Top-sealed semiconductor refrigerator

Abstract

The utility model provides a top sealed type semiconductor refrigerator, which relates to the technical field of semiconductor thermoelectric refrigeration, and comprises a radiating fin, a refrigeration sheet and an evaporation sheet, the top of the radiating fin is provided with a groove, the bottom of the evaporation sheet is provided with a base, the bottom of the base is provided with a fitting groove, and the refrigeration sheet is arranged in the groove and is positioned in the fitting groove; the grooves are matched with the attaching grooves, the grooves in the tops of the cooling fins are used in cooperation with the attaching grooves in the bottoms of the evaporation fins, the contact area between the refrigeration fins and the cooling fins and the contact area between the refrigeration fins and the evaporation fins are increased, heat resistance is reduced, and heat transfer efficiency is improved; the refrigeration sheet, the cooling sheet and the evaporation sheet are bonded through heat conduction silicone grease glue, interface gaps are filled with the silicone grease glue with the high heat conduction coefficient, it is ensured that heat is rapidly conducted to the cooling sheet, cold energy is efficiently transferred to the evaporation sheet, and the overall energy efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor thermoelectric refrigeration technology, and in particular to a top-sealed semiconductor cooler. Background Technology

[0002] A semiconductor cooler is a thermoelectric conversion device based on the Peltier effect. It achieves directional heat transfer by driving the migration of charge carriers inside the semiconductor material with current. Its core function is to achieve precise temperature control without mechanical moving parts. It is commonly used in electronic equipment heat dissipation, car refrigerators, medical instruments (such as PCR instruments), laser cooling and other scenarios.

[0003] The structure of currently used semiconductor cooling components includes a cooling chip consisting of a hot-end substrate, a hot-end guide plate, an electrocoupler arm, a cold-end guide plate, and a cold-end substrate. The cooling chip is generally attached to the heat sink with thermally conductive silicone grease, and then the evaporator is placed on the other side of the cooling chip. That is, the hot and cold end substrates of the cooling chip are in contact with the contact surfaces of the cooling and heat dissipation devices. After the cooling chip is energized, the cold energy can be conducted out through the evaporator. Traditional semiconductor coolers have the following technical defects: low heat conduction efficiency, gaps between the cooling chip and the heat sink and evaporator due to insufficient processing precision, and poor heat transfer due to reliance on physical contact, resulting in serious loss of cold energy. Therefore, we propose a top-sealed semiconductor cooler. Utility Model Content

[0004] The purpose of this invention is to provide a top-sealed semiconductor cooler to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A top-sealed semiconductor cooler includes a heat sink, a cooling plate, and an evaporator. The heat sink has a groove on its top, the evaporator has a base at its bottom, and the base has a fitting groove at its bottom. The cooling plate is installed in the groove and located in the fitting groove.

[0007] The heat sink is bolted to a protective housing, which is mounted on a base. A drive motor is mounted inside the base, and a fan is connected to the output of the drive motor. Multiple airflow ports are provided through the front and back of the protective housing.

[0008] As a preferred embodiment of this utility model, the bottom side of the cooling chip is a hot end substrate and the top side is a cold end substrate. The bottom hot end substrate of the cooling chip is tightly fitted with the groove of the heat sink, and the top cold end substrate is embedded in the evaporator bonding groove to achieve physical isolation between the hot and cold ends.

[0009] The technical effect of adopting the above-mentioned further solution is that the hot end substrate and the heat sink groove are closely attached in the cooling chip, and the cold end substrate is embedded in the evaporation chip, which realizes physical isolation between the hot and cold ends, reduces heat conduction loss, improves temperature difference efficiency, and avoids performance degradation caused by mutual interference between the hot and cold ends.

[0010] In a preferred embodiment of this invention, the cooling plate is bonded to the heat sink and the evaporator plate using thermally conductive silicone grease.

[0011] The technical effect of adopting the above-mentioned further solution is that by filling the interface gap with silicone grease with high thermal conductivity, the contact thermal resistance is significantly reduced, the heat of the cooling chip is quickly conducted to the heat sink, and the cold energy is efficiently transferred to the evaporator, thus greatly improving the overall energy efficiency ratio.

[0012] As a preferred embodiment of this utility model, the heat sink and the evaporator are fixedly connected by bolts.

[0013] The technical advantages of adopting the above-mentioned further solution are: using bolts to fasten the heat sink and evaporator ensures structural stability, while facilitating quick disassembly and replacement of the cooling element during maintenance.

[0014] As a preferred embodiment of this utility model, a flow port is provided between the protective shell and the base.

[0015] As a preferred embodiment of this utility model, a first filter screen is provided inside the flow port.

[0016] The technical effect of adopting the above-mentioned further solution is that the protective shell and the base are connected through the flow port to form an air duct. The cold end substrate on the other side of the cooling chip is connected to the evaporator to transfer the cold energy out. The cold air is conducted out by the rotation of the fan to carry out the cooling.

[0017] As a preferred embodiment of this utility model, a second filter screen is provided at the top port of the base.

[0018] The technical effect of adopting the above-mentioned further solution is that the second filter screen blocks large particles of foreign matter from entering the motor compartment, thus extending the life of the drive motor.

[0019] As a preferred embodiment of this utility model, a third filter screen is provided in each of the multiple flow guide ports.

[0020] The technical effect of adopting the above-mentioned further solution is that, through multiple air guide ports and a third filter screen set in the air guide ports, the airflow distribution is balanced and dust is filtered, ensuring the uniformity of air circulation between the inside of the protective housing and the outside.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] In this invention, the groove on the top of the heat sink and the fitting groove on the bottom of the evaporator are used together to increase the contact area between the cooling plate and the heat sink and evaporator, reduce thermal resistance, and improve heat transfer efficiency. The cooling plate is bonded to the heat sink and evaporator with thermally conductive silicone grease. The high thermal conductivity silicone grease fills the interface gaps, ensuring that heat is quickly conducted to the heat sink and cold energy is efficiently transferred to the evaporator, thus improving overall energy efficiency. Attached Figure Description

[0023] Figure 1 A schematic diagram of the internal structure of a top-sealed semiconductor cooler provided by this utility model;

[0024] Figure 2 An enlarged schematic diagram of the A-section structure of a top-sealed semiconductor cooler provided by this utility model;

[0025] Figure 3 A schematic diagram of the internal structure of a top-sealed semiconductor cooler provided by this utility model;

[0026] Figure 4 This is a partial overall structural diagram of a top-sealed semiconductor cooler provided by this utility model.

[0027] Legend: 1. Heat sink; 101. Groove; 2. Cooling plate; 3. Evaporator plate; 301. Base; 3011. Adhesive groove; 4. Thermal grease; 5. Protective shell; 501. Base; 5011. Second filter; 502. Drive motor; 5021. Fan; 503. Inlet; 5031. Third filter; 6. Flow port; 601. First filter. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0029] To facilitate understanding of this utility model, a more comprehensive description of this utility model will be provided below with reference to relevant embodiments, and several embodiments of this utility model will be given. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this utility model more thorough and complete.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] Example 1

[0033] like Figure 1-4 As shown, this utility model provides a technical solution: a top-sealed semiconductor cooler, including a heat sink 1, a cooling plate 2, and an evaporator 3. The heat sink 1 has a groove 101 on its top, and the evaporator 3 has a base 301 at its bottom. The base 301 has a fitting groove 3011 at its bottom. The cooling plate 2 is installed in the groove 101 and located in the fitting groove 3011. The heat sink 1 fixes the cooling plate 2 through the top groove 101, increasing the contact area and improving heat dissipation efficiency. The fitting groove 3011 at the bottom of the base 301 fits tightly with the cooling plate 2, ensuring stable transfer of cooling energy to the evaporator 3. The base 301 at the bottom of the evaporator 3 optimizes the heat conduction path and reduces cooling loss. A protective shell 5 is bolted to the top of the heat sink 1. A base 501 is provided on the top of the protective shell 5, and a drive motor 50 is installed inside the base 501. 2. A fan 5021 is connected to the output end of the drive motor 502. Multiple air guide ports 503 are provided through the front and back of the protective housing 5. The protective housing 5 is modularly packaged by bolt connection to prevent foreign objects from entering. The bottom side of the cooling chip 2 is a hot end substrate, and the top side is a cold end substrate. The bottom hot end substrate of the cooling chip 2 is tightly attached to the groove 101 of the heat sink 1. The top cold end substrate is embedded in the evaporator 3 fitting groove 3011 to achieve physical isolation between the hot and cold ends. A flow port 6 is provided between the protective housing 5 and the base 501. A first filter 601 is provided in the flow port 6. The protective housing 5 and the base 501 are connected through the flow port 6 to form an air duct. The cold end substrate on the other side of the cooling chip 2 is connected to the evaporator 3 to transfer the cold energy. The fan 5021 rotates and conducts the cold air out for cooling.

[0034] Example 2

[0035] like Figure 1-4As shown, this utility model provides a technical solution: a top-sealed semiconductor cooler, in which the cooling chip 2 is bonded to the heat sink 1 and the evaporator 3 by thermally conductive silicone grease 4. The high thermal conductivity silicone grease fills the interface gap, significantly reducing the contact thermal resistance, allowing the heat of the cooling chip 2 to be quickly conducted to the heat sink 1 and the cold energy to be efficiently transferred to the evaporator 3, greatly improving the overall energy efficiency ratio. The heat sink 1 and the evaporator 3 are bolted together, and the bolts are used to fasten the heat sink 1 and the evaporator 3 to ensure structural stability and facilitate quick disassembly and replacement of the cooling chip 2 during maintenance. A second filter 5011 is provided at the top port of the base 501. The second filter 5011 blocks large particles of foreign matter from entering the motor compartment, extending the life of the drive motor 502. A third filter 5031 is provided in each of the multiple air guide ports 503. Through the multiple air guide ports 503 and the third filters in the air guide ports 503, the airflow distribution is balanced and dust is filtered, ensuring the uniformity of airflow between the inside of the protective shell 5 and the outside.

[0036] The working process of this utility model is as follows: When using a top-sealed semiconductor cooler, after the cooling chip 2 is powered on, a temperature difference is generated through the Peltier effect. Its hot-end substrate is tightly bonded to the groove 101 of the heat sink 1 via thermally conductive silicone grease 4, and heat is diffused through the fins of the heat sink 1. At the same time, the cold-end substrate is in efficient contact with the evaporator 3 through the bonding groove 3011, and the cold energy is conducted to the surface of the evaporator 3 through the base 301. A protective shell 5 is bolted to the top of the heat sink 1. A base 501 is provided on the top of the protective shell 5. A drive motor 502 is provided inside the base 501. A fan 5021 is connected to the output end of the drive motor 502. Multiple air guide ports 503 are provided through the front and back of the protective shell 5. The protective shell 5 is modularly packaged by bolt connection to prevent foreign objects from entering. The bottom side of the cooling chip 2 is the hot-end substrate, and the top side is the cold-end substrate. The bottom hot-end substrate of the cooling chip 2 is bonded to the groove 101 of the heat sink 1. 01. A tight fit is achieved by embedding the top cold end substrate into the evaporator plate 3's bonding groove 3011, thus physically isolating the hot and cold ends. A flow port 6 is provided between the protective shell 5 and the base 501, and a first filter 601 is installed inside the flow port 6. The flow port 6 connects the protective shell 5 and the base 501, forming an air duct. The cold end substrate on the other side of the cooling plate 2 is connected to the evaporator plate 3, transferring the cooling energy out. The fan 5021 rotates and conducts the cold air out for cooling. A second filter 5011 is provided at the top port of the base 501. The second filter 5011 blocks large particles of foreign matter from entering the motor compartment, extending the life of the drive motor 502. A third filter 5031 is provided in each of the multiple guide ports 503. Through the multiple guide ports 503 and the third filters in the guide ports 503, the airflow distribution is balanced and dust is filtered, ensuring the uniformity of airflow between the inside of the protective shell 5 and the outside.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A top-sealed semiconductor cooler, comprising a heat sink (1), a cooling plate (2), and an evaporator (3), characterized in that: The heat sink (1) has a groove (101) on the top, the evaporator (3) has a base (301) at the bottom, the base (301) has a fitting groove (3011) at the bottom, and the cooling chip (2) is installed in the groove (101) and located in the fitting groove (3011); The heat sink (1) is bolted to the top of a protective housing (5). A base (501) is provided on the top of the protective housing (5). A drive motor (502) is provided inside the base (501). A fan (5021) is connected to the output end of the drive motor (502). Multiple air guide ports (503) are provided through the front and back of the protective housing (5).

2. The top-sealed semiconductor cooler according to claim 1, characterized in that: The bottom side of the cooling chip (2) is a hot end substrate and the top side is a cold end substrate. The bottom hot end substrate of the cooling chip (2) is tightly attached to the groove (101) of the heat sink (1), and the top cold end substrate is embedded in the bonding groove (3011) of the evaporator (3) to achieve physical isolation between the hot and cold ends.

3. A top-sealed semiconductor cooler according to claim 1, characterized in that: The cooling plate (2) is bonded to the heat sink (1) and the evaporator (3) by thermally conductive silicone grease (4).

4. A top-sealed semiconductor cooler according to claim 1, characterized in that: The heat sink (1) and the evaporator (3) are fixedly connected by bolts.

5. A top-sealed semiconductor cooler according to claim 1, characterized in that: A flow port (6) is provided between the protective shell (5) and the base (501).

6. A top-sealed semiconductor cooler according to claim 5, characterized in that: A first filter screen (601) is provided inside the flow port (6).

7. A top-sealed semiconductor cooler according to claim 1, characterized in that: A second filter (5011) is provided at the top port of the base (501).

8. A top-sealed semiconductor cooler according to claim 1, characterized in that: Each of the multiple flow inlets (503) is provided with a third filter (5031).

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