Binding test device of display panel and display device

Abstract

The utility model provides a binding test device of a display panel and a display device.The binding test device of the display panel comprises a test pin, the test pin is provided with a first end and a second end which are oppositely arranged, the first end is provided with at least three metal bonding pads, and the second end is provided with at least three metal bonding pads; each metal bonding pad extends from the first end to the second end to form three corresponding test bonding pads, the metal bonding pads are used for being connected with integrated circuit bonding pads or flexible circuit board bonding pads, and the test bonding pads are used for being connected with a resistance tester. Compared with the prior art that two test pins are needed for testing the integrated circuit bonding pad or the flexible circuit board bonding pad, the binding test device has the advantages that one test pin is reduced, meanwhile, the occupied area of the corresponding metal bonding pad is reduced, and therefore the overall layout of the display panel can be facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display panel testing, in particular to a display panel binding test device and a display device. BACKGROUND

[0002] Display panels are components used to display images and text in electronic devices, typically consisting of three major parts: display units, glass substrates, and driving circuits. Display panels are widely used in television, computer monitors, mobile phones, tablets, e-readers, automotive displays, and other fields. They are important infrastructure in daily life and modern electronic information industries. With the development of technology, display panels have also been applied to emerging fields such as wearable devices, smart homes, medical devices, and have promoted the development of related industries.

[0003] In display panels, ICs are often bonded through devices (COG technology, i.e., chip on glass) and FPCs are often bonded through devices (FOG technology, i.e., FPC on glass). However, it is often found that the bonding contact between the bonded object and the bonded object is poor after bonding ICs or FPCs, so it is necessary to test the resistance to determine whether the bonding is qualified. If the bonding resistance is too large, it will cause the signal transmission to be lost, resulting in poor display of the display panel.

[0004] In addition, common COG and FOG bonding resistance tests are placed separately, i.e., COG bonding resistance is a separate test pin test pad loop, and FOG bonding resistance test is another test pin test pad loop. Relatively speaking, it occupies more pad area, affecting the overall layout of the display panel.

[0005] Therefore, it is a technical problem for those skilled in the art to provide a display panel binding test device that provides a display panel layout. Content of the utility model

[0006] The present application provides a display panel binding test device and a display device.

[0007] This application provides a bonding test device for a display panel, including test pins. Each test pin has a first end and a second end arranged opposite to each other. The first end has at least three metal pads, each metal pad extending from the first end to the second end with three corresponding test pads. The metal pads are used to connect to integrated circuit pads or flexible circuit board pads, and the test pads are used to connect to a resistance tester. In some embodiments, bonding adhesive is also included, and the metal pads are connected to the integrated circuit pads or flexible circuit board pads via the bonding adhesive. In some embodiments, the metal pads and the test pads are connected via metal test leads. In some embodiments, the metal pads are divided into a first metal pad, a second metal pad, and a third metal pad arranged sequentially, with the first metal pad, the second metal pad, and the third metal pad corresponding to the first test pad, the second test pad, and the third test pad, respectively. In some embodiments, the first metal pad, the second metal pad, and the third metal pad are equidistant. In some embodiments, the second test pad has two sub-test pads. In some embodiments, the two sub-test pads are arranged side-by-side. In some embodiments, the metal test lines include a first test line, a second test line, and a third test line. The first metal pad is connected to the first test pad via the first test line, the second metal pad is connected to the first test pad via the second test line, and the third metal pad is connected to the first test pad via the third test line. The first, second, and third test lines are arranged in parallel. In some embodiments, the bonding adhesive is made of any one of polyvinyl alcohol, polyvinyl acetate, epoxy resin, and phenolic resin. Another embodiment of this application also provides a display device that uses the bonding test device for the display panel as described in the above embodiments for bonding testing.

[0008] This application provides a bonding test device for a display panel, including a test pin with a first end and a second end arranged opposite to each other. The first end has at least three metal pads, each metal pad extending from the first end to the second end with three corresponding test pads. The metal pads are used to connect to integrated circuit pads or flexible circuit board pads, and the test pads are used to connect to a resistance tester. Using this display panel bonding test device, the connection between the three metal pads and the integrated circuit pads or flexible circuit board pads is tested using one test pin. Then, the bonding test is performed by testing the resistance of the three test pads to determine whether the display panel is good. Compared to the prior art which requires two test pins to test integrated circuit pads or flexible circuit board pads, this reduces one test pin and the corresponding metal pad area, thus facilitating the overall layout of the display panel. Attached Figure Description

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings needed to be used in the description of the embodiments will be briefly introduced. Obviously, the accompanying drawings in the following description only represent some of the embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0010] Figure 1 A structure schematic diagram of a binding test device of a display panel is provided for the embodiments of the present application.

[0011] Figure 2 A structure schematic diagram of a test pin is provided for the embodiments of the present application.

[0012] Figure 3 A side schematic diagram of a binding test device of a display panel is provided for the embodiments of the present application.

[0013] Figure 4 A structure schematic diagram of a display device is provided for the embodiments of the present application. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without any creative effort under the premise that the embodiments of the present application are within the scope of protection of the present application.

[0015] In the description of the present application, it should be understood that the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise” and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms “first” and “second” are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by “first” and “second” can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of “multiple” is two or more, unless otherwise specifically limited.

[0016] In the description of the application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0017] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0018] The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the application, the components and arrangements of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the application. In addition, the application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0019] The embodiment of the application provides a display panel binding test device and a display device.

[0020] Please refer to Figures 1 to 3 The embodiment of the application provides a display panel binding test device 100, which comprises a test pin 10, the test pin 10 has a first end 10a and a second end 10b arranged oppositely, the first end 10a has at least three metal pads 11, each metal pad extends out a corresponding three test pads 12 from the first end 10a to the second end 10b, the metal pad 11 is used for being connected with an integrated circuit pad 20 or a flexible circuit board pad 30, and the test pad 12 is used for being connected with a resistance tester.

[0021] Specifically, in actual use, after the display panel is bound with the IC or the FPC, it is necessary to ensure that the binding contact is good, that is, the binding resistance should not be too large, otherwise it will cause signal transmission loss and affect the display effect. The common COG and FOG binding resistance test needs to be connected with a test pin 10 to test, which occupies a large pad area and affects the layout of the display panel. The test device of the present application can test the IC or the FPC with only one test pin 10. The structure of the test pin 10 is that the first end 10a of the test pin 10 has at least three metal pads 11, each of which extends out three corresponding test pads 12 from the first end 10a to the second end 10b. The metal pads 11 are used to connect with the integrated circuit pads 20 or the flexible circuit board pads 30, and the test pads 12 are used to connect with the resistance tester. This design not only ensures the resistance test of the binding contact, but also reduces the occupied area of the pad and optimizes the layout of the display panel.

[0022] Through this design, the display panel binding test device 100 of the present application can effectively solve the problem of poor contact after binding the IC or the FPC, ensure the accuracy of the resistance test, and thus ensure the display effect of the display panel. At the same time, by reducing the occupied area of the pad, the overall layout of the display panel is optimized. As can be seen, the display panel binding test device 100 of the present application optimizes the layout of the display panel while solving the problem of poor binding contact through reasonable structural design, which has significant technical advantages and innovative points.

[0023] Further, the display panel binding test device 100 of the present application further comprises a binding glue 40, and the metal pads are connected with the integrated circuit pads 20 or the flexible circuit board pads 30 through the binding glue 40.

[0024] In the display panel, binding IC and binding FPC often cause display problems due to poor binding contact. In order to detect the reliability of the binding, resistance test is needed. The binding test device of the present application sets the binding glue 40, so that the metal pads 11 can be more stably connected with the integrated circuit pads 20 or the flexible circuit board pads 30, thereby improving the reliability of the binding.

[0025] The use of the binding glue 40 can effectively enhance the connection strength between the metal pads 11 and the integrated circuit pads 20 or the flexible circuit board pads 30, avoiding the problem of excessive resistance caused by poor contact in the traditional binding method. The material of the binding glue 40 can be any one of polyvinyl alcohol, polyvinyl acetate, epoxy resin, and phenolic resin. These materials have good adhesion and stability, which can ensure the reliability and durability of the connection.

[0026] The binding test device of the present application improves the stability of the binding connection by adding the binding glue 40.

[0027] Further, the present application also proposes that the metal pad 11 is connected with the test pad 12 through the metal test line 13.

[0028] Specifically, the metal pad 11 is connected with the test pad 12 through the metal test line 13, which can be implemented in various ways, for example, the metal test line 13 can be a copper wire or an aluminum wire, which has good electrical conductivity and mechanical strength. In addition, the arrangement of the metal test line 13 can also be adjusted according to specific needs, for example, parallel arrangement or cross arrangement can be used to adapt to different display panel layout requirements.

[0029] The technical solution of the present application, through the connection between the metal pad 11 and the test pad 12 through the metal test line 13, not only can realize the resistance test of the binding situation, but also can optimize the overall layout of the display panel, improve the integration and reliability of the display panel. Compared with the prior art, the technical solution of the present application has significant advantages in display panel layout and binding test.

[0030] Further, the first end 10a is divided into a first metal pad 111, a second metal pad 112 and a third metal pad 113 arranged in sequence, and the first metal pad 111, the second metal pad 112 and the third metal pad 113 correspond to the first test pad, the second test pad 122 and the third test pad 123 respectively.

[0031] Specifically, the first metal pad 111, the second metal pad 112 and the third metal pad 113 are arranged in sequence and correspond to the first test pad, the second test pad 122 and the third test pad 123 respectively. This arrangement makes each sub-metal pad can be tested independently, avoiding the interference phenomenon that may occur in the test process.

[0032] For example, in actual application, each sub-metal pad can be connected to the corresponding test pad through the metal test line 13. In this way, different test pads can independently detect the resistance value of each sub-metal pad, so as to judge the quality of the binding. As a preferred embodiment, the first test line 131, the second test line 132 and the third test line 133 arranged in parallel can be used to connect the corresponding metal pad and test pad, further improving the stability and reliability of the test.

[0033] Therefore, the technical solution of the present application not only simplifies the layout of the display panel, but also improves the accuracy and efficiency of the test.

[0034] Further, the first metal pad 111, the second metal pad 112 and the third metal pad 113 are equidistantly arranged.

[0035] Specifically, the equidistant arrangement of the first metal pad 111, the second metal pad 112 and the third metal pad 113 can ensure that the distances between the test points are consistent during resistance testing, thereby improving the accuracy and consistency of the test results. This equidistant arrangement can effectively avoid test errors caused by uneven distances and ensure the reliability of the binding test device in actual application.

[0036] Therefore, by equidistantly arranging the first metal pad 111, the second metal pad 112 and the third metal pad 113, the present application solves the problem of inaccurate test results caused by uneven distances in the prior art, and provides a more accurate and reliable display panel binding test device. Compared with the prior art, the technical solution of the present application has significant advantages in improving test accuracy and consistency.

[0037] Further, the second test pad 122 has two sub-test pads.

[0038] In the display panel binding test device, the second test pad 122 has two sub-test pads. This technical solution aims to solve the problem of a large number of test pads and complex layout in display panel binding testing. By designing the second test pad 122 to have two sub-test pads, the total number of test pads can be reduced, thereby optimizing the overall layout of the display panel.

[0039] The present application separates the binding resistance (Z) by defining and measuring a specific resistance value and using mathematical calculation to achieve accurate measurement. The specific steps are as follows: first, divide the test pins into five equal parts, and finally leave only the first metal pad 111, the second metal pad 112 and the third metal pad 113. The first metal pad 111, the second metal pad 112 and the third metal pad 113 correspond to the first test pad, the second test pad 122 and the third test pad 123, respectively. The second test pad 122 has two sub-test pads.

[0040] 1. Define resistance parameters: X: wiring resistance connecting test pads. Y: one-fifth of the test pin resistance. Z: one-fifth of the binding resistance. 5Z: total binding resistance (i.e. total resistance of five test pads).

[0041] 2. Test step: Test 1: measure the resistance between the first test pad and the lower one of the two sub-test pads, and get a value A. The resistance value at this time includes: two test line resistances, two test pin resistances, and three binding resistances. The mathematical expression is: 2X + 2Y + 3Z = A……① Test 2: measure the resistance between the uppermost and lowermost test pads, and get a value B. The resistance value at this time includes: two test line resistances, two test pin resistances, and five binding resistances. The mathematical expression is: 2X + 2Y + 5Z = B……②

[0042] 3. Calculate the binding resistance: by solving the above two equations, the test line resistance (X) and PIN resistance (Y) can be eliminated, and the binding resistance (Z) is obtained: ② - ①: (2X + 2Y + 5Z) - (2X + 2Y + 3Z) = B - A; After simplification, we get: 2Z = B - A; Therefore: Z = (B - A) / 2. Thus the binding resistance is calculated.

[0043] Further, the application also proposes that the two sub-test pads are arranged side by side.

[0044] Specifically, by arranging the two sub-test pads side by side, the occupied area of the test pad can be reduced, thereby saving space and improving the overall layout efficiency of the display panel.

[0045] Further, the metal test line 13 includes a first test line 131, a second test line 132, and a third test line 133, the first metal pad 111 is connected to the first test pad 121 through the first test line 131, the second metal pad 112 is connected to the first test pad 121 through the second test line 132, and the third metal pad 113 is connected to the first test pad 121 through the third test line 133, and the first test line 131, the second test line 132, and the third test line 133 are arranged in parallel. In this way, each sub-metal pad 11 can be independently tested for resistance, thereby improving the accuracy and reliability of the test.

[0046] Further, the application also proposes that the binding glue 40 is made of any one of polyvinyl alcohol, polyvinyl acetate, epoxy resin, and phenolic resin.

[0047] Specifically, polyvinyl alcohol has good bonding performance and chemical stability, and can provide strong binding effect. Polyvinyl acetate has excellent adhesion and durability, and is suitable for long-term use. Epoxy resin is known for its high strength and corrosion resistance, and can maintain good binding effect in harsh environments. Phenolic resin is excellent in heat resistance and mechanical strength, and is suitable for binding in high temperature environment.

[0048] By using these materials as the binding glue 40, the problem of poor performance of the traditional binding glue 40 in different environments can be effectively solved, thereby improving the overall performance and reliability of the display panel binding test device. In this way, the present application provides a more reliable and stable display panel binding test device 100, which ensures the high-quality display effect of the display panel. Please refer to Figure 4 The display device 1000 provided by another embodiment of the present application is tested by using the display panel binding test device described in the above embodiments. Since the display panel binding test device 100 has been described in detail in the above embodiments, the display panel binding test device 100 in the above embodiments will not be described in detail in the present embodiment.

[0049] The display panel binding test device and the display device provided by the embodiments of the present application are described in detail above, and the specific examples are applied to explain the principles and implementation modes of the present application. The above embodiments are only used to help understand the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the content of the present description should not be understood as a limitation of the present application.

Claims

1. A bonding test device for a display panel, characterized in that, include: The test pin has a first end and a second end that are set opposite to each other. The first end has at least three metal pads, and each metal pad extends from the first end to the second end to give three corresponding test pads. The metal pads are used to connect to integrated circuit pads or flexible circuit board pads, and the test pads are used to connect to a resistance tester.

2. The bonding test device for the display panel according to claim 1, characterized in that, It also includes bonding adhesive, through which the metal pads are connected to the integrated circuit pads or the flexible circuit board pads.

3. The bonding test device for the display panel according to claim 1, characterized in that, The metal pads and the test pads are connected by metal test leads.

4. The bonding test device for the display panel according to claim 3, characterized in that, The first end is divided into a first metal pad, a second metal pad, and a third metal pad arranged sequentially. The first metal pad, the second metal pad, and the third metal pad correspond to the first test pad, the second test pad, and the third test pad, respectively.

5. The bonding test apparatus for a display panel according to claim 4, characterized in that, The first metal pad, the second metal pad, and the third metal pad are equidistant.

6. The bonding test apparatus for a display panel according to claim 4, characterized in that, The second test pad has two sub-test pads.

7. The bonding test apparatus for a display panel according to claim 6, characterized in that, The two sub-test pads are arranged side by side.

8. The bonding test apparatus for a display panel according to claim 4, characterized in that, The metal test lines include a first test line, a second test line, and a third test line. The first metal pad is connected to the first test pad via the first test line, the second metal pad is connected to the first test pad via the second test line, and the third metal pad is connected to the first test pad via the third test line. The first test line, the second test line, and the third test line are arranged in parallel.

9. The bonding test apparatus for a display panel according to claim 2, characterized in that, The adhesive used is made of any one of polyvinyl alcohol, polyvinyl acetate, epoxy resin, or phenolic resin.

10. A display device, characterized in that, The bonding test is performed using the bonding test apparatus for the display panel as described in any one of claims 1 to 9.

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