Chip deviation rectifying device and chip testing equipment

Abstract

The utility model provides a chip deviation rectifying device and chip testing equipment, and relates to the technical field of chip testing. According to the utility model, the first driving member and the adsorption rod of the rotating mechanism are arranged in a staggered manner along the vertical direction, and the first driving member and the adsorption rod are connected through the connecting assembly, so that the first driving member drives the connecting assembly to drive the adsorption rod to rotate, thereby adjusting the position of the tested chip. Equivalently, the first driving part and the adsorption rod are made into a split type, then the adsorption rod is driven by the second driving part to move up and down, and the second driving part does not need to drive the rotating mechanism to move up and down, so that the burden of the second driving part is relieved, and the driving precision of the second driving part can be improved on the basis of realizing rotary adjustment of the adsorption rod; the moving distance of the adsorption rod is accurately controlled, and the chip is prevented from being crushed.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, in particular to a kind of chip deviation rectifying device and chip testing equipment. BACKGROUND

[0002] At present, in the chip testing process, before chip enters test, the relative position of chip position and test probe needs to be guaranteed accurate, if chip position and test probe position are misaligned, it will cause test probe to be skew, lead to test exception, and it will cause appearance damage to chip.

[0003] Chip deviation rectifying device is to correct the position of chip before chip test, so that the position of chip is accurate and unified.The common correction mode in market is mechanical correction mechanism, and mechanical correction mechanism is used to position chip to edge.Mechanical correction mechanism is relatively simple in structure, but it has obvious shortcomings, and when positioning to edge, the edge will contact the edge of chip, there is risk of causing damage to the edge of chip, and mechanical correction mechanism is more troublesome to change, and it is difficult to be compatible with multiple chip sizes.

[0004] In addition, there is also a scheme of adsorbing chip to adjust position in prior art, in order to adjust the rotation angle of chip, linear motor is usually arranged on the top of adsorption rod to drive adsorption rod to rotate, and linear motor is additionally used to drive adsorption rod and linear motor to move up and down.In this scheme, since the weight of adsorption rod and linear motor is large, the precision of chip movement cannot be controlled, so that there is risk of crushing chip in the process of adsorption rod contacting chip. SUMMARY

[0005] One object of the utility model is to provide a kind of chip deviation rectifying device, solve the technical problem that chip is easily crushed in prior art when adsorption rod contacts chip.

[0006] A further object of the utility model is to improve the accuracy of visual positioning.

[0007] Another object of the utility model is to provide a kind of chip testing equipment with the above-mentioned chip deviation rectifying device.

[0008] Particularly, the utility model provides a kind of chip deviation rectifying device, including at least one position adjusting module, each position adjusting module includes:

[0009] adsorption rod, the bottom of which is provided with a suction nozzle for adsorbing the measured chip;

[0010] The rotating mechanism comprises a first driving member and a connecting assembly, the first driving member is arranged vertically offset from the adsorption rod, the connecting assembly is connected with the first driving member and the adsorption rod respectively, and the first driving member is configured to drive the connecting assembly to rotate the adsorption rod under control, so as to adjust the position of the measured chip.

[0011] A second driving member is arranged above the adsorption rod and connected with the adsorption rod, and the second driving member is configured to drive the adsorption rod to move up and down under control.

[0012] Optionally, the connecting assembly comprises:

[0013] A first synchronous wheel is sleeved on the output shaft of the first driving member;

[0014] A second synchronous wheel is sleeved on the adsorption rod;

[0015] A synchronous belt is sleeved on the first synchronous wheel and the second synchronous wheel, so as to rotate when the first synchronous wheel follows the rotation of the output shaft of the first driving member, thereby driving the second synchronous wheel to rotate the adsorption rod.

[0016] Optionally, the connecting assembly further comprises:

[0017] A spline structure comprises a spline sleeve connected with the second synchronous wheel, the spline sleeve is connected with the adsorption rod, and the adsorption rod is configured to rotate with the spline sleeve and move up and down relative to the spline sleeve.

[0018] Optionally, the second driving member is a torque motor.

[0019] Optionally, further comprising:

[0020] A torque adjustment module is arranged below the position adjustment module, the torque adjustment module comprises a pressure sensor, the adsorption rod is configured to move downward to abut against the pressure sensor under the driving of the second driving member, until the pressure value of the pressure sensor reaches a preset value, so that the second driving member obtains driving data adapted to the preset value.

[0021] Optionally, the torque adjustment module further comprises:

[0022] A first XY adjustment module is arranged above the pressure sensor, and the first XY adjustment module is used to adjust the position of the pressure sensor along the X-axis and the Y-axis under control.

[0023] Optionally, further comprising a top plate; each position adjustment module further comprises:

[0024] A second XY adjusting module is installed on the top plate and connected with the adsorption rod, and is configured to adjust the position of the adsorption rod along the X-axis and the Y-axis under control.

[0025] Optionally, the second XY adjusting module comprises a second Y-axis adjusting member.

[0026] A visual detection assembly comprises a light source, a lens and a camera, the lens and the camera are both connected below the top plate, the light source is connected with the second Y-axis adjusting member and arranged opposite to the lens.

[0027] Optionally, the light source is a corner light source, and the light source, the lens and the camera are arranged in sequence along the Y-axis direction.

[0028] In particular, the utility model also provides a chip testing device, including above-mentioned chip deviation rectifying device.

[0029] In the utility model, the first driving part of the rotating mechanism and the adsorption rod are arranged in vertical staggered mode, the first driving part and the adsorption rod are connected through the connecting assembly, the first driving part drives the connecting assembly to drive the adsorption rod to rotate, so as to adjust the position of the measured chip. It is equivalent to making the first driving part and the adsorption rod into a split type, and then driving the adsorption rod to move up and down through the second driving part, and the second driving part does not need to drive the rotating mechanism to move up and down, so as to reduce the burden of the second driving part. On the basis of realizing the rotation adjustment of the adsorption rod, the driving precision of the second driving part can be improved, the moving distance of the adsorption rod is accurately controlled, and the chip is prevented from being damaged.

[0030] Further, the second XY adjusting module comprises a Y-axis adjusting member, and the chip deviation rectifying device further comprises a visual detection assembly, the visual detection assembly comprises a light source, a lens and a camera, the lens and the camera are both connected below the top plate, the light source is connected with the Y-axis adjusting member and arranged opposite to the lens. The Y-axis adjusting member drives the light source to move above the measured chip first, obtains the position of the chip, and then the second XY adjusting assembly drives the adsorption rod to move above the measured chip to adsorb the chip, so as to realize the avoidance of taking the material. This avoidance design only moves the light source, does not move the camera and the lens, can improve the visual positioning precision, and prevents the photographing error caused by the structure shaking.

[0031] The above and other objects, advantages and features of the present utility model will become more apparent from the following detailed description of the preferred embodiments thereof, when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0032] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are by way of illustration and not limitation. The same or similar reference signs denote the same or similar components or parts throughout the drawings. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0033] Figure 1 is a schematic structural diagram of a chip deviation rectifying device according to an embodiment of the present application;

[0034] Figure 2 is Figure 1 a schematic structural diagram of a position adjusting module in the chip deviation rectifying device shown in the figure;

[0035] Figure 3 is Figure 2 a schematic structural diagram of a rotating mechanism in the position adjusting module shown in the figure;

[0036] Figure 4 is Figure 1 a schematic structural diagram of a torque adjusting module in the chip deviation rectifying device shown in the figure;

[0037] Figure 5 is Figure 2 a schematic side view of the position adjusting module shown in the figure.

[0038] Reference signs:

[0039] 100 - chip deviation rectifying device, 10 - position adjusting module, 20 - torque adjusting module, 30 - visual detection assembly, 40 - ion fan, 11 - adsorption rod, 111 - suction nozzle, 12 - second driving member, 13 - second XY adjusting module, 131 - second X-axis adjusting member, 132 - second Y-axis adjusting member, 14 - rotating mechanism, 141 - first driving member, 142 - connecting assembly, 143 - first synchronous wheel, 144 - synchronous belt, 145 - second synchronous wheel, 15 - top plate, 21 - pressure sensor, 22 - first XY adjusting module, 221 - first Y-axis adjusting member, 222 - first X-axis adjusting member, 23 - support, 31 - light source, 32 - lens, 33 - camera, 34 - electric sliding table. DETAILED DESCRIPTION

[0040] Embodiments of the present application will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.

[0041] In the description of the utility model, it is understood that the terms "upper", "lower", "front", "rear" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0042] The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features, that is, one or more of the features. In the description of the utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and can further include other features are not excluded.

[0043] Unless otherwise specified and limited, the terms "connection", "installation" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the utility model according to the specific circumstances.

[0044] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the embodiments have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0045] Figure 1 is a schematic structural diagram of the chip deviation rectifying device 100 according to an embodiment of the utility model, Figure 2 is Figure 1 is a schematic structural diagram of the position adjusting module 10 in the chip deviation rectifying device 100 shown in the figure, Figure 3 is Figure 2 is a schematic structural diagram of the rotating mechanism 14 in the position adjusting module 10 shown in the figure. As Figures 1 to 3As shown, in one preferred embodiment, the chip rectification device 100 comprises a position adjustment module 10, which comprises an adsorption rod 11, a rotating mechanism 14 and a second driving member 12. The bottom of the adsorption rod 11 is provided with a suction nozzle 111 for adsorbing the measured chip. The rotating mechanism 14 comprises a first driving member 141 and a connecting assembly 142, the first driving member 141 is arranged vertically staggered with the adsorption rod 11, the connecting assembly 142 is connected with the first driving member 141 and the adsorption rod 11 respectively, and the first driving member 141 is arranged to drive the connecting assembly 142 to rotate the adsorption rod 11 under control, so as to adjust the position of the measured chip. The second driving member 12 is arranged above the adsorption rod 11 and connected with the adsorption rod 11, and the second driving member 12 is arranged to drive the adsorption rod 11 to move up and down under control. Here, the vertical direction is the Z-axis direction. The first driving member 141 and the adsorption rod 11 are arranged vertically staggered, the second driving member 12 is arranged up and down with the adsorption rod 11 along the Z-axis direction, and the first driving member 141 is arranged parallel to the second driving member 12.

[0046] This embodiment is equivalent to making the first driving member 141 and the adsorption rod 11 into a split type, and then driving the adsorption rod 11 to move up and down through the second driving member 12, so that the second driving member 12 does not need to drive the rotating mechanism 14 to move up and down, thereby reducing the burden of the second driving member 12, improving the driving accuracy of the second driving member 12 on the basis of realizing the rotation adjustment of the adsorption rod 11, accurately controlling the movement distance of the adsorption rod 11, and avoiding damaging the chip. In addition, this embodiment adopts the suction nozzle 111 adsorption mode, which can be compatible with chips of many sizes, and has better compatibility than the external shape positioning.

[0047] In some specific embodiments, the chip rectification device 100 comprises two position adjustment modules 10, which are completely independent and can simultaneously adjust the positions of two measured chips, thereby improving the chip testing efficiency. In other embodiments, the number of position adjustment modules 10 can also be designed according to specific needs.

[0048] In some embodiments, the connecting assembly 142 comprises a first synchronous wheel 143, a second synchronous wheel 145 and a synchronous belt 144, and the first synchronous wheel 143 is sleeved on the output shaft of the first driving member 141. The second synchronous wheel 145 is sleeved on the adsorption rod 11. The synchronous belt 144 is sleeved on the first synchronous wheel 143 and the second synchronous wheel 145, so as to follow the rotation of the first synchronous wheel 143 when the first driving member 141 rotates, thereby driving the second synchronous wheel 145 to rotate the adsorption rod 11. Referring to Figure 3The connecting assembly 142 is arranged along the Y-axis direction, and the length of the synchronous belt 144 is designed to adapt to the adjustment of the distance between the first driving member 141 and the adsorption rod 11. In other embodiments, the connecting assembly 142 can also be designed as other structures, such as a gear and a rack.

[0049] In some embodiments, the connecting assembly 142 further comprises a spline structure, which comprises a spline sleeve connected with the second synchronous wheel 145, the spline sleeve is connected with the adsorption rod 11, the adsorption rod 11 is arranged to rotate with the spline sleeve and move up and down relative to the spline sleeve. The second synchronous wheel 145 is fixed on the spline sleeve by a fixing member. In this embodiment, the spline structure can realize that the second synchronous wheel 145 can drive the adsorption rod 11 to rotate, and the adsorption rod 11 can move up and down relative to the second synchronous wheel 145 under the drive of the second driving member 12.

[0050] In some embodiments, the second driving member 12 is a torque motor. The torque motor can adjust the torque output for different thicknesses of chips, so as to accurately control the distance of the adsorption rod 11 moving downward, control the pressure of contacting the measured chip, realize soft landing of picking and placing, and avoid crushing the chip. The linear motor used in the prior art can only realize point-to-point movement, and when different thicknesses of chips are used, due to the different thicknesses, the point-to-point movement may exist the risk of crushing the chip. Therefore, compared with the linear motor used in the prior art, the torque motor of this embodiment can be adapted to different thicknesses of chips, reducing the risk of crushing the chip. In other embodiments, the second driving member 12 can also be a servo motor.

[0051] Figure 4 is Figure 1 Fig. 6 shows a schematic structural diagram of the torque adjustment module 20 in the chip deviation correction device 100. As shown in Figure 4 In some embodiments, the chip deviation correction device 100 further comprises a torque adjustment module 20, the torque adjustment module 20 is arranged below the position adjustment module 10, the torque adjustment module 20 comprises a pressure sensor 21, the adsorption rod 11 is arranged to move downward to abut against the pressure sensor 21 under the drive of the second driving member 12, until the pressure value of the pressure sensor 21 reaches a preset value, so that the second driving member 12 obtains driving data adapted to the preset value. Here, first, the preset pressure value of the pressure sensor 21 is set, the adsorption rod 11 abuts against the pressure sensor 21 to apply pressure to the pressure sensor 21 until the preset pressure value is reached, at this time the second driving member 12 converts the preset pressure value into a current feedback value, so as to control the distance of the adsorption rod 11 moving downward according to the current feedback value. In this embodiment, when different thicknesses of measured chips are used, the torque output of the torque motor can be adjusted by the torque adjustment module 20 to ensure the downward pressure of the suction nozzle 111, and the pressure can be adjusted online according to different products to avoid crushing the chip.

[0052] In some embodiments, the torque adjustment module 20 further comprises a first XY adjustment module 22, and the pressure sensor 21 is mounted on the first XY adjustment module 22. The first XY adjustment module 22 is configured to adjust the position of the pressure sensor 21 along the X-axis and the Y-axis in a controlled manner. In this embodiment, when the torque output of the second driving member 12 needs to be adjusted, the first XY adjustment module 22 is used to move the pressure sensor 21 to the lower side of the adsorption rod 11. After the torque output adjustment is completed, the first XY adjustment module 22 is used to move the pressure sensor 21 away. Normally, the lower side of the adsorption rod 11 is provided with a test seat for testing the measured chip. The adsorption rod 11 takes the measured chip from the test seat. After the position adjustment of the measured chip is completed, the test seat is moved to the next work station. When there is no test seat under the adsorption rod 11, the first XY adjustment module 22 is controlled to move the pressure sensor 21 to the lower side of the adsorption rod 11.

[0053] In some embodiments, the first XY adjustment module 22 comprises a bracket 23, a first X-axis adjustment member 222, and a first Y-axis adjustment member 221. The first X-axis adjustment member 222 is mounted on the bracket 23 along the X-axis direction. The first Y-axis adjustment member 221 is mounted on the first X-axis adjustment member 222 along the Y-axis direction. The pressure sensor 21 is mounted on the first Y-axis adjustment member 221. See Figure 4 .

[0054] In some embodiments, the chip deviation correction device 100 further comprises a top plate 15, and each position adjustment module 10 further comprises a second XY adjustment module 13. The second XY adjustment module 13 is mounted on the top plate 15 and connected with the adsorption rod 11. The second XY adjustment module 13 is configured to adjust the position of the adsorption rod 11 along the X-axis and the Y-axis in a controlled manner. Here, the first driving member 141, the rotating mechanism 14, and the adsorption rod 11 are all mounted on the front side of the second XY adjustment module 13.

[0055] In some embodiments, the second XY adjustment module 13 comprises a second Y-axis adjustment member 132 arranged along the Y-axis direction. The chip deviation correction device 100 further comprises a visual detection assembly 30 comprising a light source 31, a lens 32, and a camera 33. The lens 32 and the camera 33 are both connected below the top plate 15. The light source 31 is connected with the second Y-axis adjustment member 132 and arranged opposite to the lens 32. In this embodiment, the second Y-axis adjustment member 132 first moves the light source 31 to the upper side of the measured chip to obtain the position of the chip. Then, the second XY adjustment assembly moves the adsorption rod 11 to the upper side of the measured chip to adsorb the chip, thereby achieving the pick-and-place operation. This design only moves the light source 31 and does not move the camera 33 and the lens 32, which can improve the visual positioning accuracy and prevent the shooting error caused by structural vibration.

[0056] The embodiment uses the visual detection assembly 30 to suck the measured chip, and corrects and positions the position of the measured chip, which is more flexible, and sucks the front surface of the measured chip, without causing any damage to the edge of the measured chip.

[0057] In some embodiments, the second XY adjustment module 13 further comprises a second X-axis adjustment piece 131 arranged along the X-axis direction, the second X-axis adjustment piece 131 being installed on the front side of the second Y-axis adjustment piece 132 and connected with the first driving piece 141 and the second driving piece 12.

[0058] Figure 5 is Figure 2 The schematic side view of the position adjustment module 10 is shown. As Figure 5 In some embodiments, the light source 31 is a corner light source 31, and the light source 31, the lens 32, and the camera 33 are arranged along the Y-axis direction in sequence. Here, the light source 31 is arranged along the Z-axis direction, and the light source 31 can achieve a 90° corner, Figure 5 The arrow direction in the figure is the visual acquisition path of the camera 33 through the light source 31 to acquire the position of the chip.

[0059] In a preferred embodiment, the visual detection assembly 30 further comprises an electric sliding table 34 connected with the camera 33, which can perform micro compensation of the focal length of the camera 33 according to chips of different thicknesses, has better compatibility, and has higher stability.

[0060] In some embodiments, the chip correction device 100 further comprises an ion fan 40 for removing static electricity on the measured chip.

[0061] The chip correction process in this embodiment is as follows: first, the test seat carrying the measured chip moves to the lower side of the chip correction device 100, the second Y-axis adjustment piece 132 first drives the visual detection assembly 30 to move to the upper side of the measured chip to perform photographing positioning on the measured chip. After positioning is completed, the second Y-axis adjustment piece 132 drives the adsorption rod 11 to move to the upper side of the measured chip, and then the second driving piece 12 drives the adsorption rod 11 to press down to adsorb the measured chip, and then performs micro adjustment in the X-axis, Y-axis, and R-axis directions according to the position compensation value fed back by the visual detection assembly 30, adjusts the measured chip to the test seat after adjustment is completed, and completes the entire correction process.

[0062] The embodiment further provides a chip test device, which comprises the above-mentioned chip correction device 100. For the chip correction device 100, details are not repeated here.

[0063] Up to now, the person skilled in the art should recognize that, although the multiple exemplary embodiments of the utility model have been shown and described in detail herein, many other variants or modifications conforming to the principles of the utility model can still be directly determined or deduced according to the content disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.

Claims

1. A chip deviation correcting device, characterized by comprising: comprise at least one position adjusting module, each of the position adjusting modules comprising: a suction rod having a suction nozzle at a bottom thereof for suctioning a chip to be measured; a rotating mechanism comprising a first driving member and a connecting assembly, the first driving member being vertically staggered with the suction rod, the connecting assembly being connected with the first driving member and the suction rod respectively, the first driving member being configured to drive the connecting assembly to rotate the suction rod, thereby adjusting a position of the chip to be measured; a second driving member being disposed above the suction rod and connected with the suction rod, the second driving member being configured to drive the suction rod to move up and down.

2. The chip deviation correcting apparatus according to claim 1, wherein the connecting assembly comprising: a first synchronous wheel being sleeved on an output shaft of the first driving member; a second synchronous wheel being sleeved on the suction rod; a synchronous belt being sleeved on the first synchronous wheel and the second synchronous wheel, so as to rotate following the first synchronous wheel when the first driving member rotates, thereby driving the second synchronous wheel to rotate the suction rod.

3. The chip deviation correcting apparatus according to claim 2, wherein the connecting assembly further comprising: a spline structure comprising a spline sleeve connected with the second synchronous wheel, the spline sleeve being connected with the suction rod, the suction rod being configured to rotate following the spline sleeve and move up and down relative to the spline sleeve.

4. The chip deviation correcting device according to any one of claims 1-3, wherein: the second driving member is a torque motor.

5. The chip deviation correcting apparatus according to claim 4, wherein further comprising: a torque adjusting module being disposed below the position adjusting module, the torque adjusting module comprising a pressure sensor, the suction rod being configured to move down to abut against the pressure sensor under the driving of the second driving member, until a pressure value of the pressure sensor reaches a preset value, so that the second driving member obtains driving data adapted to the preset value.

6. The chip deviation correcting apparatus according to claim 5, wherein the torque adjusting module further comprising: a first XY adjusting module having the pressure sensor mounted thereon, the first XY adjusting module being configured to adjust positions of the pressure sensor along X and Y axes.

7. The chip deviation correcting apparatus according to any one of claims 1 to 3, wherein further comprising a top plate, each of the position adjusting modules further comprising: a second XY adjusting module being mounted on the top plate and connected with the suction rod, the second XY adjusting module being configured to adjust positions of the suction rod along X and Y axes.

8. The chip deviation correcting apparatus according to claim 7, wherein the second XY adjusting module comprising a second Y-axis adjusting member; each of the position adjusting modules further comprising: a visual detection assembly comprising a light source, a lens and a camera, the lens and the camera being connected below the top plate, the light source being connected with the second Y-axis adjusting member and being arranged opposite to the lens.

9. The chip deviation correcting device according to claim 8, wherein: the light source is a corner light source, the light source, the lens and the camera being arranged along the Y axis in sequence.

10. A chip testing apparatus characterized by comprising: comprising the chip deviation correcting device according to any one of claims 1-9.

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