Vacuum packaging device for chip production

Abstract

The utility model relates to the technical field of chip production, in particular to a vacuum packaging device for chip production, which comprises a packaging machine body, an encapsulation assembly is arranged in the packaging machine body, a feeding mechanism is arranged below the encapsulation assembly, the feeding mechanism comprises a filling area and a temporary storage area distributed in parallel with the filling area, and the temporary storage area is arranged in the filling area. A plurality of layers of chip trays are sequentially stacked in the filling area, a plurality of transmission shafts are rotationally connected to the positions, close to the chip trays, of the inner wall of the temporary storage area, a push plate is arranged on one side of each chip tray, and an air cylinder is installed on one side of each push plate. After packaging is completed, the chip tray on the uppermost layer slides to the temporary storage area, the chip tray on the second layer is jacked to the upper position, automatic feeding and discharging are achieved while batch feeding is conducted, the switching frequency of equipment is reduced, and energy is saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip production technical field, concretely is a vacuum packaging device for chip production. BACKGROUND

[0002] Chip vacuum packaging is the technology that chip is placed in the vacuum environment and is packaged, aims at improving chip performance, reliability and stability, wherein chip potting is an important link in the chip packaging process, aims at protecting chip from the influence of external environment, improves its electrical performance and mechanical stability simultaneously, and main work flow is that liquid packaging material such as epoxy resin is injected into the space around the packaged chip, the packaging material should have good fluidity, insulation, thermal stability and mechanical properties, can completely cover the chip and lead bonding area, plays the role of protection and isolation

[0003] In the chip potting machine, the workbench is horizontally laid with a layer of chips, once a layer of chips completes potting operation, needs to open the equipment again, unloads the packaged chip, places new chip to be packaged again, cannot batch feeding, reduces the packaging efficiency, in addition, frequent feeding and discharging operation needs to open the equipment repeatedly, and each opening will introduce external air, destroys the vacuum environment, leads to must re-evacuation, this series of actions not only prolongs the overall processing cycle, but also increases energy consumption and equipment maintenance cost. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a vacuum packaging device for chip production to solve the problems of unable batch feeding, low packaging efficiency and repeated evacuation of energy consumption in the above background technology.

[0005] To achieve the above object, the embodiment of the utility model provides the following technical scheme:

[0006] A vacuum packaging device for chip production, including the packaging machine body, the inside installation of potting assembly of packaging machine body, be equipped with feeding mechanism below potting assembly;

[0007] The feeding mechanism includes a perfusion area, and a temporary storage area distributed in parallel with the perfusion area, a plurality of transmission shafts are rotatably connected to the position of the inner wall of the temporary storage area close to the chip tray.

[0008] One side of the chip tray is provided with a push plate, a cylinder is installed on one side of the push plate, the piston rod of the cylinder extends outward, pushes the push plate to extrude the chip tray and slides to the transmission shaft, and is transmitted to the temporary storage area in sequence through the transmission shaft.

[0009] As one preferred scheme of the utility model, a plurality of parallel distributed limiting rods are arranged below the lowermost chip tray, and a damping spring is sleeved outside each limiting rod.

[0010] As one preferred scheme of the utility model, the multilayer chip tray is stacked above the limiting rods in turn, and is pressed to slide downwards along the perfusion area under the action of its own gravity, and is accompanied by compression of the damping spring.

[0011] As one preferred scheme of the utility model, a horizontal baffle is arranged between the perfusion area and the temporary storage area, and the horizontal plane height of the horizontal baffle is lower than the horizontal plane height of the uppermost chip tray, and the horizontal baffle limits the horizontal movement of the chip tray below the uppermost chip tray.

[0012] As one preferred scheme of the utility model, the upper surface of the uppermost chip tray is provided with a pressing rod welded with the inner wall of the perfusion area, the pressing rod is closely attached to the upper surface edge of the uppermost chip tray, and the pressing rod and the limiting rod press and fix the chip tray.

[0013] As one preferred scheme of the utility model, the end of each of the plurality of transmission shafts is provided with a guide wheel, the surface of the guide wheel is provided with a belt in transmission connection, and the end of one of the transmission shafts is provided with a driving motor.

[0014] As one preferred scheme of the utility model, the sealing assembly comprises a three-shaft gantry, a sliding block is slidably connected to the three-shaft gantry, and a sealing needle head is arranged at the bottom of the sliding block.

[0015] As one preferred scheme of the utility model, a vacuum pump is arranged on one side of the packaging machine body, and the inlet of the vacuum pump is connected to the working space in the packaging machine body through a suction pipeline.

[0016] Compared with the prior art, the utility model has the advantages of:

[0017] In the utility model, the feeding mechanism is subdivided into a perfusion area and a temporary storage area, the perfusion area can accommodate a plurality of chip trays at the same time, a group of chips to be packaged can be embedded in each chip tray, once the chip packaging process on the surface of the lowermost chip tray is completed, the cylinder pushes the push plate, so that the uppermost chip tray slides to the temporary storage area, the second chip tray is lifted to the upper position again under the action of the damping spring, automatic feeding and discharging are realized at the same time of batch feeding, and the unloading is carried out after complete packaging, so that the opening and closing frequency of the equipment is reduced, and energy is saved. BRIEF DESCRIPTION OF DRAWINGS

[0018] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0020] Figure 1 This is a top view of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the overall side sectional view of the present invention;

[0022] Figure 3 This is a schematic diagram of the overall structure of the feeding mechanism of this utility model;

[0023] Figure 4 This is a side sectional view of the feeding mechanism of this utility model.

[0024] Figure 5 This is a top sectional view of the feeding mechanism of this utility model;

[0025] Figure 6 This utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0026] In the diagram: 1. Packaging machine body; 101. Vacuum pump; 102. Air extraction pipe; 2. Encapsulation assembly; 201. Three-axis gantry; 202. Slider; 203. Encapsulation needle; 3. Feeding mechanism; 301. Filling area; 302. Temporary storage area; 303. Chip tray; 304. Drive shaft; 305. Push plate; 306. Cylinder; 307. Limit rod; 308. Damping spring; 309. Horizontal baffle; 3010. Pressure rod; 3011. Drive motor. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1 to 6 This utility model provides a vacuum packaging device for chip production, including a packaging machine body 1, a potting assembly 2 installed inside the packaging machine body 1, and a feeding mechanism 3 provided below the potting assembly 2;

[0029] The feeding mechanism 3 includes a filling area 301 and a temporary storage area 302 distributed parallel to the filling area 301. Multiple chip trays 303 are stacked inside the filling area 301. Multiple drive shafts 304 are rotatably connected to the inner wall of the temporary storage area 302 near the chip trays 303.

[0030] A push plate 305 is provided on one side of the chip tray 303, and a cylinder 306 is installed on one side of the push plate 305. The piston rod of the cylinder 306 extends outward to push the push plate 305 to squeeze the chip tray 303 to slide towards the drive shaft 304, and then is sequentially transferred to the temporary storage area 302 through the drive shaft 304.

[0031] In this embodiment, by performing the feeding operation in the filling area 301, a set of chips to be potted can be embedded in each layer of chip tray 303, thereby achieving batch feeding. Once the chip encapsulation process on the surface of the first layer of chip tray 303 is completed, the cylinder 306 pushes the push plate 305, causing the upper layer of chip tray 303 to slide sequentially to the temporary storage area 302, automatically completing the storage action. The fully automated operation reduces the switching frequency of the equipment and helps maintain the stability of the internal vacuum environment.

[0032] In this embodiment, as Figure 5 and Figure 6 As shown, the bottommost chip tray 303 has multiple parallelly arranged limiting rods 307 below it, and a damping spring 308 is sleeved on the outside of each limiting rod 307.

[0033] The chip tray 303 is stacked on top of the limiting rod 307. Relying on its own gravity, it squeezes the limiting rod 307 to slide down along the injection area 301, accompanied by the compression of the damping spring 308.

[0034] It should be noted that after the multi-layer chip trays 303 are stacked in sequence, they will compress the damping spring 308. The bottom of the filling area 301 is provided with a groove corresponding to the position of the limiting rod 307. The limiting rod 307 slides vertically up and down along the groove. The bottom limiting rod 307 is designed to guide the compression trajectory of the damping spring 308, ensuring that the damping spring 308 is prevented from bending when it is subjected to downward pressure. After the first layer of chip trays 303 is pushed out, the elastic force of the damping spring 308 will automatically lift the second layer of chip trays 303 back to the upper position, and start a new round of filling and unloading process.

[0035] In this embodiment, as Figure 4 and Figure 5 As shown, a transverse baffle 309 is provided between the filling area 301 and the temporary storage area 302, and the horizontal height of the transverse baffle 309 is lower than the horizontal height of the uppermost chip tray 303. The transverse baffle 309 restricts the transverse movement of the chip tray 303 below the uppermost chip tray 303.

[0036] It should be noted that the horizontal baffle 309 is designed to block the chip tray 303 below. The push plate 305 is flush with the top chip tray 303. When the push plate 305 pushes, it can only push the first chip tray 303 at a time. When the first chip tray 303 moves backward, the horizontal baffle 309 blocks the remaining chip trays 303 at the bottom that have not yet been packaged, ensuring that they will not slide out along with it.

[0037] In addition, the horizontal height of the transverse baffle 309 is set lower than that of the first chip tray 303. When the cylinder 306 at the rear pushes the first chip tray 303, it can be ensured that it smoothly passes over the transverse baffle 309 and avoid any possible interference.

[0038] In this embodiment, as Figure 3 and Figure 5 As shown, the uppermost chip tray 303 has a pressure rod 3010 welded to the inner wall of the filling area 301 on its upper surface. The pressure rod 3010 is in close contact with the edge of the upper surface of the uppermost chip tray 303, and the pressure rod 3010 and the limiting rod 307 press and fix the chip tray 303.

[0039] It should be noted that during the feeding process, the upper edge of the chip tray 303 is pressed down by the upper pressure rod 3010, and the bottom limiting rod 307 abuts against the bottom edge of the chip tray 303, clamping and fixing it from the top and bottom to prevent the bottom chip tray 303 from shifting. The pressure rod 3010 applies pressure to the edge of the chip tray 303 to prevent the chip tray 303 from detaching from the filling area 301 due to excessive elasticity.

[0040] In this embodiment, as Figure 3 and Figure 4As shown, guide wheels are installed at the ends of multiple drive shafts 304, and belts are connected to the surface of the guide wheels. A drive motor 3011 is installed at the end of one of the drive shafts 304.

[0041] It should be noted that by driving a drive motor 3011 to rotate a drive shaft 304, and with the help of the transmission mechanism of the guide wheel and belt, another drive shaft 304 also rotates in the same direction, thereby steadily conveying the chip tray 303 above to the temporary storage area 302, thus realizing automatic transmission and storage.

[0042] In this embodiment, as Figure 1 and Figure 2 As shown, the potting assembly 2 includes a three-axis gantry 201, a slider 202 is slidably connected to the three-axis gantry 201, and a potting needle 203 is installed at the bottom of the slider 202.

[0043] A vacuum pump 101 is installed on one side of the packaging machine body 1. The inlet of the vacuum pump 101 is connected to the working space inside the packaging machine body 1 through the air extraction pipe 102.

[0044] It should be noted that the vacuum pump 101 and the air extraction pipe 102 are used to evacuate the inside of the equipment to maintain the internal vacuum environment and avoid contamination by the outside air. Transparent glass is installed on the front and side of the packaging machine body 1 to facilitate observation of the internal packaging status. A controller is provided above the three-axis gantry 201 and the potting needle 203. The controller contains a control chip to control the sliding of each slider 202 of the three-axis gantry 201.

[0045] In addition, a camera is provided on one side of the encapsulation needle 203. The camera captures the position of the chip and transmits the signal to the controller. The controller then sends the signal to the control terminal of the three-axis gantry 201 to control the sliding of the slider 202. The camera is an intelligent camera with an internal chip as the processing core. It collects ultra-high-definition video data from the image sensor in real time, realizes fully automatic capture, rapid recognition and analysis of video images, and transmits the information to the controller to control the sliding of the slider 202 of the three-axis gantry 201. This further drives the encapsulation needle 203 at the bottom to move itself to the top of the chip to be encapsulated.

[0046] In practical use, the specific working process is as follows:

[0047] I. Installing the chip:

[0048] The entire feeding mechanism 3 is slid out along the front of the packaging machine body 1. The chips to be packaged are laid in the four chip trays 303 in sequence. The first layer of chip tray 303 is placed in the middle area, and then the second layer of chip tray 303 is superimposed on its surface. When installing the second layer of chip tray 303, pressure is applied gently downwards to compress the damping spring 308 and the limiting rod 307 slides down along the inner wall of the filling area 301. In this way, the remaining chip trays 303 with chips are installed in sequence.

[0049] II. Preparatory Work for Launch:

[0050] Start the drive motor 3011 to make the two drive shafts 304 rotate toward the temporary storage area 302, push the feeding mechanism 3 to slide to the bottom of the potting assembly 2, then turn on the vacuum pump 101 to evacuate the inside of the encapsulation machine body 1 to a vacuum state through the air extraction pipe 102, and adjust the controller.

[0051] III. Begin packaging:

[0052] By adjusting the controller, the slider 202 of the internal three-axis gantry 201 is manipulated to move along the slide rail until the slider 202 reaches above the chip. Then, using the potting needle 203 (in this embodiment, the potting needle 203 is a fully automatic potting needle 203, which is existing technology in the field), a flexible tube is provided on one side of the potting needle 203, which is connected to the top housing. The housing contains potting material to pot the chip until the chip potting operation in the first chip tray 303 is completed. Then, the cylinder 306 is activated to push the top chip tray 303. Sliding onto the drive shaft 304, the packaged chip tray 303 and the chips are transported together to the temporary storage area 302 at the rear end via the drive shaft 304. At this time, the second layer chip tray 303 is lifted back to the upper position under the action of the damping spring 308, and a new round of packaging and unloading process begins until all chips in the multi-layer chip tray 303 have completed the encapsulation operation. Then, the loading mechanism 3 is slid out to remove all the packaged chips in the temporary storage area 302 and new chips to be packaged are placed into the filling area 301.

[0053] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A vacuum packaging apparatus for chip manufacturing, characterized in that, The package includes a packaging machine body (1), and a potting assembly (2) is installed inside the packaging machine body (1). A feeding mechanism (3) is provided below the potting assembly (2). The feeding mechanism (3) includes a filling area (301) and a temporary storage area (302) distributed parallel to the filling area (301). Multiple chip trays (303) are stacked inside the filling area (301). Multiple drive shafts (304) are rotatably connected to the inner wall of the temporary storage area (302) near the chip trays (303). A push plate (305) is provided on one side of the chip tray (303), and a cylinder (306) is installed on one side of the push plate (305). The piston rod of the cylinder (306) extends outward to push the push plate (305) to squeeze the chip tray (303) and slide it toward the drive shaft (304), and then it is sequentially transported to the temporary storage area (302) through the drive shaft (304).

2. The vacuum packaging apparatus for chip manufacturing according to claim 1, characterized in that: Below the bottommost chip tray (303) are multiple parallel limiting rods (307), and a damping spring (308) is sleeved on the outside of each limiting rod (307).

3. The vacuum packaging apparatus for chip manufacturing according to claim 2, characterized in that: The multiple chip trays (303) are stacked on top of the limiting rod (307) in sequence. Due to their own gravity, the limiting rod (307) is squeezed to slide down along the injection area (301) and the damping spring (308) is compressed.

4. The vacuum packaging apparatus for chip manufacturing according to claim 1, characterized in that: A transverse baffle (309) is provided between the filling area (301) and the temporary storage area (302), and the horizontal plane height of the transverse baffle (309) is lower than the horizontal plane height of the uppermost chip tray (303). The transverse baffle (309) restricts the transverse movement of the chip tray (303) below the uppermost chip tray (303).

5. The vacuum packaging apparatus for chip manufacturing according to claim 2, characterized in that: The uppermost chip tray (303) has a pressure bar (3010) welded to the inner wall of the injection area (301) on its upper surface. The pressure bar (3010) is in close contact with the edge of the upper surface of the uppermost chip tray (303). The pressure bar (3010) and the limiting rod (307) press and fix the chip tray (303).

6. The vacuum packaging apparatus for chip manufacturing according to claim 1, characterized in that: Each of the multiple drive shafts (304) has a guide wheel installed at its end, and a belt is driven to the surface of the guide wheel. A drive motor (3011) is installed at the end of one of the drive shafts (304).

7. The vacuum packaging apparatus for chip manufacturing according to claim 1, characterized in that: The potting assembly (2) includes a three-axis gantry (201), on which a slider (202) is slidably connected, and a potting needle (203) is installed at the bottom of the slider (202).

8. The vacuum packaging apparatus for chip manufacturing according to claim 1, characterized in that: A vacuum pump (101) is installed on one side of the packaging machine body (1), and the inlet of the vacuum pump (101) is connected to the working space inside the packaging machine body (1) through an air extraction pipe (102).

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