathode of the first diode D5 is connected with the third output PIN13 of the logic control chip U2.

[0078] The ground terminal GND of the logic control chip U2 is grounded.

[0079] The input PIN11 of the logic control chip U2 is connected with the anode of the super capacitor.

[0080] As a preferred embodiment, the temperature acquisition module comprises a negative temperature coefficient thermistor R8.

[0081] One end of the negative temperature coefficient thermistor R8 is grounded, and the other end is connected with one end of the fourth resistor R6 and one end of the fifth resistor R7 respectively.

[0082] The other end of the fourth resistor R6 and the other end of the fifth resistor R7 are connected with the input of the temperature conversion and forwarding module.

[0083] The first output PIN5 of the logic control chip U2 functions to output a high level to control the D-S conduction of the MOS Q31 when the logic control chip U2 detects that the voltage on the super capacitor C34 reaches 3.6V, so as to discharge the current of the solar panel to the GND, preventing overcharging from damaging the subsequent integrated chip.

[0084] The second output PIN12 of the logic control chip U2 functions to output a low level to control the D-S conduction of the MOS Q26 when the logic control chip detects that the voltage on the super capacitor exceeds 3.2V, so as to allow the front super capacitor to supply power to the subsequent circuit; and output a high level to control the D-S cut-off of the MOS Q26 when the logic control chip detects that the voltage on the super capacitor is lower than 2.5V, so as to end the power supply to the subsequent circuit.

[0085] The third output PIN13 of the logic control chip U2 functions to output a low level through the first diode D5 to consume the power of the subsequent circuit as soon as possible when the logic control chip detects that the voltage on the super capacitor is lower than 2.5V. The subsequent circuit comprises the temperature conversion and forwarding module and the temperature acquisition module.

[0086] The input PIN11 of the logic control chip U2 functions to detect the voltage on the super capacitor by the logic control chip. VC is a network name, indicating that it is connected with the anode of the super capacitor.

[0087] Referring to Figure 3 As a preferred embodiment, the temperature conversion and forwarding module comprises a wireless transceiver SOC chip U13.

[0088] The other end of the fifth resistor R7 is connected with the first ADC channel end PB3 of the wireless transceiving SOC chip U13;

[0089] The other end of the fourth resistor R6 is connected with the second ADC channel end PB4 and the common input and output end PB5 of the wireless transceiving SOC chip U13;

[0090] The first internal digital part power supply end VDD1 of the wireless transceiving SOC chip U13 is grounded through the third capacitor C56, and is connected with the power supply;

[0091] The internal real-time clock power supply end VBAT of the wireless transceiving SOC chip U13 is respectively grounded through the fourth capacitor C59, and is connected with the power supply;

[0092] The internal analog part power supply end VDDA of the wireless transceiving SOC chip U13 is respectively grounded through the fifth capacitor C51, and is connected with the power supply;

[0093] The second internal digital part power supply end VDD2 of the wireless transceiving SOC chip U13 is grounded through the sixth capacitor C55;

[0094] The feedback end VFBSMPS of the internal switching power supply of the wireless transceiving SOC chip U13 is respectively grounded through the seventh capacitor C49, and is connected with the switching end VLXSMPS of the internal switching power supply of the wireless transceiving SOC chip U13 through the third inductor L21;

[0095] The power supply end VDDSMPS of the internal switching power supply of the wireless transceiving SOC chip U13 is grounded through the eighth capacitor C54, and the ninth capacitor C60 is connected in parallel with the eighth capacitor C54;

[0096] The ground end VSSSMPS and the heat dissipation end EXP of the internal switching power supply of the wireless transceiving SOC chip U13 are grounded;

[0097] The power supply end VDDRF1V55 of the first internal radio frequency part of the wireless transceiving SOC chip U13 is grounded through the tenth capacitor C57;

[0098] The power supply end VDDRF of the second internal radio frequency part of the wireless transceiving SOC chip U13 is respectively connected with one end of the eleventh capacitor C53 and one end of the twelfth capacitor C50, and is connected with the power supply, and the other end of the eleventh capacitor C53 and the other end of the twelfth capacitor C50 are grounded;

[0099] The power supply end VDDPA of the internal radio frequency amplifier of the wireless transceiver SOC chip U13 is grounded through the thirteenth capacitor C61 and the fourteenth capacitor C62 respectively, and is connected with the power supply end VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip U13 and the feedback end VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip.

[0100] The input end OSC_IN of the external high-speed crystal oscillator of the wireless transceiver SOC chip U13 is connected with the frequency input end 1 of the four-pin passive crystal oscillator X3, the output end OSC_OUT of the external high-speed crystal oscillator of the wireless transceiver SOC chip U13 is connected with the frequency output end 3 of the four-pin passive crystal oscillator X3, and the first ground end 2 and the second ground end 4 of the four-pin passive crystal oscillator X3 are grounded.

[0101] The upgrade configuration end BOOT0 of the wireless transceiver SOC chip U13 is grounded through the sixth resistor R11, and the reset end NRST of the wireless transceiver SOC chip U13 is grounded through the sixteenth capacitor C58.

[0102] The output end VR_PA of the internal radio frequency amplifier power supply of the wireless transceiver SOC chip U13 is grounded through the seventeenth capacitor C43 and the eighteenth capacitor C44 respectively, and is connected with one end of the fifth inductor L18 through the fourth inductor L19, the radio frequency signal output end RFO_LP of the wireless transceiver SOC chip U13 is connected with one end of the fifth inductor L18, the other end of the fifth inductor L18 is connected with one end of the nineteenth capacitor C45 respectively, and is grounded through the twentieth capacitor C29, the twenty-first capacitor C46 is connected in parallel across the fifth inductor L18, the other end of the nineteenth capacitor C45 is connected with one end of the twenty-second capacitor C47 through the sixth inductor L15 respectively, and is grounded through the twenty-third capacitor C21, the other end of the twenty-second capacitor C47 is grounded through the seventh inductor L17 respectively, and is connected with the negative electrode welding point of the monocrystalline silicon solar panel.

[0103] Circuit principle:

[0104] Power supply and signal transmission module:

[0105] Function: Use monocrystalline silicon solar panel as radiation antenna to transmit collected temperature data to receiving equipment, and provide power support for other modules.

[0106] Circuit principle: Solar panel: as the energy source and antenna of the system, its positive and negative electrodes are connected with other modules through specific circuit.

[0107] Transient voltage suppression diode (D6): used to protect the subsequent circuit from static electricity or other transient voltage damage.

[0108] Inductors (L22, L23): Used for filtering and matching impedance, ensuring stability and efficiency of power transmission.

[0109] Capacitors (C35, etc.): Used for energy storage and filtering, smoothing power supply.

[0110] Resistors (R16, etc.): Used for current limiting and voltage division, protecting circuit components.

[0111] Ideal Diode Chip (U11): Used to achieve unidirectional conductivity, preventing reverse current flow.

[0112] MOS Tube (Q31): Under the control of the control module, it realizes the on-off of the circuit and the management of electric energy.

[0113] Control Module:

[0114] Function: Responsible for controlling the charging and discharging process of the energy storage module, preventing overcharging and low voltage protection, ensuring the stable operation of the system under different light conditions.

[0115] Diode (D5): Used to achieve unidirectional conductivity, protecting subsequent circuits.

[0116] MOS Tube (Q26): Under the control of the logic control chip, it realizes the power supply control of the energy storage module to the subsequent circuit.

[0117] Logic Control Chip (U2): According to the preset logic and conditions (such as the voltage level of the energy storage module), it controls the on-off of the MOS tube, realizing intelligent energy management.

[0118] Capacitors (C33, etc.): Used for energy storage and filtering, ensuring the stable operation of the logic control chip.

[0119] Resistors (R14, etc.): Used for current limiting and voltage division, protecting circuit components.

[0120] Temperature Acquisition Module:

[0121] Function: Using negative temperature coefficient thermistor as temperature sensor, converting temperature change into electrical signal output.

[0122] Circuit Principle: Negative Temperature Coefficient Thermistor (R8): Its resistance changes with temperature, thereby converting temperature information into electrical signal.

[0123] Resistors (R6, R7, etc.): Used for voltage division and current limiting, ensuring the stability and measurability of thermistor output signal.

[0124] Energy Storage Module:

[0125] Function: Including lithium sub-battery and super capacitor, used to store the converted electric energy of solar panel, providing continuous and stable power support for the system.

[0126] Circuit principle: lithium sub-battery (BAT1): as a long-term energy storage element, provides stable power output.

[0127] Super capacitor (C34): as a short-term energy storage element, provides instantaneous high-power output to compensate for fluctuations in solar panel output power.

[0128] Ideal diode chip (U10): prevents reverse current of energy storage module, protects battery and capacitor.

[0129] Temperature conversion and forwarding module:

[0130] Function: convert the electrical signal output by the temperature acquisition module into a temperature result and send it to the receiving device through wireless means.

[0131] Circuit principle: wireless transceiver SOC chip (U13): integrates analog-to-digital converter (ADC), processor, radio frequency transmitter, etc. in one, realizes temperature signal acquisition, processing and wireless transmission.

[0132] Capacitor (C56, C59, etc.): used for energy storage and filtering to ensure stable operation of the SOC chip.

[0133] Inductor (L19, L21, etc.): used for impedance matching and filtering to improve radio frequency signal transmission efficiency.

[0134] Four-pin passive crystal oscillator (X3): provides a stable clock signal for the SOC chip.

[0135] In the embodiments of the present application, "at least one" means one or more, and "multiple" means two or more. The association relationship between the associated objects is described as "and / or", which means that there can be three kinds of relationships, for example, A and / or B, which can represent the existence of A alone, the existence of A and B together, and the existence of B alone. Where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it. "At least one of the following" and similar expressions mean any combination of these items, including any combination of single or multiple items. For example, at least one of a, b and c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple.

[0136] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation based on the content of the present application specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A wireless temperature measurement system using a solar panel as an antenna, characterized in that, It includes a power supply and signal transmission module, a control module, a temperature acquisition module, an energy storage module, and a temperature conversion and forwarding module; The output of the temperature acquisition module is connected to the input of the temperature conversion and forwarding module, the output of the temperature conversion and forwarding module is connected to the input of the power supply and signal transmission module, the control module is connected to the power supply and signal transmission module and the energy storage module respectively, and the output of the power supply and signal transmission module is connected to the input of the energy storage module and the input of the temperature conversion and forwarding module respectively. The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module based on the measured temperature. The temperature conversion and forwarding module is used to convert the electrical signal into a temperature result and forward it to the power supply and signal transmission module. The monocrystalline silicon solar panel of the power supply and signal transmission module acts as a radiating antenna to transmit temperature results to the receiving device, and also supplies power to the energy storage module, control module, and temperature conversion and forwarding module. The energy storage module is used to power the control module and the temperature conversion and forwarding module; The control module is used to control the energy storage module to supply power to the control module and the temperature conversion and forwarding module, and to control the power supply and signal transmission module to charge the energy storage module.

2. The wireless temperature measurement system using a solar panel as an antenna according to claim 1, characterized in that, The power supply and signal transmission module also includes a transient voltage suppression diode, a first MOSFET, and a second ideal diode chip; The negative electrode welding point of the monocrystalline silicon solar panel is connected to the temperature conversion and forwarding module, and grounded through the first inductor; The positive electrode welding point of the monocrystalline silicon solar panel is connected to one end of the second inductor. The other end of the second inductor is connected to the positive electrode of the transient voltage suppression diode, one end of the first capacitor, one end of the first resistor, and the input terminal of the second ideal diode chip. The negative electrode of the transient voltage suppression diode and the other end of the first capacitor are grounded. The ground terminal of the second ideal diode chip is grounded. The output terminal of the second ideal diode chip is connected to the input terminal of the energy storage module and the input terminal of the control module. The other end of the first resistor is connected to the drain of the first MOSFET, the source of the first MOSFET is grounded, and the gate of the first MOSFET is grounded through the second resistor and connected to the output of the control module.

3. The wireless temperature measurement system using a solar panel as an antenna according to claim 2, characterized in that, The energy storage module includes a lithium-ion battery, a supercapacitor, and a first ideal diode chip. The negative terminal of the lithium-ion battery is grounded, and the positive terminal is connected to the input terminal of the first ideal diode chip, while the ground terminal of the first ideal diode chip is grounded. The negative terminal of the supercapacitor is grounded, and the positive terminal of the supercapacitor is connected to the output terminal of the second ideal diode chip; The output terminal of the first ideal diode chip and the positive terminal of the supercapacitor are connected to the input terminal of the control module.

4. The wireless temperature measurement system using a solar panel as an antenna according to claim 3, characterized in that, The control module includes a first diode, a second MOSFET, and a logic control chip; The gate of the first MOSFET is connected to the first output terminal of the logic control chip; The output terminal of the first ideal diode chip, the positive terminal of the supercapacitor, and the output terminal of the second ideal diode chip are grounded through the second capacitor, and connected to the power input terminal of the logic control chip, one end of the third resistor, and the source of the second MOS transistor. The other end of the third resistor and the gate of the second MOS transistor are connected to the second output terminal of the logic control chip. The drain of the second MOSFET is connected to the anode of the first diode and the output power supply, respectively, and the cathode of the first diode is connected to the third output terminal of the logic control chip. The grounding terminal of the logic control chip is grounded; The input terminal of the logic control chip is connected to the positive terminal of the supercapacitor.

5. The wireless temperature measurement system using a solar panel as an antenna according to claim 4, characterized in that, The temperature acquisition module includes a negative temperature coefficient thermistor; One end of the negative temperature coefficient thermistor is grounded, and the other end is connected to one end of the fourth resistor and one end of the fifth resistor, respectively. The other ends of the fourth resistor and the fifth resistor are connected to the input of the temperature conversion and forwarding module.

6. The wireless temperature measurement system using a solar panel as an antenna according to claim 5, characterized in that, The temperature conversion and forwarding module includes a wireless transceiver SOC chip; The first ADC channel of the wireless transceiver SOC chip is connected to the other end of the fifth resistor. The second ADC channel and the general input / output terminal of the wireless transceiver SOC chip are connected to the other end of the fourth resistor. The power supply terminal of the first internal digital section of the wireless transceiver SOC chip is grounded through a third capacitor and connected to a power source. The internal real-time clock power supply terminal of the wireless transceiver SOC chip is grounded through the fourth capacitor and connected to the power supply. The internal analog power supply terminals of the wireless transceiver SOC chip are grounded and connected to a power source via a fifth capacitor. The power supply terminal of the second internal digital section of the wireless transceiver SOC chip is grounded through the sixth capacitor. The feedback terminal of the internal switching power supply of the wireless transceiver SOC chip is grounded through the seventh capacitor and connected to the switching terminal of the internal switching power supply of the wireless transceiver SOC chip through the third inductor. The power supply terminal of the internal switching power supply of the wireless transceiver SOC chip is grounded through the eighth capacitor, and the ninth capacitor is connected in parallel across the eighth capacitor. The grounding terminal and heat dissipation terminal of the internal switching power supply of the wireless transceiver SOC chip are grounded; The power supply terminal of the first internal radio frequency section of the wireless transceiver SOC chip is grounded through the tenth capacitor. The power supply terminal of the second internal radio frequency section of the wireless transceiver SOC chip is connected to one end of the eleventh capacitor and one end of the twelfth capacitor, respectively, and connected to the power supply. The other ends of the eleventh capacitor and the other ends of the twelfth capacitor are grounded. The power supply terminals of the internal radio frequency amplifier of the wireless transceiver SOC chip are grounded through the thirteenth and fourteenth capacitors, respectively, and are connected to the power supply terminals of the first internal radio frequency section of the wireless transceiver SOC chip and the feedback terminals of the internal switching power supply of the wireless transceiver SOC chip. The input terminal of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency input terminal of the four-pin passive crystal oscillator, and the output terminal of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency output terminal of the four-pin passive crystal oscillator. The first ground terminal and the second ground terminal of the four-pin passive crystal oscillator are grounded. The upgrade configuration terminal of the wireless transceiver SOC chip is grounded through the sixth resistor, and the reset terminal of the wireless transceiver SOC chip is grounded through the sixteenth capacitor. The output terminals of the internal RF amplifier power supply of the wireless transceiver SOC chip are grounded through the seventeenth capacitor and the eighteenth capacitor, respectively, and connected to one end of the fifth inductor through the fourth inductor. The RF signal output terminal of the wireless transceiver SOC chip is connected to one end of the fifth inductor. The other end of the fifth inductor is connected to one end of the nineteenth capacitor and grounded through the twentieth capacitor. The twenty-first capacitor is connected in parallel across the two ends of the fifth inductor. The other end of the nineteenth capacitor is connected to one end of the twenty-second capacitor through the sixth inductor and grounded through the twenty-third capacitor. The other end of the twenty-second capacitor is grounded through the seventh inductor and connected to the negative electrode solder point of the monocrystalline silicon solar panel.

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