Electronic atomization device

Abstract

The utility model relates to the technical field of electronic atomization, in particular to an electronic atomization device which comprises a shell assembly, a first atomization assembly, a second atomization assembly, a support assembly and a control circuit board, the first atomization assembly comprises a first atomization shell and a first atomization core, and a first atomization channel is formed in the first atomization shell; the first atomizing core is provided with a first conductive pin; the second atomization assembly comprises a second atomization shell and a second atomization core, a second atomization channel is formed in the second atomization shell, and the second atomization core is provided with a second conductive pin; the support assembly is provided with an electrode hole and an air inlet channel, and the air inlet channel is communicated with the first atomization channel and the second atomization channel. A first electrode of the control circuit board penetrates through the electrode hole and then is electrically connected with the first conductive pin, and a second electrode of the control circuit board penetrates through the electrode hole and then is electrically connected with the second conductive pin. As the electrode penetrates through the support assembly and is electrically connected with the conductive pin, the risk of air leakage does not exist, the aerosol quality of the electronic atomization device is improved, and the service life of the electronic atomization device is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic atomization, and more particularly to an electronic atomization device. BACKGROUND

[0002] The electronic atomization device can heat an atomization substrate to generate aerosol. In order to improve the taste of the aerosol, multiple atomization assemblies are provided in the electronic atomization device, at least one of which has an auxiliary atomization substrate with ice degree (or cool feeling) or sweetness, so as to increase the ice degree or sweetness of the aerosol. However, the increase of the atomization assemblies leads to the increase of the lead wire. In the conventional electronic atomization device, the lead wire is connected to the control circuit board after passing through the support of the control circuit board. Since the support is also a part of the air passage of the electronic atomization device, the perforation of the lead wire on the support increases the risk of air leakage, which affects the normal use of the electronic atomization device and causes problems such as poor quality of the aerosol and short service life of the electronic atomization device. CONTENT OF THE UTILITY MODEL

[0003] The present application provides an electronic atomization device which can avoid the risk of air leakage caused by the perforation of the lead wire and improve the service life of the electronic atomization device and the quality of the aerosol.

[0004] The present application provides an electronic atomization device, which comprises a shell assembly, a first atomization assembly, a second atomization assembly, a support assembly and a control circuit board. The first atomization assembly comprises a first atomization shell and a first atomization core. The first atomization shell is provided with a first atomization passage. The first atomization core is arranged in the first atomization passage and has a first conductive pin. The second atomization assembly and the first atomization assembly are arranged side by side in the shell assembly along a first direction. The second atomization assembly comprises a second atomization shell and a second atomization core. The second atomization shell is provided with a second atomization passage. The second atomization core is arranged in the second atomization passage and has a second conductive pin. The support assembly is arranged in the shell assembly and is arranged on a side of the second atomization shell away from the first atomization shell. The support assembly is provided with an electrode hole and an air inlet passage for air inlet. The air inlet passage is in communication with the first atomization passage and the second atomization passage. The control circuit board is arranged in the shell assembly and is arranged on a side of the support assembly away from the second atomization shell. The control circuit board is provided with at least a first electrode and a second electrode. The first electrode is electrically connected to the first conductive pin after passing through the electrode hole. The second electrode is electrically connected to the second conductive pin after passing through the electrode hole.

[0005] In some optional embodiments, the electronic atomization device further comprises a first sealing member arranged between the second atomization housing and the support assembly to seal the opening of the second atomization housing, the first sealing member is provided with a first lead hole and a second lead hole, the first electrode is arranged in the first lead hole after passing through the electrode hole, and the first conductive pin is arranged in the first lead hole and electrically connected with the first electrode; the second electrode is arranged in the second lead hole after passing through the electrode hole, and the second conductive pin is arranged in the second lead hole and electrically connected with the second electrode.

[0006] In some optional embodiments, the first sealing member comprises a connecting portion and a sealing portion, the sealing portion is arranged at the opening of the second atomization housing away from the first atomization housing, one end of the connecting portion is connected with the sealing portion, and the other end extends to the opening of the second atomization housing close to the first atomization housing along the first direction; a lead channel is arranged in the connecting portion along the first direction, the first lead hole and the second lead hole are arranged in the sealing portion, the second lead hole is in communication with the second atomization channel, the first lead hole is in communication with the lead channel, and the first conductive pin is arranged in the first lead hole after passing through the lead channel.

[0007] In some optional embodiments, the first lead hole comprises a first through hole and a first accommodating groove in communication, and the second lead hole comprises a second through hole and a second accommodating groove in communication, the first through hole and the second through hole pass through the sealing portion along the first direction, and the first accommodating groove and the second accommodating groove are arranged on the side of the sealing portion facing the support assembly.

[0008] In some optional embodiments, the first lead hole further comprises a first blind hole, and the second lead hole further comprises a second blind hole, the first blind hole and the second blind hole are arranged on the side of the first sealing member facing the support assembly, the first blind hole is in communication with the first accommodating groove, the first conductive pin is arranged in the first blind hole after being bent through the first accommodating groove, and the first electrode is arranged in the first blind hole after passing through the electrode hole; the second blind hole is in communication with the second accommodating groove, the second conductive pin is arranged in the second blind hole after being bent through the second accommodating groove, and the second electrode is arranged in the second blind hole after passing through the electrode hole.

[0009] In some optional embodiments, the connecting portion and the sealing portion are integrally formed of a silica gel material.

[0010] In some optional embodiments, the electronic atomization device further comprises a second sealing member arranged between the first atomization housing and the second atomization housing for sealing and isolating the first atomization housing and the second atomization housing; the second sealing member is provided with a third lead hole, and the third lead hole is in communication with the first atomization channel and the lead channel.

[0011] In some optional embodiments, the electrode hole penetrates through the support assembly along the first direction, and the electrode is in interference fit with the electrode hole.

[0012] In some optional embodiments, the electronic atomization device further comprises a battery arranged in the housing assembly and arranged side by side with the second atomization assembly along a second direction, and the first direction and the second direction are perpendicular to each other.

[0013] In some optional embodiments, the electronic atomization device further comprises a bottom cover assembly arranged on the side of the support assembly away from the second atomization housing and connected with the housing assembly for sealing the opening of the housing assembly, and the bottom cover assembly is provided with an air inlet hole and an adjusting member, the air inlet hole is in communication with the air inlet channel, and the adjusting member is arranged on the air inlet hole for adjusting the size of the air inlet hole.

[0014] According to the electronic atomization device in the embodiment, the electronic atomization device comprises a housing assembly, a first atomization assembly, a second atomization assembly, a support assembly and a control circuit board, the first atomization assembly and the second atomization assembly are arranged on the same side of the support assembly, the control circuit board is arranged on the other side of the support assembly, the electrode on the control circuit board is electrically connected with the conductive pins of the first atomization assembly and the second atomization assembly after penetrating through the support assembly, the first atomization housing is provided with a first atomization channel, the second atomization housing is provided with a second atomization channel, and the support assembly is provided with an air inlet channel in communication with the first atomization channel and the second atomization channel. Since the electrode is electrically connected with the conductive pins after penetrating through the support assembly, a relatively sealed structure is formed between the support assembly and the second atomization housing, so that there is no risk of air leakage caused by the lead-through hole in the entire air inlet path, and the aerosol quality and service life of the electronic atomization device are improved. At the same time, the punching and glue sealing operations on the support assembly are saved, the production and assembly operations are simplified, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structure explosion diagram of the electronic atomization device in an embodiment;

[0016] Figure 2 It is a structure cross-sectional view of the electronic atomization device in an embodiment;

[0017] Figure 3FIG. 1 is a structural schematic view of a bracket assembly in an embodiment;

[0018] Figure 4 FIG. 2 is a structural schematic view of a control circuit board in an embodiment;

[0019] Figure 5 FIG. 3 is a structural sectional view of a first sealing member in an embodiment;

[0020] Figure 6 FIG. 4 is a structural sectional view of a first sealing member in an embodiment;

[0021] Figure 7 FIG. 5 is a structural schematic view of a first sealing member in another embodiment;

[0022] Figure 8 FIG. 6 is a structural schematic view of a second sealing member in an embodiment;

[0023] Figure 9 FIG. 7 is a structural schematic view of a bottom cover assembly in an embodiment.

[0024] 100, housing assembly; 200, first atomization assembly; 210, first atomization housing; 211, first storage cavity; 212, first atomization channel; 220, first atomization core; 221, first conductive pin; 222, first heating body; 223, first liquid guide; 300, second atomization assembly; 310, second atomization housing; 311, second storage cavity; 312, second atomization channel; 320, second atomization core; 321, second conductive pin; 322, second heating body; 323, second liquid guide; 400, bracket assembly; 410, electrode hole; 420, air inlet channel; 500, control circuit board; 510, first electrode; 520, second electrode; 600, first sealing member; 610, connecting portion; 611, lead channel; 620, sealing portion; 621, first lead hole; 6211, first through hole; 6212, first accommodating groove; 6213, first blind hole; 622, second lead hole; 6221, second through hole; 6222, second accommodating groove; 6223, second blind hole; 700, second sealing member; 710, third lead hole; 800, battery; 900, bottom cover assembly; 910, air inlet hole; 920, adjusting member; Y, first direction; X, second direction. DETAILED DESCRIPTION

[0025] The application will be described in further detail below with reference to the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, those of skill in the art will recognize that the application can be practiced without these specific details. In other instances, well-known structures have not been described in detail to avoid unnecessarily obscuring the application. In addition, some of the descriptions that follow can constitute examples of the application and are intended to provide a general understanding of the application. The application will be more fully understood and appreciated by referring to the detailed description in conjunction with the following figures.

[0026] In addition, the features, operations, or steps described in the specification can be combined in any suitable manner without departing from the scope of the application. The steps of the various embodiments described in the specification can be performed in any suitable order without departing from the scope of the application. Thus, the specification and the accompanying drawings are not intended to limit the application to the particular embodiments described. The scope of the application is defined by the appended claims.

[0027] The serial numbers of components used herein, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequential or technical meaning. The "connection" and "coupling" in the application, unless otherwise specified, include direct and indirect connections (couplings).

[0028] Before the technical solutions of the application are described in detail, some terms related to the application are introduced.

[0029] An aerosol refers to a dispersion of solid or liquid particles in a gas. As used herein, "aerosol" can be used to refer to a substance that has been vaporized, atomized, in the form of a spray or jet, or otherwise converted from a solid or liquid form to an inhalable form comprising suspended solid or liquid drug particles.

[0030] As used herein, the term "atomized substrate" refers to any suitable compound or mixture of compounds that facilitates aerosol formation in use, e.g., a stable aerosol that is substantially resistant to thermal degradation at the operating temperature of the system. Suitable atomized substrates are well known in the art and include, but are not limited to: polyhydric alcohols such as triethylene glycol, 1,3-butanediol, and glycerol; esters of polyhydric alcohols such as glycerol mono-, di-, or triacetate; and aliphatic esters of mono-, di-, or polybasic carboxylic acids such as dimethyl dodecanedioate and dimethyl tetradecanedioate. The atomized substrate can include nicotine. The atomized substrate can include water. The atomized substrate can include glycerol (also known as glycerin), which has a higher boiling point than nicotine. The atomized substrate can include propylene glycol. The atomized substrate can include plant-based material. The atomized substrate can include a homogenized plant-based substrate material. The homogenized plant-based substrate material can contain volatile compounds. These compounds can be released from the atomized substrate upon heating. The atomized substrate is generally stored directly in the container or through a wicking medium (such as wicking cotton or porous ceramic) by being in a liquid form.

[0031] The atomized substrate includes a base atomized substrate, i.e., an atomized substrate that generates an aerosol that meets the basic needs of a user, and an auxiliary atomized substrate. The auxiliary atomized substrate is a functional atomized substrate that can increase the cooling degree (e.g., a mint flavor, a green tea flavor) or the sweetness (e.g., a fruit flavor, a candy flavor), and the like, and can increase the cooling degree or the sweetness of the aerosol generated by the base atomized substrate when mixed with the base atomized substrate.

[0032] The present application provides an electronic atomization device that can heat the atomized substrate to generate an aerosol.

[0033] Please refer to Figures 1 to 9 , the electronic atomization device includes a shell assembly 100, a first atomization assembly 200, a second atomization assembly 300, a support assembly 400, and a control circuit board 500. The shell assembly 100 can be understood as a collection of multiple structural components. The first atomization assembly 200, the second atomization assembly 300, the support assembly 400, and the control circuit board 500 are all arranged in the shell assembly 100, which not only facilitates the integration and portability of the electronic atomization device, but also facilitates the protection of the first atomization assembly 200, the second atomization assembly 300, the support assembly 400, and the control circuit board 500. The first atomization assembly 200 and the second atomization assembly 300 can both heat and atomize the atomized substrate into an aerosol. The first atomization assembly 200 is used to heat the base atomized substrate, and the second atomization assembly 300 is used to heat the auxiliary atomized substrate. The support assembly 400 is used to fix the control circuit board 500, the first atomization assembly 200, and the second atomization assembly 300, so as to avoid their shaking during transportation and use, and to affect the normal use of the electronic atomization device.

[0034] The first atomization assembly 200 comprises a first atomization shell 210 and a first atomization core 220. The first atomization shell 210 is internally provided with a first storage cavity 211 and a first atomization channel 212. The basic atomization substrate is stored in the first storage cavity 211. The first atomization core 220 is arranged in the first atomization channel 212. The first atomization channel 212 is provided with a first liquid inlet channel (not shown in the figure) communicating with the first storage cavity 211, so that the basic atomization substrate can flow from the first storage cavity 211 to the first atomization core 220. The first atomization core 220 has a first conductive pin 221, a first heating body 222 and a first liquid guide 223. The basic atomization substrate can flow into the first liquid guide 223. The first heating body 222 is in contact with the first liquid guide 223 to heat the basic atomization substrate to generate aerosol. One end of the first conductive pin 221 is connected with the first heating body 222, and the other end can be electrically connected with the control circuit board 500 to realize the control of the working state of the first heating body 222 through the control circuit board 500. The first atomization shell 210 is arranged to integrally arrange the constituent parts of the first atomization assembly 200, so that the first atomization assembly 200 can be transported, maintained or replaced separately.

[0035] The second atomization assembly 300 and the first atomization assembly 200 are arranged side by side in the first direction Y in the shell assembly 100, and are used to adjust the ice degree or sweetness of the entire electronic atomization device. The second atomization assembly 300 and the first atomization assembly 200 have the same structure, comprising a second atomization shell 310 and a second atomization core 320. The second atomization shell 310 is internally provided with a second storage cavity 311 and a second atomization channel 312. The auxiliary atomization substrate is stored in the second storage cavity 311. The second atomization core 320 is arranged in the second atomization channel 312. The second atomization core 320 has a second conductive pin 321, a second heating body 322 and a second liquid guide 323. The auxiliary atomization substrate can flow into the second liquid guide 323. The second heating body 322 is in contact with the second liquid guide 323 to heat the auxiliary atomization substrate to generate aerosol with adjustable ice degree or flavor. One end of the second conductive pin 321 is connected with the second heating body 322, and the other end can be electrically connected with the control circuit board 500 to realize the control of the working state of the second heating body 322 through the control circuit board 500. The second atomization shell 310 is arranged to integrally arrange the constituent parts of the second atomization assembly 300, so that the second atomization assembly 300 can be transported, maintained or replaced separately.

[0036] The bracket assembly 400 can also be understood as a collection of a plurality of structural components, which is mainly used to fix the control circuit board 500 and the second atomization assembly 300 and the first atomization assembly 200, and is arranged in the shell assembly 100 and is arranged on the side of the second atomization shell 310 away from the first atomization shell 210, and can serve as a partition structure of the internal space of the shell assembly 100, and divides the internal space of the shell assembly 100 into a first cavity and a second cavity, the first cavity is used to assemble the first atomization assembly 200 and the second atomization assembly 300, and the first atomization assembly 200 and the second atomization assembly 300 are arranged in order from far to near with respect to the bracket assembly 400, and the second cavity is used to assemble the control circuit board 500, and the bracket assembly 400 is provided with an electrode hole 410 and an air inlet passage 420 for air inlet, the air inlet passage 420 is in communication with the first atomization passage 212 and the second atomization passage 312, and when a user inhales, external air can enter the first atomization passage 212 and the second atomization passage 312 along the air inlet passage 420, which can balance the internal and external air pressures of the first storage cavity 211 and the second storage cavity 311, ensure smooth flow of the atomization base, and generate uniform aerosol, and can also carry aerosol and finally discharge to the outside of the electronic atomization device for use by the user.

[0037] The control circuit board 500 is arranged in the shell assembly 100 and is arranged on the side of the bracket assembly 400 away from the second atomization shell 310, and the control circuit board 500 is provided with at least a first electrode 510 and a second electrode 520, the first electrode 510 is electrically connected with the first conductive pin 221 after penetrating through the electrode hole 410, and the second electrode 520 is electrically connected with the second conductive pin 321 after penetrating through the electrode hole 410, which also realizes separate control of the first atomization assembly 200 and the second atomization assembly 300.

[0038] In the above embodiment, the first atomization assembly 200 is arranged closer to the user, that is, the basic atomization base is arranged closer to the user, and the auxiliary atomization base is arranged away from the user, which can make the aerosol generated by the auxiliary atomization base fully and uniformly mixed with the aerosol generated by the basic atomization base. Of course, in some embodiments, the positions of the first atomization assembly 200 and the second atomization assembly 300 can also be exchanged, that is, the auxiliary atomization base is arranged closer to the user end.

[0039] The first conductive pin 221 and the second conductive pin 321 are arranged on the side of the support assembly 400 close to the second atomization shell 310 after being led out from the corresponding heat-generating bodies. Compared with the conventional mode in which the first conductive pin 221 and the second conductive pin 321 pass through the support assembly 400 and the control circuit board 500 for connection, the application directly saves the punching operation and avoids the subsequent operation of sealing the punching hole with glue, thereby simplifying the production and assembly operation, helping to improve the production efficiency. At the same time, a relatively sealed structure is formed between the support assembly 400 and the second atomization shell 310, so that there is no risk of air leakage caused by the punching hole in the entire air inlet path, thereby improving the aerosol quality and service life of the electronic atomization device.

[0040] In some embodiments, the number of first electrodes 510 and second electrodes 520 can be two respectively. The two first electrodes 510 are respectively positive and negative electrodes for electrically connecting the control circuit board 500 and the first atomization assembly 200. Similarly, the two second electrodes 520 are respectively positive and negative electrodes for electrically connecting the control circuit board 500 and the second atomization assembly 300. The electrode holes 410 on the support assembly 400 can correspond to the number of electrodes one by one.

[0041] In some embodiments, the first atomization assembly 200 and the second atomization assembly 300 are controlled separately or jointly by the control circuit board 500, that is, only the first atomization assembly 200 can be turned on, or the first atomization assembly 200 and the second atomization assembly 300 can be turned on according to requirements.

[0042] In some embodiments, in order to enrich the selection of the electronic atomization device, the second atomization assembly 300 can also be provided with two, one of which is used to adjust the ice degree, and the other can be used to adjust the sweetness. Of course, the second atomization assembly 300 can also be provided with more than two according to requirements. In order to increase the total capacity of use or the atomization amount at the same time of the entire electronic atomization device, the first atomization assembly 200 can also be provided with two or more. In this embodiment, correspondingly, the number of first electrodes 510 matches the number of first atomization assemblies 200, and the number of second electrodes 520 matches the number of second atomization assemblies 300, that is, the first electrodes 510 and the second electrodes 520 can each be provided with two or more.

[0043] It can be understood that the capacity requirement of the basic atomization substrate is generally greater than that of the auxiliary atomization substrate. In some embodiments, the volume of the first liquid storage cavity of the first atomization assembly 200 is greater than that of the second liquid storage cavity of the second atomization assembly 300, and the overall volume of the first atomization assembly 200 is greater than that of the second atomization assembly 300. The space occupancy distribution of the entire electronic atomization device can be reasonably planned, which helps to design the electronic atomization device to be small in size under the condition of meeting the use requirements.

[0044] In some embodiments, the electronic atomization device further comprises a first sealing member 600 arranged between the second atomization housing 310 and the support assembly 400 to seal the opening of the second atomization housing 310. The first sealing member 600 is provided with a first lead hole 621 and a second lead hole 622. The first electrode 510 is arranged in the first lead hole 621 after passing through the electrode hole 410. The first conductive pin 221 is arranged in the first lead hole 621 and electrically connected to the first electrode 510 after extending from the first heating body 222. The second electrode 520 is arranged in the second lead hole 622 after passing through the electrode hole 410. The second conductive pin 321 is arranged in the second lead hole 622 and electrically connected to the second electrode 520 after extending from the second heating body 322. This can stabilize the circuit of the first conductive pin 221 and the second conductive pin 321 and stabilize the installation of the control circuit board 500. The first sealing member 600 can be fixed to the second atomization housing 310 as an integral structure.

[0045] Please refer to Figure 5 and Figure 6 In some embodiments, the first sealing member 600 comprises a connecting portion 610 and a sealing portion 620. The sealing portion 620 is arranged at the opening of the second atomization housing 310 away from the first atomization housing 210. One end of the connecting portion 610 is connected to the sealing portion 620, and the other end extends to the opening of the second atomization housing 310 close to the first atomization housing 210 along the first direction Y. A lead channel 611 is arranged in the connecting portion 610 along the first direction Y. The first lead hole 621 and the second lead hole 622 are arranged in the sealing portion 620. The second lead hole 622 is in communication with the second atomization channel 312. The first lead hole 621 is in communication with the lead channel 611. The first conductive pin 221 is arranged in the first lead hole 621 after passing through the lead channel 611. The second conductive pin 321 is arranged in the second lead hole 622 after being led out directly from the second atomization channel 312. The first conductive pin 221 and the second conductive pin 321 are separated, and the lead path of the first conductive pin 221 does not pass through the second atomization assembly 300, thereby avoiding unsafe accidents caused by high-temperature lead gas of the first conductive pin 221.

[0046] Please refer to Figure 7In some embodiments, the first lead hole 621 includes a first through hole 6211 and a first accommodating groove 6212 in communication, and the second lead hole 622 includes a second through hole 6221 and a second accommodating groove 6222 in communication. The first through hole 6211 and the second through hole 6221 penetrate the sealing portion 620 along the first direction Y. The first accommodating groove 6212 and the second accommodating groove 6222 are arranged on the side of the sealing portion 620 facing the bracket assembly 400. The first accommodating groove 6212 and the second accommodating groove 6222 do not penetrate the sealing portion 620, and the openings are all directed towards the bracket assembly 400. The first conductive pin 221 is bent and arranged in the first accommodating groove 6212 after being led out through the first through hole 6211. Similarly, the second conductive pin 321 is bent and arranged in the second accommodating groove 6222 after being led out through the second through hole 6221, so as to fix the first conductive pin 221 and the second conductive pin 321.

[0047] In some embodiments, the first accommodating groove 6212 and the second accommodating groove 6222 can be provided with at least two, so as to lead out the positive and negative lead wires respectively. The at least two first accommodating grooves 6212 are arranged in a fan shape around the peripheral wall of the first through hole 6211. The at least two second accommodating grooves 6222 are arranged in a fan shape around the peripheral wall of the second through hole 6221.

[0048] Please continue to refer to Figure 7 In some embodiments, the first lead hole 621 further includes a first blind hole 6213, and the second lead hole 622 further includes a second blind hole 6223. The first blind hole 6213 and the second blind hole 6223 are arranged on the side of the first sealing member 600 facing the bracket assembly 400. The first blind hole 6213 is in communication with the first accommodating groove 6212. The first conductive pin 221 is bent and arranged in the first blind hole 6213 after being led out through the first accommodating groove 6212. The first electrode 510 is arranged in the first blind hole 6213 after being led out through the electrode hole 410, which can increase the contact area of the first electrode 510 and the first conductive pin 221, and also can increase the stability of the connection between the first electrode 510 and the first conductive pin 221. Similarly, the second blind hole 6223 is in communication with the second accommodating groove 6222. The second conductive pin 321 is bent and arranged in the second blind hole 6223 after being led out through the second accommodating groove 6222. The second electrode 520 is arranged in the second blind hole 6223 after being led out through the electrode hole 410, which can increase the contact area of the second electrode 520 and the second conductive pin 321, and also can increase the stability of the connection between the second electrode 520 and the second conductive pin 321.

[0049] It should be noted that the blind hole refers to a through hole connecting the surface layer and the inner layer without penetrating the whole plate, in other words, the first blind hole 6213 and the second blind hole 6223 are connected to the surface layer on the side of the sealing part 620 facing the support assembly 400 and the inner layer of the sealing part 620 without penetrating the sealing part 620, and the openings of the first blind hole 6213 and the second blind hole 6223 face the support assembly 400, so as to facilitate the arrangement of the first electrode 510 and the second electrode 520. The first accommodating groove 6212 and the second accommodating groove 6222 are similar in structure to the first blind hole 6213 and the second blind hole 6223, except that the depth (dimension along the first direction Y) of the first blind hole 6213 and the second blind hole 6223 is larger, and the depth (dimension along the first direction Y) of the first accommodating groove 6212 and the second accommodating groove 6222 is smaller.

[0050] In some embodiments, the electronic atomization device further comprises a second sealing member 700 arranged between the first atomization housing 210 and the second atomization housing 310 for sealing and isolating the first atomization housing 210 and the second atomization housing 310. Please refer to Figure 8 , the third lead hole 710 is provided on the second sealing member 700, which communicates the first atomization channel 212 and the lead channel 611, so that the first conductive pin 221 is arranged in the first lead hole 621 after being drawn out from the first atomization channel 212 and then passing through the third lead hole 710 and the lead channel 611 in sequence. The second sealing member 700 is also provided with a through hole (not labeled in the figure) to realize the communication between the first atomization channel 212 and the second atomization channel 312. The second sealing member 700 can be fixed as an integral structure with the first atomization housing 210.

[0051] In some embodiments, the connecting part 610 and the sealing part 620 are an integrally formed structure made of silicone material, and the second sealing member 700 is also made of silicone material.

[0052] In some embodiments, the electrode hole 410 penetrates the support assembly 400 along the first direction Y, and the electrode is in interference fit with the electrode hole 410, so as to be able to seal the periphery of the electrode and avoid gas leakage from the electrode hole 410, thereby improving the air tightness of the electronic atomization device.

[0053] In some embodiments, the electronic atomization device further comprises a battery 800 and a control circuit board 500 as power supply components in the electronic atomization device, which are electrically connected to each other and capable of controlling the operation of the electronic atomization device. The battery 800 provides the power required for the operation of the electronic atomization device, and the control circuit board 500 realizes state control. The battery 800 is arranged in the housing assembly 100 and is arranged side by side with the second atomization assembly 300 along the second direction X, and the first direction Y and the second direction X are perpendicular to each other. The volume of the second atomization assembly 300 is smaller than that of the first atomization assembly 200, so that there is space on the side of the second atomization assembly 300 in the second direction X. The battery 800 is arranged in the space, which can reasonably utilize the internal space of the electronic atomization device and reduce the overall volume of the electronic atomization device.

[0054] Please refer to Figure 9 In some embodiments, the electronic atomization device further comprises a bottom cover assembly 900 arranged on the side of the support assembly 400 away from the second atomization housing 310 and connected with the housing assembly 100, for sealing the opening of the housing assembly 100. The bottom cover assembly 900 is provided with an air inlet hole 910 and an adjusting piece 920. The air inlet hole 910 is in communication with the air inlet channel 420, and the adjusting piece 920 is arranged on the air inlet hole 910 for adjusting the size of the air inlet hole 910. Specifically, the adjusting piece 920 can move linearly relative to the air inlet hole, so as to adjust the size of the air inlet hole 910 to realize internal air intake adjustment, and finally realize adjustment of the aerosol atomization amount.

[0055] The above application uses specific examples to illustrate the present application, which is only used to help understand the present application and does not limit the present application. For those skilled in the art to which the present application belongs, according to the idea of the present application, a number of simple deductions, deformations or substitutions can be made.

Claims

1. An electronic atomizing device, characterized by, The electronic atomization device comprises: a shell assembly; a first atomization assembly comprising a first atomization shell and a first atomization core, the first atomization shell being provided with a first atomization channel, and the first atomization core being arranged in the first atomization channel and having a first conductive pin; a second atomization assembly, which is arranged in the shell assembly in parallel with the first atomization assembly along a first direction; the second atomization assembly comprises a second atomization shell and a second atomization core, the second atomization shell being provided with a second atomization channel, and the second atomization core being arranged in the second atomization channel and having a second conductive pin; a support assembly, which is arranged in the shell assembly and is arranged on a side of the second atomization shell away from the first atomization shell, the support assembly being provided with an electrode hole and an air inlet channel for air inlet, and the air inlet channel being in communication with the first atomization channel and the second atomization channel; and a control circuit board, which is arranged in the shell assembly and is arranged on a side of the support assembly away from the second atomization shell, the control circuit board being provided with at least a first electrode and a second electrode, the first electrode being electrically connected with the first conductive pin after passing through the electrode hole, and the second electrode being electrically connected with the second conductive pin after passing through the electrode hole. The electronic atomization device further comprises a first sealing member, which is arranged between the second atomization shell and the support assembly and is used for sealing an opening of the second atomization shell, the first sealing member being provided with a first lead hole and a second lead hole, the first electrode being arranged in the first lead hole after passing through the electrode hole, and the first conductive pin being arranged in the first lead hole and being electrically connected with the first electrode; the second electrode being arranged in the second lead hole after passing through the electrode hole, and the second conductive pin being arranged in the second lead hole and being electrically connected with the second electrode.

2. The electronic atomizing device of claim 1, wherein, The first sealing member comprises a connecting portion and a sealing portion, the sealing portion being arranged at an opening of the second atomization shell away from the first atomization shell, one end of the connecting portion being connected with the sealing portion, and the other end of the connecting portion extending to an opening of the second atomization shell close to the first atomization shell along the first direction; a lead channel is provided in the connecting portion along the first direction, the first lead hole and the second lead hole are arranged in the sealing portion, the second lead hole is in communication with the second atomization channel, the first lead hole is in communication with the lead channel, and the first conductive pin is arranged in the first lead hole after passing through the lead channel.

3. The electronic atomizing device of claim 2, wherein, The first lead hole comprises a first through hole and a first accommodating groove in communication, and the second lead hole comprises a second through hole and a second accommodating groove in communication, the first through hole and the second through hole penetrating the sealing portion along the first direction, and the first accommodating groove and the second accommodating groove being arranged on a side of the sealing portion facing the support assembly.

4. The electronic atomizing device of claim 3, wherein, ​ 5. The electronic atomizing device of claim 4, wherein, The first lead hole further comprises a first blind hole, and the second lead hole further comprises a second blind hole, both of which are arranged on a side of the first sealing member facing the support assembly, the first blind hole is in communication with the first accommodating groove, and the first conductive pin is arranged in the first blind hole after being bent through the first accommodating groove; the first electrode is arranged in the first blind hole after passing through the electrode hole. The second blind hole is in communication with the second accommodating groove, and the second conductive pin is arranged in the second blind hole after being bent through the second accommodating groove; the second electrode is arranged in the second blind hole after passing through the electrode hole.

6. The electronic atomizing device of any one of claims 3-5, wherein, The connecting portion and the sealing portion are integrally formed of a silica gel material.

7. The electronic atomizing device of claim 3, wherein, The electronic atomization device further comprises a second sealing member arranged between the first atomization housing and the second atomization housing for sealing and isolating the first atomization housing and the second atomization housing. A third lead hole is arranged on the second sealing member, and the third lead hole is in communication with the first atomization channel and the lead channel.

8. The electronic atomizing device of claim 1, wherein, The electrode hole penetrates the support assembly along the first direction, and the electrode is in interference fit with the electrode hole.

9. The electronic atomizing device of claim 1, wherein, The electronic atomization device further comprises a battery arranged in the housing assembly and arranged side by side with the second atomization assembly along a second direction, and the first direction and the second direction are perpendicular to each other.

10. The electronic atomizing device of claim 1, wherein, The electronic atomization device further comprises a bottom cover assembly arranged on a side of the support assembly away from the second atomization housing and connected with the housing assembly for sealing the opening of the housing assembly, and the bottom cover assembly is provided with an air inlet hole and an adjusting member, the air inlet hole is in communication with the air inlet channel, and the adjusting member is arranged on the air inlet hole for adjusting the size of the air inlet hole.

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