Wave-absorbing structural body and electronic equipment

Abstract

The embodiment of the utility model provides a wave-absorbing structural body and electronic equipment, the wave-absorbing structural body comprises a PCB, a wave-absorbing material and a first bonding layer, the PCB comprises an onboard antenna circuit, and the onboard antenna circuit is used for providing electric resonance; the wave-absorbing material is arranged on one side of the PCB, and the wave-absorbing material and the PCB are coupled to form a magnetic resonance body; the first bonding layer is arranged on the side, away from the PCB, of the wave absorbing material and used for being connected with an electronic equipment body. Through the processing scheme disclosed by the invention, the electromagnetic interference generated by the electronic equipment can be absorbed, so that the wireless receiving performance of the electronic equipment is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of communication technology, and in particular, to a wave-absorbing structure and an electronic device. BACKGROUND

[0002] DC / DC switching power supply is widely used in electronic devices due to its large current and high efficiency output characteristics. The rapid change of current and voltage caused by the high-frequency turn-on and turn-off operation of power supply devices is the main reason for electromagnetic interference. Due to the size limitation of some electronic devices, not all DC / DC switching power supplies can be effectively shielded; the switching frequency of the DC / DC power device and its harmonic frequency will fall within the receiving band of the wireless transceiver system, causing interference to the wireless transceiver system reception and affecting the receiving ability of the wireless transceiver system. The high-frequency signal radiation of the high-speed interface such as the display screen and the camera will also fall within the receiving band of the wireless transceiver system, causing interference to the wireless transceiver system reception and affecting the receiving ability of the wireless transceiver system. SUMMARY

[0003] Therefore, the present disclosure provides a wave-absorbing structure and an electronic device, which at least partially solve the problems in the prior art.

[0004] The first aspect of the present disclosure provides a wave-absorbing structure, comprising a PCB board, a wave-absorbing material and a first adhesive layer, the PCB board comprising an on-board antenna circuit, the on-board antenna circuit being configured to provide electrical resonance; the wave-absorbing material being arranged on one side of the PCB board, the wave-absorbing material being coupled with the PCB board to form a magnetic resonance body; and the first adhesive layer being arranged on the side of the wave-absorbing material away from the PCB board, the first adhesive layer being configured to connect with the main body of the electronic device.

[0005] According to a specific implementation mode of the first aspect of the present disclosure, the on-board antenna circuit comprises a first etched metal, a plurality of resistors and a second etched metal connected in series.

[0006] According to a specific implementation mode of the first aspect of the present disclosure, the resistors are adjustable value magnetic beads, and the plurality of adjustable value magnetic beads have the same specification.

[0007] According to a specific implementation mode of the first aspect of the present disclosure, the wave-absorbing material comprises one or more of ferrite, barium titanate, metal powder, graphite, silicon carbide and conductive fiber.

[0008] According to a specific implementation mode of the first aspect of the present disclosure, the thickness of the wave-absorbing material is 0.1mm-3mm.

[0009] According to a specific implementation mode of the first aspect of the present disclosure, the first adhesive layer comprises one or more of epoxy resin glue, polyurethane glue, acrylic glue and double-sided adhesive.

[0010] According to a specific implementation of the first aspect of the present disclosure, the wave-absorbing structure further comprises a second adhesive layer, which is arranged between the PCB and the wave-absorbing material.

[0011] The second aspect of the present disclosure provides an electronic device, comprising an electronic device body and the wave-absorbing structure of any one of the first aspect of the present disclosure.

[0012] The wave-absorbing structure in the embodiments of the present disclosure comprises a PCB, a wave-absorbing material and a first adhesive layer, the PCB comprises an on-board antenna circuit, the wave-absorbing material is arranged on one side of the PCB, and the first adhesive layer is arranged on the side of the wave-absorbing material away from the PCB, and the first adhesive layer is used to connect with the electronic device body. Through the scheme of the present disclosure, the on-board antenna circuit provides electrical resonance, the wave-absorbing material is coupled with the PCB to form a magnetic resonance body, so as to absorb electromagnetic interference generated by the electronic device, thereby improving the wireless receiving performance of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0014] Figure 1 A structural schematic diagram of a wave-absorbing structure provided by the first aspect of the present disclosure is shown in FIG. 1.

[0015] Figure 2 A structural schematic diagram of an on-board antenna circuit in a wave-absorbing structure provided by the first aspect of the present disclosure is shown in FIG. 2.

[0016] Reference signs:

[0017] 10, wave-absorbing structure; 1, PCB; 11, first etched metal; 12, resistor; 13, second etched metal; 2, wave-absorbing material; 3, first adhesive layer. DETAILED DESCRIPTION

[0018] The embodiments of the present disclosure will be described in detail below with reference to the drawings.

[0019] The following detailed description is presented in terms of specific embodiments illustrating the implementations of the disclosure. Those skilled in the art will recognize that the disclosure can be practiced with modifications and changes within the scope of the disclosure. The disclosure is not limited to the embodiments described as such. The disclosure can also be implemented in additional different way, and the details in the description can be modified or changed based on different views and applications without departing from the spirit of the disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the disclosure, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the disclosure.

[0020] It should be noted that various aspects of the embodiments described below are within the scope of the appended claims. It should be apparent that the aspects described herein can be embodied in a wide variety of forms and that any specific structure and / or function described herein is merely illustrative. Based on the teachings herein one skilled in the art should appreciate that an aspect described herein can be implemented independently of any other aspects and that an aspect described herein can be implemented both as any number of software and / or hardware structures.

[0021] It should also be noted that the figures provided in the following embodiments are only to illustrate the basic concept of the disclosure in a schematic manner, and only the components related to the disclosure are shown in the figures, not drawn according to the number, shape and size of the components in actual implementation, the actual implementation of each component can be a random change in shape, number and proportion, and the layout of the components can be more complex.

[0022] In addition, in the following description, specific details are provided in order to facilitate a thorough understanding of the examples. However, one skilled in the art will understand that aspects can be practiced without these specific details.

[0023] DC / DC switching power supply is widely used in electronic devices due to its large current and high efficiency output characteristics. The high-frequency turn-on and turn-off operation of power supply devices leads to rapid changes in current and voltage, which is the main cause of electromagnetic interference. Due to size limitations of some electronic devices, not all DC / DC switching power supplies can be effectively shielded; the switching frequency of the DC / DC power device and its harmonic frequency will fall within the receive band of the wireless transceiver system, causing interference to the wireless transceiver system reception and affecting the reception capability of the wireless transceiver system. The high-frequency signal radiation of high-speed interfaces such as display screens and cameras will also fall within the receive band of the wireless transceiver system, causing interference to the wireless transceiver system reception and affecting the reception capability of the wireless transceiver system.

[0024] To solve the above problems, the present disclosure provides a wave-absorbing structure and an electronic device, which will be described below in conjunction with the accompanying drawings.

[0025] Please refer to Figure 1 , Figure 1 A structure diagram of a wave-absorbing structure 10 provided by the first aspect of the present application. The first aspect of the present disclosure provides a wave-absorbing structure 10, which includes a PCB board 1, a wave-absorbing material 2, and a first adhesive layer 3. The PCB board 1 includes an on-board antenna circuit, the wave-absorbing material 2 is arranged on one side of the PCB board 1, and the first adhesive layer 3 is arranged on the side of the wave-absorbing material 2 away from the PCB board 1. The first adhesive layer 3 is used to connect with the main body of the electronic device. Through the scheme of the present disclosure, the on-board antenna circuit provides electrical resonance, and the wave-absorbing material 2 and the PCB board 1 form a magnetic resonance body to absorb electromagnetic interference generated by the electronic device, thereby improving the wireless reception performance of the electronic device.

[0026] Please refer to Figure 2 , Figure 2A structure diagram of the on-board antenna circuit in the wave-absorbing structure 10 is provided for the first aspect of the embodiments of the present application. In some optional embodiments, the on-board antenna circuit includes a first etched metal 11, a plurality of resistors 12, and a second etched metal 13 connected in series. Optionally, the resistors 12 are adjustable-value magnetic beads, and the plurality of adjustable-value magnetic beads have the same specification. For example, after the frequency band and bandwidth of the interference are determined through spectrum analyzer sweep positioning and active antenna test, the adjustable-value magnetic beads with large impedance values of the interference frequency points are selected and removed. The adjustable-value magnetic beads have three regions of impedance, i.e., a low-frequency inductance region, a middle-frequency resistance region, and a high-frequency capacitance region. The adjustable-value magnetic beads are mainly used for filtering on the signal line, and the middle-frequency resistance region is mainly used. When the noise passes through the adjustable-value magnetic beads, heat is generated, and the energy signal is converted into heat energy. According to Joule's law, sufficient heat needs to be generated in a certain time, or the current needs to be large, or the resistance needs to be large. We use the device characteristics of the adjustable-value magnetic beads with high resistance values.

[0027] In some optional embodiments, the wave-absorbing material 2 includes one or more of ferrite, barium titanate, metal powder, graphite, silicon carbide, and conductive fiber. The wave-absorbing material 2 needs to select a material with high real part of magnetic permeability and high imaginary part of magnetic permeability. The above materials can meet the requirements. The real part of magnetic permeability represents the ability of a material to store magnetic energy in an alternating magnetic field. A higher real part means that the material can more effectively concentrate and guide electromagnetic waves, thereby helping to reduce the reflection of electromagnetic waves. The real part of magnetic permeability is close to the magnetic permeability of free space to achieve impedance matching, which can maximize the transmission of electromagnetic waves and minimize reflection, thereby improving the absorption efficiency. The imaginary part of magnetic permeability is directly related to the ability of a material to lose electromagnetic wave energy. A higher imaginary part indicates that the material has strong absorption capacity and can convert more electromagnetic energy into heat energy or other forms of energy, thereby reducing the transmission of electromagnetic waves.

[0028] In some optional embodiments, the thickness of the wave-absorbing material 2 is 0.1 mm to 3 mm. In general, a thicker wave-absorbing material 2 has better absorption performance, but in actual application, the thickness of the wave-absorbing material 2 cannot be increased unlimitedly due to the limitations of the electronic device itself. The thickness needs to be determined according to the wave-absorbing performance in a specific frequency band and the required wave-absorbing degree.

[0029] In some optional embodiments, the first adhesive layer 3 includes one or more of epoxy resin glue, polyurethane glue, acrylic glue, and double-sided adhesive tape 。The first adhesive layer 3 should have good adhesion and weather resistance to ensure firm adhesion to the wave-absorbing material 2, prevent easy falling off during use, and maintain stable performance under high temperature, low temperature, humidity, and other conditions. Epoxy resin glue has high adhesion and weather resistance, and is suitable for wave-absorbing material 2 adhesion under various environmental conditions. In addition, epoxy resin glue also has good chemical corrosion resistance and can maintain stable performance in harsh environments. Polyurethane glue has excellent elasticity and weather resistance, and is suitable for wave-absorbing material 2 adhesion that requires high elasticity and softness. At the same time, polyurethane glue also has high curing speed and can quickly complete the adhesion work. Acrylic glue has good adhesion and weather resistance, and is suitable for wave-absorbing material 2 adhesion in indoor and outdoor environments. In addition, acrylic glue also has a low curing temperature and a fast curing speed, which can facilitate mass production. Double-sided tape is a common adhesive material, which is firm and easy to use.

[0030] In some optional embodiments, the wave-absorbing structure 10 further comprises a second adhesive layer arranged between the PCB board 1 and the wave-absorbing material 2.

[0031] The second aspect of the present disclosure provides an electronic device comprising an electronic device body and the wave-absorbing structure 10 of any one of the aforementioned first aspect embodiments. The electronic device has the structure of the wave-absorbing structure 10 of any one of the aforementioned first aspect embodiments, and thus has all the beneficial effects of the aforementioned wave-absorbing structure 10. To avoid repetition, details are not repeated here.

[0032] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A wave-absorbing structure, characterized by comprising: The application relates to a wave-absorbing structure body. The wave-absorbing structure body comprises a PCB plate, a wave-absorbing material and a first adhesive layer. The PCB plate comprises an on-board antenna circuit for providing electric resonance. The wave-absorbing material is arranged on one side of the PCB plate and is coupled with the PCB plate to form a magnetic resonance body.

2. The wave-absorbing structure according to claim 1, wherein The first adhesive layer is arranged on the side of the wave-absorbing material away from the PCB plate and is used for connecting with an electronic device main body.

3. The wave-absorbing structure according to claim 2, wherein The on-board antenna circuit comprises a first etched metal, a plurality of resistors and a second etched metal connected in series.

4. The wave-absorbing structure according to claim 1, wherein The resistors are adjustable value magnetic beads, and the plurality of adjustable value magnetic beads have the same specification.

5. The wave-absorbing structure according to claim 1, wherein The wave-absorbing material comprises one or more of ferrite, barium titanate, metal micro powder, graphite, silicon carbide and conductive fiber.

6. The wave-absorbing structure according to claim 1, wherein The thickness of the wave-absorbing material is 0.1mm-3mm.

7. The wave-absorbing structure according to claim 1, wherein The first adhesive layer comprises one or more of epoxy resin glue, polyurethane glue, acrylic glue and double-sided adhesive tape.

8. An electronic device, comprising: The wave-absorbing structure body further comprises a second adhesive layer arranged between the PCB plate and the wave-absorbing material. The application further relates to an electronic device main body and the wave-absorbing structure body as claimed in any one of claims 1 to 7.

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