Rear shell and electronic equipment

Abstract

The utility model discloses a rear shell and electronic equipment, and belongs to the technical field of electronic equipment. The rear shell is used for the electronic equipment and comprises a shell body and an embedded part, the shell is provided with an outer side face and an inner side face which are opposite, and the direction from the outer side face to the inner side face is parallel to the thickness direction of the shell. The embedded part is embedded into the shell, and the embedded part is located between the outer side face and the inner side face in the thickness direction of the shell. The electronic equipment comprises a loudspeaker, a middle frame and the rear shell, an expansion cavity is formed between the middle frame and the rear shell, and the rear cavity of the loudspeaker is communicated with the expansion cavity; the loudspeaker is fixedly connected with the middle frame, and the rear shell is fixedly connected with the middle frame. According to the invention, the embedded part is arranged in the housing to improve the overall rigidity of the rear housing, thereby facilitating the reduction of the vibration of the rear housing when the loudspeaker makes a sound.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a back cover and electronic device. Background Technology

[0002] As electronic devices (such as mobile phones and tablets) continue to develop, their internal structures are becoming increasingly integrated and thinner. However, limited by the finite internal stacking space, the volume of the speaker cavity in electronic devices is gradually shrinking, which limits the audio performance of the speakers to some extent.

[0003] To improve audio playback, audio design solutions have evolved from sealed-cavity speakers to open-cavity designs. This approach utilizes the internal space of electronic devices to create larger cavities, improving the speaker's low-frequency response and overall sound quality. However, in such open-cavity designs, airflow can cause resonance within the device's casing; this resonance effect is particularly pronounced at high volumes, resulting in noticeable vibrations when the user holds the device, negatively impacting the user experience. Utility Model Content

[0004] This application provides a rear shell and an electronic device to solve the technical problem in the related art that the device shell is prone to resonance when using a loudspeaker with an open acoustic cavity.

[0005] The technical solution is as follows:

[0006] A first aspect of this application provides a rear housing for an electronic device, comprising: a housing and an insert; the housing having opposing outer and inner sides, the direction from the outer to the inner sides being parallel to the thickness direction of the housing; the insert being embedded inside the housing, the insert being located between the outer and inner sides in the thickness direction of the housing.

[0007] By adopting the above solution, an insert is set inside the housing to improve the overall rigidity of the rear housing, thereby reducing the vibration of the rear housing when the speaker is emitting sound. In addition, the insert is installed in the rear housing so that the electronic device can effectively absorb and disperse external forces when subjected to external impacts, thereby reducing the impact on the internal components of the electronic device and improving the shock resistance of the whole device.

[0008] In some implementations, the insert includes a first sub-component and a second sub-component; the first sub-component and the second sub-component are distributed along the length of the housing.

[0009] By adopting the above scheme, the first and second sub-components are distributed along the length direction, so that the stress of the entire insert can be distributed more evenly, improving the overall rigidity of the rear shell, while avoiding structural deformation or damage due to excessive local stress.

[0010] In some implementations, the first sub-component is a plate-like structure with a first through hole, and the second sub-component is located in the first through hole.

[0011] By adopting the above solution, the second sub-component is placed in the first through hole. In this way, when the first and second sub-components are made of different materials, the resonance phenomenon of the back shell during vibration can be reduced by the combination of the two materials, thereby improving the user experience.

[0012] In some implementations, the first sub-component is made of stainless steel or carbon fiber; the second sub-component is also made of stainless steel or carbon fiber.

[0013] By adopting the above solutions, stainless steel, with its high strength and impact resistance, effectively improves the pressure resistance of the back cover, preventing damage caused by drops or external forces. Carbon fiber, with its high strength and light weight, reduces the overall weight of the electronic device while maintaining robustness, thus improving portability. The first and second sub-components can optimize impact absorption through combinations of different materials: when stainless steel and carbon fiber are combined, a rigid-flexible structure is formed, with the carbon fiber providing cushioning and additional strength support. When carbon fiber is combined with carbon fiber, it ensures strength while reducing resonance and vibration transmission to some extent. When stainless steel is combined with stainless steel, it provides higher overall rigidity, which helps reduce resonance.

[0014] In some implementations, the first sub-component is a flat plate or a corrugated plate; the second sub-component is a flat plate or a corrugated plate.

[0015] By adopting the above solutions, the planar plate form can provide uniform mechanical support, resulting in a more balanced stress distribution. The corrugated plate form can form rigid support and improve vibration damping and impact resistance, exhibiting good deformation absorption capacity. Combining planar plates with planar plates helps to improve the rigidity of the rear shell. When planar plates and corrugated plates are combined, the planar plates can provide stable support, while the corrugated plates can absorb vibrations through their corrugated structure, improving impact resistance. Combining corrugated plates with corrugated plates maximizes vibration damping and impact resistance while reducing resonance and noise, thus helping to reduce the overall weight of electronic equipment.

[0016] In some implementations, the elastic modulus of the insert is greater than that of the shell.

[0017] By adopting the above solution, the stiffness of the insert is higher than that of the shell, thus enhancing the overall support of the rear shell, preventing deformation caused by external forces, and improving the structural strength of the shell. Furthermore, the high elastic modulus of the insert suppresses vibration propagation and reduces resonance in the rear shell.

[0018] In some implementations, the elastic modulus of the insert is greater than or equal to 50 MPa.

[0019] By adopting the above solution, when electronic devices are dropped or subjected to external forces, the embedded component with an elastic modulus greater than or equal to 50 MPa can absorb impact energy to a certain extent, thereby reducing the risk of damage to critical components such as the motherboard and battery. When the embedded component adopts a corrugated plate structure, the material's elastic modulus, combined with a reasonable shape design (such as crest spacing and thickness), can effectively disperse stress and reduce the problem of local stress concentration. In addition, by selecting a material with an elastic modulus greater than or equal to 50 MPa, the embedded component can have sufficient structural support capacity, while avoiding excessive amplification of vibration frequency, thus improving the user's comfort during use.

[0020] In some implementations, the insert is made of stainless steel; or, the insert is made of carbon fiber plate; or, the insert is made of titanium alloy; or, the insert is made of aluminum alloy.

[0021] By adopting the above solutions, stainless steel, with its high strength and impact resistance, effectively improves the pressure resistance of the back cover, preventing damage caused by drops or external forces. Carbon fiber, with its high strength and light weight, reduces the overall weight of electronic devices while ensuring robustness, thus improving portability; titanium alloy or aluminum alloy helps to improve the rigidity of the back cover.

[0022] In some implementations, the thickness of the shell is 0.3mm-2mm; the thickness of the insert is greater than or equal to 0.01mm, and the thickness direction of the insert is parallel to the thickness direction of the shell.

[0023] By adopting the above solution and placing an insert inside the housing, the overall structural strength of the rear housing can be enhanced and its impact resistance improved. Furthermore, by appropriately selecting the thickness of the insert, it can be ensured that it does not affect the overall thickness of the rear housing, thus maintaining the slim and lightweight characteristics of the electronic device.

[0024] In some implementations, the embedded part is a planar plate; or, the embedded part is a wave plate.

[0025] By adopting the above scheme, the panel form can provide uniform mechanical support, resulting in a more balanced stress distribution. The corrugated plate form can create rigid support and improve vibration damping and impact resistance, while also exhibiting good deformation absorption capacity.

[0026] In some implementations, the inner surface of the housing has a honeycomb structure.

[0027] By adopting the above scheme, the honeycomb structure exhibits high specific strength characteristics, meaning that while maintaining lightweight design, it can provide high strength and rigidity, improving the overall bending resistance of the back shell. Furthermore, the honeycomb structure combined with inserts can reduce the excessive propagation of vibration energy and lower noise levels.

[0028] In some implementations, the back cover has a camera hole.

[0029] By adopting the above solution, it is easy to cooperate with the camera module of electronic devices.

[0030] A second aspect of this application provides an electronic device comprising: a speaker, a mid-frame, and a rear shell of any of the above implementations; an expansion cavity is formed between the mid-frame and the rear shell, and the rear cavity of the speaker is connected to the expansion cavity; the speaker is fixedly connected to the mid-frame, and the rear shell is fixedly connected to the mid-frame.

[0031] By adopting the above solution, after the back cover is applied to the electronic device, in addition to improving the low-frequency response and overall sound quality of the speaker, an insert is set inside the housing to improve the overall rigidity of the back cover, thereby helping to reduce the vibration of the back cover when the speaker is emitting sound. In addition, the insert is installed in the back cover so that the electronic device can effectively absorb and disperse external forces when subjected to external impacts, thereby reducing the impact on the internal components of the electronic device and improving the shock resistance of the whole device.

[0032] In some implementations, the electronic device also includes a battery, a display screen, and a bezel; the display screen, back cover, and bezel together form an inner cavity, in which the battery is located.

[0033] An elastic structure is filled between the battery and the back cover in the thickness direction of the electronic device.

[0034] By adopting the above scheme, the elastic structure can play a role in buffering and shock absorption of the rear shell.

[0035] In some implementations, the elastic structure is made of rubber, silicone, or foam.

[0036] By adopting the above solution, the rear shell can be buffered and shock-absorbing. Attached Figure Description

[0037] Figure 1 This is a front view of the electronic device provided in the embodiments of this application;

[0038] Figure 2 This is a rear view of the electronic device provided in the embodiments of this application;

[0039] Figure 3 This is a cross-sectional view of the electronic device provided in the embodiments of this application;

[0040] Figure 4 This is a schematic diagram of the planar plate structure in an embodiment of this application;

[0041] Figure 5 This is a structural schematic diagram of the planar plate from another perspective in an embodiment of this application;

[0042] Figure 6 This is a schematic diagram of the waveform board structure in an embodiment of this application;

[0043] Figure 7 This is a structural schematic diagram of the waveform board from another perspective in an embodiment of this application;

[0044] Figure 8 This is a schematic diagram of the structure of the first type of rear shell provided in the embodiments of this application;

[0045] Figure 9 This is a schematic diagram of the structure of the second type of rear shell provided in the embodiments of this application;

[0046] Figure 10 This is a schematic diagram of the structure of the third type of rear shell provided in the embodiments of this application;

[0047] Figure 11 This is a schematic diagram of the structure of the fourth type of rear shell provided in the embodiments of this application;

[0048] Figure 12 This is a schematic diagram of the structure of the fifth type of rear shell provided in the embodiments of this application;

[0049] Figure 13 This is a schematic diagram of the structure of the rear shell in an embodiment of this application.

[0050] The meanings of the various symbols in the attached icons are as follows:

[0051] 101. Display screen; 102. Bezel; 103. Back cover; 104. Inner cavity; 105. Mid-frame; 106. Speaker; 107. Battery; 108. First sound outlet; 109. Second sound outlet; 110. Top; 111. Bottom; 112. Camera module; 113. Expansion cavity; 201. Housing; 202. Lens decoration; 203. Embedded part; 204. First sub-component; 205. Second sub-component; 206. Camera hole; 207. Groove; 208. Edge contour; 209. First through hole; 210. First surface; 211. Inner side; 212. Outer side; 213. Honeycomb structure. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0053] It should be understood that "multiple" as mentioned in this application refers to two or more. In the description of this application, unless otherwise stated, " / " indicates "or," for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist, for example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, to facilitate a clear description of the technical solutions of this application, the terms "first," "second," etc., are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first," "second," etc., do not limit the quantity or execution order, and that "first," "second," etc., do not necessarily imply differences.

[0054] Figure 1 This is a front view of the electronic device provided in the embodiments of this application. Figure 2 This is a rear view of the electronic device provided in the embodiments of this application, in conjunction with... Figure 1 and Figure 2 As shown, in one or more embodiments, the electronic device in this application can be a mobile phone, tablet computer, laptop computer, wearable device, automotive-related electronic device, etc. The mobile phone can be a candybar phone or a foldable phone. The wearable device can be a smartwatch, VR (Virtual Reality) wearable device, etc. Of course, the electronic device can also be other devices, such as acoustic cameras or XR (Extended Reality) technology-related devices. This application does not impose special limitations on the specific form of the above-mentioned electronic device. For example, for ease of explanation and understanding, a mobile phone is used as an example for illustration.

[0055] For ease of description, such as Figure 1 and Figure 2 As shown, the length direction of the electronic device can be defined as the AA direction, the width direction of the electronic device can be defined as the BB direction, and the thickness direction of the electronic device can be defined as the CC direction; the thickness direction, the width direction, and the length direction of the electronic device are all perpendicular to each other.

[0056] Combination Figure 1 and Figure 2 As shown, in some embodiments, the electronic device includes a display screen 101, a frame 102, and a back cover 103; the display screen 101 and the back cover 103 are respectively connected to the frame 102. For example, the display screen 101, the back cover 103, and the frame 102 together form an inner cavity 104. This inner cavity 104 effectively protects the internal components of the electronic device, preventing external impacts, dust, moisture, and other factors from entering, thereby improving the durability and lifespan of the electronic device.

[0057] See Figure 2 As shown, in some embodiments, the rear cover 103 includes a housing 201 and a lens trim 202, which is fixedly connected to the housing 201. Exemplarily, the lens trim 202 may protrude from the surface of the housing 201; the lens trim 202 and the housing 201 may be bonded, snap-fitted, or formed into an integral structure using a one-piece molding process. The lens trim 202 not only has an aesthetic effect but also serves to protect the camera module 112. The electronic device also includes a camera module 112, which is installed in the inner cavity 104. The lens trim 202 has a camera hole 206 to facilitate cooperation with the camera module 112, allowing external light from the electronic device to enter the camera module 112 through the camera hole 206.

[0058] In related technologies, to improve the audio playback performance of electronic devices, audio design has gradually evolved from sealed-cavity speakers to open-cavity designs. This approach connects the open rear cavity of the speaker to the internal space of the electronic device, creating a larger cavity that improves the speaker's low-frequency response and overall sound quality. However, in such open-cavity designs, airflow can cause resonance in the device's casing; this resonance is amplified, especially at high volumes, resulting in noticeable vibrations when the user holds the device, negatively impacting the user experience.

[0059] Therefore, this application provides a back cover 103 to solve the problems in the related technology; the back cover 103 provided in this application will be explained in detail below.

[0060] Figure 3 This is a cross-sectional view of the electronic device provided in the embodiments of this application; see also Figure 3 As shown in the embodiment of this application, the rear shell 103 further includes an insert 203; the shell 201 has opposing outer surfaces 212 and inner surfaces 211, and the direction from the outer surface 212 to the inner surface 211 is parallel to the thickness direction of the shell 201; the insert 203 is embedded inside the shell 201, and in the thickness direction of the shell 201, the insert 203 is located between the outer surface 212 and the inner surface 211. The insert 203 is thus provided inside the shell 201 to improve the overall rigidity of the rear shell 103, thereby helping to reduce the vibration of the rear shell 103 when the speaker 106 emits sound; in addition, the insert 203 installed on the rear shell 103 allows the electronic device to effectively absorb and disperse external forces when subjected to external impacts, thereby reducing the impact on the internal components of the electronic device and improving the overall shock resistance performance.

[0061] In this embodiment, the thickness direction of the housing 201 is parallel to the thickness direction of the electronic device. Furthermore, the direction from the outer side 212 to the inner side 211 and the direction from the inner side 211 to the outer side 212 are two opposite and parallel directions, but both are parallel to the thickness direction of the housing 201. The thickness of the housing 201 can refer to the straight-line distance between the outer side 212 and the inner side 211. The outer side 212 of the housing 201 is exposed, while the inner side 211 of the housing 201 faces the inner cavity 104; alternatively, the inner side 211 of the housing 201 faces the display screen 101. For example, the outer side 212 can be a plane. The length direction of the housing 201 is parallel to the length direction of the electronic device, and the width direction of the housing 201 is parallel to the width direction of the electronic device. The lens trim 202 is located on the outer side 212.

[0062] It should be noted that, in the embodiments of this application, for the rear shell 103, the insert 203 located between the outer side 212 and the inner side 211 can be either completely embedded inside the shell 201 without being exposed, or the outer side 212 and / or the inner side 211 can have recesses that expose the surface of the insert 203, or the side of the insert 203 facing the inner cavity 104 can be flush with the inner side 211, or the side of the insert 203 facing away from the inner cavity 104 can be flush with the outer side 212.

[0063] In some embodiments, the housing 201 may be made of plastic, which may be polycarbonate (PC) or acrylonitrile butadiene styrene (ABS), or glass fiber reinforced plastic (GFRP). It is understood that other materials may also be used for the housing 201.

[0064] In some embodiments, the thickness of the housing 201 is 0.3mm-2mm. By appropriately selecting the thickness of the housing 201, different application scenarios can be adapted. For example, the thickness of the housing 201 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 1mm, 1.5mm or 2mm.

[0065] In some embodiments, the insert 203 can be disposed inside the housing 201 by an insert process, such as insert injection molding or 3D printing. It should be noted that in some other possible embodiments, when the housing 201 is manufactured using a hot pressing process, the insert 203 can be placed in the mold used to manufacture the housing 201 so that the insert 203 is embedded in the housing 201.

[0066] See Figure 3 As shown, in some embodiments, the electronic device further includes a mid-frame 105, a speaker 106, and a battery 107; a frame 102 surrounds the circumference of the mid-frame 105, and the mid-frame 105 is fixedly connected to the frame 102; the frame 102 and the mid-frame 105 can be fixedly connected by adhesive or snap-fit, or the frame 102 and the mid-frame 105 can be formed into an integral structure by an integral molding process. For example, the speaker 106 can be a speaker 106 with an open rear cavity.

[0067] See Figure 3 As shown, in some embodiments, the speaker 106 is located in the inner cavity 104, and the battery 107 is located in the inner cavity 104; an expansion cavity 113 is formed between the middle frame 105 and the rear shell 103, and the rear cavity of the speaker 106 is connected to the expansion cavity 113, so that the rear cavity of the speaker 106 and the expansion cavity 113 together form a larger acoustic cavity to improve the low-frequency response and overall sound quality of the speaker 106. Exemplarily, the expansion cavity 113 includes the space between the rear shell 103 and the battery 107. The electronic device may include two speakers 106, one speaker 106 near the top 110 of the electronic device, and the other speaker 106 near the bottom 111 of the electronic device, with the direction from the top 110 to the bottom 111 of the electronic device parallel to the length direction of the electronic device. The battery 107 can power the electrical components of the electronic device, such as the speaker 106. In some other possible implementations, an elastic structure can be filled between the battery 107 and the back cover 103 in the thickness direction of the electronic device. The elastic structure can buffer and dampen the back cover 103. The elastic structure can be rubber, silicone or foam. This, combined with the insert 203 in the back cover 103, increases the rigidity of the back cover 103 and reduces the possibility of deformation of the back cover 103, thereby further reducing the vibration of the back cover 103.

[0068] See Figure 3As shown, in some embodiments, a first sound outlet 108 is formed between the display screen 101 and the frame 102. The first sound outlet 108 is near the top 110 of the electronic device and is connected to the front cavity of the speaker 106 near the electronic device. This facilitates the transmission of sound emitted by the speaker 106 through the first sound outlet 108 formed between the display screen 101 and the frame 102. A second sound outlet 109 is provided at the bottom 111 of the frame 102. The second sound outlet 109 is used to connect to the front cavity of the speaker 106 near the bottom 111 of the electronic device. This facilitates the transmission of sound emitted by the speaker 106 through the second sound outlet 109.

[0069] Figure 4 This is a schematic diagram of the planar plate structure in an embodiment of this application. Figure 5 This is a structural schematic diagram of the planar plate from another perspective in an embodiment of this application; combined with Figure 4 and Figure 5 As shown, in some embodiments, the planar plate has two opposing first surfaces 210, and the two opposing first surfaces 210 are planar.

[0070] Figure 6 This is a schematic diagram of the waveform board structure in an embodiment of this application. Figure 7 This is a structural schematic diagram of the waveform board from another perspective in an embodiment of this application; combined with Figure 6 and Figure 7 As shown, in some embodiments, the corrugated board has two opposing surfaces, and these two opposing surfaces are non-planar; such as Figure 7 As shown, at least one edge profile 208 of the thickness surface of the corrugated plate can be a curved curve, which can be composed of multiple arc segments.

[0071] It should be noted that curved lines can also be formed by connecting multiple straight lines, and the two adjacent straight lines are not parallel. They can also be formed by combining multiple straight lines with multiple arcs.

[0072] Combination Figure 6 and Figure 7 As shown, since the two opposite surfaces of the waveform plate are non-planar, a groove 207 is formed on the waveform plate. The groove 207 has a certain length, and the length direction of the groove 207 is the DD direction.

[0073] In some embodiments, the number of embedded members 203 embedded in the housing 201 can be one or more. When the number of embedded members 203 is multiple, the number of embedded members 203 can be 2, 3, 4 or 5, etc. This application does not limit the number of embedded members 203, and the specific number can be determined according to actual needs.

[0074] Figure 8 This is a schematic diagram of the structure of the first type of rear shell 103 provided in the embodiments of this application; see also Figure 8 As shown, in some embodiments, the housing 201 has a top end 110 and a bottom end 111, with the direction from the top end 110 to the bottom end 111 of the housing 201 parallel to the length direction of the housing 201. The lens trim 202 is located near the top end 110 of the housing 201 and away from the bottom end 111. Exemplarily, the lens trim 202 is also located near one long side of the housing 201 and away from the opposite long side, i.e., at the midpoint of the width of the lens trim 202 in the width direction of the housing 201, on one side of the first center line O of the housing 201, which is parallel to the length direction of the housing 201 and passes through the midpoint of the width of the housing 201. The orthographic projection of the insert 203 in the first plane overlaps with the orthographic projection of the battery 107 in the first plane, which is perpendicular to the thickness direction of the electronic device, i.e., perpendicular to the thickness direction of the rear housing 103. The orthographic projection of the insert 203 in the first plane does not overlap with the orthographic projection of the lens decoration 202 in the first plane; that is, there is no overlapping portion between the two. For example... Figure 8 As shown, there is one insert 203, and the lens decoration 202 and the insert 203 are distributed along the length direction of the rear shell 103.

[0075] It should be noted that, in order to show the position of the insert 203 in the housing 201, the insert 203 is shown with cross-sectional lines and its edges are shown with dashed lines. Figure 8 The diagram shows that the insert 203 is not limited to being located on the outer surface 212 of the housing 201; the same schematic representation is used for the insert 203 in other figures of this application embodiment. The first plane is not a single plane; it can be a plane perpendicular to the thickness direction of the rear housing 103. Furthermore, when there are multiple inserts 203, the orthographic projections of the multiple inserts 203 in the first plane may not overlap, or at least two inserts 203 may have overlapping portions in their orthographic projections in the first plane. Moreover, in some other possible embodiments, the midpoint of the width of the lens trim 202 in the width direction of the housing 201 may also be located on the first centerline O.

[0076] In some embodiments, the elastic modulus of the insert 203 is greater than that of the shell 201, resulting in higher stiffness of the insert 203 compared to the shell 201. This enhances the overall support of the rear shell 103, prevents deformation caused by external forces, and improves the structural strength of the shell 201. Furthermore, the higher elastic modulus of the insert 203 suppresses vibration propagation and reduces resonance in the rear shell 103. It should be noted that the elastic modulus can be Young's modulus.

[0077] In some embodiments, the elastic modulus of the insert 203 is greater than or equal to 50 MPa. This allows the insert 203, with its elastic modulus greater than or equal to 50 MPa, to absorb impact energy to a certain extent when the electronic device is dropped or subjected to external force, thereby reducing the risk of damage to critical components such as the motherboard and battery 107. When the insert 203 adopts a corrugated plate structure, the material's elastic modulus, combined with a reasonable shape design (such as crest spacing and thickness), can effectively disperse stress and reduce local stress concentration problems. Furthermore, by selecting a material with an elastic modulus greater than or equal to 50 MPa, the insert 203 can have sufficient structural support capacity while avoiding excessive amplification of vibration frequencies, thus improving user comfort during use. For example, the elastic modulus of the insert 203 can be in the range of 50MPa-300GPa. For instance, the elastic modulus of the insert 203 can be 300MPa, 500MPa, 1GPa, 2GPa, 5GPa, 10GPa, 20GPa, 30GPa, 40GPa, 50GPa, 70GPa, 110GPa, 150GPa, 200GPa, or 300GPa.

[0078] In one embodiment, the insert 203 is made of stainless steel. Because stainless steel has high strength and impact resistance, it effectively improves the pressure resistance of the back cover 103, thus preventing damage to the back cover 103 due to drops or external forces. In another embodiment, the insert 203 is made of carbon fiber sheet. Because carbon fiber has high strength but is lightweight, it helps reduce the overall weight of the electronic device while ensuring robustness, thus improving portability.

[0079] It should be noted that in some other possible implementations, the material of the insert 203 may also be titanium alloy, aluminum alloy or ceramic.

[0080] In some embodiments, the thickness of the insert 203 is greater than or equal to 0.01 mm, and the thickness direction of the insert 203 is parallel to the thickness direction of the housing 201. Inserting an insert 203 of a certain thickness inside the housing 201 can enhance the overall structural strength of the rear housing 103 and improve its impact resistance. Appropriate selection of the thickness of the insert 203 can ensure that it does not affect the overall thickness of the rear housing 103, maintaining the slim and lightweight characteristics of the electronic device. For example, the thickness of the insert 203 is less than the thickness of the housing 201; the thickness of the insert 203 can be 0.01 mm. Alternatively, the thickness of the insert 203 can also range from 0.05 mm to 0.25 mm, for example, 0.05 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, or 0.25 mm.

[0081] In one embodiment, the insert 203 is a flat plate, which provides uniform mechanical support and makes the stress distribution more even. In another embodiment, the insert 203 is a corrugated plate, which forms a rigid support and can improve vibration reduction and impact resistance, and has good deformation absorption capacity.

[0082] In some embodiments, the embedding 203 can be a polygonal structure, such as a quadrilateral structure or a triangular structure, etc., and this application does not make specific limitations.

[0083] Figure 9 This is a schematic diagram of the structure of the second type of rear shell 103 provided in the embodiments of this application; see also Figure 9 As shown, in some embodiments, the insert 203 includes a first sub-component 204 and a second sub-component 205; the first sub-component 204 and the second sub-component 205 are distributed along the length direction of the housing 201, so that the entire insert 203 can distribute stress more evenly, improve the overall rigidity of the rear housing 103, and avoid structural deformation or damage due to excessive local stress. For example, there is one first sub-component 204 and one second sub-component 205. The lens decoration 202, the first sub-component 204 and the second sub-component 205 are distributed sequentially and alternately along the length direction of the housing 201. In the length direction of the housing 201, the first sub-component 204 is located between the second sub-component 205 and the lens decoration 202; the orthographic projection of the first sub-component 204 in the first plane and the orthographic projection of the second sub-component 205 in the first plane have overlapping portions with the orthographic projection of the battery 107 in the first plane. The orthographic projections of lens decoration 202, first sub-part 204, and second sub-part 205 in the first plane do not overlap with each other.

[0084] In some embodiments, the first sub-component 204 is made of stainless steel or carbon fiber; the second sub-component 205 is also made of stainless steel or carbon fiber. This allows for optimized impact absorption through combinations of different materials between the first and second sub-components 204 and 205: when stainless steel and carbon fiber are combined, a rigid-flexible structure is formed, with the carbon fiber portion providing cushioning and additional strength support. When carbon fiber is combined with carbon fiber, strength is ensured while reducing resonance and vibration transmission to some extent. When stainless steel is combined with stainless steel, higher overall rigidity is provided, which helps reduce resonance.

[0085] In some embodiments, the thickness of the first sub-component 204 is greater than or equal to 0.01 mm, and the thickness direction of the first sub-component 204 is parallel to the thickness direction of the housing 201. Inserting a first sub-component 204 of a certain thickness inside the housing 201 can enhance the overall structural strength of the rear housing 103 and improve its impact resistance. Appropriate selection of the thickness of the first sub-component 204 can ensure that it does not affect the overall thickness of the rear housing 103, maintaining the slim and lightweight characteristics of the electronic device. For example, the thickness of the first sub-component 204 is less than the thickness of the housing 201; the thickness of the first sub-component 204 can be 0.01 mm. Alternatively, the thickness of the first sub-component 204 can also range from 0.05 mm to 0.25 mm, for example, 0.05 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, or 0.25 mm. The thickness of the second sub-component 205 is greater than or equal to 0.01 mm, and the thickness direction of the second sub-component 205 is parallel to the thickness direction of the housing 201. Inserting a second sub-component 205 of a certain thickness inside the housing 201 can enhance the overall structural strength of the rear housing 103 and improve its impact resistance. Appropriate selection of the thickness of the second sub-component 205 can ensure that it does not affect the overall thickness of the rear housing 103, maintaining the slim and lightweight characteristics of the electronic device. For example, the thickness of the second sub-component 205 is less than the thickness of the housing 201; the thickness of the second sub-component 205 can be 0.01 mm. Alternatively, the thickness of the second sub-component 205 can also be in the range of 0.05 mm to 0.25 mm, for example, 0.05 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, or 0.25 mm.

[0086] In some embodiments, the first sub-component 204 is a flat plate or a corrugated plate; the second sub-component 205 is a flat plate or a corrugated plate. This allows for different plate structures between the first sub-component 204 and the second sub-component 205 to improve vibration damping. When both the first sub-component 204 and the second sub-component 205 are flat plates, combining flat plates with flat plates improves the rigidity of the rear shell 103. When the first sub-component 204 is a flat plate and the second sub-component 205 is a corrugated plate; or when the first sub-component 204 is a corrugated plate and the second sub-component 205 is a flat plate, combining flat plates with corrugated plates allows the flat plate to provide stable support, while the corrugated plate absorbs vibration through its corrugated structure, improving impact resistance. When both the first sub-component 204 and the second sub-component 205 are corrugated plates, combining corrugated plates maximizes vibration damping and impact resistance while reducing resonance and noise, thus reducing the overall weight of the electronic device.

[0087] In some embodiments, the elastic modulus of the first sub-component 204 is greater than that of the shell 201, and the elastic modulus of the second sub-component 205 is greater than that of the shell 201. This results in the overall elastic modulus of the insert 203 being greater than that of the shell 201, thereby achieving a higher stiffness for the insert 203 than that of the shell 201. This enhances the overall support of the rear shell 103, prevents deformation caused by external forces, and improves the structural strength of the shell 201. For example, the elastic modulus of the first sub-component 204 is greater than or equal to 50 MPa. The elastic modulus of the second sub-component 205 is also greater than or equal to 50 MPa, thus making the overall elastic modulus of the insert 203 greater than that of the shell 201. The elastic modulus of the first sub-component 204 can range from 50 MPa to 300 GPa. For example, the elastic modulus of the first sub-component 204 can be 300 MPa, 500 MPa, 1 GPa, 2 GPa, 5 GPa, 10 GPa, 20 GPa, 30 GPa, 40 GPa, 50 GPa, 70 GPa, 110 GPa, 150 GPa, or 200 GPa. The elastic modulus of the second sub-component 205 can also range from 50 MPa to 300 GPa. For example, the elastic modulus of the second sub-component 205 can be 300 MPa, 500 MPa, 1 GPa, 2 GPa, 5 GPa, 10 GPa, 20 GPa, 30 GPa, 40 GPa, 50 GPa, 70 GPa, 110 GPa, 150 GPa, or 200 GPa.

[0088] Figure 10 This is a schematic diagram of the structure of the third form of the rear shell 103 provided in the embodiments of this application; see also Figure 10 As shown, in some embodiments, the first sub-component 204 is a plate-like structure with a first through hole 209, and the second sub-component 205 is located in the first through hole 209. By placing the second sub-component 205 in the first through hole 209, when the first sub-component 204 and the second sub-component 205 are made of different materials and / or have different structures, the resonance phenomenon of the rear shell 103 during vibration can be reduced through the combination of two different materials and / or two different structures, thus improving the user experience. For example, because the first sub-component 204 has the first through hole 209, the solid portion of the first sub-component 204 forms a closed shape; the second sub-component 205 is a plate-like structure.

[0089] See Figure 10As shown, in some embodiments, the orthographic projections of the first sub-component 204 and the second sub-component 205 in the first plane do not overlap; the orthographic projections of the lens decoration 202, the first sub-component 204, and the second sub-component 205 in the first plane do not overlap. The lens decoration 202 and the first sub-component 204 are spaced apart along the length of the housing 201, and the lens decoration 202 and the second sub-component 205 are also spaced apart along the length of the housing 201. The orthographic projections of the first sub-component 204 and the second sub-component 205 in the first plane overlap with the orthographic projection of the battery 107 in the first plane. The elastic modulus of the first sub-component 204 is greater than that of the housing 201, and the elastic modulus of the second sub-component 205 is greater than that of the housing 201, thus making the overall elastic modulus of the insert 203 greater than that of the housing 201.

[0090] In one embodiment, the first sub-component 204 is made of stainless steel, and the second sub-component 205 is made of carbon fiber. This combination of stainless steel and carbon fiber creates a rigid-flexible structure, with the carbon fiber portion providing cushioning and additional strength support. In another embodiment, the first sub-component 204 is made of carbon fiber, and the second sub-component 205 is made of stainless steel. This combination of stainless steel and carbon fiber also creates a rigid-flexible structure, with the carbon fiber portion providing cushioning and additional strength support.

[0091] It should be noted that in some other possible embodiments, the materials of the first sub-component 204 and the second sub-component 205 can also be other combinations, such as the first sub-component 204 being made of stainless steel and the second sub-component 205 being made of stainless steel. Alternatively, the first sub-component 204 being made of carbon fiber and the second sub-component 205 being made of carbon fiber.

[0092] In some other embodiments, the first sub-component 204 is a flat plate and the second sub-component 205 is a corrugated plate, or the first sub-component 204 is a corrugated plate and the second sub-component 205 is a flat plate. In this way, when the flat plate and the corrugated plate are combined, the flat plate can provide stable support, while the corrugated plate can absorb vibration through the corrugated structure and improve the impact resistance.

[0093] It should be noted that in some other possible implementations, the first sub-component 204 and the second sub-component 205 may both be planar plates, or the first sub-component 204 and the second sub-component 205 may both be corrugated plates.

[0094] Figure 11 This is a schematic diagram of the structure of the fourth type of rear shell 103 provided in the embodiments of this application; see also Figure 11As shown, in some embodiments, there is one first sub-component 204 and one second sub-component 205. The orthographic projections of the first sub-component 204 and the second sub-component 205 in the first plane do not overlap. The orthographic projections of the lens decoration 202, the first sub-component 204, and the second sub-component 205 in the first plane do not overlap. The lens decoration 202 and the first sub-component 204 are spaced apart along the width direction of the housing 201, and the lens decoration 202 and the second sub-component 205 are spaced apart along the length direction of the housing 201. The first sub-component 204 and the second sub-component 205 in the first plane do not overlap; the orthographic projections of the second sub-component 205 and the battery 107 in the first plane have overlapping portions. The elastic modulus of the first sub-component 204 is greater than that of the housing 201, and the elastic modulus of the second sub-component 205 is greater than that of the housing 201. This results in the overall elastic modulus of the insert 203 being greater than that of the housing 201. It should be noted that for... Figure 11 The materials of the first sub-component 204 and the second sub-component 205 of the rear shell 103, the form of the plate structure of the first sub-component 204 (corrugated plate or flat plate), and the form of the plate structure of the second sub-component 205 can be found in the documentation for... Figure 10 The description in the text will not be repeated here.

[0095] Figure 12 This is a schematic diagram of the structure of the fifth form of the rear shell 103 provided in the embodiments of this application; see also Figure 12 As shown, Figure 12 and Figure 10 The main difference is that, Figure 12 There are two embedded members 203. One embedded member 203 includes a first sub-member 204 and a second sub-member 205. The other embedded member 203 is an independent unit, and this embedded member 203 and the lens decoration member 202 are distributed at intervals along the width direction of the housing 201. The orthographic projection of the lens decoration member 202 in the first plane does not overlap with the orthographic projection of the embedded member 203 in the first plane, and the orthographic projection of the embedded member 203 in the first plane does not overlap with the orthographic projection of the battery 107 in the first plane. For the material and plate structure form of the embedded member 203, the material of the first sub-member 204, the material of the second sub-member 205, the plate structure form of the first sub-member 204 and the plate structure form of the second sub-member 205, please refer to the description in other embodiments, and will not be repeated here.

[0096] Figure 13 This is a schematic diagram of the structure of the rear shell 103 in the embodiment of this application. Figure 13The inner surface 211 of the housing 201 is shown. See also Figure 13 As shown, in some embodiments, the inner surface 211 of the housing 201 has a honeycomb structure 213. The honeycomb structure 213 has high specific strength characteristics, that is, while maintaining lightweight, it can provide high strength and rigidity, improving the overall bending resistance of the rear housing 103. In addition, the honeycomb structure 213 combined with the insert 203 can reduce the excessive propagation of vibration energy and reduce noise. It should be noted that in some other possible embodiments, the inner surface 211 of the housing 201 may also be flat, instead of being provided with a honeycomb structure 213.

[0097] In this embodiment, when the insert 203, the first sub-part 204, and the second sub-part 205 are all made of corrugated plates, the length direction of the groove 207 of the corrugated plate can be parallel to the length direction of the housing 201. Furthermore, the location within the housing 201 where the insert 203 needs to be placed is not limited to the location disclosed in this embodiment, but can also be any area other than the lens trim 202. For the insert 203, the first sub-part 204, and the second sub-part 205, when a flat plate is used, its thickness is the distance d1 between the two opposing first surfaces 210 of the flat plate; while when a corrugated plate is used, the thickness of the corrugated plate is the distance between the crests and troughs of the corrugated plate in the thickness direction of the housing; of course, the range of the distance d2 between the two opposing surfaces of the corrugated plate can be 0.02mm to 0.25mm, for example, 0.02mm, 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, or 0.25mm.

[0098] In the description of this application, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A back case for an electronic device, comprising: The shell has opposite outer and inner sides, and a thickness direction parallel to the direction from the outer side to the inner side. The embedded part is embedded in the interior of the shell, and is located between the outer side and the inner side in the thickness direction of the shell. The embedded part includes a first subpart and a second subpart; the first subpart and the second subpart are distributed along the length direction of the shell.

2. The back case of claim 1, wherein, The first subpart is a plate structure, and has a first through hole, and the second subpart is located in the first through hole.

3. The back case of claim 2, wherein, The material of the first subpart is stainless steel or carbon fiber; the material of the second subpart is stainless steel or carbon fiber.

4. The back case of claim 2, wherein, The first subpart is a flat plate or a wave-shaped plate; the second subpart is a flat plate or a wave-shaped plate.

5. The back case of claim 2, wherein, The elastic modulus of the embedded part is greater than the elastic modulus of the shell.

6. The back case of any one of claims 1-5, wherein, The elastic modulus of the embedded part is greater than or equal to 50 MPa.

7. The back case of any one of claims 1-5, wherein, The material of the embedded part is stainless steel; 8. The back cover of claim 1, wherein, Or, the material of the embedded part is a carbon fiber plate; Or, the material of the embedded part is titanium alloy; Or, the material of the embedded part is aluminum alloy. The thickness of the shell is 0.3-2 mm; the thickness of the embedded part is greater than or equal to 0.01 mm, and the thickness direction of the embedded part is parallel to the thickness direction of the shell.

9. The back cover of any one of claims 1-5, wherein, The embedded part is a flat plate; or, the embedded part is a wave-shaped plate.

10. The back cover of claim 1, wherein, The inner side of the shell has a honeycomb structure.

11. The back cover of any one of claims 1-5, wherein, The rear shell has a camera hole.

12. The back cover of any one of claims 1-5, wherein, The electronic device includes a speaker, a middle frame, and a rear shell according to any one of claims 1-12; an expansion cavity is formed between the middle frame and the rear shell, a rear cavity of the speaker communicates with the expansion cavity; the speaker is fixedly connected with the middle frame, and the rear shell is fixedly connected with the middle frame.

13. An electronic device, comprising: The electronic device further includes a battery, a display screen, and a bezel; the display screen, the rear shell, and the bezel together enclose an inner cavity, and the battery is located in the inner cavity; In the thickness direction of the electronic device, an elastic structure is filled between the battery and the rear shell.

14. The electronic device of claim 13, wherein, The material of the elastic structure is rubber, silicone, or foam. ​ 15. The electronic device of claim 14, wherein, ​

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