Low-delay underwater wireless optical communication assembly capable of resisting self-transceiving interference

Abstract

The utility model belongs to the technical field of wireless optical communication, and particularly relates to a low-delay underwater wireless optical communication component capable of resisting self-transceiving interference, which comprises a component shell arranged in a sealing manner, a plurality of optical active devices and a media conversion chip are arranged in the component shell, a light hole is arranged on the wall body of the component shell, a lens is nested in the light hole, and the optical active devices and the media conversion chip are arranged in the component shell. The wet-plugging watertight connector is arranged on the wall body of the assembly shell in a penetrating manner, the wet-plugging watertight connector, the media conversion chip and the optical active device are sequentially connected through a circuit, and the media conversion chip and the optical active device are both arranged on a printed board fixed in the assembly shell. According to the utility model, a discrete lens optical window structure is adopted, optical signals are transmitted in the independent lens optical window structure, the self-transceiving interference probability in optical transmission is reduced, and the communication quality is improved; according to the utility model, the media conversion chip is adopted to directly forward a transmission signal without additional processing such as coding and decoding, so that the data transmission rate is improved, and the communication delay is greatly reduced.

Description

Technical Field

[0001] This utility model belongs to the field of wireless optical communication technology, specifically relating to a low-latency underwater wireless optical communication component that resists self-transmission interference. Background Technology

[0002] In underwater environments, compared to radio frequency communication and underwater acoustic communication, wireless optical communication has several advantages: low loss, no electromagnetic pollution, resistance to electromagnetic interference, and high transmission rate. It has important application value in marine engineering, marine equipment and other fields, and can be widely used in military and civilian underwater communication scenarios.

[0003] Currently, underwater wireless optical communication components capable of full-duplex communication often use codecs or integrated chips to process signals before transmission, resulting in high communication latency and failing to meet the requirements of high-speed communication. In addition, underwater wireless optical communication components often use a single solid lens as the channel optical window, and in order to meet the offset index, the communication light source and detector are located in the center of the underwater wireless optical communication component and are closely spaced. In addition, the reflection of signal light by the optical window interface makes it very easy for the detector to misreceive the optical signal from the same side of the light source, which causes self-transmission interference and affects the communication quality. Utility Model Content

[0004] To address the technical problems of high communication latency and self-transmission interference in the aforementioned underwater wireless optical communication components, this invention provides a low-latency underwater wireless optical communication component that is resistant to self-transmission interference.

[0005] The purpose of this utility model is achieved through the following technical solution. A low-latency underwater wireless optical communication component with anti-self-transmitting interference proposed in this utility model includes a sealed component housing. The component housing contains multiple active optical devices for receiving or transmitting optical signals and a media conversion chip for signal forwarding. The wall of the component housing has light-transmitting holes opposite to the corresponding active optical devices, with lenses nested within the light-transmitting holes. A wet-plug watertight connector passes through the wall of the component housing. The wet-plug watertight connector, the media conversion chip, and the active optical devices are sequentially connected via circuitry. Furthermore, the media conversion chip and the active optical devices are both mounted on a printed circuit board fixed within the component housing.

[0006] Compared with the prior art, the advantages of this utility model are:

[0007] This invention employs a discrete lens window structure (including a light-transmitting aperture and a lens), in which optical signals are transmitted through independent lens window structures, achieving isolation between various transmission channels, reducing the probability of self-transmission interference in optical transmission, and improving communication quality. Furthermore, due to the reduction in the size of the light-transmitting aperture on the light-emitting surface (in the prior art, the light-transmitting aperture on the light-emitting surface is a single unit with a large area), the water pressure resistance of the component structure is improved.

[0008] This invention uses a media conversion chip to directly forward the transmitted signal without additional processing such as encoding and decoding, thereby improving the data transmission rate and significantly reducing communication latency.

[0009] Furthermore, the optical active device is disposed on the same side of the printed circuit board I. The printed circuit board I is provided with through holes corresponding to the optical active device for light signals to pass through. The through holes and light-transmitting holes are positioned opposite each other. The other side of the printed circuit board I is attached to the inner wall of the component housing. The printed circuit board I is made of aluminum-based printed circuit board.

[0010] Compared with the prior art, the advantages of this utility model are:

[0011] Since active optical devices often use high-heat lasers and other devices, they are placed on an aluminum-based printed circuit board, which is attached to the wall of the housing assembly to facilitate heat dissipation. Furthermore, the through holes and light-transmitting holes on the printed circuit board form a light-transmitting structure, which facilitates the isolation of optical signals.

[0012] Furthermore, the light-transmitting hole is a stepped hole, with the outer diameter of the light-transmitting hole being larger than the inner diameter. The lens is nested inside the outer hole, and a sealing ring is nested on the radial surface of the stepped hole. An upper cover plate is provided on the end face of the wall where the lens is located, and the upper cover plate has a through hole opposite to the light-transmitting hole, with the diameter of the through hole being smaller than the diameter of the lens.

[0013] Compared with the prior art, the advantages of this utility model are:

[0014] The lens is detachably mounted on the assembly via the top cover, facilitating maintenance and replacement.

[0015] Furthermore, a sealing ring is nested on the edge of the end face where the component housing mates with the upper cover plate.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] After the top cover is attached and installed, it is pressed against the sealing ring. Together with the sealing ring at the lens, it provides a secondary seal for the light-transmitting hole, enhancing the sealing effect and ensuring normal underwater communication.

[0018] Furthermore, the component housing includes an outer shell, a rear cover detachably disposed on the outer shell, and a sealing ring nested between the outer shell and the rear cover.

[0019] Compared with the prior art, the advantages of this utility model are:

[0020] Opening the back cover makes it easy to repair the internal components of the assembly.

[0021] Furthermore, a printed circuit board II is provided on the inner side of the rear cover, and a media conversion chip is disposed on the printed circuit board II.

[0022] Compared with the prior art, the advantages of this utility model are:

[0023] The printed circuit board is placed on the back cover, and can be removed when the back cover is opened for easy maintenance.

[0024] Furthermore, a support post is provided on the inner side of the rear cover, and the printed circuit board II is mounted on the support post.

[0025] Furthermore, the aperture of the light-transmitting hole is larger than the diameter of the optical active device and its pads.

[0026] Compared with the prior art, the advantages of this utility model are:

[0027] When the printed circuit board I is attached to the inner wall of the housing, the light-transmitting hole can accommodate the light-active device and the protruding part of its pad, so that it cannot cause assembly interference and ensure smooth assembly.

[0028] Furthermore, the optical active devices provided on the printed circuit board I include lasers and detectors.

[0029] Furthermore, the printed circuit board I is also equipped with a power management chip and a high-frequency field-effect transistor.

[0030] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0031] Figure 1 This is a cross-sectional view of an embodiment of a low-latency underwater wireless optical communication component that resists self-transmitting interference according to this utility model;

[0032] Figure 2 for Figure 1 The left view;

[0033] Figure 3 for Figure 1 A three-dimensional image;

[0034] Figure 4 for Figure 1 A stereoscopic view from another perspective;

[0035] Figure 5 for Figure 1 A cross-sectional view from another location.

[0036] [Attached image labels]

[0037] 1. Lens;

[0038] 2. Top cover plate;

[0039] 3.0 type ring I;

[0040] 4. O-ring II;

[0041] 5.0 Type III;

[0042] 6.0 type ring IV;

[0043] 7.0 type ring V;

[0044] 8. Screw I;

[0045] 9. Outer shell;

[0046] 91 - Light-transmitting hole;

[0047] 10. Back cover;

[0048] 11. Wet-plug watertight connector;

[0049] 12. Screw II;

[0050] 13. Supporting columns;

[0051] 14. Screw III;

[0052] 15. Active optical devices;

[0053] 16. Media conversion chip;

[0054] 17. Printed Circuit Board I;

[0055] 18. Printed Circuit Board II. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0057] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0058] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0059] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0060] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0061] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0062] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0063] The following detailed description, in conjunction with embodiments, further illustrates the features and performance of a low-latency underwater wireless optical communication component suitable for resisting self-transmitting interference.

[0064] An embodiment of this utility model of a low-latency underwater wireless optical communication component with anti-self-transmitting interference is shown below. Figures 1 to 5 As shown.

[0065] The underwater wireless optical communication component in this embodiment integrates transmission and reception, enabling full-duplex communication.

[0066] The underwater wireless optical communication assembly of this embodiment includes a lens 1, an upper cover plate 2, O-rings, screws, a wet-plug watertight connector 11, a rear cover 10, an outer shell 9, a support column 13, a printed circuit board I 17, a printed circuit board II 18, a media conversion chip 16, and multiple active optical devices 15. These include a light source and a detector to transmit and receive optical signals. In this embodiment, three active optical devices 15 are provided, and correspondingly, three lenses 1 are also provided.

[0067] The printed circuit boards (including printed circuit boards I17 and II18) are fixed to the inside of the component housing (including the rear cover 10 and the outer housing 9) by screw II 12.

[0068] The outer casing 9 is a cylindrical body with a cavity. Its rear end face is open and sealed by a rear cover 10. After opening the rear cover 10, the internal components of the outer casing 9 can be repaired. Multiple threaded holes are distributed circumferentially along the edge of the rear end face of the outer casing 9. After the rear cover 10 is placed over the corresponding position on the rear end face of the outer casing 9, multiple screws III14 are inserted into the through holes on the edge of the rear cover 10 and then screwed into the corresponding threaded holes to fix the rear cover 10 onto the outer casing 9, thus sealing the outer casing 9. Two O-ring grooves are concentrically arranged near the circumferential distribution of the threaded holes on the rear end face of the outer casing 9. O-rings V7 and IV6 are nested in the two O-ring grooves from the outside to the inside. After fixing the rear cover 10 to the outer casing 9, the end face of the rear cover 10 presses against the two O-rings, achieving a seal between the rear cover 10 and the outer casing 9, preventing liquid from flowing into the cavity from the opening on the rear side of the outer casing 9.

[0069] The inner side of the rear cover 10 is provided with multiple support posts 13. The printed circuit board II 18 is set on the end face of the support post 13. The screw II 12 passes through the through hole on the printed circuit board II 18 and is screwed into the threaded hole at the end of the support post 13, thereby fixing the printed circuit board II 18 on the support post 13. After the rear cover 10 is fixed to the outer shell 9, the printed circuit board II 18 is fixed in the component housing.

[0070] A media conversion chip 16 is provided on the printed circuit board II 18. This utility model uses a media conversion chip to directly forward communication data without performing additional encoding and decoding or other complex data processing, which effectively improves the signal transmission rate and significantly reduces communication latency.

[0071] The components on the printed circuit board I17 are all located on one side of the printed circuit board I17, which faces the inner cavity of the housing 9, providing space for the components. The other side of the printed circuit board I17 is attached to the inner wall of the bottom of the cavity of the housing 9 (i.e., the inner wall of the front end of the housing 9). The printed circuit board I17 is fixed to the housing 9 by passing through the through hole on the printed circuit board I17 and screwing it into the threaded hole on the inner wall of the bottom of the cavity of the housing 9.

[0072] The printed circuit board I17 has through holes corresponding to the positions of the optical active devices 15. The optical active devices 15 are disposed on the side of the printed circuit board I17 facing the inner cavity. The received optical signals can pass through the through holes on the printed circuit board I17 and be received by the detector, or the optical signals emitted by the light source can pass through the corresponding through holes and be emitted. The number of through holes on the printed circuit board I17 is the same as the number of optical active devices 15.

[0073] A light-transmitting hole 91 corresponding to the through hole position of the printed circuit board I17 is opened on the wall of the outer casing 9. The light-transmitting hole 91 is a stepped hole that penetrates the wall of the outer casing 9. The diameter of the outer hole is larger than the diameter of the inner hole. The lens 1 is nested in the outer hole of the light-transmitting hole 91.

[0074] An O-ring groove is provided on the radial surface of the light-transmitting hole 91, and an O-ring III5 is nested inside the O-ring groove. After the lens 1 is nested in the outer hole, the lens 1 is squeezed inside the O-ring III5 to prevent liquid from flowing into the cavity of the outer shell 9 from between the lens 1 and the inner wall of the light-transmitting hole 91.

[0075] A top cover plate 2 is attached to the front end face of the outer casing 9. The top cover plate 2 has through holes corresponding to the positions of the light-transmitting holes 91. After the top cover plate 2 is attached to the front end face of the outer casing 9, the through holes of the top cover plate 2 are positioned opposite to the light-transmitting holes 91. The diameter of the through holes in the top cover plate 2 is smaller than the diameter of the lens 1, allowing the edge of the through holes in the top cover plate 2 to press against the lens 1, preventing the lens 1 from dislodging from the through holes in the top cover plate 2.

[0076] Two O-ring grooves are concentrically arranged near the edge of the front end face of the outer shell 9. O-ring I 3 and O-ring groove II 4 are nested in the two O-ring grooves from the outside to the inside. After the upper cover plate 2 is attached to the outer shell 9, the upper cover plate 2 is pressed on the two O-rings. Together with O-ring III 5, the light-transmitting hole 91 is sealed for a second time to enhance the sealing effect and ensure that underwater communication is normal.

[0077] The top cover plate 2 has multiple through holes near its edge, and the front end of the outer shell 9 has multiple threaded holes. When the top cover plate 2 is attached to the front end of the outer shell 9, screws I 8 are passed through the through holes on the top cover plate 2 and screwed into the threaded holes on the front end of the outer shell 9 to fix the top cover plate 2 to the outer shell 9.

[0078] The number of lenses 1 corresponds to the number of active optical devices 15. The layout position of the active optical devices 15 on the printed circuit board I is opposite to the position of the light-transmitting hole 91 where the lens 1 is located, so that the light signal emitted by the active optical device 15 can pass through the corresponding lens 1 and be emitted out, or the light signal passing through a certain lens 1 can enter the corresponding active optical device 15.

[0079] Lens 1 uses high-transmittance and high-strength materials such as quartz and sapphire as the channel light window, which can withstand water pressure. Furthermore, since lens 1 is set separately, its area is smaller than that of the overall lens, which can increase its pressure resistance.

[0080] Meanwhile, the aperture of the light-transmitting hole 91 is much larger than the diameter of the light-active device 15 and its pads. When the printed circuit board I17 is attached to the inner wall of the housing 9, the light-transmitting hole 91 can accommodate the protruding part of the light-active device 15 and its pads, so that it cannot cause assembly interference and ensure smooth assembly.

[0081] By using the lens window structure (light-transmitting hole 91 and lens 1) separated on the outer casing 9, the channels for the light source to emit signal light and the detector to receive signal light from the opposite component are isolated from each other at the same component end, effectively reducing self-transmission and reception interference.

[0082] In addition, the printed circuit board I17, where the light source and detector are located, is made of aluminum substrate and is tightly mounted on the inner wall of the housing with screws II 12. For high-heat-generating devices such as LD (laser) or other light sources, power management chips, and high-frequency field-effect transistors set on the printed circuit board I17, the printed circuit board I17 has a larger direct contact area with the housing 9, resulting in higher heat dissipation efficiency.

[0083] A wet-plug watertight connector 11 is installed on the side wall of the outer casing 9 as an external interface for electrical connection with the internal printed circuit board, enabling communication between the internal and external data signals and supplying power to the component. In this embodiment, the wet-plug watertight connector 11 is wired to the printed circuit board II 18, which is equipped with a power supply, a media conversion chip 16, and other related circuits to supply power to the internal components and transmit signals with them.

[0084] Printed board I17 and printed board II 18 are connected by wiring to realize the interaction of drive signals, receive signals and other signals.

[0085] The wet-plug watertight connector 11, media conversion chip 16, and optical active device 15 are sequentially connected by a circuit. The signal is input from the outside through the wet-plug watertight connector 11. The media conversion chip 16 and related circuits on printed circuit board II 18 match and forward the signal, which is then sent to printed circuit board I 17 via a signal line. The electrical signal is amplified by the drive circuit and drives the LD to work. The emitted optical signal is received by the detector of the opposite component. The photocurrent signal generated by the detector (located on printed circuit board I 17 of the opposite component) is transmitted to printed circuit board II 18 of the opposite component via a signal line. It is then forwarded by the media conversion chip 16 on the opposite side and transmitted to the external user terminal by the wet-plug watertight connector 11 on the opposite side.

[0086] The edge of the top cover plate 2 protrudes from the edge of the component and is provided with mounting holes for mounting the component on the corresponding device.

[0087] The active optical device 15 used in this invention is an LD and a PIN detector, but it is not limited to these two types of devices. Other forms of light sources or detectors may also be used. This description should not be construed as a limitation of this invention.

[0088] The sealing structures, components, and connectors used in the embodiments of this utility model can be effectively replaced by similar or functional structures, components, and connectors, and should not be construed as limiting this utility model. For example, the O-ring can be replaced with a sealing ring of other cross-sectional shapes.

[0089] The features of this utility model embodiment are summarized as follows:

[0090] This invention, as an underwater wireless optical communication component, achieves wireless optical transmission of underwater signals by encapsulating the light source, detector, and supporting circuit board inside a sealed housing. For its watertight structure, this invention employs O-ring seals. O-rings I 3 and II 4 are added for axial sealing between the upper cover plate 2 and the outer shell 9; O-ring III 5 is added for axial sealing between the lens 1 and the outer shell 9; and O-rings IV 6 and V 7 are assembled for axial sealing between the outer shell 9 and the rear cover 10. The component's external interface uses a wet-plug watertight connector 11 to supply power to the internal power supply, enabling communication between the internal and external data signals and achieving a watertight seal at the external interface. Simulation calculations show that the overall structure of this product can withstand water pressures exceeding 7.2 MPa; higher pressure resistance can be achieved by using different materials and wall thicknesses.

[0091] This invention can be used in scenarios such as underwater submarine communication, underwater unmanned surface vessel networking, underwater ocean current detection, and marine resource development, utilizing visible light communication technology for underwater wireless data transmission. In practical operation, it can be installed on equipment such as ships and submersibles, connecting the invention to the underwater equipment platform via external cables to achieve high-speed, stable real-time information exchange and wireless transmission between underwater platforms.

[0092] This invention adopts a discrete lens window structure, with the active optical device 15 arranged on the same side of the printed circuit board I17. The optical signal is transmitted in an independent lens window structure, realizing isolation of each transmission channel, reducing the probability of self-transmission interference in optical transmission, and improving communication quality. Furthermore, due to the reduction of the light-emitting surface aperture 91 (the light-emitting surface aperture in the prior art is a whole with a large area), the water pressure resistance of the component structure is improved.

[0093] This invention uses a media conversion chip to directly forward the transmitted signal without additional processing such as encoding and decoding, thereby improving the data transmission rate and significantly reducing communication latency.

[0094] This invention solders high-heat-generating devices, such as optical active devices, onto an aluminum-based printed circuit board. The printed circuit board I17 is mounted tightly against the inner wall of the outer casing 9 using screws II 12. The heat generated during device operation is dissipated through the heat dissipation pads of the printed circuit board I17 and the outer casing 9, which is in direct contact with the printed circuit board I17, thereby improving heat dissipation efficiency.

[0095] This invention adopts a one-way communication layout structure, which is divided into a transmitting component and a receiving component. However, this invention can arrange the light source and detector alternately through the layout, thereby realizing full-duplex communication.

[0096] In other embodiments of this utility model, the top cover plate 2 can be removed, and the lens 1 can be integrally set in the wall of the outer shell 9. In this case, the O-ring III5 can also be omitted.

[0097] In other embodiments of this utility model, the printed circuit board II 18 may also be an aluminum-based printed circuit board and be attached to the back cover 10 to accelerate heat dissipation.

[0098] In other embodiments of this utility model, the printed circuit board II 18 may also be disposed on other inner walls of the outer casing 9, and after opening the back cover 10, the printed circuit boards inside can be inspected.

[0099] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low-latency underwater wireless optical communication assembly against self-interference, comprising a sealed assembly housing, characterized in that: The assembly shell is internally provided with a plurality of optical active devices (15) for receiving or transmitting optical signals, respectively, and a media conversion chip (16) for forwarding signals. The wall of the assembly shell is provided with a light-transmitting hole (91) arranged opposite to the corresponding optical active device (15). The light-transmitting hole (91) is nested with a lens (1). A wet-pluggable water-tight connector (11) is provided on the wall of the assembly shell. The wet-pluggable water-tight connector (11), the media conversion chip (16) and the optical active device (15) are sequentially connected by an electric circuit. The media conversion chip (16) and the optical active device (15) are arranged on a fixed printed board in the assembly shell.

2. The low-latency underwater wireless optical communication assembly of claim 1, wherein: The optical active devices (15) are arranged on the same side of a printed board I (17). The printed board I (17) is provided with through holes corresponding to the optical active devices (15) for the optical signals to pass through. The through holes are opposite to the light-transmitting holes (91) in position. The other side of the printed board I (17) is attached to the inner wall of the assembly shell. The printed board I (17) is an aluminum-based printed board.

3. The low-latency underwater wireless optical communication assembly of claim 1, wherein: The light-transmitting hole (91) is a stepped hole. The outer hole diameter of the light-transmitting hole (91) is larger than the inner hole diameter. The lens (1) is nested in the outer hole. A sealing ring is nested on the radial face of the stepped hole. An upper cover plate (2) is arranged on the end face of the wall where the lens (1) is located. The upper cover plate (2) is provided with a through hole opposite to the light-transmitting hole (91). The diameter of the through hole is smaller than the diameter of the lens (1).

4. The low-latency underwater wireless optical communication assembly of claim 3, wherein: The end face edge of the assembly shell and the upper cover plate (2) is nested with a sealing ring.

5. The low-latency underwater wireless optical communication assembly of claim 1, wherein: The assembly shell comprises an outer shell (9) and a rear cover (10) detachably arranged on the outer shell (9). The face of the outer shell (9) and the rear cover (10) is nested with a sealing ring.

6. The low-latency underwater wireless optical communication assembly of claim 5, wherein: The inner side of the rear cover (10) is provided with a printed board II (18). The media conversion chip (16) is arranged on the printed board II (18).

7. The low-latency underwater wireless optical communication assembly of claim 6, wherein: The inner side of the rear cover (10) is provided with a support column (13). The printed board II (18) is arranged on the support column (13).

8. The low-latency underwater wireless optical communication assembly of claim 1, wherein: The aperture of the light-transmitting hole (91) is larger than the diameter of the optical active device (15) and its solder pad.

9. The low-latency underwater wireless optical communication assembly of claim 2, wherein: The optical active devices arranged on the printed board I (17) comprise lasers and detectors.

10. The low-latency underwater wireless optical communication assembly of claim 9, wherein: The printed board I (17) is further provided with a power management chip and a high-frequency field effect transistor.

Images