Earphone damping sound outlet nozzle

Abstract

The utility model discloses an earphone damping sound outlet nozzle in the earphone sound outlet nozzle technical field, comprising a straight segment main body, one end of the straight segment main body is provided with a combination end head, the combination end head is used for butt joint with an earphone, the other end of the straight segment main body is provided with a thickening segment, one end of the thickening segment is fixed with the straight segment main body, and the other end of the thickening segment is provided with a connection end head. A sound outlet is fixed at the other end of the thickened section; and a buffer echo mechanism is arranged in the straight section main body and is made of an elastic material. According to the utility model, the position of the sound outlet nozzle is arranged in a segmented manner, and the buffer echo mechanism is arranged in the sound outlet nozzle, so that falling buffer and echo enhancement are effectively considered, and the safety of the position of the sound outlet nozzle of the earphone is ensured on the basis of improving the tone quality.

Description

Technical Field

[0001] This utility model relates to the field of headphone sound outlet technology, specifically a headphone vibration damping sound outlet. Background Technology

[0002] The sound outlet, also known as the sound tube or nozzle, is the channel at the front of the earphone that transmits sound to the ear canal. It is commonly found in in-ear or semi-in-ear earphones. It is usually located at the head of the earbud, in direct contact with the ear canal, and is mostly cylindrical or conical in shape.

[0003] The sound outlet can effectively guide sound waves into the ear canal, reducing sound loss and thus ensuring the quality of the sound entering the ear through the headphones.

[0004] Since the sound outlet is usually located on semi-in-ear and in-ear headphones, it is often necessary to take them out and put them down frequently. Moreover, as the size of semi-in-ear and in-ear headphones in current technology is gradually decreasing, the headphones are more likely to fall off when being taken out and put down. If the headphones fall off, they will be damaged. The sound outlet part is prone to damage due to the large shear stress when it falls because of the neck structure.

[0005] Therefore, how to protect the headphone output nozzle and improve its sound quality has become an urgent problem to be solved in the field of headphone output nozzle technology. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of existing technologies that cause damage to the sound outlet position when headphones are dropped due to impact and shear stress. It provides a shock-absorbing sound outlet for headphones by segmenting the sound outlet position and setting a buffer echo mechanism inside the sound outlet, which effectively takes into account both drop buffering and echo enhancement, thereby ensuring the safety of the headphone sound outlet position while improving sound quality.

[0007] The objective of this utility model is mainly achieved through the following technical solutions:

[0008] A headphone vibration damping sound outlet includes a straight body, one end of which is provided with a connecting end for connecting to an earphone, and the other end of which is provided with a thickened section, one end of which is fixed to the straight body, and the other end of which is fixed with a sound outlet;

[0009] The straight section body is equipped with a buffer echo mechanism, which is made of elastic material.

[0010] Furthermore, the buffer echo mechanism includes several annular grooves, which are embedded in the inner wall of the straight section body;

[0011] The annular groove has several circumferentially distributed inclined sidewalls, which are inclined from one side of the connecting end toward the side of the sound outlet.

[0012] Furthermore, the inclined sidewall is an arc-shaped structure, and the inclined sidewall is evenly distributed circumferentially around the axis of the straight section body.

[0013] Furthermore, a stepped end face is provided inside the joint end, and the stepped end face is adjacent to the annular groove closest to the end face of the joint end.

[0014] Furthermore, the thickened section includes a first expansion section and a second expansion section, wherein the wall thickness of the first expansion section is less than the wall thickness of the second expansion section.

[0015] Furthermore, the wall thickness of the first expansion section increases linearly from the straight section to the second expansion section;

[0016] The wall thickness of the second expansion section increases linearly from the first expansion section to the sound outlet.

[0017] In summary, the present invention has the following advantages compared with the prior art:

[0018] In this invention, after the headphone's sound-producing unit emits sound, the sound waves can pass through the connecting end into the straight section body and be emitted from the sound outlet through the thickened section. Within the straight section body, the sound waves are guided by a buffer echo mechanism, enhancing their sound quality and improving the quality of the sound heard by the user. In this embodiment, the buffer echo mechanism, through its elastic material properties, can cushion the sound outlet when it is subjected to external impact, preventing shear stress at the straight section body from breaking the sound outlet and thus protecting it. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a top view of the present invention;

[0022] Figure 3 This is a front view of the present utility model;

[0023] Figure 4 This is a cross-sectional view of the present invention;

[0024] The names corresponding to the reference numerals in the attached drawings are as follows: 1. Sound outlet; 2. Thickened section; 3. Straight section body; 4. Connecting end; 5. Buffer echo mechanism; 6. Stepped end face; 21. First expansion section; 22. Second expansion section; 51. Annular groove; 52. Inclined side wall. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0026] Example:

[0027] like Figures 1-4 As shown, this embodiment relates to an earphone vibration damping sound outlet, including a straight body 3, one end of the straight body 3 is provided with a connecting end 4, the connecting end 4 is used to connect to an earphone, the other end of the straight body 3 is provided with a thickened section 2, one end of the thickened section 2 is fixed to the straight body 3, and the other end of the thickened section 2 is fixed with a sound outlet 1.

[0028] The straight section body 3 is provided with a buffer echo mechanism 5, which is made of elastic material.

[0029] Currently, headphone design primarily focuses on sound quality, neglecting drop protection. The headphone's sound outlet is a crucial component connecting the headphone to the ear canal. To protect sound quality, the sound outlet typically protrudes from the headphone body. While this elongated structure effectively transmits sound, a drop can create significant shear stress at the sound outlet. This shear stress can lead to breakage between the sound outlet and the headphone body, impairing sound transmission and potentially rendering the entire headphone unusable.

[0030] In this embodiment, the straight section 3 is used for sound wave transmission, the connecting end 4 is used for connection with the headphones, and the thickened section 2 is used to enhance the stability of the corresponding position during sound wave transmission, thereby reducing sound leakage at the sound outlet 1. The buffer echo mechanism 5 can effectively buffer the impact force within the straight section 3 when the headphones are dropped, thereby effectively reducing the risk of damage to the headphones.

[0031] The buffer structure of the echo buffer mechanism 5 can also effectively guide sound waves, thereby enhancing the echo effect and improving sound quality.

[0032] In this embodiment, after the headphone's sound-producing unit emits sound, the sound waves can pass through the connecting end 4 into the straight section body 3 and be emitted from the sound outlet 1 through the thickened section 2. Within the straight section body 3, the sound waves are guided by the buffer echo mechanism 5, resulting in enhanced sound quality and improving the sound quality heard by the user. In this embodiment, the buffer echo mechanism 5, through its elastic material properties, can buffer the sound outlet when it is subjected to external impact, thereby preventing shear stress at the straight section body 3 from breaking the sound outlet and protecting it.

[0033] Furthermore, the buffer echo mechanism 5 includes a plurality of annular grooves 51, which are embedded in the inner wall of the straight section body 3;

[0034] The annular groove 51 is provided with a plurality of circumferentially distributed inclined sidewalls 52, which are inclined from one side of the connecting end 4 toward the side of the sound outlet 1.

[0035] In this embodiment, the annular groove 51 provides a space for the inclined sidewall 52, and the annular groove 51 can form a structure for an echo cavity, thereby helping the sound waves to be transmitted and partially reflected within the straight section body 3. The inclined sidewall 52 can form a one-way channel within the straight section body 3 by being inclined, thereby guiding the sound waves and preventing them from propagating into the headphones, thus enhancing the sound quality of the sound outlet 1.

[0036] Furthermore, the inclined sidewall 52 has an arc-shaped structure, and the inclined sidewall 52 is evenly distributed circumferentially around the axis of the straight main body 3.

[0037] In this embodiment, the arc-shaped structure of the inclined sidewall 52 can better guide sound waves and, when impacted on the outside of the straight body 3, can perform buffering more linearly, avoiding bending of the inclined sidewall 52, thus making the buffering process more stable. The inclined sidewall 52 is evenly distributed circumferentially around the axis of the straight body 3, so that the forces on the straight body 3 in all directions can be effectively buffered.

[0038] Furthermore, a stepped end face 6 is provided inside the joint end 4, and the stepped end face 6 is adjacent to the annular groove 51 closest to the end face of the joint end 4.

[0039] In this embodiment, the stepped end face 6 of the connecting end 4 can effectively restrict the inclined side wall 52 in the annular groove 51, thereby limiting the inclination direction of the inclined side wall 52 and preventing it from folding in the opposite direction under the action of external force. In addition, the stepped end face 6 can effectively unify the inlet position of the input straight section body 3, avoiding the problem of local sound quality damage caused by different circumferential structures.

[0040] Furthermore, the thickened section 2 includes a first expansion section 21 and a second expansion section 22, wherein the wall thickness of the first expansion section 21 is less than the wall thickness of the second expansion section 22.

[0041] In this embodiment, the first expansion section 21 in the thickened section 2 is used to enhance stability and avoid the sound wave transmission being affected by resonance or external force during the transmission process. The second expansion section 22 is directly connected to the sound outlet 1, so stronger stability is required to ensure that the sound quality of the sound outlet 1 is not affected.

[0042] Furthermore, the wall thickness of the first expansion segment 21 increases linearly from the straight body 3 to the second expansion segment 22;

[0043] The wall thickness of the second expansion section 22 increases linearly from the first expansion section 21 to the sound outlet 1.

[0044] In this embodiment, by increasing the wall thickness of the first expansion section 21 and the second expansion section 22, the stability of the sound wave transmission process is effectively ensured, and the sound wave transmission process is not affected. Since the first expansion section 21 and the second expansion section 22 are located at different positions, the required thickness to maintain stability is also different. The linearly thickened first expansion section 21 and the second expansion section 22 can effectively adapt to the changes in sound wave quality during transmission, thereby ensuring the stability of sound propagation while saving materials.

[0045] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A headphone vibration damping sound output nozzle, characterized in that, It includes a straight body, one end of which is provided with a connecting end for connecting to an earphone, and the other end of which is provided with a thickened section. One end of the thickened section is fixed to the straight body, and the other end of the thickened section is fixed with a sound outlet. The straight section body is equipped with a buffer echo mechanism, which is made of elastic material.

2. The headphone vibration damping sound outlet according to claim 1, characterized in that, The buffer echo mechanism includes several annular grooves, which are embedded in the inner wall of the straight section body; The annular groove has several circumferentially distributed inclined sidewalls, which are inclined from one side of the connecting end toward the side of the sound outlet.

3. The headphone vibration damping sound outlet according to claim 2, characterized in that, The inclined sidewalls are arc-shaped structures, and are evenly distributed circumferentially around the axis of the straight main body.

4. A headphone vibration damping sound outlet according to any one of claims 2 or 3, characterized in that, A stepped end face is provided inside the joint end, and the stepped end face is adjacent to the annular groove closest to the end face of the joint end.

5. The headphone vibration damping sound outlet according to claim 1, characterized in that, The thickened section includes a first expansion section and a second expansion section, wherein the wall thickness of the first expansion section is less than the wall thickness of the second expansion section.

6. The headphone vibration damping sound outlet according to claim 5, characterized in that, The wall thickness of the first expansion section increases linearly from the straight section to the second expansion section; The wall thickness of the second expansion section increases linearly from the first expansion section to the sound outlet.

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