Core cladding structure for capacitor

Abstract

The utility model relates to the technical field of capacitors, and discloses a capacitor core cladding structure, which comprises an insulating substrate, an anode electrode layer is fixedly connected to the upper surface of the insulating substrate, a solid electrolyte layer is fixedly connected to the upper surface of the anode electrode layer, an ion conduction channel is arranged on the inner side surface of the solid electrolyte layer, and the ion conduction channel is communicated with the solid electrolyte layer. The upper surface of the solid electrolyte layer is fixedly connected with a cathode electrode layer, the lower surface of the cathode electrode layer is fixedly connected with salient points, the lower surface of the insulating substrate is fixedly connected with a buffer layer, and the outer side surface of the buffer layer is fixedly connected with a packaging frame. According to the capacitor core cladding structure, the semicircular ion conduction channels distributed in an array mode are arranged on the inner side of the solid electrolyte layer, ion collision scattering is reduced, parallel paths are increased, the ion conduction efficiency is improved, the buffer layer absorbs and disperses stress to protect the upper structure, the anode electrode layer is fixedly connected with the packaging frame, and the positions of all the layers are stabilized; the working stability in a complex environment is improved.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, specifically to a capacitor core structure. Background Technology

[0002] As electronic devices continue to evolve towards miniaturization and higher performance, the optimization of capacitors, as key components in electronic circuits, is crucial. While traditional capacitor core structures have undergone structural and material optimizations to improve efficiency and stability, they still face some challenges in practical applications.

[0003] Traditional capacitor core-pack structures often have tortuous ion conduction paths, resulting in low ion conduction efficiency. Under mechanical vibration or impact, the electrode and electrolyte layers inside the capacitor are prone to displacement or damage, leading to unstable capacitor performance. Therefore, we propose a new capacitor core-pack structure. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a capacitor core-pack structure that offers advantages such as improved ion conduction efficiency and enhanced stability, thus solving the problems of low ion conduction efficiency and weak stability in existing capacitor core-pack structures.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A capacitor core package structure includes an insulating substrate. An anode electrode layer is fixedly connected to the upper surface of the insulating substrate. An anode lead terminal is fixedly connected to one side surface of the anode electrode layer. A solid electrolyte layer is fixedly connected to the upper surface of the anode electrode layer. An ion conduction channel is formed on the inner surface of the solid electrolyte layer. A cathode electrode layer is fixedly connected to the upper surface of the solid electrolyte layer. A protrusion is fixedly connected to the lower surface of the cathode electrode layer. A cathode lead terminal is fixedly connected to one side surface of the cathode electrode layer. A buffer layer is fixedly connected to the lower surface of the insulating substrate. An encapsulation frame is fixedly connected to the outer surface of the buffer layer. An inner encapsulation layer is fixedly connected to the outer surface of the encapsulation frame. An outer protective layer is fixedly connected to the outer surface of the inner encapsulation layer. A heat dissipation fin is fixedly connected to the upper surface of the outer protective layer.

[0007] Preferably, the surface of the anode electrode layer is chemically etched to form an uneven structure, and the anode electrode layer is fixedly connected to the packaging frame.

[0008] Preferably, the ion conduction channels are arranged in an array on the inner surface of the solid electrolyte layer in multiple groups, and the shape of the ion conduction channels is semi-circular.

[0009] Preferably, the buffer layer is configured as a flexible insulating material, and the ion conduction channel is disposed throughout the thickness direction of the solid electrolyte layer.

[0010] Preferably, the bumps are arranged in an array on the lower surface of the cathode electrode layer, and the height and density of the bumps are set according to the capacitance performance requirements.

[0011] Preferably, the outer surfaces of the anode and cathode leads are treated with anti-oxidation agents, and the inner encapsulation layer is made of an insulating material with good sealing performance.

[0012] Preferably, the heat dissipation fins are integrally formed with the outer protective layer, and multiple sets of heat dissipation fins are equally spaced on the upper surface of the outer protective layer.

[0013] Compared with the prior art, the present invention provides a capacitor core-package structure with the following advantages:

[0014] 1. This capacitor core structure features an array of semi-circular ion conduction channels on the inner surface of the solid electrolyte layer. This reduces collisions and scattering during ion conduction, providing a smoother migration path for ions. The multiple arrays of semi-circular ion conduction channels increase the parallel paths of ion conduction, allowing more ions to participate in conduction simultaneously and improving ion conduction efficiency.

[0015] 2. This is used in capacitor core-package structure. The buffer layer absorbs and disperses mechanical stress to avoid damage to the upper structure. The anode electrode layer is fixedly connected to the packaging frame to prevent the anode electrode layer from shaking or shifting, ensuring the stability of each layer structure and greatly improving the stability of the capacitor in complex environments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the interaction between the ion conduction channel and the solid electrolyte layer of this utility model.

[0018] Figure 3 This is a schematic diagram of the interaction between the cathode electrode layer and the packaging frame of this utility model.

[0019] Figure 4 This is a schematic diagram of the structure in which the protrusions and the cathode electrode layer of this utility model interact.

[0020] The components are: 1. Insulating substrate; 2. Anode electrode layer; 3. Anode lead-out terminal; 4. Solid electrolyte layer; 5. Ion conduction channel; 6. Cathode electrode layer; 7. Bump; 8. Cathode lead-out terminal; 9. Buffer layer; 10. Encapsulation frame; 11. Inner encapsulation layer; 12. Outer protective layer; 13. Heat dissipation fins. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4 A capacitor core package structure includes an insulating substrate 1, an anode electrode layer 2 fixedly connected to the upper surface of the insulating substrate 1, an anode lead terminal 3 fixedly connected to one side surface of the anode electrode layer 2, a solid electrolyte layer 4 fixedly connected to the upper surface of the anode electrode layer 2, an ion conduction channel 5 formed on the inner surface of the solid electrolyte layer 4, a cathode electrode layer 6 fixedly connected to the upper surface of the solid electrolyte layer 4, a protrusion 7 fixedly connected to the lower surface of the cathode electrode layer 6, a cathode lead terminal 8 fixedly connected to one side surface of the cathode electrode layer 6, a buffer layer 9 fixedly connected to the lower surface of the insulating substrate 1, an encapsulation frame 10 fixedly connected to the outer surface of the buffer layer 9, an inner encapsulation layer 11 fixedly connected to the outer surface of the encapsulation frame 10, an outer protective layer 12 fixedly connected to the outer surface of the inner encapsulation layer 11, and a heat dissipation fin 13 fixedly connected to the upper surface of the outer protective layer 12.

[0023] In this embodiment, the surface of the anode electrode layer 2 is chemically etched to form an uneven structure. The anode electrode layer 2 is fixedly connected to the packaging frame 10. With the anode electrode layer 2, the uneven structure formed by the chemical etching process greatly increases the contact area between the anode electrode layer 2 and the solid electrolyte layer 4, accelerates the ion conduction speed, and improves the charging and discharging efficiency of the capacitor.

[0024] Furthermore, multiple sets of ion conduction channels 5 are arrayed on the inner surface of the solid electrolyte layer 4. The ion conduction channels 5 are semi-circular in shape. By setting up the ion conduction channels 5, multiple sets of ion conduction channels 5 are arrayed on the inner surface of the solid electrolyte layer 4 during use, providing multiple parallel conduction paths for ions, which greatly increases the flux of ion conduction. The inner wall of the semi-circular ion conduction channel 5 is smooth and the curvature changes continuously, which can reduce the collision and scattering of ions during the conduction process, provide a smoother migration path for ions, reduce the resistance of ion conduction, and thus further improve the ion conduction efficiency.

[0025] Furthermore, the buffer layer 9 is set as a flexible insulating material, and the ion conduction channel 5 is set through the thickness direction of the solid electrolyte layer 4. With the setting of the buffer layer 9, in the actual working scenario of the capacitor, it is easy to be subjected to external mechanical vibration, impact and other forces, which may cause structural deformation and damage, thereby affecting the performance and stability of the capacitor. The buffer layer 9 can effectively absorb and disperse these forces, protect the key internal structure of the capacitor, and ensure that the capacitor can work stably in complex working environments.

[0026] In addition, the bumps 7 are arranged in an array on the lower surface of the cathode electrode layer 6. The height and density of the bumps 7 are set according to the performance requirements of the capacitor. By setting the bumps 7, when in use, the bumps 7 are arranged in an array on the lower surface of the cathode electrode layer 6, which increases the contact area between the cathode electrode layer 6 and the solid electrolyte layer 4, improves the efficiency of charge transfer, accelerates the charging and discharging speed of the capacitor, and improves the overall performance of the capacitor.

[0027] In addition, the outer surfaces of the anode lead-out terminal 3 and the cathode lead-out terminal 8 are treated with anti-oxidation, and the inner encapsulation layer 11 is set as an insulating material with good sealing performance. With the setting of the anode lead-out terminal 3 and the cathode lead-out terminal 8, when in use, the anti-oxidation treatment on the surface of the anode lead-out terminal 3 and the cathode lead-out terminal 8 can form a protective film on the terminal surface, preventing oxygen, moisture and other substances from contacting the metal, thereby effectively preventing the occurrence of oxidation reaction, making the conductivity and stability of the anode lead-out terminal 3 and the cathode lead-out terminal 8 better.

[0028] It is worth noting that the heat dissipation fins 13 and the outer protective layer 12 are integrally formed. Multiple sets of heat dissipation fins 13 are equally spaced on the upper surface of the outer protective layer 12. Through the arrangement of heat dissipation fins 13 and outer protective layer 12, the integral design of heat dissipation fins 13 and outer protective layer 12 can greatly improve heat conduction efficiency during use. Multiple sets of equally spaced heat dissipation fins 13 increase the heat dissipation area and improve heat dissipation efficiency.

[0029] During use, when the capacitor is connected to the circuit and begins charging, the external power supply drives electrons to flow from the anode terminal 3 out of the anode electrode layer 2, making the anode electrode layer 2 positively charged. Simultaneously, ions in the anode electrode layer 2 migrate towards the solid electrolyte layer 4. Under the influence of the electric field, the ions in the solid electrolyte layer 4 move towards the cathode electrode layer 6, while electrons flow through the external circuit to the cathode terminal 8 and accumulate on the cathode electrode layer 6, making it negatively charged, thus completing charge storage. During discharge, electrons in the cathode electrode layer 6 flow through the external circuit back to the anode electrode layer 2, while ions in the solid electrolyte layer 4 migrate in the opposite direction, releasing the stored charge. The anode electrode layer 2 is chemically etched to form a textured structure, increasing the contact area with the solid electrolyte layer 4 and improving ion exchange efficiency. It is fixedly connected to the packaging frame 10, enhancing structural stability. The ion conduction channels 5 within the solid electrolyte layer 4 are arranged in an array, and the semi-circular design reduces ion collisions. The structure features a through-hole design that shortens the migration distance and improves ion conduction efficiency. The buffer layer 9 is made of flexible insulating material, which can absorb and disperse mechanical stress and protect the internal structure. The array of protrusions 7 below the cathode electrode layer 6 increases the contact area with the solid electrolyte layer 4. The anode lead-out terminal 3 and cathode lead-out terminal 8 are treated with anti-oxidation to prevent oxidation from increasing resistance and ensuring reliable connection with external circuits. The heat dissipation fins 13 are integrally formed with the outer protective layer 12, reducing thermal resistance and improving heat conduction efficiency. Multiple sets of heat dissipation fins 13 with equal spacing increase the heat dissipation area, form convection channels, and reduce the capacitor's operating temperature. The inner encapsulation layer 11 uses insulating material with good sealing performance to block external moisture, dust, and chemicals, protect key internal components, and ensure stable capacitor performance. Through the optimized design and coordinated operation of each component, this structure significantly improves the capacitor's charging and discharging efficiency, stability, and service life, meeting the application requirements in complex environments.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A capacitor core-pack structure comprising an insulating substrate (1), characterized in that: An anode electrode layer (2) is fixedly connected to the upper surface of the insulating substrate (1). An anode lead-out terminal (3) is fixedly connected to one side surface of the anode electrode layer (2). A solid electrolyte layer (4) is fixedly connected to the upper surface of the anode electrode layer (2). An ion conduction channel (5) is opened on the inner surface of the solid electrolyte layer (4). A cathode electrode layer (6) is fixedly connected to the upper surface of the solid electrolyte layer (4). A protrusion (7) is fixedly connected to the lower surface of the cathode electrode layer (6). A cathode lead-out terminal (8) is fixedly connected to one side surface of the cathode electrode layer (6). A buffer layer (9) is fixedly connected to the lower surface of the insulating substrate (1). An encapsulation frame (10) is fixedly connected to the outer surface of the buffer layer (9). An inner encapsulation layer (11) is fixedly connected to the outer surface of the encapsulation frame (10). An outer protective layer (12) is fixedly connected to the outer surface of the inner encapsulation layer (11). A heat dissipation fin (13) is fixedly connected to the upper surface of the outer protective layer (12).

2. The capacitor core package structure according to claim 1, characterized in that: The surface of the anode electrode layer (2) is chemically etched to form a concave-convex structure, and the anode electrode layer (2) is fixedly connected to the packaging frame (10).

3. The capacitor core package structure according to claim 1, characterized in that: The ion conduction channels (5) are arranged in an array on the inner surface of the solid electrolyte layer (4), and the shape of the ion conduction channels (5) is semi-circular.

4. A capacitor core package structure according to claim 1, characterized in that: The buffer layer (9) is made of flexible insulating material, and the ion conduction channel (5) is disposed through the solid electrolyte layer (4) along the thickness direction.

5. A capacitor core-package structure according to claim 1, characterized in that: The bumps (7) are arranged in an array on the lower surface of the cathode electrode layer (6), and the height and density of the bumps (7) are set according to the capacitance performance requirements.

6. A capacitor core-package structure according to claim 1, characterized in that: The outer surfaces of the anode lead-out terminal (3) and the cathode lead-out terminal (8) are treated with anti-oxidation, and the inner encapsulation layer (11) is made of insulating material with good sealing performance.

7. A capacitor core package structure according to claim 1, characterized in that: The heat dissipation fins (13) are integrally formed with the outer protective layer (12), and the heat dissipation fins (13) are arranged in multiple sets at equal intervals on the upper surface of the outer protective layer (12).

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