Bag opening device used before silicon wafer feeding

Abstract

According to the bag opening device before silicon wafer feeding, full automation of the whole full-automatic box opening and feeding process can be achieved, feeding and discharging are conducted through a robot, and plastic bags and dust-free paper packages on silicon wafers are automatically removed. Aiming at the mode of manual box and bag opening and feeding, the defects of the traditional technology are overcome, the working efficiency is improved, workers are effectively protected from being hurt, and unnecessary expenses are saved for enterprises, the device comprises a base, two bag taking lifting mechanisms are symmetrically arranged at the bottom of the base, and the two bag taking lifting mechanisms are arranged on the base. A bag taking lifting mechanism is arranged at the top of the base, a bag flattening mechanism is arranged between the two bag taking lifting mechanisms, a containing box bottom drawing mechanism is connected to the bag flattening mechanism, a lifting mechanism is arranged at the top of the base, a Bernoulli suction cup set and a clamping jaw mechanism are arranged on the lifting mechanism, the lifting mechanism comprises a linear sliding rail, the linear sliding rail is vertically installed at the top of the base, and the linear sliding rail is connected with the Bernoulli suction cup set and the clamping jaw mechanism. And a lifting servo motor is mounted at the top end of the linear sliding rail.

Description

Technical Field

[0001] This utility model relates to the field of automatic unpacking and loading technology for monocrystalline silicon wafers, and in particular to a special device for automatically removing plastic strips and dust-free paper packaging before automatic unpacking and loading by a robot. Background Technology

[0002] Currently, the first step in solar panel manufacturing is drawing round silicon ingots, followed by squaring them into square bars according to size requirements. These square bars are then sliced, packaged, and transported to a factory with silicon wafer texturing and cleaning equipment. The wafers are then manually unpacked and placed into the wafer forming machine fixture. This process is cumbersome, labor-intensive, and costly. Therefore, there is an urgent need for automated equipment to replace manual labor. During automated equipment operation, the silicon wafers are still wrapped in a plastic bag and lint-free paper, preventing direct placement into the wafer forming machine fixture. A dedicated bag-removing device is required to remove these materials. Only after removing the plastic bag can the wafers be placed into the wafer forming machine for the texturing process.

[0003] Currently, production involves manual unpacking of boxes and removal of plastic bags and dust-free paper packaging. In the future, this process will definitely be automated to replace manual labor. Within the automated unpacking equipment, there must be a dedicated device to remove the packaging of silicon wafers. Utility Model Content

[0004] In view of the deficiencies in the existing technology, the technical problem solved by this utility model is: currently, production relies on manual unpacking of boxes and removal of plastic bags and dust-free paper packaging, so this utility model provides a bag unpacking device before silicon wafer loading.

[0005] To achieve the above objectives, this utility model provides:

[0006] A bag-unpacking device for silicon wafers before loading includes a base, two bag-picking lifting mechanisms symmetrically arranged at the bottom of the base, a bag flattening mechanism arranged between the two bag-picking lifting mechanisms, a box-pulling mechanism connected to the bag flattening mechanism, a lifting mechanism arranged at the top of the base, and a Bernoulli suction cup assembly and a gripper mechanism arranged on the lifting mechanism.

[0007] Preferably, the lifting mechanism includes a linear slide rail, which is vertically mounted on the top of the base. A lifting servo motor is mounted on the top of the linear slide rail, and a ball screw is mounted on the output shaft of the lifting servo motor. The ball screw is rotatably mounted on the linear slide rail, and a linear slider is slidably mounted on the linear slide rail. The linear slider is threadedly connected to the outside of the ball screw.

[0008] Preferably, a bracket is mounted on the outer side of the linear slider, the gripper mechanism is mounted on the bracket, and the Bernoulli suction cup assembly is mounted on the gripper mechanism.

[0009] Preferably, the gripper mechanism comprises, from top to bottom, a third gripper mechanism, a second gripper mechanism and a first gripper mechanism, and the third gripper mechanism, the second gripper mechanism and the first gripper mechanism are all installed on the support.

[0010] Preferably, the Bernoulli chuck group comprises, from top to bottom, a third Bernoulli chuck group, a second Bernoulli chuck group and a first Bernoulli chuck group, and the third Bernoulli chuck group, the second Bernoulli chuck group and the first Bernoulli chuck group are in one-to-one correspondence with the third gripper mechanism, the second gripper mechanism and the first gripper mechanism.

[0011] Preferably, the top of the base is fixedly provided with a silicon wafer placing box, the silicon wafer placing box is located below the Bernoulli chuck group, and the silicon wafer placing box is used for placing a single stack of silicon wafers.

[0012] Preferably, the bag taking and lifting mechanism comprises a support, a clamping hand and a lifting cylinder, the support is installed at the bottom of the base, the lifting cylinder is installed on the support, a clamping hand is installed on the output shaft of the lifting cylinder, and the clamping hand is used for clamping.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] 1. The bag opening mechanism adopts a third Bernoulli chuck group to open the bag, and the whole process is continuous and efficient.

[0015] 2. The bag opening device is provided with a draw plate mechanism at the bottom and a bag taking mechanism at the two sides, the packaging belt is taken out from the bottom and can directly fall onto the conveying belt, the whole action is from top to bottom, and is continuous and efficient.

[0016] 3. The bag opening device is provided with a double-roller flattening mechanism at the bottom, the plastic bag is flattened through the gap of the roller when being taken out, and the subsequent collection is facilitated.

[0017] The utility model can realize complete automation of the whole automatic box opening and feeding process, uses a robot to feed and discharge, and automatically opens and removes the plastic bag and the dust-free paper package on the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic view of the main structure of the design;

[0019] Figure 2 It is a schematic view of the plane structure of the design; Figure 1

[0020] It is a schematic view of the plane structure of the design; Figure 3 Figure 2 ​Cross-sectional view along direction A;

[0021] Figure 4 For this design Figure 2 A schematic diagram of the side view structure;

[0022] Figure 5 This is a schematic diagram of the packaging plastic bags, packaging dust-free paper, and stacked silicon wafers in this design.

[0023] In the diagram: 1. Base; 2. Silicon wafer placement box; 3. First-stage Bernoulli suction cup assembly; 4. Second-stage Bernoulli suction cup assembly; 5. Third-stage Bernoulli suction cup assembly; 6. Lifting servo motor; 7. Third-stage gripper mechanism; 8. Second-stage gripper mechanism; 9. First-stage gripper mechanism; 10. Bag lifting mechanism; 11. Placement box bottom-pulling mechanism; 12. Bag flattening mechanism; 13. Linear slider; 14. Linear slide rail; 15. Ball screw; 16. Packaging plastic bag; 17. Packaging dust-free paper; 18. Single stack of silicon wafers; 19. Support. Detailed Implementation

[0024] The embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0025] See Figures 1-5 As shown, a bag-unpacking device for silicon wafers before loading includes a base 1. Two bag-lifting mechanisms 10 are symmetrically arranged at the bottom of the base 1. A bag flattening mechanism 12 is arranged between the two bag-lifting mechanisms 10. A box-pulling mechanism 11 is connected to the bag flattening mechanism 12. A lifting mechanism is arranged at the top of the base 1. A Bernoulli suction cup assembly and a gripper mechanism are arranged on the lifting mechanism. A silicon wafer box 2 is fixedly installed on the top of the base 1. The silicon wafer box 2 is located below the Bernoulli suction cup assembly and is used to place a single stack of silicon wafers 18.

[0026] In this embodiment, the lifting mechanism includes a linear slide rail 14, which is vertically mounted on the top of the base 1. A lifting servo motor 6 is mounted on the top of the linear slide rail 14. A ball screw 15 is mounted on the output shaft of the lifting servo motor 6. The ball screw 15 is rotatably mounted on the linear slide rail 14. A linear slider 13 is slidably mounted on the linear slide rail 14. The linear slider 13 is threaded to the outside of the ball screw 15. A bracket 19 is mounted on the outside of the linear slider 13. The gripper mechanism is mounted on the bracket 19. The Bernoulli suction cup assembly is mounted on the gripper mechanism.

[0027] In this embodiment, the gripper mechanism includes a three-stage gripper mechanism 7, a two-stage gripper mechanism 8, and a one-stage gripper mechanism 9 from top to bottom. The three-stage gripper mechanism 7, the two-stage gripper mechanism 8, and the one-stage gripper mechanism 9 are all mounted on the bracket 19.

[0028] In this embodiment, the Bernoulli chuck group comprises, from top to bottom, a three-stage Bernoulli chuck group 5, a two-stage Bernoulli chuck group 4 and a one-stage Bernoulli chuck group 3, which are in one-to-one correspondence with the three-stage clamping jaw mechanism 7, the two-stage clamping jaw mechanism 8 and the one-stage clamping jaw mechanism 9.

[0029] In this embodiment, the bag taking lifting mechanism 10 comprises a bracket, a clamping hand and a lifting cylinder, the bracket is installed at the bottom of the base 1, the lifting cylinder is installed on the bracket, the output shaft of the lifting cylinder is provided with the clamping hand, and the clamping hand is used for clamping.

[0030] Working mode: first, the robot places a single stack of silicon wafers 18 in the bag opening device silicon wafer placing box 2, the lifting servo motor 6 drives the ball screw 15 to drive the Bernoulli chuck group and the clamping jaw mechanism to rise to the top of the silicon wafer placing box 2, first, the one-stage clamping jaw mechanism 9 drives the one-stage Bernoulli chuck group 3 to clamp, then the one-stage Bernoulli chuck group 3 is ventilated to generate negative pressure, and the side of the packaging plastic bag 16 is sucked, then the mechanism as a whole is lowered by one pitch, the two-stage clamping jaw mechanism 8 drives the two-stage Bernoulli chuck group 4 to clamp, then the two-stage Bernoulli chuck group 4 is ventilated to generate negative pressure, and the side of the packaging plastic bag 16 is sucked, then the mechanism as a whole is lowered by one pitch, at this time, the plastic bag has been pulled to the lower side of the silicon wafer, and the packaging dust-free paper 17 is exposed, then the three-stage clamping jaw mechanism 7 drives the three-stage Bernoulli chuck group 5 to clamp, the three-stage Bernoulli chuck group 5 is ventilated to generate negative pressure, and the side of the dust-free paper is sucked, then the three-stage clamping jaw mechanism 7 drives the three-stage Bernoulli chuck group 5 to open, the dust-free paper is separated from the silicon wafer, the single stack of silicon wafers exposes the robot clamping jaw grabbing space on both sides, the robot takes away the whole stack of silicon wafers, then the placing box bottom opening mechanism 11 is opened, the bag taking lifting mechanism 10 clamps the two sides of the plastic bag, the three-stage clamping jaw mechanism 7 drives the three-stage Bernoulli chuck group 5 to clamp, all the Bernoulli chucks are disconnected from the negative pressure, the lifting mechanism rises, the bag taking lifting mechanism 10 is lowered, the packaging plastic bag 16 is pulled down, the plastic bag is flattened through the bag flattening mechanism 12, then the bag taking lifting mechanism 10 clamping jaw is opened, the plastic bag is dropped, and one working process is completed.

[0031] The utility model not only is limited to the above best implementation, anyone can draw other various forms of product under the enlightenment of the utility model, but no matter makes any change in its shape or structure, all have the same or similar technical scheme with the utility model, are in its protection scope.

Claims

1. A bag opening device for silicon wafer before loading, comprising a base (1), characterized in that: The bottom of the base (1) is symmetrically provided with two bag taking lifting mechanisms (10), and a bag flattening mechanism (12) is arranged between the two bag taking lifting mechanisms (10), and a placing box bottom pulling mechanism (11) is connected to the bag flattening mechanism (12), and the top of the base (1) is provided with a lifting mechanism, and a Bernoulli suction disc group and a jaw mechanism are arranged on the lifting mechanism.

2. The device for unpacking the bags of silicon wafers before loading according to claim 1, characterized in that: The lifting mechanism comprises a linear slide rail (14), the linear slide rail (14) is vertically installed at the top of the base (1), the top end of the linear slide rail (14) is provided with a lifting servo motor (6), the output shaft of the lifting servo motor (6) is provided with a ball screw (15), the ball screw (15) is rotatably installed on the linear slide rail (14), and a linear slide block (13) is slidably installed on the linear slide rail (14). The linear slide block (13) is threadedly connected to the outer side of the ball screw (15).

3. The device for unpacking the bags of silicon wafers before loading according to claim 2, characterized in that: The outer side of the linear slide block (13) is provided with a support (19), the jaw mechanism is installed on the support (19), and the Bernoulli suction disc group is installed on the jaw mechanism.

4. The device for unpacking the bags of silicon wafers before loading according to claim 3, characterized in that: The jaw mechanism comprises a three-stage jaw mechanism (7), a two-stage jaw mechanism (8) and a one-stage jaw mechanism (9) from top to bottom, and the three-stage jaw mechanism (7), the two-stage jaw mechanism (8) and the one-stage jaw mechanism (9) are all installed on the support (19).

5. The device for unpacking the bags of silicon wafers before loading according to claim 4, characterized in that: The Bernoulli suction disc group comprises a three-stage Bernoulli suction disc group (5), a two-stage Bernoulli suction disc group (4) and a one-stage Bernoulli suction disc group (3) from top to bottom, and the three-stage Bernoulli suction disc group (5), the two-stage Bernoulli suction disc group (4) and the one-stage Bernoulli suction disc group (3) are one-to-one corresponding to the three-stage jaw mechanism (7), the two-stage jaw mechanism (8) and the one-stage jaw mechanism (9).

6. The device for unpacking the bags of silicon wafers before loading according to claim 1, characterized in that: The top of the base (1) is fixedly provided with a silicon wafer placing box (2), and the silicon wafer placing box (2) is located below the Bernoulli suction disc group.

7. The device for unpacking bags before loading silicon wafers according to claim 1, characterized in that: The bag taking lifting mechanism (10) comprises a support, a clamping hand and a lifting cylinder, the support is installed at the bottom of the base (1), the lifting cylinder is installed on the support, and the output shaft of the lifting cylinder is provided with the clamping hand.

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