Diffusion layer stamping equipment

Abstract

The utility model discloses diffusion layer stamping equipment. A diffusion layer is a wave-shaped mechanism formed by a net-shaped base material. The diffusion layer stamping equipment comprises a rack, a stamping assembly, a forming assembly and a positioning assembly. The stamping assembly comprises a lower pressing block and an upper pressing block which are arranged on the rack and slide relative to each other. The forming assembly comprises a first forming module arranged on the lower pressing block and a second forming module arranged on the upper pressing block. The positioning assemblies are arranged on the lower pressing block, the number of the positioning assemblies is at least two, each positioning assembly comprises a positioning block, and the positioning blocks slide between a first set position and a second set position relative to the lower pressing block; the two positioning blocks limit the position of the base material in the first direction and the second direction respectively. Through the arrangement of the positioning assembly, the problem that the shapes of the machined diffusion layers are different is solved, the quality of the diffusion layers is improved, and the problem that the electrolytic efficiency is reduced due to the shape error of the diffusion layers in the subsequent electrolytic hydrogen production process can be solved.

Description

Technical Field

[0001] This application relates to the field of electrolytic hydrogen production, and in particular to a diffusion layer stamping device. Background Technology

[0002] Electrolysis of water is a relatively convenient method for producing hydrogen. The diffusion layer is a key component of the electrolyzer, and its structure features protrusions extending towards opposite sides. During the processing of the diffusion layer, a stamping device is used to extrude the substrate into the desired shape. However, during the stamping process, the substrate's position on the forming base is prone to shift, resulting in errors in the shape of the processed diffusion layer. Utility Model Content

[0003] In view of this, the purpose of this application is to provide a diffusion layer stamping device to reduce the problem of errors in the shape of the formed diffusion layer and improve the accuracy of diffusion layer forming.

[0004] To achieve at least one of the above objectives, this application provides the following technical solution:

[0005] In a first aspect, embodiments of this application provide a diffusion layer stamping device, wherein the diffusion layer is a wave-shaped structure formed from a mesh substrate;

[0006] The diffusion layer stamping equipment includes a frame, stamping components, forming components, and positioning components;

[0007] The stamping assembly includes a lower pressing block and an upper pressing block disposed on the frame and sliding relative to each other;

[0008] The molding assembly includes a first molding module disposed on the lower pressure block and a second molding module disposed on the upper pressure block;

[0009] The positioning components are disposed on the pressing block and at least two are provided. Each positioning component includes a positioning block, which slides relative to the pressing block between a first predetermined position and a second predetermined position.

[0010] The two positioning blocks respectively restrict the position of the substrate in the first direction and the second direction;

[0011] Wherein, the straight line containing the first direction is not parallel to the straight line containing the second direction.

[0012] In some embodiments, the first direction is perpendicular to the second direction.

[0013] In some embodiments, the positioning component includes a mounting plate disposed on the lower pressure block and an adjusting member fixedly connected to the mounting plate;

[0014] The adjusting component is connected to the positioning block and is used to drive the positioning block to slide relative to the pressing block.

[0015] In some embodiments, the mounting plate is slidably connected to the pressing block and can be locked relative to the pressing block;

[0016] The sliding direction of the mounting plate relative to the pressure block is the same as the sliding direction of the corresponding positioning block relative to the pressure block.

[0017] In some embodiments, when the positioning block is in the first set position, its vertical projection on the upper surface of the first molding module is located inside the first molding module.

[0018] When the positioning block is in the second set position, its vertical projection on the upper surface of the first molding module is located outside the first molding module.

[0019] In some embodiments, a peeling component disposed on the first molding module is also included;

[0020] The first molding module has a mounting groove for accommodating the peeling component;

[0021] The peeling assembly includes a peeling block that is slidably connected to the first molding module;

[0022] The peeling block slides between a storage position and a peeling position. When the peeling block is in the storage position, it is located inside the mounting groove, and when it is in the peeling position, it is at least partially located outside the mounting groove.

[0023] In some embodiments, when the peeling block is in a retracted position, the surfaces of the peeling block and the first molding module that are in contact with the substrate are combined to form a molding surface that adapts to the shape of the diffusion layer.

[0024] In some embodiments, the mounting groove sidewall is provided with an overlap edge;

[0025] When the peeling block is in the storage position, the peeling block abuts against the side of the overlapping edge facing out of the mounting groove.

[0026] In some embodiments, the first molding module is provided with at least two peeling components.

[0027] In some embodiments, the second molding module is also provided with the peeling component.

[0028] In the above technical solution, the positioning component ensures the accuracy of the substrate's position on the first forming module during stamping, making it easier to determine the substrate's placement and preventing offset. It also avoids differences in the shape of the final diffusion layer caused by different substrate placement positions in different processing stages, thus improving the quality of the processed diffusion layer and reducing the reduction in electrolysis efficiency caused by diffusion layer shape errors during subsequent hydrogen production. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the overall structure of a stamping device provided in some embodiments of this application;

[0031] Figure 2 This is a schematic diagram of the structure of the positioning component provided in some embodiments of this application;

[0032] Figure 3 Provided for some embodiments of this application Figure 1 Enlarged diagram of part A in the middle;

[0033] Figure 4 This is a schematic diagram of the structure of a stripping assembly provided in some embodiments of this application.

[0034] The attached figures are labeled as follows:

[0035] 1. Rack;

[0036] 2. Stamping assembly; 21. Lower pressing block; 211. Limiting groove; 22. Upper pressing block; 23. Driving component;

[0037] 3. Molding components; 31. First molding module; 311. Mounting slot; 32. Second molding module; 33. Overlap edge;

[0038] 4. Positioning component; 41. Positioning block; 42. Mounting plate; 43. Adjusting component; 44. Limiting block; 45. Tightening bolt.

[0039] 5. Peeling assembly, 51. Peeling block, 52. Power component. Detailed Implementation

[0040] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. Through these descriptions, the features and advantages of the present application will become clearer and more apparent.

[0041] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit this application; the terms "comprising" and "having" and any variations thereof in the specification and the foregoing description of this application are intended to cover non-exclusive inclusion.

[0042] The term "embodiment" as used in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0043] The specific term "exemplary" used in this application means "serving as an example, embodiment, or illustration." Any embodiment illustrated as "exemplary" is not necessarily to be construed as superior or better than other embodiments. Although various aspects of embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated otherwise.

[0044] In the description of this application, the technical terms "first", "second", "third", etc. are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0045] In the description of this application, the technical term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0046] In the description of this application, the technical terms "upper", "lower", "inner", "outer", "front", "back", "left", "right", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship in the working state of this application. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] In the description of this application, unless otherwise expressly specified and limited, the technical terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] In the description of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0049] In the description of this application, "multiple" means two or more (including two), unless otherwise expressly and specifically defined.

[0050] In the description of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, and other dimensions of various components in the embodiments of this application shown in the drawings, as well as the overall thickness, length, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0051] As part of the inventive concept of this application, before describing the embodiments of this application, it is necessary to analyze the reasons for the problem of displacement during the stamping of the diffusion layer substrate and the error in the shape of the diffusion layer in the related art, and obtain the technical solution of the embodiments of this application through reasonable analysis.

[0052] In related technologies, the equipment for stamping the diffusion layer mainly includes two forming modules mounted on a stamping press. The two modules move relative to each other to clamp the diffusion layer substrate, thereby forming the diffusion layer. During the processing, the diffusion layer substrate is first placed on the lower forming module, and then the stamping press is started, causing the two forming modules to extrude the substrate to form it. However, it should be noted that the position of the substrate on the forming module is arbitrary, as long as the substrate is located within the forming area of ​​the forming module.

[0053] However, the different positions of the substrate during different processing stages will lead to differences in the shape of multiple diffusion layers, resulting in a decrease in overall production quality. Furthermore, for the molding module, there will inevitably be processing errors during the manufacturing process, which will cause certain differences in the molding structure of different areas on the molding module. This will result in differences in the shape of the final formed diffusion layer when the substrate is placed in different areas of the molding module.

[0054] Differences in the shape of the diffusion layer can lead to poor efficiency in hydrogen electrolysis when applied to hydrogen electrolysis equipment. In other words, some areas of the diffusion layer inevitably suffer from reduced efficiency due to differences in the shaped form compared to the standard shape.

[0055] Therefore, this application provides a diffusion layer stamping device that avoids the situation where the diffusion layer substrate position shifts and causes differences in the shape of the diffusion layer during the diffusion layer processing, thereby improving the quality of the processed diffusion layer.

[0056] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings. The technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0057] For ease of description of the following embodiments, this application will refer to the "diffusion layer stamping equipment" as "stamping equipment"; the diffusion layer is a wavy structure formed by a mesh substrate. The example of the diffusion layer produced being applied to an electrolytic hydrogen production equipment will be used for illustration. Of course, in practical applications, the diffusion layer produced can also be applied to fuel cells or other related structures as needed.

[0058] An embodiment of this application provides a diffusion layer stamping device, such as... Figure 1 As shown, Figure 1 A schematic diagram of the overall structure of the stamping equipment is shown. The stamping equipment includes a frame 1, a stamping assembly 2, a forming assembly 3, and a positioning assembly 4. The frame 1 and the stamping assembly 2 are the main functional components of a conventional stamping equipment. The stamping assembly 2 includes a lower pressing block 21, an upper pressing block 22, and a driving component 23, which are mounted on the frame 1. The lower pressing block 21 is fixed relative to the frame 1, the upper pressing block 22 is slidably connected to the frame 1, and the driving component 23 is fixedly connected to the frame 1 and connected to the upper pressing block 22 to drive the upper pressing block 22 to slide.

[0059] Alternatively, the lower pressure block 21 can be slidably connected to the frame 1, while the upper pressure block 22 is fixed relative to the frame 1. Correspondingly, the driving component 23 drives the lower pressure block 21 to slide. Alternatively, both the lower pressure block 21 and the upper pressure block 22 can be slidably connected to the frame 1, with two driving components 23 driving the lower pressure block 21 and the upper pressure block 22 to slide respectively. The driving component 23 can be a linear telescopic mechanism such as a cylinder, hydraulic cylinder, or electric push rod. In this embodiment, a hydraulic cylinder is used as an example.

[0060] The molding component 3 includes a first molding module 31 and a second molding module 32. The first molding module 31 is fixedly connected to the lower pressure block 21, and the second molding module 32 is fixedly connected to the upper pressure block 22. Matching molding protrusions are provided on the opposing surfaces of the two molding modules to form the substrate by pressing it together. (See reference...) Figure 4 The structure of the first molding module 31 shown in the figure.

[0061] refer to Figure 2 and combined Figure 1 The positioning component 4 is disposed on the lower pressing block 21 and located outside the first molding module 31. It includes a positioning block 41 that slides relative to the lower pressing block 21. The positioning block 41 reciprocates between a first set position and a second set position. When the positioning block 41 is in the first set position, its vertical projection onto the upper surface of the first molding module 31 is located inside the first molding module 31; when the positioning block 41 is in the second set position, its vertical projection onto the upper surface of the first molding module 31 is located outside the first molding module 31. The positioning block 41 is in contact with the surface of the first molding module 31 facing the upper pressing block 22, thereby limiting the position of the substrate in the corresponding direction.

[0062] At least two positioning components 4 are provided, wherein the two positioning components 4 respectively restrict the position of the substrate in the first direction and the second direction; the included angle between the first direction and the second direction is not 0, that is, the straight line in the first direction is not parallel to the straight line in the second direction.

[0063] For example, two positioning components 4 are provided, and two positioning blocks 41 restrict the position of the substrate in a first direction and a second direction, the first direction being perpendicular to the second direction.

[0064] In other embodiments, the number of positioning components 4 may be three, four or more, restricting the position of the substrate in different directions.

[0065] When processing the diffusion layer using the positioning component 4, the substrate is placed on the first forming module 31. The position of the substrate is determined by the limitation of at least two positioning blocks 41. In multiple processing steps, the substrate is placed on the first forming module 31 each time, ensuring that it is placed in the same position. This avoids the problem of different diffusion layers having different shapes due to substrate position shift, and improves the quality of the processed diffusion layer.

[0066] The positioning component 4 also includes a mounting plate 42 and an adjusting component 43. The positioning block 41 is slidably connected to the mounting plate 42, and the mounting plate 42 is fixedly connected to the pressing block 21 to achieve the slidable connection between the positioning block 41 and the pressing block 21. The adjusting component 43 is fixedly connected to the mounting plate 42 and connected to the positioning block 41 to drive the positioning block 41 to slide relative to the mounting plate 42 and lock at any position in the sliding stroke.

[0067] The adjusting component 43 is a linear telescopic structure, with its main body fixedly connected to the mounting plate 42 and its telescopic end fixedly connected to the positioning block 41. For example, the adjusting component 43 is an electric push rod, but different types of linear telescopic structures such as hydraulic cylinders or pneumatic cylinders can also be selected.

[0068] To improve the convenience of stamping the diffusion layer, a matching control system can be set up to automatically adjust the actions of the drive component 23 and the positioning component 43. For example, after the control system controls the drive component 23 to separate the first forming module 31 and the second forming module 32, the positioning component 43 drives the positioning block 41 to slide to the first set position. Then, the operator (or an automated transfer device such as a robotic arm) places the substrate on the first forming module 31 and triggers the corresponding button to indicate that the substrate has been placed. At this time, the positioning component 43 is first controlled to slide the positioning block 41 to the second set position, and then the drive component 23 drives the second forming module 32 to cooperate with the first forming module 31 to extrude the substrate.

[0069] The control principles or methods involved are those that can be implemented by those skilled in the art based on existing technology, and this application will not elaborate on the specific control principles or methods.

[0070] As for the specific position of the first set position relative to the first forming module 31, it can be determined in the actual design process according to the shape and size of the diffusion layer to be processed. Furthermore, if the shape and size of the processed diffusion layer are deformed, the first set position can be adjusted adaptively.

[0071] One specific way to adjust the first set position is to change the sliding stroke of the adjusting member 43 so that the telescopic end of the adjusting member 43 stops when it slides to different positions. Another way is to change the position of the mounting plate 42. However, it should be ensured that while adjusting the first set position, the second set position is always located outside the first forming module 31 to avoid interfering with the cooperation between the first forming module 31 and the second forming module 32 in stamping the substrate.

[0072] refer to Figure 3The mounting plate 42 and the pressing block 21 are slidably connected along a set direction, where the set direction is the direction in which the corresponding positioning block 41 can restrict the movement of the substrate. Specifically, the mounting plate 42 has a limiting block 44 on the side facing the pressing block 21, and the pressing block 21 has a limiting groove 211 that matches the limiting block 44; the limiting block 44 is engaged in the limiting groove 211, thereby realizing the sliding connection between the mounting plate 42 and the pressing block 21, and restricting the mounting plate 42 from disengaging from the pressing block 21 in a direction perpendicular to the upper surface of the pressing block 21.

[0073] In addition, the mounting plate 42 is provided with a tightening bolt 45, the end of which abuts against the lower pressure block 21. After sliding the mounting plate 42 to the desired position, tightening the tightening bolt 45 can fix the position of the mounting plate 42, making the adjustment and fixing operations relatively convenient.

[0074] Furthermore, during actual processing, it was found that due to the material and structure of the substrate (diffusion layer), specifically its relatively small thickness (e.g., 0.5mm), after the substrate is formed by stamping, there is a high probability that the diffusion layer will remain tightly attached to the first forming module 31 (or the second forming module 32). To remove the diffusion layer, workers need to pry it off the first forming module 31 from its edge. This operation is convenient but reduces work efficiency and can easily cause deformation of the diffusion layer's edges.

[0075] To solve this problem, refer to Figure 2 and Figure 4 The stamping equipment is also equipped with a peeling component 5, which is disposed on the first forming module 31 and the second forming module 32. The peeling component 5 is used to peel the formed diffusion layer from the first forming module 31 or the second forming module 32, so that the diffusion layer can be removed. Depending on the actual situation, the diffusion layer, after forming, is mainly attached to the lower first forming module 31 and is difficult to remove. Therefore, the peeling component 5 is at least disposed on the first forming module 31. In some embodiments, the peeling component 5 may also be disposed on the second forming module 32.

[0076] The following description uses the example of the peeling component 5 being set on the first molding module 31. The structure of the peeling component 5 set on the second molding module 32, as well as the cooperation between the second molding module 32 and the peeling component 5, can be referred to the structure of the peeling component 5 set on the first molding module 31 and the cooperation between the first molding module 31 and the peeling component 5, and will not be described separately.

[0077] refer to Figure 4The first forming module 31 has an installation groove 311 for accommodating the peeling component 5. The peeling component 5 includes a peeling block 51 and a power component 52, both of which are disposed in the installation groove 311. The side wall of the peeling block 51 is attached to the side wall of the installation groove 311 and is slidably connected to the first forming module 31. The power component 52 is fixedly connected to the first forming module 31, and the driving end of the power component 52 is fixedly connected to the peeling block 51 to drive the peeling block 51 to slide relative to the first forming module 31, so that the peeling block 51 slides between the storage position and the peeling position. For example, the power component 52 is a linear telescopic mechanism such as a cylinder, hydraulic cylinder, or electric push rod.

[0078] When the peeling block 51 is in the retracted position, the surface of the peeling block 51 that contacts the substrate and the surface of the first molding module 31 that contacts the substrate combine to form a molding surface that is adapted to the shape of the diffusion layer to be processed.

[0079] To facilitate understanding, the structural relationship between the peeling block 51 and the first molding module 31 is further explained: The molding surface adapts to the shape of the diffusion layer to be processed. Without the peeling component 5, and without the mounting groove 311 on the first molding module 31, the molding surface on the first molding module 31 is a complete surface with protrusions and depressions of a specific shape. With the peeling component 5, the first molding module 31 has a mounting groove 311, resulting in a partial loss of the originally complete molding surface. The peeling block 51 is placed within the mounting groove 311, and its surface fills in the missing portion of the originally completed molding surface, forming a molding surface that adapts to the shape of the diffusion layer.

[0080] During the process of placing the substrate onto the first forming module 31 and during the stamping process to form the substrate, the peeling block 51 remains in the storage position, completing the normal stamping process. After the forming process is completed, the first forming module 31 separates from the second forming module 32, and the power component 52 drives the peeling block 51 to slide to the peeling position, so that the diffusion layer is separated from the first forming module 31. This makes it easy for the operator to remove the formed diffusion layer, which is convenient to operate and less likely to cause deformation of the diffusion layer.

[0081] refer to Figure 4 The mounting groove 311 has an overlapping edge 33 on its side wall. When the peeling block 51 is in the storage position, it abuts against the side wall of the mounting groove 311 facing outward from the overlapping edge 33. The overlapping edge 33 provides support for the peeling block 51, preventing the power component 52 from being damaged due to excessive pressure during the pressing and molding process of the substrate.

[0082] In some embodiments, multiple peeling components 5 are provided on the first molding module 31, which can further reduce the risk of deformation of the diffusion layer when peeling the diffusion layer from the first molding module 31, resulting in a better quality diffusion layer.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A diffusion layer punching apparatus characterized by comprising: The diffusion layer is a wave-shaped mechanism formed by a net-shaped substrate; The diffusion layer stamping device comprises a frame, a stamping assembly, a forming assembly and a positioning assembly; The stamping assembly comprises a lower pressing block and an upper pressing block arranged on the frame and sliding relative to each other; The forming assembly comprises a first forming module arranged on the lower pressing block and a second forming module arranged on the upper pressing block; The positioning assembly is arranged on the lower pressing block and comprises at least two positioning blocks, which slide relative to the lower pressing block between a first set position and a second set position; The two positioning blocks limit the position of the substrate in a first direction and a second direction, respectively; The first direction and the second direction are perpendicular to each other.

2. The diffusion layer punching apparatus according to claim 1, characterized by The positioning assembly comprises a mounting plate arranged on the lower pressing block and a position adjusting member fixedly connected to the mounting plate; 3. The diffusion layer punching apparatus according to claim 1, wherein The position adjusting member is connected to the positioning block and is used to drive the positioning block to slide relative to the lower pressing block. The mounting plate is slidingly connected to the lower pressing block and can be locked relative to the lower pressing block; 4. The diffusion layer punching apparatus according to claim 3, wherein The sliding direction of the mounting plate relative to the lower pressing block is the same as the sliding direction of the corresponding positioning block relative to the lower pressing block. When the positioning block is in the first set position, the vertical projection of the upper surface of the first forming module is located inside the first forming module; 5. The diffusion layer stamping apparatus of claim 1, wherein When the positioning block is in the second set position, the vertical projection of the upper surface of the first forming module is located outside the first forming module. Further comprising a stripping assembly arranged on the first forming module; 6. The diffusion layer stamping apparatus of claim 1, wherein The first forming module is provided with a mounting groove for accommodating the stripping assembly; The stripping assembly comprises a stripping block slidingly connected to the first forming module; The stripping block slides between a storage position and a stripping position, and when the stripping block is in the storage position, it is located in the mounting groove, and when it is in the stripping position, it is at least partially located outside the mounting groove. When the stripping block is in the storage position, the surfaces of the stripping block and the first forming module used for contacting the substrate combine to form a forming surface that is adapted to the shape of the diffusion layer.

7. The diffusion layer stamping apparatus of claim 6, wherein, The side wall of the mounting groove is provided with a lap joint; 8. The diffusion layer stamping apparatus of claim 7, wherein, When the stripping block is in the storage position, the stripping block and the lap joint abut on the side of the mounting groove. The first forming module is provided with at least two stripping assemblies.

9. The diffusion layer stamping apparatus of claim 6, wherein, The second forming module is also provided with the stripping assembly.

10. The diffusion layer stamping apparatus of claim 6, wherein, ​

Images