Chip testing tool and testing seat
By designing a test probe with a beveled cut and a pointed tip, the short-circuit problem caused by the excessive size of the probe tip was solved, and the reliability and accuracy requirements of small-area contact of the pads were met.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-24
AI Technical Summary
In existing technologies, the probe head size of test probes is too large, which cannot meet the requirements of small-area contact of solder pads, and is prone to short circuits and poor fault tolerance.
Design a testing tool comprising multiple test probes, each probe head having a beveled portion and a tip, the tip being located at the outer edge of the probe and contacting the pad, and the tips of the multiple probes being arranged opposite each other, the beveled portion having a specific inclined surface design, the probe head being flat, and being connected to the PCB board via a probe board.
The contact area between the probe tip and the pad is reduced, meeting the requirement for small-area contact of the pad, avoiding short circuits, and improving the reliability and accuracy of the test.
Smart Images
Figure CN224035565U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip testing technical field especially, and it relates to a kind of testing tool and test seat of chip. BACKGROUND
[0002] When the performance of the measured chip is tested, the measured chip and the PCB board are generally connected by test probes to realize the signal transmission of the measured chip. Generally, the measured chip has multiple pads, and each pad is in contact with multiple test probes. When the pad size is very small and only part of the pad area can contact the test probe, that is, the area of the pad that can be touched is very small, so the shape of the probe head of the test probe is required to be very small. If the probe head is too large, short circuit may occur when the adjacent two probe heads contact, and the fault tolerance effect is poor. Therefore, it is urgent to design a test tool that can meet the small-area contact requirement of the pad. SUMMARY
[0003] One object of the utility model is to provide a test tool for a chip that solves the technical problem of the probe head size of the test probe being too large to meet the small-area contact requirement of the pad in the prior art.
[0004] Another object of the utility model is to provide a test seat with the above test tool.
[0005] In particular, the utility model provides a test tool for a chip, which contacts a same pad of the measured chip, and the test tool comprises:
[0006] a plurality of test probes, each of which has a first probe head with a chamfered portion and a tip formed at the top of the chamfered portion, the tip being located at the outer edge of the test probe and contacting the pad of the measured chip, and the tips of every two test probes in the plurality of test probes are oppositely arranged, and the chamfered portions of the two test probes are respectively located on the two sides of the two tips.
[0007] Optionally, the chamfered portion has a first inclined surface, a second inclined surface and a third inclined surface, the second inclined surface and the third inclined surface are respectively located on the opposite sides of the first inclined surface and are respectively arranged at a preset angle with the first inclined surface.
[0008] Optionally, the second inclined surface and the third inclined surface are symmetrically arranged along the first inclined surface.
[0009] Optionally, the first probe head is flat.
[0010] Optionally, the first probe head further comprises:
[0011] Two flat surfaces are arranged along the extension direction of the test probe and are respectively located on two sides of the second inclined surface and the third inclined surface.
[0012] Optionally, the test probe further comprises a probe body and a second probe head, and the first probe head and the second probe head are respectively located at two ends of the probe body.
[0013] Optionally, the second probe head is in a cylindrical shape.
[0014] In particular, the utility model further provides a chip test seat, which comprises:
[0015] The test tool described above;
[0016] A probe plate, wherein the test tool is installed on the probe plate;
[0017] A PCB plate, which is located below the probe plate and is in contact with the test probe of the test tool.
[0018] Optionally, the probe plate comprises:
[0019] A plate body, wherein the test tool is installed on the plate body;
[0020] A positioning block, which is installed at the middle position of the plate body, the test tool is installed around the positioning block, and the positioning block is used for positioning the chip to be tested.
[0021] Optionally, the probe plate is made of ceramic material.
[0022] In the utility model, the test tool is in contact with the same pad of the chip to be tested, the test tool comprises a plurality of test probes, each test probe has a first probe head, the first probe head has a beveling part and a tip formed at the top of the beveling part, the tip is located at the outer edge of the test probe and is in contact with the pad of the chip to be tested, the tips of every two test probes in the plurality of test probes are oppositely arranged, and the beveling parts of the two test probes are respectively located on two sides of the two tips. The above technical scheme can reduce the contact area of the probe head and the pad, meet the contact demand of the small area of the pad, the tip of the test probe of the chip to be tested is arranged at the edge of the test probe, and the tips of the two test probes are oppositely arranged, so that the distance between the two tips is reduced, and the contact demand of the small area of the pad can be further met.
[0023] The above and other objects, advantages and features of the utility model will become more apparent from the following detailed description of the preferred embodiments thereof, given by way of example only, in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0024] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are presented by way of illustration and not of limitation. The same reference numbers in the drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:
[0025] Figure 1 is a schematic structural diagram of a test tool for a chip according to an embodiment of the present application;
[0026] Figure 2 is Figure 1 is a schematic structural diagram of a test probe of one embodiment of the test tool shown in
[0027] Figure 3 is Figure 1 is a schematic structural diagram of a test probe of another embodiment of the test tool shown in
[0028] Figure 4 is a schematic structural diagram of a pad of a chip under test according to an embodiment of the present application;
[0029] Figure 5 is a schematic structural diagram of a test probe mounted on a probe board according to an embodiment of the present application;
[0030] Figure 6 is a schematic structural diagram of a test probe and a chip under test according to an embodiment of the present application;
[0031] Figure 7 is a schematic structural diagram of a chip under test according to an embodiment of the present application;
[0032] Figure 8 is a schematic structural diagram of a probe board, a chip under test and a PCB board according to an embodiment of the present application.
[0033] Reference signs:
[0034] 100 - test tool, 200 - chip under test, 210 - pad, 300 - probe board, 400 - PCB board, 10 - test probe, 11 - first probe head, 12 - probe body, 13 - second probe head, 111 - bevel, 112 - first inclined surface, 113 - second inclined surface, 114 - third inclined surface, 115 - tip, 116 - flat surface, 310 - positioning block, 320 - board body, 321 - through hole. DETAILED DESCRIPTION
[0035] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.
[0036] In the description of the present application, it should be understood that the terms "upper", "lower", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0037] The terms "first", "second", etc. are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and can further include other features are not excluded.
[0038] Unless otherwise specifically defined and limited, the terms "connection", "installation", and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.
[0039] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the present embodiment have the same meaning as generally understood by those skilled in the art to which the present application belongs.
[0040] Figure 1 is a schematic structural diagram of a test tool 100 of a chip according to an embodiment of the present application, Figure 2 is Figure 1 is a schematic structural diagram of a test probe 10 of an embodiment of the test tool 100 shown, Figure 3 is Figure 1 is a schematic structural diagram of a test probe 10 of another embodiment of the test tool 100 shown. As Figures 1 to 3As shown in the figure, in one specific embodiment, the test tool 100 of the chip is in contact with the same pad 210 of the chip under test 200, the test tool 100 comprises a plurality of test probes 10, each test probe 10 has a first probe head 11, the first probe head 11 has a bevel 111 and a tip 115 formed on the top of the bevel 111, the tip 115 is located at the outer edge of the test probe 10 and is in contact with the chip under test 200, the tips 115 of every two test probes 10 of the plurality of test probes 10 are oppositely arranged, and the bevels 111 of the two test probes 10 are respectively located on the two sides of the two tips 115. It can be understood that one pad 210 of each chip under test 200 is in contact with the plurality of test probes 10. In some cases, only part of the area of the pad 210 can be in contact with the test probe 10, and the contact area is very small, so the size of the probe head of the test probe 10 should be reduced as much as possible.
[0041] This embodiment can reduce the contact area of the probe head and the pad 210 by designing the tip 115, meet the contact requirement of the small area of the pad 210, and further meet the contact requirement of the small area of the pad 210 by setting the tip 115 of the test probe 10 of the chip under test 200 at the edge of the test probe 10 and oppositely arranging the tips 115 of the two test probes 10 to reduce the distance between the two tips 115.
[0042] In some embodiments, each test tool 100 comprises two test probes 10, and in other embodiments, each test tool 100 can also be provided to comprise a plurality of test probes 10, which is determined according to the design requirement.
[0043] Figure 4 It is a schematic structural view of the pad 210 of the chip under test 200 according to one embodiment of the utility model. As Figure 4 As shown in the figure, in some embodiments, the width of the pad 210 of the chip under test 200 is about 0.1 mm, and the length is about 0.43 mm. The A area is an area that cannot be touched by the test probe 10, and the B area is very small and cannot be used, so the test probe 10 can only touch the C area, and therefore the shape of the probe head of the test probe 10 is required to be as small as possible, and needs to be reasonably arranged with other probe heads, so that a plurality of probe heads can be in contact with the same pad 210 and no short circuit occurs. This embodiment is equivalent to back-to-back arrangement of the probe heads of the two test probes 10, thereby meeting the contact requirement of the small area of the pad 210 as much as possible.
[0044] Referring to Figure 2 , Figure 2 It is the shape of one of the probe heads, the bevel 111 has a face, and the height of the bevel 111 is 0.15 mm. Referring to Figure 3 , Figure 3is another shape of the probe head, the chamfered portion 111 has a first inclined surface 112, a second inclined surface 113 and a third inclined surface 114, the second inclined surface 113 and the third inclined surface 114 are respectively located on opposite sides of the first inclined surface 112 and are arranged at a preset angle with the first inclined surface 112. The height of the chamfered portion 111 is 0.25mm.
[0045] In some embodiments, the second inclined surface 113 and the third inclined surface 114 are symmetrically arranged along the first inclined surface 112. In other embodiments, the second inclined surface 113 and the third inclined surface 114 can also be arranged asymmetrically, which can be determined according to specific design requirements.
[0046] In some embodiments, the first probe head 11 is flat, so as to reduce the size of the probe head, avoid the contact of the probe head of the test probe 10 between two adjacent pads 210, and avoid short circuit. In other embodiments, the first probe head 11 can also be arranged in other shapes.
[0047] Specifically, the first probe head 11 further comprises two flat surfaces 116, which are arranged along the extension direction of the test probe 10 and are respectively located on the two sides of the second inclined surface 113 and the third inclined surface 114. In other embodiments, the size of the probe head can also be reduced by other means.
[0048] Referring to Figure 1 , the test probe 10 further comprises a probe body 12 and a second probe head 13, the first probe head 11 and the second probe head 13 are respectively located at two ends of the probe body 12, and the second probe head 13 is in contact with the PCB 400. Specifically, the second probe head 13 is in a cylindrical shape. It can be understood that the second probe head 13 is a shape of a commonly used probe head in the prior art. However, the embodiment reduces the size of the probe head through improvement of the probe head, so as to meet the contact requirement of the small area of the pad 210.
[0049] Figure 5 is a schematic structural view of the test probe 10 according to an embodiment of the utility model installed on the probe plate 300. As Figure 5 shown, the probe plate 300 is provided with a plurality of through holes 321, and the first probe head 11 of the test probe 10 in contact with the same pad 210 is arranged in the same through hole 321.
[0050] In some embodiments, the through hole 321 is a U-shaped hole, and the first probe head 11 in a flat shape is arranged in the through hole 321. The shape design of the U-shaped hole can avoid rotation of the first probe head 11 and can limit the first probe head 11.
[0051] Figure 6is a schematic structural diagram of the test probe 10 and the measured chip 200 according to one embodiment of the utility model, Figure 7 is a schematic structural diagram of the measured chip 200 according to one embodiment of the utility model, Figure 8 is a schematic structural diagram of the probe plate 300, the measured chip 200 and the PCB plate 400 according to one embodiment of the utility model. Figures 6 to 8 As shown in the figure, in one specific embodiment, the test seat of the chip comprises the test tool 100, the probe plate 300 and the PCB plate 400 of any one of the above embodiments, the test tool 100 is installed on the probe plate 300, the PCB plate 400 is located below the probe plate 300 and contacts the test probe 10 of the test tool 100. Figure 6 As shown in the figure, the first probe head 11 of the test probe 10 protrudes above the probe plate 300 to contact the pad 210 of the measured chip 200. The second probe head 13 protrudes below the probe to contact the PCB plate 400.
[0052] As shown in the figure, Figure 7 The measured chip 200 is provided with a square positioning hole at the middle position, and the plurality of pads 210 of the measured chip 200 are arranged along the periphery of the positioning hole.
[0053] As shown in the figure, Figure 5 , Figure 6 and Figure 8 The probe plate 300 comprises a plate body 320 and a positioning block 310, and the test probe 10 of the test tool 100 is installed on the plate body 320. The positioning block 310 is installed at the middle position of the plate body 320, and the test tool 100 is installed at the periphery of the positioning block 310. The positioning block 310 is used for positioning the measured chip 200. The positioning block 310 is first positioned with the plate body 320 through the positioning column, and then the screw is tightened to be installed with the plate body 320. Here, the outer shape of the positioning block 310 matches the shape of the through hole 321 of the measured chip 200. When the measured chip 200 is installed on the probe plate 300, the through hole 321 at the middle position of the measured chip 200 cooperates with the positioning block 310, so that the positioning of the measured chip 200 and the probe plate 300 is realized.
[0054] In some embodiments, the probe plate 300 adopts ceramic material. Here, the probe plate 300 previously adopts engineering plastic PEEK, and it is found that there are many burrs after actual processing, which are difficult to remove and cannot reach the accuracy of-0.005mm. In addition, the probe plate 300 also considers adopting PI material, but there are similar shortcomings. After many experiments, the processable ceramic material is finally selected.
[0055] Up to now, the person skilled in the art should recognize that, although the multiple exemplary embodiments of the utility model have been shown and described in detail herein, many other variants or modifications conforming to the principles of the utility model can still be directly determined or deduced according to the content disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.
Claims
1. A chip testing tool, characterized in that, The testing tool contacts the same pad of the chip under test, and the testing tool includes: A plurality of test probes, each of the test probes having a first probe head having a beveled portion and a tip formed on top of the beveled portion, the tip being located at the outer edge of the test probe and in contact with the pad of the chip under test, wherein the tips of every two test probes are arranged opposite each other, and the beveled portions of the two test probes are respectively located on both sides of the two tips.
2. The testing tool according to claim 1, characterized in that, The oblique cut portion has a first oblique surface, a second oblique surface and a third oblique surface. The second oblique surface and the third oblique surface are located on opposite sides of the first oblique surface and are arranged at a preset angle to the first oblique surface.
3. The testing tool according to claim 2, characterized in that, The second inclined surface and the third inclined surface are arranged symmetrically along the first inclined surface.
4. The testing tool according to claim 3, characterized in that, The first probe tip is flat.
5. The testing tool according to claim 4, characterized in that, The first probe head also includes: Two flat surfaces are arranged along the extension direction of the test probe and are located on both sides of the second inclined surface and the third inclined surface, respectively.
6. The testing tool according to any one of claims 1-3, characterized in that, The test probe also includes a probe body and a second probe head, with the first probe head and the second probe head located at opposite ends of the probe body.
7. The testing tool according to claim 6, characterized in that, The second probe head is cylindrical.
8. A test socket for a chip, characterized in that, include: The testing tool as described in any one of claims 1-7; A probe plate on which the testing tool is mounted; The PCB board is located below the probe board and is in contact with the test probes of the testing tool.
9. The test fixture according to claim 8, characterized in that, The probe plate includes: The test tool is mounted on the board. A positioning block is installed in the middle of the board, and the testing tool is installed around the positioning block. The positioning block is used to position the chip under test.
10. The test fixture according to claim 8, characterized in that, The probe plate is made of ceramic material.