SIP (Session Initiation Protocol) module structure capable of reducing sputtering coating scraps

Abstract

The utility model relates to an SIP (Session Initiation Protocol) module structure capable of reducing sputtering scraps, which comprises a module jointed board and a sputtering pre-pasting assembly, the module jointed board comprises a plurality of SIP modules, the sputtering pre-pasting assembly comprises a first sputtering adhesive film, and the first sputtering adhesive film is pasted at the bottom of the module jointed board. The beneficial effects of the utility model lie in that the production technology can be simplified, the product reliability can be improved, and the production cost can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to SIP module sputtering technology field, concretely relates to a SIP module structure capable of reducing sputtering debris. BACKGROUND

[0002] With the mobile phone pixel and battery capacity bigger and bigger, the volume of device and be compressed smaller and smaller, the device miniaturization modularization demand is more and more intense, under this background, system in package module (SIP module) arises at the historic moment.Magnetron sputtering shielding technology as the miniaturization scheme of alternative shielding cover, is one of the key technologies of miniaturization scheme in system in package, it utilizes physical vapor deposition principle, uses magnetron sputtering process (Sputter) to deposit shielding material to the front and four sides of system in package module, and PCB ground layer needs to leak out side, and is connected to form a shielding cover with sputtering film layer.

[0003] In the process of the existing sputtering process, single SiP module plastic package face is fixed in array on sputtering adhesive film, then sputtering bottom film and the carrier of sputtering bottom film and SIP module are sent into high-temperature sputtering cavity to carry out magnetron sputtering, to complete film plating. Due to the characteristics of metal film deposition, the plated film material will form a slight accumulation at the vertical angle position of the side of the SIP module and the sputtering bottom film. When the SIP module and the sputtering bottom film are separated, due to the high viscosity of the sputtering bottom film, the accumulated metal plated layer will tear at the corner and form metal debris (burr). The debris remains on the edge of the sputtering bottom film or the SIP module product. When it remains on the product, the debris may fall off during the subsequent test process, causing short circuit and other problems. The current solution in the industry is to add a step of removing debris after the SIP module product is separated from the sputtering bottom film, for example, using a brush to remove the debris remaining on the product. However, there are problems such as incomplete removal of debris, risk of scratching the bottom pads during the debris removal process, and risk of not being able to separate the sputtering adhesive film. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a SIP module structure capable of reducing sputtering debris, which can simplify production process, improve product reliability and reduce production cost.

[0005] A SIP module structure capable of reducing sputtering debris, comprising a module panel and a sputtering pre-sticking assembly. The module panel comprises a plurality of SIP modules. The sputtering pre-sticking assembly comprises a first sputtering adhesive film, which is attached to the bottom of the module panel.

[0006] In the above scheme, the first sputtering adhesive film is attached to the bottom of the module panel, and after the module panel is half-cut to obtain a plurality of SIP modules connected to each other, the module panel with the first sputtering adhesive film is sent to the sputtering process, thereby avoiding the cumbersome step of separately attaching the sputtering adhesive film to each SIP module, simplifying the process flow. After sputtering the SIP module, the sputtering layer on the surface of the SIP module does not contact the first sputtering adhesive film, and during the process of tearing off the first sputtering adhesive film, metal debris is avoided, thereby avoiding problems such as short circuit caused by the falling of debris in the subsequent testing process, improving the reliability and yield of the product. After the first sputtering adhesive film is torn off, the half-cut module panel is fully cut to obtain a single SIP module, thereby reducing the scrap rate caused by metal debris, and reducing material waste and production cost.

[0007] Further, the first sputtering adhesive film is a high-temperature adhesive film.

[0008] In the above scheme, the high-temperature adhesive film can maintain structural stability and adhesion in the high-temperature environment of the sputtering process, and will not deform or lose adhesion due to high temperature, so that the first sputtering adhesive film can be firmly attached to the bottom of the module panel during the sputtering process.

[0009] Further, the sputtering pre-attachment assembly further comprises a second sputtering adhesive film, and the SIP module with the first sputtering adhesive film is attached to the second sputtering adhesive film.

[0010] In the above scheme, after the module panel is fully cut to obtain a plurality of independent SIP modules, the first sputtering adhesive film is previously attached to the bottom of the SIP module, and then the SIP module with the first sputtering adhesive film is attached to the second sputtering adhesive film. After sputtering the SIP module, a sputtering layer is formed on the surface of the SIP module and the first sputtering adhesive film. At this time, the slight edge metal accumulation generated by sputtering will occur on the vertical angle of the first sputtering adhesive film and the first sputtering adhesive film. During the separation of the second sputtering adhesive film and the SIP module, the metal debris accumulated on the vertical angle of the first sputtering adhesive film and the first sputtering adhesive film will remain on the second sputtering adhesive film with the first sputtering adhesive film, thereby achieving the purpose of reducing the edge debris at the bottom of the sputtered product, avoiding problems such as short circuit caused by the falling of debris in the subsequent testing process, and improving the reliability and yield of the product.

[0011] Further, the adhesion between the second sputtering adhesive film and the first sputtering adhesive film is greater than the adhesion between the first sputtering adhesive film and the SIP module.

[0012] In the above scheme, since the adhesion between the second sputtering adhesive film and the first sputtering adhesive film is greater than the adhesion between the first sputtering adhesive film and the SIP module, when the SIP module is separated, the first sputtering adhesive film will be separated from the SIP module and remain on the second sputtering adhesive film, and the metal debris accumulated at the corner position of the SIP module and the first sputtering adhesive film will be adhered together on the second sputtering adhesive film, thereby achieving the effect of reducing sputtering debris after the SIP module is separated.

[0013] Further, the first sputtering adhesive film is a single-sided high-temperature adhesive film, and the second sputtering adhesive film is a double-sided high-temperature adhesive film.

[0014] In the above scheme, the first sputtering adhesive film is a single-sided high-temperature adhesive film, one side of which is adhered to the bottom of the SIP module, and the other side is non-adhesive, and the second sputtering adhesive film is a double-sided high-temperature adhesive film, both upper and lower surfaces of which have adhesion, the upper surface of the second sputtering adhesive film is bonded to the first sputtering adhesive film, and the lower surface is used to adhere to the bearing table of the sputtering equipment to ensure the stability of the SIP module during sputtering.

[0015] Further, the SIP module includes a bottom pad, a ground copper layer, a substrate, and a plastic encapsulation layer, the bottom pad is arranged at the bottom of the substrate, the ground copper layer is embedded in the substrate, and the plastic encapsulation layer is wrapped around the outer periphery of the device on the substrate.

[0016] In the above scheme, the substrate serves as a support structure for the SIP module, carrying the bottom pad, the ground copper layer, and the device, the bottom pad is located at the bottom of the substrate, providing an electrical connection interface with an external circuit (such as a PCB), the ground copper layer is embedded in the substrate, providing electrical grounding and electromagnetic shielding functions, and the plastic encapsulation layer wrapped around the outer periphery of the device on the substrate serves to protect the device.

[0017] Further, the substrate is an organic substrate or a ceramic substrate.

[0018] In the above scheme, the organic substrate has a certain flexibility and can adapt to certain mechanical stress, reducing the risk of cracking or breaking, and the ceramic substrate can maintain structural stability and electrical performance in a high-temperature environment, suitable for high-temperature application scenarios.

[0019] Further, the bottom pad is a copper pad.

[0020] In the above scheme, the copper pad can maintain structural stability and electrical performance in a high-temperature environment, suitable for high-temperature application scenarios, and the performance will not be affected after high-temperature sputtering.

[0021] The utility model discloses a SIP module structure that can reduce sputtering debris has the beneficial effect that can simplify production process, can improve product reliability and reduce production cost. When a plurality of SIP modules connected to each other are obtained after the module panel is half cut, the first sputtering adhesive film is attached to the bottom of the module panel, and then the module panel with the first sputtering adhesive film is sent into the sputtering process, avoiding the cumbersome steps of attaching the sputtering adhesive film to the single SIP module, simplifying the process flow. In this way, after sputtering the SIP module, the sputtering layer on the surface of the SIP module does not contact the first sputtering adhesive film, and then in the process of tearing off the first sputtering adhesive film, metal debris is avoided, thereby avoiding the problem of short circuit caused by the falling of debris in the subsequent test process, improving the reliability and yield of the product. After the first sputtering adhesive film is torn off, the half-cut module panel is fully cut to obtain a single SIP module, reducing the scrap rate caused by metal debris, thereby reducing material waste and production cost. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the module panel and the first sputtering bottom film in example 1.

[0023] Figure 2 It is a schematic diagram of the sputtered module panel and the first sputtering bottom film in example 1.

[0024] Figure 3 It is a schematic diagram of tearing the first sputtering bottom film and the UV film position in example 1.

[0025] Figure 4 It is a schematic diagram of the cut SIP module structure in example 1.

[0026] Figure 5 It is a schematic diagram of the full cutting of the module panel by the laser beam in example 2.

[0027] Figure 6 It is a schematic diagram of the structure of the fully cut module panel in example 2.

[0028] Figure 7 It is a schematic diagram of the separation of the SIP module and the first sputtering bottom film in example 2.

[0029] Figure 8 It is a schematic diagram of the connection of the SIP module and the sputtering pre-attachment assembly in example 3.

[0030] Figure 9 It is a schematic diagram of the sputtering of the SIP module in example 3.

[0031] Figure 10 It is a schematic diagram of the separation of the SIP module and the sputtering pre-attachment assembly in example 3.

[0032] The reference numerals are as follows: 1. Module panel; 2. Sputtered pre-attached component; 21. First sputtered adhesive film; 22. Second sputtered adhesive film; 3. SIP module; 31. Bottom pad; 32. Substrate; 33. Ground copper layer; 34. Molding layer; 4. Sputtered layer; 5. UV film. Detailed Implementation

[0033] The following will describe in further detail a SIP module structure that can reduce sputtering debris according to the present invention, with reference to specific embodiments and accompanying drawings. Example 1

[0034] like Figures 1 to 4 As shown in this embodiment, a SIP module 3 structure that can reduce sputtering debris according to the present invention includes a module panel 1 and a sputtering pre-attachment component 2. The module panel 1 includes multiple SIP modules 3, and the sputtering pre-attachment component 2 includes a first sputtering adhesive film 21, which is attached to the bottom of the module panel 1. The first sputtering adhesive film 21 is attached to the bottom of the module panel 1. After the module panel 1 is cut in half, multiple interconnected SIP modules 3 are obtained. Then, the module panel 1 with the first sputtering adhesive film 21 is sent to the sputtering process, avoiding the cumbersome step of attaching a sputtering adhesive film to each individual SIP module 3, thus simplifying the process. In this way, after the SIP module 3 is sputtered, the sputtering layer 4 on the surface of the SIP module 3 does not come into contact with the first sputtering adhesive film 21. Then, during the process of peeling off the first sputtering adhesive film 21, metal debris is avoided, thereby avoiding short circuits caused by debris falling off during subsequent testing and other processes, improving product reliability and yield. After peeling off the first sputtering adhesive film 21, the half-cut module panel 1 is fully cut to obtain individual SIP modules 3, reducing the scrap rate caused by metal debris and avoiding the problem of the SIP module 3 being unable to be pushed off the sputtering adhesive film, thereby reducing material waste and production costs.

[0035] The specific process flow is as follows: first, the first sputtering adhesive film 21 is pasted to the first sputtering adhesive film 21 with the module panel 1 plastic sealing layer 34 one side up, the module panel 1 is SAW half cut, and the substrate 32 is cut to half. The substrate 32 here is also the PCB board. In this embodiment, the substrate 32 with a thickness of about 100 μm is not cut through. In this way, grooves are formed between the SIP modules 3; second, the half-cut module panel 1 obtained after cutting is placed in a sputtering device for sputtering; third, the sputtered module panel 1 is turned over and pasted to another UV film 5, and then the first sputtering adhesive film 21 is torn off. Since the first sputtering adhesive film 21 does not come into contact with the sputtered layer 4 generated after sputtering, the sputtered layer 4 will not be separated from the sputtered layer 4. In the fourth step, the module panel 1 with the first sputtering adhesive film 21 is fully cut to obtain a single SIP module 3. This process needs to accurately set the cutting height according to the product thickness. The sputtered layer 4 near the substrate 32 end is cut off, and the sputtered layer 4 is not torn, avoiding the generation of sputtered metal debris; fifth, the SIP module 3 is separated from the UV film 5, and the UV film 5 is irradiated with a UV lamp to achieve debonding, so that the SIP module 3 is separated from the UV film 5.

[0036] As shown in Figure 1 In this embodiment, the first sputtering adhesive film 21 is a high-temperature adhesive film. The high-temperature adhesive film can maintain structural stability and adhesion in a high-temperature environment of the sputtering process, and will not deform or lose adhesion due to high temperature. This can ensure that the first sputtering adhesive film 21 is firmly attached to the bottom of the module panel 1 during the sputtering process.

[0037] As shown in Figure 1 In this embodiment, the SIP module 3 includes a bottom pad 31, a ground copper layer 33, a substrate 32, and a plastic sealing layer 34. The bottom pad is arranged at the bottom of the substrate 32. The ground copper layer 33 is embedded in the substrate 32. The plastic sealing layer 34 wraps around the outer periphery of the device on the substrate 32. The substrate 32 serves as a support structure for the SIP module 3, carrying the bottom pad 31, the ground copper layer 33, and the device. The substrate 32 can be a PCB board. The bottom pad 31 is located at the bottom of the substrate 32, providing an electrical connection interface with an external circuit (such as a PCB). The ground copper layer 33 is embedded in the substrate 32, providing electrical grounding and electromagnetic shielding functions. The plastic sealing layer 34 wraps around the outer periphery of the device on the substrate 32, protecting the device.

[0038] As shown in Figure 1 In this embodiment, the substrate 32 is an organic substrate 32 or a ceramic substrate 32. The organic substrate 32 has a certain flexibility, which can adapt to certain mechanical stress and reduce the risk of cracking or breaking. The ceramic substrate 32 can maintain structural stability and electrical performance in a high-temperature environment, making it suitable for high-temperature application scenarios.

[0039] As shown in Figure 1As shown, in this embodiment, the bottom pad 31 is a copper pad. Copper pads can maintain structural stability and electrical performance in high-temperature environments, making them suitable for high-temperature applications, and their performance is not affected after high-temperature sputtering. Example 2

[0040] like Figures 5 to 7 As shown, in this embodiment, SAW cutting is replaced by laser cutting, which offers higher precision than SAW cutting. The laser cutting process is as follows: First, the molding compound 34 of the module panel 1 is attached to the first sputtered adhesive film 21 with one side facing up. The module panel 1 is then laser-cut in half, cutting to half of the substrate 32, leaving approximately 100μm of the substrate 32 uncut. Figure 5 The 'a' indicates the laser beam, and grooves are formed between the SIP modules 3. The second step is to place the half-cut module panel 1 obtained after cutting into the sputtering equipment for sputtering. The third step is to place the sputtered product with the plastic cover facing up and use a laser to cut it completely. This process requires precise control of the laser energy so that it just cuts through the substrate 32 but does not cut through the first sputtering film 21, thus obtaining a single SIP module 3 that is bonded to the first sputtering film 21. The fourth step is to push the SIP module 3 away from the first sputtering film 21. Since the first sputtering film 21 does not come into contact with the sputtered layer 4 generated after sputtering, there will be no sputtering layer 4 debris generated during separation. Example 3

[0041] like Figures 8 to 10 As shown, in this embodiment, the sputtering pre-attachment component 2 includes a first sputtering adhesive film 21 and a second sputtering adhesive film 22, and the SIP module 3 with the first sputtering adhesive film 21 is attached to the second sputtering adhesive film 22. After the module panel 1 is fully cut, multiple independent SIP modules 3 are obtained. The first sputtering film 21 is first attached to the bottom of the SIP module 3. Then, the SIP module 3 with the first sputtering film 21 attached is attached to the second sputtering film 22. In this way, after sputtering, a sputtering layer 4 will be formed on the surface of the SIP module 3 and the first sputtering film 21. At this time, the slight edge metal accumulation generated by sputtering will occur at the vertical angle between the first sputtering film 21 and the first sputtering film 22. In this way, during the separation of the second sputtering film 22 and the SIP module 3, the metal debris accumulated at the vertical angle between the first sputtering film 21 and the first sputtering film 22 will remain on the second sputtering film 22 along with the first sputtering film 21. This also avoids the problem that the SIP module 3 cannot be pushed off the sputtering film, thereby reducing the edge debris at the bottom of the sputtered product and avoiding short circuits caused by debris falling off during subsequent testing and other processes, thus improving the reliability and yield of the product.

[0042] The specific process is as follows: first, a first sputtering adhesive film 21 is pre-stuck on the back of the module plate 1, one side of the module plate 1 is adhesive, and the other side is not adhesive; second, the module plate 1 with the first sputtering adhesive film 21 is divided by SAW, so that a single SIP module 3 with the first sputtering adhesive film 21 on the bottom is obtained; third, the SIP module 3 obtained by division is stuck to a second sputtering adhesive film 22; fourth, the SIP module 3 stuck to the second sputtering adhesive film 22 is sputtered, referring to Figure 9 ; fifth, the SIP module 3 is separated from the second sputtering adhesive film 22, because the adhesion of the second sputtering adhesive film 22 is greater than that of the first sputtering adhesive film 21, the metal debris formed by the first sputtering adhesive film 21 and the vertical angle between the first sputtering adhesive film 21 and the second sputtering adhesive film 22 will be left on the second sputtering adhesive film 22 together with the first sputtering adhesive film 21, referring to Figure 10 .

[0043] As shown in Figure 8 , in this embodiment, the adhesion between the second sputtering adhesive film 22 and the first sputtering adhesive film 21 is greater than the adhesion between the first sputtering adhesive film 21 and the SIP module 3. Because the adhesion between the second sputtering adhesive film 22 and the first sputtering adhesive film 21 is greater than the adhesion between the first sputtering adhesive film 21 and the SIP module 3, when the SIP module 3 is separated, the first sputtering adhesive film 21 will be separated from the SIP module 3 and left on the second sputtering adhesive film 22, and the metal debris accumulated at the corner position of the SIP module 3 and the first sputtering adhesive film 21 will be left on the second sputtering adhesive film 22 together, thereby realizing the effect of reducing sputtering debris after the SIP module 3 is separated.

[0044] As shown in Figure 8 , in this embodiment, the first sputtering adhesive film 21 is a single-sided high-temperature adhesive film, and the second sputtering adhesive film 22 is a double-sided high-temperature adhesive film. The first sputtering adhesive film 21 is a single-sided high-temperature adhesive film, one side of which is adhesive and the other side is non-adhesive, and the second sputtering adhesive film 22 is a double-sided high-temperature adhesive film, both upper and lower surfaces of which are adhesive, the upper surface of the second sputtering adhesive film 22 is bonded to the first sputtering adhesive film 21, and the lower surface is used to be attached to the bearing table of the sputtering equipment to ensure the stability of the SIP module 3 during sputtering.

[0045] The utility model discloses a SIP module 3 structure working principle and process that can reduce sputtering debris, first sputtering adhesive film 21 is pasted at the bottom of module panel 1, when the SIP module 3 of a plurality of mutual connections is obtained after half cutting to module panel 1, then module panel 1 that pastes first sputtering adhesive film 21 is sent into sputtering procedure, like this after sputtering to SIP module 3, the sputtering layer 4 of SIP module 3 surface does not contact first sputtering adhesive film 21, then avoids the production of SIP module 3 edge metal debris in the process of tearing down first sputtering adhesive film 21, when the SIP module 3 of single kernel is obtained after full cutting to module panel 1 that pastes first sputtering adhesive film 21, like this after sputtering to SIP module 3, will form sputtering layer 4 on the surface of SIP module 3 and first sputtering adhesive film 21, when the slight edge metal accumulation of sputtering generation will take place on the vertical angle of first sputtering adhesive film 21 and first sputtering adhesive film 21, like this in the process of separating second sputtering adhesive film 22 and SIP module 3, the metal debris that accumulated in the vertical angle of first sputtering adhesive film 21 and first sputtering adhesive film 21 will be left on second sputtering adhesive film 22 with first sputtering adhesive film 21, to reach the purpose of reducing sputtering product bottom edge debris.

[0046] In the description of the utility model, it is necessary to understand that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0047] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0048] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0049] Although the description of the utility model is combined with above specific embodiment, but, personnel familiar with this technical field can carry out many substitutions, modification and change according to the above content, it is obvious. Therefore, all such alternatives, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A SIP module structure that reduces sputtering debris, characterized in that, The device includes a module panel and a sputtering pre-attachment assembly. The module panel includes multiple SIP modules, and the sputtering pre-attachment assembly includes a first sputtering adhesive film, which is attached to the bottom of the module panel.

2. The SIP module structure for reducing sputtering debris according to claim 1, characterized in that, The first sputtered adhesive film is a high-temperature adhesive film.

3. The SIP module structure for reducing sputtering debris according to claim 1, characterized in that, The sputtering pre-attachment assembly also includes a second sputtering adhesive film, and the SIP module with the first sputtering adhesive film is attached to the second sputtering adhesive film.

4. The SIP module structure for reducing sputtering debris according to claim 3, characterized in that, The adhesion between the second sputtered adhesive film and the first sputtered adhesive film is greater than the adhesion between the first sputtered adhesive film and the SIP module.

5. The SIP module structure for reducing sputtering debris according to claim 4, characterized in that, The first sputtered adhesive film is a single-sided high-temperature adhesive film, and the second sputtered adhesive film is a double-sided high-temperature adhesive film.

6. The SIP module structure for reducing sputtering debris according to claim 1, characterized in that, The SIP module includes a bottom pad, a ground copper layer, a substrate, and a molding compound. The bottom pad is located at the bottom of the substrate, the ground copper layer is embedded in the substrate, and the molding compound covers the outer periphery of the device on the substrate.

7. The SIP module structure for reducing sputtering debris according to claim 6, characterized in that, The substrate is an organic substrate or a ceramic substrate.

8. The SIP module structure for reducing sputtering debris according to claim 6, characterized in that, The bottom pad is a copper pad.

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