Machining mechanism, machining device and machining equipment

Abstract

The utility model relates to a machining mechanism, a machining device and machining equipment. The machining mechanism comprises a machining platform; the laser component is used for modification processing and ablation processing, is positioned on one side of the processing platform, and comprises a common laser, a common light path transmission unit and a common processing head which are arranged in sequence; and the machining parameter adjusting assembly is connected to the laser assembly so as to adjust the laser parameters of the laser assembly, and therefore the laser assembly can conduct modification machining and ablation machining on the workpiece located on the machining platform. According to the processing mechanism, the problem of low processing efficiency caused by the fact that the wafer needs to be independently processed on a plurality of devices and needs to be transferred among the plurality of devices when being subjected to modification processing and ablation processing is effectively solved, so that the processing timeliness of workpieces (such as the wafer) is improved, and higher requirements in the semiconductor processing process are met.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a processing mechanism, processing apparatus and processing equipment. Background Technology

[0002] With the continuous advancement of semiconductor processing technology and the diversification of applications for semiconductor products, the requirements for semiconductor processing are becoming increasingly stringent. In the wafer processing process, semiconductor silicon carbide wafer processing equipment is mainly used for wafer dicing, loading and unloading, wafer positioning, and dicing path control.

[0003] In related technologies, wafer modification and ablation processes require independent processing on multiple devices, and the wafers need to be transferred between multiple devices during the process, resulting in low processing efficiency. Utility Model Content

[0004] Therefore, it is necessary to provide a processing mechanism, processing device, and processing equipment to address the aforementioned technical problems.

[0005] A processing mechanism, comprising:

[0006] Processing platform;

[0007] A laser assembly for modification and ablation processing is located on one side of the processing platform. The laser assembly includes a shared laser, a shared optical path transmission unit, and a shared processing head arranged sequentially.

[0008] A processing parameter adjustment component is connected to the laser component to adjust the laser parameters of the laser component, thereby enabling the laser component to perform modification and ablation processing on the workpiece located on the processing platform.

[0009] In one embodiment, the processing parameter adjustment component includes a power adjustment unit and a focusing unit.

[0010] The power adjustment unit is connected to the common laser to adjust the power value of the laser beam output by the common laser;

[0011] The focusing unit is connected to the common optical path transmission unit to adjust the focusing depth of the laser beam acting on the workpiece.

[0012] In one embodiment, the processing mechanism further includes:

[0013] A platform moving component, connected to the processing platform, adjusts the relative position between the processing platform and the shared processing head, thereby moving the laser beam relative to the processing platform.

[0014] In one embodiment, the platform mobility component includes:

[0015] The horizontal moving component can drive the processing platform to move along the length and width directions of the processing mechanism;

[0016] A rotary moving component, connected to the horizontal moving component, can drive the processing platform to rotate.

[0017] In one embodiment, the shared optical path transmission unit includes:

[0018] The system comprises a first reflector, a second reflector, a third reflector, a fourth reflector, a fifth reflector, an objective lens, and a separator. One end of the first reflector is located on one side of the common laser, and the other end of the first reflector is provided with the second reflector. One end of the second reflector is provided with the separator, one end of the separator is provided with the third reflector, one end of the third reflector is provided with the fourth reflector, one end of the fourth reflector is provided with the fifth reflector, and one end of the fifth reflector is provided with the objective lens, which is located on one side of the common processing head.

[0019] In one embodiment, the processing parameter adjustment component includes a focusing unit, the focusing unit comprising:

[0020] A ranging component is located on one side of the processing platform;

[0021] A focusing drive is connected to the rangefinder and the objective lens.

[0022] In one embodiment, the processing mechanism further includes:

[0023] A machining head moving assembly is connected to the common machining head to adjust the relative position of the common machining head with respect to the workpiece.

[0024] A processing apparatus, comprising:

[0025] The lifting mechanism is capable of lifting the workpiece to the clamping position;

[0026] A clamping mechanism, located on one side of the lifting mechanism, is capable of clamping the workpiece at the clamping station and moving it along the length of the clamping mechanism.

[0027] The glue-applying mechanism, located on one side of the clamping mechanism, is capable of receiving the clamped workpiece and applying glue to it.

[0028] The loading and unloading mechanism, located on one side of the gluing mechanism, is capable of moving the glued workpiece to the processing station;

[0029] The processing mechanism described above is capable of performing modification and ablation processing on the workpiece located at the processing station.

[0030] In one embodiment, the loading and unloading mechanism can also move the processed workpiece to a cleaning station, and the processing device further includes:

[0031] The cleaning mechanism, arranged side by side with the adhesive application mechanism, is capable of cleaning the workpiece located at the cleaning station.

[0032] A processing device, comprising:

[0033] The processing equipment described above.

[0034] The technical effects of the embodiments provided in this application are as follows:

[0035] In the aforementioned processing mechanism, when processing a workpiece (such as a wafer), the laser assembly located on one side of the processing platform adjusts the laser parameters of a laser assembly consisting of a shared laser, a shared optical path transmission unit, and a shared processing head, under the action of the processing parameter adjustment assembly. After the laser parameters of the laser assembly are adjusted, the laser assembly performs modification and ablation processing on the workpiece located on the processing platform based on the adjusted laser parameters. By sharing the laser, optical path transmission unit, and processing head during the modification and ablation processes, the processing effect of modification and ablation can be guaranteed while effectively improving the problem of low processing efficiency caused by the need for independent processing on multiple machines and transfer between multiple machines when performing modification and ablation processing on wafers. This improves the processing timeliness of workpieces (such as wafers) and meets the higher requirements of semiconductor processing. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the processing mechanism 10 in one embodiment;

[0038] Figure 2 This is a schematic diagram of the specific structure of the shared optical path transmission unit 1220 in one embodiment;

[0039] Figure 3 This is a schematic diagram of the specific structure of the focusing unit 1320 in one embodiment;

[0040] Figure 4This is a schematic diagram of the specific structure of the platform moving component 140 in one embodiment;

[0041] Figure 5 This is a schematic diagram of the specific structure of the processing head moving assembly 150 in one embodiment;

[0042] Figure 6 This is a schematic diagram of the processing device in one embodiment;

[0043] Figure 7 This is a schematic diagram of the processing device in one embodiment. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0048] Figure 1 This is a schematic diagram of the processing mechanism 10 in one embodiment.

[0049] In this embodiment, as Figure 1 As shown, the processing mechanism 10 includes a processing platform 110, a laser assembly 120, a processing parameter adjustment assembly 130, a platform moving assembly 140, and a processing head moving assembly 150.

[0050] The laser assembly 120 for modification and ablation processing is located on one side of the processing platform 110. The laser assembly 120 includes a common laser 1210, a common optical path transmission unit 1220 and a common processing head 1230 arranged in sequence.

[0051] The processing platform 110 may be a functional structure equipped with a processing station and connected to the platform moving component 140, capable of carrying the workpiece to be processed at the processing station and adjusting its position under the action of the platform moving component 140. The laser component 120 may be a functional component connected to the processing parameter adjustment component 130, capable of adjusting the output laser parameters under the action of the processing parameter adjustment component 130, and capable of performing modification and ablation processing on the workpiece located on the processing platform 110 based on the adjusted laser parameters. Optionally, the workpiece may be a structure such as a wafer that requires modification and ablation processing.

[0052] The shared laser 1210 can be a functional unit connected to the processing parameter adjustment component 130 and the shared optical path transmission unit 1220, capable of adjusting the output laser under the action of the processing parameter adjustment component 130 and transmitting the adjusted laser to the shared optical path transmission unit 1220. The shared optical path transmission unit 1220 can be a functional unit connected to the shared laser 1210 and the shared processing head 1230, capable of receiving the laser beam output from the shared laser 1210 and adjusting the transmission path of the laser beam. The shared processing head 1230 can be a functional structure connected to the processing head moving component 150, capable of adjusting its position under the action of the processing head moving component 150 to adjust the relative position between the shared processing head 1230 and the workpiece located on the processing platform 110.

[0053] like Figure 2 As shown, the shared optical path transmission unit 1220 includes a first reflector 1220a, a second reflector 1220b, a third reflector 1220c, a fourth reflector 1220d, a fifth reflector 1220e, an objective lens 1220f, and a blocker 1220g. One end of the first reflector 1220a is located on one side of the shared laser 1210, and the other end of the first reflector 1220a is provided with the second reflector 1220b. One end of the second reflector 1220b is provided with the blocker 1220g, and one end of the blocker 1220g is provided with the third reflector 1220c. One end of the third reflector 1220c is provided with the fourth reflector 1220d, and one end of the fourth reflector 1220d is provided with the fifth reflector 1220e. One end of the fifth reflector 1220e is provided with the objective lens 1220f, and one end of the objective lens 1220f is located on one side of the shared processing head 1230.

[0054] It should be noted that the laser beam output by the shared laser 1210 is reflected by the first reflector 1220a and the second reflector 1220b in sequence before entering the partition 1220g. If the partition 1220g is open, the laser beam passes through and is reflected by the third reflector 1220c, the fourth reflector 1220d and the fifth reflector 1220e before entering the objective lens 1220f. Then it passes through the shared processing head 1230 and finally acts on the workpiece located on the processing platform 110.

[0055] The processing parameter adjustment component 130 is connected to the laser component 120 to adjust the laser parameters of the laser component 120, so that the laser component 120 can perform modification and ablation processing on the workpiece located on the processing platform 110.

[0056] The processing parameter adjustment component 130 can be a functional component that can adjust the parameters of the laser output by the laser component 120 to adjust the laser processing parameters of the laser component 120 during the modification and ablation processing of the workpiece.

[0057] The processing parameter adjustment assembly 130 includes a power adjustment unit 1310 and a focusing unit 1320. The power adjustment unit 1310 is connected to the common laser 1210 to adjust the power value of the laser beam output by the common laser 1210; the focusing unit 1320 is connected to the common optical path transmission unit 1220 to adjust the focusing depth of the laser beam acting on the workpiece. Figure 3 As shown, the focusing unit 1320 includes a rangefinder 1320a and a focusing drive 1320b. The rangefinder 1320a is located on one side of the processing platform 110; the focusing drive 1320b is connected to the rangefinder 1320a and the objective lens 1220f.

[0058] The power adjustment unit 1310 can be a controlled terminal connected to the common laser 1210, capable of adjusting the power of the laser beam output by the common laser 1210. The focusing unit 1320 can be a controlled terminal connected to the common optical path transmission unit 1220, capable of adjusting the focusing depth position of the laser beam transmitted through the common optical path transmission unit 1220. Optionally, the power adjustment unit 1310 can be a power regulator or similar structure, and the focusing unit 1320 can be a focuser, focusing module, or similar structure.

[0059] The rangefinder 1320a can be a functional component connected to the focusing drive 1320b, capable of measuring the thickness of the workpiece and feeding back the measured value to the focusing drive 1320b. The focusing drive 1320b can be a functional component capable of adjusting the height of the objective lens 1220f based on the measured value fed back by the rangefinder 1320a, thereby adjusting the focusing depth position of the laser beam acting on the workpiece. Optionally, the rangefinder 1320a can be a rangefinder, and the focusing drive 1320b can be a focusing drive motor.

[0060] The platform moving component 140 is connected to the processing platform 110 to adjust the relative position between the processing platform 110 and the common processing head 1230, thereby moving the laser beam relative to the processing platform 110. Figure 4 As shown, the platform moving assembly 140 includes a horizontal moving member 1410 and a rotary moving member 1420. The horizontal moving member 1410 can drive the processing platform 110 to move along the length and width directions of the processing mechanism 10. The rotary moving member 1420 is connected to the horizontal moving member 1410 and can drive the processing platform 110 to rotate.

[0061] The platform moving component 140 can be a functional component capable of driving the processing platform 110 to move along the horizontal direction of the processing platform 110 to adjust the relative position between the processing platform 110 and the common processing head 1230, and to adjust the moving speed of the workpiece on the processing platform 110 relative to the laser beam, thereby adjusting the point spacing of laser processing. The horizontal moving component 1410 can be a functional component capable of driving the processing platform 110 to adjust its position along the horizontal direction of the processing platform 110 to adjust the relative position between the workpiece on the processing platform 110 and the common processing head 1230. The rotary moving component 1420 can be a functional component capable of driving the processing platform 110 to rotate along the horizontal direction of the processing platform 110 to adjust the relative position between the workpiece on the processing platform 110 and the common processing head 1230. The point spacing can be the distance between different processing points on the workpiece where the laser beam acts. Optionally, the horizontal moving component 1410 can be a horizontal moving platform, and the rotary moving component 1420 can be a rotary driver.

[0062] It should be noted that the dot pitch is determined by the moving speed of the processing platform 110 (i.e. the moving speed of the workpiece on the processing platform 110 relative to the laser beam) and the shared laser beam frequency output by the shared laser 1210. Specifically, dot pitch = moving speed of processing platform 110 / laser beam frequency.

[0063] The machining head moving assembly 150 is connected to the common machining head 1230 to adjust the relative position of the common machining head 1230 with respect to the workpiece. For example... Figure 5As shown, the processing head moving assembly 150 includes a following module 1510, a lifting module 1520, a horizontal calibration module 1530, and a focusing module 1540.

[0064] The machining head moving assembly 150 may be a functional assembly capable of driving the common machining head 1230 to move along the height direction of the machining mechanism 10, so as to adjust the relative position between the machining head and the workpiece on the machining platform 110 and adjust the machining depth of the laser beam acting on the workpiece.

[0065] The processing parameter adjustment component 130 in the processing mechanism 10 allows for parameter adjustment of the power of the laser beam output from the laser component 120 and the focusing depth of the laser beam acting on the workpiece on the processing platform 110. Furthermore, with the cooperation of the processing platform 110 and the platform moving component 140, the point spacing of the laser beam acting on the workpiece can also be adjusted until the above parameters meet preset conditions. Thus, by sharing the laser, optical path transmission unit, and processing head during the modification and ablation processes, modification and ablation processes can be performed on different processing points on the workpiece, improving the processing efficiency of workpieces (such as wafers) and enhancing the compactness of the processed structure. In addition, by cooperating with the processing head moving component 150 and the shared processing head 1230, the relative position between the processing head and the workpiece on the processing platform 110 can be adjusted during laser processing to change the processing depth of the laser beam acting on the workpiece, thereby meeting the needs of different processing scenarios.

[0066] Figure 6 and Figure 7 This is a schematic diagram of the processing device in one embodiment.

[0067] In this embodiment, as Figure 6 and Figure 7 As shown, the processing device includes a processing mechanism 10, a lifting mechanism 20, a clamping mechanism 30, an adhesive application mechanism 40, a loading and unloading mechanism 50, and a cleaning mechanism 60.

[0068] The lifting mechanism 20 can lift the workpiece to the clamping station. The clamping mechanism 30 is located on one side of the lifting mechanism 20 and can clamp the workpiece in the clamping station and move it along the length of the clamping mechanism 30. The glue application mechanism 40 is located on one side of the clamping mechanism 30 and can receive the clamped workpiece and apply glue. The loading and unloading mechanism 50 is located on one side of the glue application mechanism 40 and can move the glued workpiece to the processing station. The processing mechanism 10 can perform modification processing and ablation processing on the workpiece in the processing station. The loading and unloading mechanism 50 can also move the processed workpiece to the cleaning station. The cleaning mechanism 60 is arranged side by side with the glue application mechanism 40 and can clean the workpiece in the cleaning station.

[0069] Optionally, the lifting mechanism 20 can be a functional structure consisting of a lifting motor and a lead screw to lift the workpiece. The clamping mechanism 30 can be a functional structure consisting of grippers, a clamping motor, a synchronous belt, and a guide rail to clamp and transport the workpiece. The gluing mechanism 40 can be a functional structure consisting of a gluing module and a rotation module to apply gluing to the workpiece. The loading and unloading mechanism 50 can be a functional structure consisting of a loading and unloading motor and a robotic arm to move the workpiece. The cleaning mechanism 60 can be a functional structure consisting of two nozzles that combine compressed gas and pure water to clean the processed workpiece.

[0070] During workpiece (such as wafer) processing, the workpiece box is placed on the lifting mechanism 20. The lifting mechanism 20 drives the workpiece box to rise along the height direction of the processing device, and moves in conjunction with the clamping mechanism 30 to pick up the wafer. After the wafer flows to the coating mechanism 40, the coating module sprays protective liquid and coats the wafer by rotating the self-rotating module. The loading and unloading mechanism 50 transports the coated wafer to the processing platform 110. The platform moving component 140 drives the processing platform 110 to move under the wide-angle imaging mechanism to perform wafer imaging, and determines the wafer center point based on the imaging result. Then, the wafer is moved below the processing mechanism 10. The processing head moving component 150 determines the wafer level through the horizontal calibration module 1530. The focusing module 1540 focuses the wafer, and in conjunction with the power adjustment unit 1310 and focusing unit 1320 in the processing parameter adjustment component 130, adjusts the power of the laser beam output from the laser component 120 and the focusing depth of the laser beam acting on the wafer surface. The lifting module 1520 in the processing head moving component 150 adjusts the relative position of the common processing head and the wafer in the vertical direction to determine the wafer processing depth, and then performs modification and ablation processing on the wafer. During the processing, the following module 1510 can ensure the consistency of the wafer processing depth. After processing, the wafer is transported to the cleaning mechanism 60 for cleaning through the loading and unloading mechanism 50, and finally returned to the picking box through the clamping mechanism 30.

[0071] This application also provides a processing apparatus, which includes the processing device in the above embodiments.

[0072] The division of the various modules in the above processing device is only for illustrative purposes. In other embodiments, the processing device can be divided into different modules as needed to complete all or part of the functions of the above processing device.

[0073] The processing mechanism, processing device, and processing equipment provided in the above embodiments, when processing a workpiece (such as a wafer), allow the laser assembly located on one side of the processing platform to adjust the laser parameters of the laser assembly, which is sequentially equipped with a shared laser, a shared optical path transmission unit, and a shared processing head, under the action of the processing parameter adjustment component. After the laser parameters of the laser assembly are adjusted, the laser assembly performs modification and ablation processing on the workpiece located on the processing platform based on the adjusted laser parameters. By sharing the laser, optical path transmission unit, and processing head during the modification and ablation processing, the processing effect of modification and ablation processing can be guaranteed, while effectively improving the problem of low processing efficiency caused by the need to transfer between multiple devices when performing modification and ablation processing on wafers. This improves the processing timeliness of workpieces (such as wafers) and meets the higher requirements of semiconductor processing, thus having significant economic value and practical application value.

[0074] The above embodiments include, but are not limited to, single-spot optical path schemes. Dual-spot and above optical spot schemes can also be applied. In addition to ensuring an efficient processing scheme that integrates modification processing and ablation processing, the application of multi-spot optical processing systems greatly improves the efficiency of the processing process.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A processing mechanism, characterized in that, include: Processing platform; A laser assembly for modification and ablation processing is located on one side of the processing platform. The laser assembly includes a shared laser, a shared optical path transmission unit, and a shared processing head arranged sequentially. A processing parameter adjustment component is connected to the laser component to adjust the laser parameters of the laser component, thereby enabling the laser component to perform modification and ablation processing on the workpiece located on the processing platform.

2. The processing mechanism according to claim 1, characterized in that, The processing parameter adjustment component includes a power adjustment unit and a focusing unit. The power adjustment unit is connected to the common laser to adjust the power value of the laser beam output by the common laser; The focusing unit is connected to the common optical path transmission unit to adjust the focusing depth of the laser beam acting on the workpiece.

3. The processing mechanism according to claim 2, characterized in that, The processing mechanism also includes: A platform moving component, connected to the processing platform, adjusts the relative position between the processing platform and the shared processing head, thereby moving the laser beam relative to the processing platform.

4. The processing mechanism according to claim 3, characterized in that, The platform mobility component includes: The horizontal moving component can drive the processing platform to move along the length and width directions of the processing mechanism; A rotary moving component, connected to the horizontal moving component, can drive the processing platform to rotate.

5. The processing mechanism according to claim 1, characterized in that, The shared optical path transmission unit includes: The system comprises a first reflector, a second reflector, a third reflector, a fourth reflector, a fifth reflector, an objective lens, and a separator. One end of the first reflector is located on one side of the common laser, and the other end of the first reflector is provided with the second reflector. One end of the second reflector is provided with the separator, one end of the separator is provided with the third reflector, one end of the third reflector is provided with the fourth reflector, one end of the fourth reflector is provided with the fifth reflector, and one end of the fifth reflector is provided with the objective lens, which is located on one side of the common processing head.

6. The processing mechanism according to claim 5, characterized in that, The processing parameter adjustment component includes a focusing unit, which includes: A ranging component is located on one side of the processing platform; A focusing drive is connected to the rangefinder and the objective lens.

7. The processing mechanism according to claim 1, characterized in that, The processing mechanism also includes: A machining head moving assembly is connected to the common machining head to adjust the relative position of the common machining head with respect to the workpiece.

8. A processing apparatus, characterized in that, include: The lifting mechanism is capable of lifting the workpiece to the clamping position; A clamping mechanism, located on one side of the lifting mechanism, is capable of clamping the workpiece at the clamping station and moving it along the length of the clamping mechanism. The glue-applying mechanism, located on one side of the clamping mechanism, is capable of receiving the clamped workpiece and applying glue to it. The loading and unloading mechanism, located on one side of the gluing mechanism, is capable of moving the glued workpiece to the processing station; The processing mechanism according to any one of claims 1 to 7 is capable of performing modification processing and ablation processing on the workpiece located at the processing station.

9. The processing apparatus according to claim 8, characterized in that, The loading and unloading mechanism can also move the processed workpiece to the cleaning station, and the processing device further includes: The cleaning mechanism, arranged side by side with the adhesive application mechanism, is capable of cleaning the workpiece located at the cleaning station.

10. A processing device, characterized in that, include: The processing apparatus as described in any one of claims 8 to 9.

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