Optical module, optical communication equipment and optical communication system

Abstract

The embodiment of the utility model provides an optical module, optical communication equipment and an optical communication system, which are used for reducing the influence of cavity resonance in the optical module on optical signal receiving and transmitting of an optical device. According to the scheme, the metal shell is connected with the machine frame of the optical communication equipment, and the machine frame of the optical communication equipment is connected with the outer frame of the rack, so that the connection between the optical assembly and the metal shell can be considered as the grounding of the optical assembly, and the grounding of the optical assembly is increased by increasing the electric connection between the optical assembly and the metal shell; gND backflow of the optical assembly is enhanced, electromagnetic interference caused by cavity resonance in the optical module is further shielded, and therefore the optical signal receiving and transmitting efficiency of the optical assembly is improved.

Description

Technical Field

[0001] This application relates to the field of optical communication, and more particularly to an optical module, optical communication equipment, and optical communication system. Background Technology

[0002] With the continuous development of optical transmission technology, optical modules integrate a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA). To prevent external electromagnetic interference from affecting the operation of the TOSA and ROSA, the outer casing of optical modules is mostly made of metal.

[0003] However, within a metal casing, when the wavelength of the internal electromagnetic waves meets certain conditions, the electromagnetic waves will continuously reflect and interfere within the casing, thus forming cavity resonance. In the context of optical modules, the radiation generated by the TOSA or other devices inside the optical module excites the cavity resonance within the module's casing, interfering with the signal in the ROSA and affecting the receiving sensitivity of the ROSA in the optical module. Utility Model Content

[0004] This application provides an optical module, an optical communication device, and an optical communication system to reduce the impact of cavity resonance in the optical module on the received and emitted signals of the optical device.

[0005] In a first aspect, this application provides an optical module, including an optical component, a flexible printed circuit board (FPC), a circuit board, and a metal housing. The FPC includes at least two grounding areas, and the circuit board includes a first wire grounding terminal (GND).

[0006] The optical component is electrically connected to the FPC and is used to receive or transmit optical signals.

[0007] The FPC is electrically connected to the circuit board. The first grounding area of ​​the FPC is electrically connected to the first GND. The first grounding area of ​​the FPC is included in at least two grounding areas. The second grounding area of ​​the FPC is electrically connected to the metal casing. The second grounding area of ​​the FPC is included in at least two grounding areas.

[0008] In this embodiment, the metal casing of the optical module is physically connected to the optical communication device during assembly. The optical communication device has a grounding wire and is also connected to the outer frame of the rack. Therefore, the metal casing of the optical module has grounding conditions. In the proposed solution, instead of using the first GND electrical connection between the optical component and the circuit board via the FPC as the grounding solution, the electrical connection between the optical component and the metal casing is increased to enhance the grounding of the optical component, strengthen the GND return current of the optical component, further shield the electromagnetic interference caused by cavity resonance in the optical module, and thus improve the transmission and reception efficiency of the optical component for optical signals.

[0009] In one possible implementation of the first aspect, the second grounding region of the FPC is a bright copper region of the first plane of the FPC;

[0010] The second grounding area of ​​the FPC is electrically connected to the metal casing, including the bright copper area of ​​the first plane of the FPC being in physical contact with the metal casing.

[0011] In this embodiment, by making the second region of the FPC a bright copper region and making the bright copper region physically contact the metal casing of the optical module, more grounding of the optical component is achieved. The implementation method is simple and does not require additional space within the optical module.

[0012] In one possible implementation of the first aspect, the optical module further includes foam;

[0013] The first plane of the foam is in contact with the first area of ​​the second plane of the FPC, the second plane of the foam is in contact with the first plane of the metal shell, the first plane of the foam is parallel to the second plane of the foam, the second plane of the FPC is parallel to the first plane of the FPC, the first plane of the metal shell is located inside the metal shell and is parallel to the second plane of the FPC, the first plane of the metal shell and the second plane of the FPC compress the foam, causing the foam to deform.

[0014] In this embodiment, by adding extra foam to the back side of the bright copper area of ​​the FPC at the contact area between the FPC and the metal casing, the connection stability of the second grounding area between the metal casing and the FPC is increased by the compression of the foam by the metal casing and the FPC, and the risk of physical disconnection between the second grounding area of ​​the metal casing and the FPC is reduced.

[0015] In one possible implementation of the first aspect, the first plane of the FPC further includes an adhesive region, which is connected to the metal housing by an adhesive.

[0016] In this embodiment of the application, it is proposed that the connection between the second grounding area of ​​the FPC and the metal casing can be fixed by bonding between the first plane of the FPC and the metal casing, which can reduce the risk of physical disconnection between the metal casing and the second grounding area of ​​the FPC.

[0017] In one possible implementation of the first aspect, the second grounding region of the FPC is a bright copper region of the first plane of the FPC;

[0018] The optical module also includes conductive foam;

[0019] The first plane of the conductive foam is in physical contact with the bright copper area of ​​the first plane of the FPC, and the second plane of the conductive foam is in physical contact with the first plane of the metal shell. The first plane of the metal shell is located inside the metal shell. The metal shell and the FPC compress the conductive foam, causing the conductive foam to deform.

[0020] In this embodiment, conductive foam is placed between the FPC and the metal casing. The conductivity and elasticity of the conductive foam allow it to deform between the FPC and the metal casing, which can ensure the connection between the FPC and the metal casing without requiring any changes to other designs of the optical module.

[0021] In one possible implementation of the first aspect, the second plane of the conductive foam is parallel to the first plane of the conductive foam, and the first plane of the metal casing is parallel to the first plane of the FPC.

[0022] The metal casing and the FPC compress the conductive foam, causing the conductive foam to deform. This process involves the first plane of the metal casing and the first plane of the FPC compressing the conductive foam, causing the conductive foam to deform.

[0023] In this embodiment, the compression of the conductive foam by the FPC and the metal casing is made to be compression between parallel planes, ensuring that the compression of the conductive foam by the FPC and the metal casing is more stable and further improving the stability of the grounding structure.

[0024] In one possible implementation of the first aspect, the electrical connection between the second grounding region of the FPC and the metal casing includes the second grounding region being connected to the metal casing via a wire, or the second grounding region being connected to the metal casing by welding.

[0025] In this embodiment, the second grounding area of ​​the FPC and the metal casing can also be connected by welding or wires, which efficiently realizes the grounding connection between the FPC and the metal casing and ensures the stability of the solution.

[0026] In one possible implementation of the first aspect, the first grounding region of the FPC includes a first connector, the first GND includes a second connector, and the electrical connection between the first grounding region and the first GND includes the connection of the first connector and the second connector.

[0027] In this embodiment, the grounding connection between the FPC and the circuit board in the optical module can be achieved by connecting them with a connector. This fully takes into account the large number of lines that need to be connected between the FPC and the circuit board, and can also ensure stable grounding between the FPC and the circuit board.

[0028] In one possible implementation of the first aspect, the optical component includes a first optical emitting component or a first optical receiving component.

[0029] In this embodiment, the optical component can be either an optical transmitter or an optical receiver. By enhancing the GND return current of the optical transmitter, the influence of cavity resonance generated by other devices within the metal housing of the optical module on the optical transmitter is eliminated, thereby improving the signal transmission efficiency of the optical transmitter. Alternatively, by increasing the GND return current of the optical receiver, the influence of cavity resonance generated by other devices within the metal housing of the optical module on the received signal of the optical receiver is eliminated, thereby improving the signal reception efficiency of the optical receiver.

[0030] In one possible implementation of the first aspect, when the optical component includes a first optical receiving component, the optical module further includes a preset FPC and a second optical transmitting component;

[0031] The second optical emitting component is electrically connected to a pre-set FPC;

[0032] The FPC is electrically connected to the circuit board by default.

[0033] In this embodiment, the connection between the FPC and the second optical emitting component and the circuit board can be a common electrical connection method. In this solution, only minor modifications to the optical module are needed to achieve a good isolation effect between transmission and reception.

[0034] A second aspect of this application provides an optical communication device that includes the optical module described in the first aspect or any possible implementation thereof.

[0035] A third aspect of this application provides an optical communication system, which includes the optical communication device provided in the second aspect above.

[0036] The beneficial effects shown in any of the second or third aspects are similar to those of the first aspect or any possible implementation of the first aspect, and will not be repeated here. Attached Figure Description

[0037] Figure 1A schematic diagram of the structure of the optical module provided in this application;

[0038] Figure 2 Another structural schematic diagram of the optical module provided in this application;

[0039] Figure 3 Another structural schematic diagram of the optical module provided in this application;

[0040] Figure 4 Another structural schematic diagram of the optical module provided in this application;

[0041] Figure 5 Another structural schematic diagram of the optical module provided in this application;

[0042] Figure 6 Another structural schematic diagram of the optical module provided in this application;

[0043] Figure 7 Another structural schematic diagram of the optical module provided in this application;

[0044] Figure 8 This is a schematic diagram illustrating one application scenario of the optical module provided in this application. Detailed Implementation

[0045] This application provides an optical module, an optical communication device, and an optical communication system to reduce the impact of cavity resonance in the optical module on the received and emitted signals of the optical device.

[0046] The embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0047] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of units is not necessarily limited to those units, but may include other units not explicitly listed or inherent to those processes, methods, products, or apparatuses. Additionally, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can be expressed as: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0048] With the continuous development of optical transmission technology, optical modules integrate a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA). To prevent external electromagnetic interference from affecting the operation of the TOSA and ROSA, a metal casing is used to isolate the TOSA and ROSA from external electromagnetic signals.

[0049] However, within a metal casing, when the wavelength of the internal electromagnetic waves meets certain conditions, the electromagnetic waves will continuously reflect and interfere within the casing, forming cavity resonance. During the use of the optical module, the radiation generated by the TOSA or other devices inside the optical module excites the cavity resonance within the module casing, which interferes with the signal in the ROSA, thereby affecting the receiving sensitivity of the ROSA in the optical module.

[0050] To address the above issues, the radiation generated by the devices inside the optical module can excite cavity resonance within the module housing, which may occur even in scenarios where only ROSA or TOSA exists in the optical module. Therefore, this application proposes an optical module comprising an optical component, a flexible printed circuit (FPC), a circuit board, and a metal housing. The FPC includes at least two grounding regions, and the circuit board includes a first grounding terminal (GND). The optical component is electrically connected to the FPC, and the FPC is electrically connected to the circuit board. The first grounding region of the FPC is electrically connected to the first GND, and the first grounding region is contained within the at least two grounding regions. The second grounding region of the FPC is electrically connected to the metal housing, and the second grounding region is contained within the at least two grounding regions. By enhancing the GND return current of the optical component, electromagnetic interference caused by cavity resonance in the optical module is further shielded, thereby improving the transceiver efficiency of the optical component.

[0051] The solution provided in this application will be described below with reference to the accompanying drawings. First, in conjunction with... Figure 1 The concept of the optical module provided in this application is introduced.

[0052] like Figure 1 As shown, the optical module 10 includes an optical component 110, an FPC 120, a circuit board 130, and a metal housing 140, wherein the FPC 120 includes at least two grounding areas, and the circuit board 130 includes a first GND 131.

[0053] The optical component 110 is electrically connected to the FPC 120, and the optical component 110 is used to receive or transmit optical signals.

[0054] FPC120 is electrically connected to circuit board 130. The first ground area 121 of FPC120 is electrically connected to first GND 131. The first ground area 121 of FPC is included in at least two ground areas. The second ground area 122 of FPC is electrically connected to metal casing 140. The second ground area 122 of FPC is included in at least two ground areas.

[0055] Since the metal casing of the optical module is physically connected to the optical communication equipment during assembly, and the optical communication equipment has a grounding wire and is also connected to the outer frame of the rack, the metal casing of the optical module has grounding conditions. In the solution proposed in this application, instead of using the first GND electrical connection between the optical component and the FPC on the circuit board as the grounding solution, an electrical connection between the optical component and the metal casing is added to increase the grounding of the optical component, enhance the GND return current of the optical component, further shield the electromagnetic interference caused by cavity resonance in the optical module, and thus improve the transmission and reception efficiency of the optical component for optical signals.

[0056] Based on the above ideas, the electrical connection between the FPC and the metal casing provided in this application will be described from different perspectives below.

[0057] In one possible implementation, the aforementioned Figure 1 The FPC120 shown can be as follows Figure 2 As shown, the second grounding area 122 of the FPC is the bright copper area of ​​the first plane of the FPC. That is, the second area 122 of the FPC directly contacts the metal casing 140 through bright copper, achieving more grounding for the optical component. Figure 2 The gray area in the figure is the raised area of ​​the metal casing 140. The first plane of the FPC can be the plane of the FPC120 that contacts the gray area, or it can be the plane of the FPC120 that is parallel to the gray area. There is no restriction here.

[0058] It should be understood that Figure 2 The bright copper area shown is merely an illustrative example. Since the metal casing 140 can completely cover the FPC120, the bright copper area of ​​the FPC120 can also be achieved by adding tails to other sides of the FPC120. This description is only an example, and in actual applications, it should be combined with specific implementation methods.

[0059] In this embodiment, by making the second region of the FPC a bright copper region and making the bright copper region physically contact the metal casing of the optical module, more grounding of the optical component is achieved. The implementation method is simple and does not require additional space within the optical module.

[0060] In one possible implementation, taking the second ground region 122 of the FPC as the bright copper region of the first plane of the FPC 120, and the first ground region 121 of the FPC also located on the first plane of the FPC 120 as an example. Figure 3 As shown, the optical module 10 may further include foam 150. The first plane of foam 150 is connected to a first region of the second plane of FPC 120, and the second plane of foam 150 is connected to the first plane of metal housing 140. The first plane of foam 150 is parallel to the second plane of foam 150, and the second plane of FPC 120 is parallel to the first plane of FPC 120. The first plane of metal housing 140 is located inside metal housing 140 and parallel to the second plane of FPC 120. The first plane of metal housing 140 and the second plane of FPC 120 compress foam 150, causing foam 150 to deform.

[0061] It should be noted that, by Figure 3As can be seen, the metal casing 140 is composed of a base 141 for supporting the optical component 110, FPC 120 and circuit board 130 and a cover plate 142 for creating a closed condition for the optical component 110, FPC 120 and circuit board 130. The inner side of the metal casing 140 is the part that is not visible on the surface of the metal casing 140 after the base 141 and cover plate 142 are combined in the direction of the arrow in the figure. All of these can be referred to as the inner side of the metal casing 140.

[0062] in, Figure 3 The gray area in the base 141 is the protruding area of ​​the metal shell 140. The first plane of the FPC can be the plane in contact with the gray area in the base 141 of the FPC 120. The first plane of the foam 150 is the plane in contact with the base 141 after assembly. The second plane of the foam 150 is the plane in contact with the cover plate 140 after assembly. There are no restrictions here.

[0063] It should be understood that the description of the first grounding area 121 and the second grounding area 122 of the FPC being located in the same plane is merely an example. In actual applications, the first grounding area 121 and the second grounding area 122 of the FPC can be located in the same plane or in different planes. For example, the first grounding area 121 and the second grounding area 122 of the FPC can also be located in two parallel planes. There is no limitation here.

[0064] In this embodiment, by adding extra foam to the back side of the bright copper area of ​​the FPC at the contact area between the FPC and the metal casing, the connection stability of the second grounding area between the metal casing and the FPC is increased by the compression of the foam by the metal casing and the FPC, and the risk of physical disconnection between the second grounding area of ​​the metal casing and the FPC is reduced.

[0065] In one possible implementation, in conjunction with the foregoing Figure 2 Please refer to the example shown. Figure 4 The first plane of the FPC120 may also include an adhesive region 123, in which case the adhesive region 123 of the FPC120 is connected to the metal housing 140 by an adhesive.

[0066] The adhesive area 123 can be set up as follows: Figure 4 As shown in Figure a, around the second grounding region 122 of the FPC, it can also be as follows: Figure 4As shown in Figure b, the second grounding area 122 of the FPC is located in any area of ​​the FPC. By taking full advantage of the physical connection between the second grounding area 122 of the FPC and the metal casing 140 on the protrusion of the metal casing 140, and by combining the adhesive to bond the bonding area 123 to the metal casing 140, the movement space of the FPC 120 within the metal casing 140 can be further restricted, thereby achieving a relatively stable physical contact between the second grounding area 122 of the FPC and the metal casing 140.

[0067] It should be understood that the description of the bonding method between the bright copper area of ​​the first plane of FPC120 and the metal casing is only an example. In actual situations, it should be set according to the specific scenario, and no restrictions are imposed here.

[0068] In this embodiment of the application, it is proposed that the connection between the second grounding area of ​​the FPC and the metal casing can be fixed by bonding between the first plane of the FPC and the metal casing, which can reduce the risk of physical disconnection between the metal casing and the second grounding area of ​​the FPC.

[0069] In one possible implementation, in conjunction with the foregoing Figure 1 The optical module 10 may further include conductive foam 160, the conductive foam 160 being disposed in the optical module 10 as follows: Figure 5 As shown.

[0070] The second grounding area 122 of the FPC is the bright copper area of ​​the first plane of the FPC120. The first plane of the conductive foam 160 is in physical contact with the bright copper area of ​​the first plane of the FPC120. The second plane of the conductive foam 160 is in physical contact with the first plane of the metal shell 140. The first plane of the metal shell 140 is located inside the metal shell 140. The metal shell 140 and the FPC120 compress the conductive foam 160 to produce deformation.

[0071] It should be understood that Figure 5 The positions of the conductive foam 150 and the second grounding area 122 of the FPC are merely examples. In actual applications, the conductive foam 150 only needs to be in physical contact with both the second grounding area 122 of the FPC and the metal casing 140. The specific positions and shapes can be set according to the specific application scenario, and are not limited here.

[0072] In this embodiment, conductive foam is placed between the FPC and the metal casing. The conductivity and elasticity of the conductive foam allow it to deform between the FPC and the metal casing, which can ensure the connection between the FPC and the metal casing without requiring any changes to other designs of the optical module.

[0073] In one possible implementation, based on the foregoing Figure 5The conductive foam 160 in the optical module 10 shown can also be arranged as follows: Figure 6 As shown, the second plane of the conductive foam 160 is parallel to the first plane of the conductive foam 160, and the first plane of the metal shell 140 is parallel to the first plane of the FPC. The conductive foam 160 can be deformed by the first plane of the metal shell 140 and the first plane of the FPC 120 pressing the conductive foam 160.

[0074] In this embodiment, the compression of the conductive foam by the FPC and the metal casing is made to be compression between parallel planes, ensuring that the compression of the conductive foam by the FPC and the metal casing is more stable and further improving the stability of the grounding structure.

[0075] In one possible implementation, based on the foregoing Figure 1 The connection between the second grounding area 122 of the optical module 10 and the metal casing 140 can also be made by wire connection or soldering.

[0076] In this embodiment, the second grounding area of ​​the FPC and the metal casing can also be connected by welding or wires, which efficiently realizes the grounding connection between the FPC and the metal casing and ensures the stability of the solution.

[0077] In one possible implementation, in the above Figures 1 to 6 In the optical module 10, the connection between the first grounding area 122 of the FPC and the first GND 131 can be a connector, or a gold finger, etc., which is not limited here.

[0078] That is, the first grounding area 121 of the FPC includes a first connector, and the first GND 131 includes a second connector. The electrical connection between the first grounding area 121 and the first GND 131 can be a connection between the first connector and the second connector. Here, the first connector refers to the first connector containing a pin for grounding, and the second connector refers to the second connector containing a pin for grounding. The connection between the first connector and the second connector is that the grounding pin in the first connector is connected to the grounding pin in the second connector.

[0079] In this embodiment, the grounding connection between the FPC and the circuit board in the optical module can be achieved by connecting them with a connector. This fully takes into account the large number of lines that need to be connected between the FPC and the circuit board, and can also ensure stable grounding between the FPC and the circuit board.

[0080] In the foregoing Figures 1 to 6 In the optical module 10 shown, the optical component 110 can be either the first optical emitting component 111 or the first optical receiving component 112, and there is no limitation here.

[0081] In this embodiment, the optical component can be either an optical transmitter or an optical receiver. By enhancing the GND return current of the optical transmitter, the influence of cavity resonance generated by other devices within the metal housing of the optical module on the optical transmitter is eliminated, thereby improving the signal transmission efficiency of the optical transmitter. Alternatively, by increasing the GND return current of the optical receiver, the influence of cavity resonance generated by other devices within the metal housing of the optical module on the received signal of the optical receiver is eliminated, thereby improving the signal reception efficiency of the optical receiver.

[0082] In one possible embodiment, when the optical component 110 in the optical module 10 is a first optical receiving component 112, the optical module 10 may further include a preset FPC 170 and a second optical transmitting component 180. The preset FPC 170 and the second optical transmitting component 180 can be configured in the optical module 10 as follows: Figure 7 As shown, the light emitting component 180 is electrically connected to the preset FPC 170 and the preset FPC 170 is electrically connected to the circuit board 130, which is not limited here.

[0083] It should be understood that here Figure 7 The description of the connection relationship between the preset FPC170 and other components in the optical module 10 is merely an example. In specific implementation scenarios, the connection relationship between the preset FPC170 and other components in the optical module 10 can also be the same as described above. Figures 1 to 6 The connection relationship between FPC120 and other components in optical module 10 is similar and is not limited here.

[0084] In this embodiment, the connection between the FPC and the second optical emitting component and the circuit board can be a common electrical connection method. In this solution, only minor modifications to the optical module are needed to achieve a good isolation effect between transmission and reception.

[0085] The structure of the optical module provided in the embodiments of this application has been described above. The following describes how the optical module provided in the embodiments of this application works in specific application scenarios. Please refer to [link to relevant documentation]. Figure 8 , Figure 8 This is a schematic diagram illustrating an application scenario of the optical module provided in an embodiment of this application.

[0086] 1. Applications in passive optical networks.

[0087] like Figure 8 As shown, a passive optical network (PON) includes optical communication equipment, specifically optical line terminal (OLT) and optical network unit (ONU).

[0088] Both OLT and / or ONU utilize optical modules for optical network transmission.

[0089] For example, the OLT can receive uplinks or the ONU transmits downlinks using wavelengths of 1270nm or 1310nm, while the OLT can transmit downlinks or the ONU can receive uplinks using wavelengths of 1577nm or 1490nm.

[0090] The optical modules in the OLT and / or ONU require a structure that includes the aforementioned silicon substrate and optical chip.

[0091] 2. Applications of routers in the telecommunications field.

[0092] like Figure 8 As shown, in the field of router telecommunications, optical modules are used in 50GE network scenarios, which are further divided into 10Km transmission and 40Km transmission.

[0093] In the 50GE 40Km transmission scenario, the optical module needs to use a structure including the aforementioned silicon substrate and optical chip.

[0094] For example, a 50GE 40km scenario can be divided into a dual-fiber solution and a single-fiber solution. The dual-fiber solution module contains two devices: an optical transmitter and an optical receiver. The single-fiber solution module contains only a bidirectional optical ablation assembly (BOSA). At the transmitting end, a 25G electro-absorption modulated laser (EML) transmits the optical signal, and at the receiving end, a 25G avalanche photodiode (APD) linear TO receives the optical signal. The dual-fiber TOSA / ROSA uses a wavelength of 1311nm; the single-fiber BOSA solution uses two wavelengths, 1295.56nm and 1309.14nm, for cross-transmission. Due to the small wavelength gap, a 13° + 32° filter for beam splitting and a 0° filter for filtering are used in the optical path.

[0095] 3. Applications in the wireless field.

[0096] like Figure 8 As shown, in the wireless field, optical modules are used in 10G and 25G network scenarios. The 25G scenario is further divided into 25G gray light scenario and 25G colored light scenario.

[0097] In the 25G colored light scenario, the optical module needs to use a structure including the aforementioned optical module.

[0098] In 25G color fiber optic scenarios, only a dual-fiber solution is used, with two devices, TOSA and ROSA, housed in the module. The TOSA device has six wavelengths: 1271nm, 1291nm, 1311nm, 1331nm, 1351nm, and 1371nm. The ROSA device is the same and can receive all six wavelengths. In application, the first three wavelengths are placed on the tower, and the latter three are placed in the equipment room, with transmission between the two ends via multiplexers / demultiplexers.

Claims

1. An optical module characterized by comprising: The optical module comprises a light assembly, a flexible printed circuit (FPC), a circuit board and a metal shell, the FPC comprises at least two grounding areas, the circuit board comprises a first ground end (GND); The light assembly is electrically connected with the FPC, and the light assembly is configured to receive or transmit an optical signal; The FPC is electrically connected with the circuit board, a first grounding area of the FPC is electrically connected with the first GND, the first grounding area of the FPC is included in the at least two grounding areas, and a second grounding area of the FPC is electrically connected with the metal shell, the second grounding area of the FPC is included in the at least two grounding areas.

2. The optical module according to claim 1, characterized by The second grounding area of the FPC is a bright copper area of a first plane of the FPC. The electrical connection between the second grounding area of the FPC and the metal shell comprises that the bright copper area of the first plane of the FPC is in physical contact with the metal shell.

3. The optical module according to claim 2, characterized by The optical module further comprises a foam. A first plane of the foam is in contact with a first area of a second plane of the FPC, a second plane of the foam is in contact with a first plane of the metal shell, the first plane of the foam is parallel to the second plane of the foam, the second plane of the FPC is parallel to the first plane of the FPC, the first plane of the metal shell is located on an inner side of the metal shell and is parallel to the second plane of the FPC, and the first plane of the metal shell and the second plane of the FPC extrude the foam to deform the foam.

4. The optical module according to claim 2, characterized by The first plane of the FPC further comprises an adhesive area, and the adhesive area of the first plane is connected with the metal shell by an adhesive.

5. The optical module according to claim 1, characterized by The second grounding area of the FPC is a bright copper area of a first plane of the FPC. The optical module further comprises a conductive foam. A first plane of the conductive foam is in physical contact with the bright copper area of the first plane of the FPC, a second plane of the conductive foam is in physical contact with a first plane of the metal shell, the first plane of the metal shell is located on an inner side of the metal shell, and the metal shell and the FPC extrude the conductive foam to deform the conductive foam.

6. The optical module according to claim 5, characterized by The second plane of the conductive foam is parallel to the first plane of the conductive foam, and the first plane of the metal shell is parallel to the first plane of the FPC. The metal shell and the FPC extrude the conductive foam to deform the conductive foam comprises that the first plane of the metal shell and the first plane of the FPC extrude the conductive foam to deform the conductive foam.

7. The optical module of claim 1, wherein, The electrical connection between the second grounding area of the FPC and the metal shell comprises that the second grounding area is connected with the metal shell by a wire or by welding.

8. The optical module according to any one of claims 1 to 7, characterized by, The first grounding area of the FPC comprises a first connector, the first GND comprises a second connector, and the electrical connection between the first grounding area and the first GND comprises that the first connector is connected with the second connector.

9. The optical module according to any one of claims 1 to 7, characterized by, The light assembly comprises a first light emitting assembly or a first light receiving assembly.

10. The optical module according to claim 9, characterized by When the light assembly comprises the first light receiving assembly, the optical module further comprises a preset FPC and a second light emitting assembly. The second light emitting component is electrically connected with the preset FPC. The preset FPC is electrically connected with the circuit board.

11. An optical communication device, comprising: The optical communication device comprises the optical module as claimed in claims 1-10.

12. An optical communication system, characterized by The system comprises the optical communication device as claimed in claim 11.

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