Memory bank heat dissipation structure

Abstract

The utility model relates to a memory bank heat dissipation structure which comprises a main board, a horizontal memory slot is formed in the top face of the main board, a horizontal memory bank is inserted in the memory slot, a main board through hole located under the memory bank is formed in the main board, a ventilation pipe is arranged in the main board through hole, and the ventilation pipe is connected with the main board through hole. The two ends of the ventilation pipe extend to form fixing rings, the two fixing rings abut against the top face and the bottom face of the main plate correspondingly, each fixing ring is provided with a ventilation notch communicating the inner side of the ventilation pipe with the outer side of the ventilation pipe, and hotter air forms the chimney effect through the ventilation pipe. According to the technical scheme, hot air, located below the memory bank, of the bottom face of the main board carries heat to flow to the position above the top face of the main board through the ventilation pipe and the ventilation notch, air with the high temperature is taken away by means of the air duct design of the whole machine, and therefore the position, located below the memory bank, of the bottom face of the main board and the periphery of the memory bank are kept at the relatively low temperature; and the effect of reducing the temperature of the memory is achieved.

Description

Technical Field

[0001] This utility model relates to the field of memory module heat dissipation, and more specifically, to a memory module heat dissipation structure. Background Technology

[0002] In the design of compact electronic products such as 1U servers or Mini-PCs, many systems use low-power fans or even fanless designs. In this case, heat dissipation has very strict requirements for the entire design. Memory modules are one of the core components inside the computer. Due to the large amount of heat generated during operation, their temperature will rise rapidly, thereby driving up the ambient temperature.

[0003] However, once the motherboard is installed on an electronic product, the bottom of the motherboard, located below the memory module, forms a relatively enclosed space with the inner wall of the electronic product. Without air convection, continuous heat accumulation keeps the area under the memory module and its surroundings at a relatively high temperature, which in turn keeps the memory module and its surroundings at a relatively high temperature as well. Utility Model Content

[0004] To address the aforementioned shortcomings of existing technologies, a heat dissipation structure for memory modules is provided.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a memory module heat dissipation structure, including a motherboard, a horizontal memory slot is provided on the top surface of the motherboard, a horizontal memory module is inserted into the memory slot, a motherboard through hole is provided on the motherboard directly below the memory module, a ventilation tube is provided in the motherboard through hole, and a fixing ring extends from both ends of the ventilation tube. The two fixing rings abut against the top and bottom surfaces of the motherboard respectively, and each fixing ring is provided with a ventilation notch connecting the inside and outside of the ventilation tube.

[0006] Preferably, the motherboard has multiple motherboard through holes, which are spaced apart and positioned directly below the memory modules, and each motherboard through hole contains a ventilation pipe.

[0007] Preferably, the memory module is provided with multiple memory through holes, which are located directly above the corresponding ventilation pipes.

[0008] Preferably, the bottom surface of the memory module is provided with multiple gaskets, and the multiple memory through holes are located in the corresponding gaskets, with the bottom surface of the gasket abutting against the top surface of the corresponding fixing ring.

[0009] Preferably, multiple ventilation openings are provided, and the multiple ventilation openings are arranged at equal intervals along the circumference of the fixed ring.

[0010] Preferably, both the ventilation duct and the fixing ring are made of anodized aluminum.

[0011] The beneficial effects of this invention are as follows: the higher temperature at the bottom of the motherboard below the memory modules causes the air density there to be lower than the surrounding air density. The lower-density, hotter air enters the ventilation duct through the ventilation opening, and at the same time, the hotter air forms a "chimney effect" through the ventilation duct, causing the hot air at the bottom of the motherboard below the memory modules to flow with heat to the top of the motherboard through the ventilation duct and ventilation opening. With the help of the overall airflow design, the hotter air is carried away, thereby maintaining a relatively low temperature at the bottom of the motherboard below the memory modules and around the memory modules, achieving the effect of reducing the temperature of the memory itself. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the rear exploded structure of an embodiment of this utility model;

[0013] Figure 2 This is a schematic diagram of the overall front structure of an embodiment of this utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the motherboard and ventilation pipe in an embodiment of this utility model;

[0015] Figure 4 This is an embodiment of the present utility model. Figure 3 Enlarged schematic diagram of region A in the middle.

[0016] Attached label: 1 Motherboard, 10 Motherboard through hole, 2 Memory slot, 3 Memory module, 30 Memory through hole, 4 Ventilation tube, 5 Retaining ring, 50 Ventilation notch, 6 Gasket ring. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. In addition, the directional terms mentioned in this utility model, such as "up," "down," "front," "back," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. The directional terms are used to better and more clearly explain and understand this utility model, and are not intended to indicate or imply the necessary orientation of this utility model. Therefore, they should not be construed as limitations on this utility model.

[0018] Examples of embodiments of this utility model Figures 1 to 4As shown, a memory module heat dissipation structure includes a motherboard 1. A horizontal memory slot 2 is provided on the top surface of the motherboard 1. For example, the memory slot 2 is a small dual in-line memory module (SODIMM) slot. A horizontal memory module 3 is inserted into the memory slot 2. Two memory modules 3 are inserted into the memory slot 2. A motherboard through hole 10 is provided on the motherboard 1, located directly below the memory module 3. A ventilation tube 4 is provided in the motherboard through hole 10. Both ends of the ventilation tube 4 extend with fixing rings 5, that is, the two fixing rings 5 ​​and the ventilation tube 4 are integrally formed. The two fixing rings 5 ​​abut against the top and bottom surfaces of the motherboard 1, that is, the ventilation tube 4 is fixed in the motherboard through hole 10 by the two fixing rings 5. Each fixing ring 5 is provided with a ventilation notch 50 connecting the inside and outside of the ventilation tube 4, that is, the ventilation notch 50 enhances the heat dissipation efficiency.

[0019] The higher temperature at the bottom of the motherboard 1, below the memory module 3, causes the air density there to be lower than the surrounding air density. This lower-density, hotter air enters the ventilation duct 4 through the ventilation opening 505. Simultaneously, the hotter air creates a "chimney effect" through the ventilation duct 4, causing the hot air at the bottom of the motherboard 1, below the memory module 3, to flow with heat through the ventilation duct 4 and ventilation opening 50 towards the top of the motherboard 1. With the help of the overall airflow design, the hotter air is carried away, thus maintaining a relatively lower temperature at the bottom of the motherboard 1, below the memory module 3, and around the memory module 3, achieving the effect of reducing the temperature of the memory itself.

[0020] Further improvements, such as Figure 1 and Figure 3 As shown, the motherboard 1 is provided with a plurality of motherboard through holes 10. There are two motherboard through holes 10, which are spaced apart and positioned directly below the memory module 3. The two motherboard through holes 10 are located on the left and right sides of the middle position of the memory slot 2. Each motherboard through hole 10 is provided with a ventilation pipe 4. The heat dissipation efficiency is improved through the two motherboard through holes 10 and the corresponding two ventilation pipes 4.

[0021] Further improvements, such as Figure 1 and Figure 2 As shown, the memory module 3 is provided with multiple memory through holes 30, and there are two memory through holes 30. The two memory through holes 30 are located directly above the corresponding ventilation pipe 4. Two gaskets 6 are provided on the bottom surface of the memory module 3. The two memory through holes 30 are located in the corresponding gaskets 6. The bottom surface of the gaskets 6 abuts against the top surface of the corresponding fixing ring 5. The memory through holes 30 improve heat dissipation efficiency. At the same time, the gaskets 6 and the fixing ring 5 also form a chimney effect, which can also improve heat dissipation efficiency. Furthermore, the fixing ring 5 and the gaskets 6 support the memory module 3 and prevent the memory module 3 from deforming due to gravity after long-term use.

[0022] Further improvements, such as Figure 1 , Figure 3 and Figure 4 As shown, multiple ventilation gaps 50 are provided, and the multiple ventilation gaps 50 are arranged at equal intervals along the circumference of the fixing ring 5. Preferably, four ventilation gaps 50 are provided, and the four ventilation gaps 50 are arranged at equal intervals along the circumference of the fixing ring 5 to form a cross-shaped structure. The ventilation volume is increased by the four ventilation gaps 50, allowing the air to carry away more heat.

[0023] Further improvements, such as Figure 1 and Figure 3 As shown, both the ventilation pipe 4 and the fixing ring 5 are made of aluminum mold material after anodizing. An oxide film is formed on the surface of the aluminum mold material after anodizing, so that the ventilation pipe 4 and the fixing ring 5 will not rust and will not conduct electricity.

[0024] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heat dissipation structure for a memory module, comprising a motherboard; characterized in that, The motherboard has a horizontal memory slot on its top surface; a horizontal memory module is inserted into the memory slot; the motherboard has a through hole located directly below the memory module; a ventilation tube is installed in the through hole; a retaining ring extends from both ends of the ventilation tube; the two retaining rings abut against the top and bottom surfaces of the motherboard; each retaining ring has a ventilation notch connecting the inside and outside of the ventilation tube.

2. The heat dissipation structure for a memory module according to claim 1, characterized in that, The motherboard has multiple motherboard through holes; the multiple motherboard through holes are spaced apart and positioned directly below the memory modules; each motherboard through hole is provided with a ventilation pipe.

3. The heat dissipation structure for a memory module according to claim 2, characterized in that, The memory module has multiple memory through holes; the multiple memory through holes are located directly above the corresponding ventilation pipes.

4. The heat dissipation structure for a memory module according to claim 3, characterized in that, The bottom surface of the memory module is provided with multiple gaskets; the multiple memory through holes are located in the corresponding gaskets; the bottom surface of the gasket abuts against the top surface of the corresponding fixing ring.

5. The heat dissipation structure for a memory module according to claim 1, characterized in that, The ventilation openings are provided in multiple ways; the multiple ventilation openings are arranged at equal intervals along the circumference of the fixed ring.

6. The heat dissipation structure for a memory module according to claim 1, characterized in that, Both the ventilation duct and the fixing ring are made of anodized aluminum.

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