Sorting device for silicon wafer flower basket

Abstract

The utility model provides a sorting device for silicon wafer flower baskets, which relates to the technical field of photovoltaic equipment, and comprises a support frame, a plurality of silicon wafers, a plurality of silicon wafers, a plurality of silicon wafers, a plurality of silicon wafers, a plurality of silicon wafers, a plurality of silicon wafers, a plurality of silicon wafers and a plurality of silicon wafers, the first conveying mechanism is arranged at the bottom in the fixed frame and is used for conveying the silicon wafer flower basket; the second conveying mechanism is located on the guide rail and used for driving the sliding block to slide, and the conveying direction of the first conveying mechanism is perpendicular to that of the second conveying mechanism; the first driving mechanism is arranged at the outer bottom of the fixing frame and used for driving the first conveying mechanism to operate; the second driving mechanism is used for driving the second conveying mechanism to operate. The sorting device is additionally arranged, on one hand, the number of the basket transmission lines and the number of the AGV devices in butt joint are reduced to reduce cost, and on the other hand, silicon wafer baskets conveyed by the basket lifting mechanism can be distributed to the basket transmission lines with the small number, so that the number of the AGV devices in butt joint is consistent.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic equipment technology, specifically to a sorting device for silicon wafer baskets. Background Technology

[0002] Silicon wafer baskets, also known as silicon wafer loading frames, are used for the storage and transportation of silicon wafers. Typically, silicon wafers are loaded into baskets and then transferred, loaded, and unloaded along with the baskets.

[0003] Currently, silicon wafer baskets are loaded and unloaded using basket lifting mechanisms, and then transported via connecting basket conveyor lines. Typically, one basket lifting mechanism corresponds to one basket conveyor line. As the number of silicon wafer baskets to be transported increases, more one-to-one basket lifting mechanisms and basket conveyor lines are needed to increase the transport capacity, thus increasing equipment costs. Furthermore, after the silicon wafer baskets have passed through the basket conveyor lines, AGV (Automated Guided Vehicle) equipment is required to connect and transport them. However, currently used AGV equipment requires that the number of baskets in the two connecting channels be consistent. But since the silicon wafer baskets are transported from two independent basket lifting mechanisms at the front end, the number of baskets entering the basket conveyor line at each lifting mechanism becomes inconsistent, triggering AGV alarms, causing the entire system to stop, and ultimately affecting overall production capacity. Utility Model Content

[0004] This invention addresses the problem of inconsistent quantities of silicon wafer baskets delivered to the basket conveyor line by independent basket lifting mechanisms during AGV docking, leading to equipment alarms and shutdowns and impacting overall production capacity. It provides a silicon wafer basket sorting device that adds a sorting mechanism between the basket lifting mechanism and the basket conveyor line. This reduces costs by decreasing the number of basket conveyor lines and docking AGVs, and also distributes the silicon wafer baskets delivered from the basket lifting mechanism to the fewer basket conveyor lines, ensuring a consistent number of AGV dockings.

[0005] The technical solution adopted in this utility model is:

[0006] A silicon wafer sorting device for basket sorting is provided, comprising:

[0007] A support frame is provided with a guide rail, on which a slider is slidably connected. A fixed frame is located at the top of the slider, and a first transition hole is formed at the bottom of the fixed frame. A conveying mechanism assembly includes a first conveying mechanism and a second conveying mechanism. The first conveying mechanism is located at the inner bottom of the fixed frame and is used to convey the silicon wafer basket. The second conveying mechanism is located on the guide rail and is used to drive the slider to slide. The conveying direction of the second conveying mechanism is perpendicular to the conveying direction of the first conveying mechanism. A drive mechanism assembly includes a first drive mechanism and a second drive mechanism. The first drive mechanism is located at the outer bottom of the fixed frame and is connected to the first conveying mechanism through the first transition hole, and is used to drive the first conveying mechanism. The second drive mechanism is located at one end of the guide rail and is used to drive the second conveying mechanism.

[0008] Optionally, the two ends of the guide rail are respectively provided with first fixing plates located on the support frame; one of the first fixing plates is provided with a first laser sensor and is the transmitting end of the first laser sensor, and the other first fixing plate is provided with the receiving end of the first laser sensor.

[0009] Optionally, each first fixed plate is also provided with a second laser sensor; the inner bottom of the fixed frame is symmetrically provided with mirror panels, the axis of symmetry between the two mirror panels is perpendicular to the conveying direction of the second conveying mechanism, and the two mirror panels are respectively used to reflect the laser beam emitted by the second laser sensor.

[0010] Optionally, each first fixed plate is provided with a first sliding groove and a second sliding groove, the first sliding groove being located above the second sliding groove, the first laser sensor being slidably connected to the first fixed plate through the first sliding groove, and the second laser sensor being slidably connected to the first fixed plate through the second sliding groove.

[0011] Optionally, the inner bottom of the fixed frame is also provided with two support plates, which are located at both ends of the first conveying mechanism; one support plate is provided with a third laser sensor and is the transmitting end of the third laser sensor, and the other support plate is provided with a receiving end of the third laser sensor.

[0012] Optionally, the fixing frame has multiple clamping components inside for clamping and fixing the silicon wafer basket.

[0013] Optionally, the bottom of the guide rail is provided with multiple base plates, each base plate has multiple adjustment holes, and each adjustment hole is threaded with an adjustment screw for adjusting the height of the guide rail.

[0014] Optionally, a support block is provided at the bottom of the fixed frame, and a support rod is provided at the top of the support block. Rollers are fitted onto the support rod to assist in conveying the silicon wafer basket.

[0015] Optionally, a second fixing plate is provided at the bottom of the fixing frame, and a tank chain distributed along the conveying direction of the second conveying mechanism is provided on the second fixing plate, and a third fixing plate is provided at the other end of the tank chain.

[0016] Optionally, the fixing frame has internal reinforcing ribs.

[0017] The beneficial effects of this utility model are:

[0018] A sorting device was added between the basket lifting mechanism and the basket conveyor line. When the silicon wafer basket moves from the basket lifting mechanism toward the inside of the fixed frame, the first drive mechanism on the fixed frame drives the first conveyor mechanism to transport the silicon wafer basket into the fixed frame. Then, the second drive mechanism drives the second conveyor mechanism to run, causing the slider to slide along the length of the guide rail. During the sliding process, the fixed frame on the slider also moves with the slider. During this process, if there is a section on the basket conveyor line with a small number of silicon wafer baskets, the slider moves to a position closer to that section. On the side of the basket conveyor line with a smaller quantity, the first drive mechanism drives the first conveying mechanism to transport the silicon wafer baskets in the fixed frame to the basket conveyor line, completing the distribution of silicon wafer baskets. Compared with the previous one-to-one basket lifting mechanism and basket conveyor line, the number of devices is greatly reduced. In addition, compared with the problem of inconsistent AGV equipment docking caused by one-to-one silicon wafer basket transportation, the silicon wafer baskets can also be sorted to the basket conveyor line with a smaller quantity by the sorting device, so as to balance the number of silicon wafer baskets docked by the AGV equipment on the two basket conveyor lines. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 Axonometric drawing of a silicon wafer sorting device for baskets. Figure 1 ;

[0021] Figure 2 This is the front view of the guide rail;

[0022] Figure 3 An isometric view of a fixed frame;

[0023] Figure 4 This is the front view of the fixed frame;

[0024] Figure 5 The left view of the fixed frame;

[0025] Figure 6 The right view of the fixed frame;

[0026] Figure 7Axonometric drawing of a silicon wafer sorting device for baskets. Figure 2 .

[0027] Figure label:

[0028] 1-Support frame, 10-First fixed plate, 11-First slide rail, 12-Second slide rail, 13-First laser sensor, 14-Second laser sensor, 15-Laser beam, 2-Fixed frame, 20-Second drive mechanism, 21-Second transmission mechanism, 22-First transition hole, 23-Second transition hole, 24-Lifting cylinder, 240-First clamping arm, 25-First cylinder, 250-Second clamping arm, 251-Baffle, 26-Second cylinder, 260-Third clamping arm, 27-Support plate, 270-Third laser sensor, 28-Support block, 280-Support rod, 281-Roller, 29-Mirror panel, 3-Guide rail, 30-Slider, 31-Second drive mechanism, 32-Second transmission mechanism, 33-Base plate, 4-Tank chain, 40-Second fixed plate, 41-Third fixed plate, 5-Reinforcing plate. Detailed Implementation

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this invention.

[0031] The embodiments of the utility model will now be described in detail with reference to the accompanying drawings.

[0032] Example

[0033] like Figure 1 and Figure 2 As shown, this embodiment provides a silicon wafer basket sorting device, including:

[0034] The support frame 1 is provided with a guide rail 3, and a slider 30 is slidably connected to the guide rail 3. A fixed frame 2 is provided on the top of the slider 30, and a first transition hole 22 is provided on the bottom of the fixed frame 2.

[0035] The conveying mechanism group includes a first conveying mechanism and a second conveying mechanism 21. The first conveying mechanism is located at the bottom of the fixed frame 2 and is used to convey the silicon wafer basket. The second conveying mechanism 21 is located on the guide rail 3 and is used to drive the slider 30 to slide. The conveying direction of the second conveying mechanism 21 is perpendicular to the conveying direction of the first conveying mechanism.

[0036] The drive mechanism assembly includes a first drive mechanism and a second drive mechanism 20. The first drive mechanism is located at the bottom of the fixed frame 2 and is connected to the first transmission mechanism through the first transition hole 22, and is used to drive the first transmission mechanism to run. The second drive mechanism 20 is located at one end of the guide rail 3 and is used to drive the second transmission mechanism 21 to run.

[0037] Specifically, in addition to supporting the guide rail 3 and the various mechanical components on the guide rail 3, the support frame 1 also supports other process equipment such as the flower basket lifting mechanism (not shown in the figure), the flower basket transmission line (not shown in the figure), etc.

[0038] The first conveying mechanism is a belt conveyor, and there are two of them. The two belt conveyors operate synchronously through an identical rotating shaft. The second conveying mechanism 21 is a screw and nut mechanism located inside the guide rail 3. The first driving mechanism and the second driving mechanism 20 are respectively a first motor and a second motor. The first motor is located on the outer bottom of the fixed frame 2, and the second motor is located on the outer wall of one end of the guide rail 3. A pulley is installed on the output shaft of the first motor, and it operates synchronously with one of the belt conveyors in the first conveying mechanism through belt transmission. It is worth noting that since the first conveyor is located on the inner bottom of the fixed frame 2 and the first motor is located on the outer bottom of the fixed frame 2, the belt needs to pass through the first transition hole 22 to facilitate the transmission between the first motor and the first driving mechanism. The connection method between the second motor and the screw and nut mechanism is a conventional technique for those skilled in the art, and will not be described in detail here. It is only necessary to ensure that when the second motor is running, the slider 30 can slide back and forth along the length of the guide rail 3 under the drive of the screw and nut mechanism.

[0039] In use, the first drive mechanism drives the first conveying mechanism through the first transition hole 22 on the fixed frame 2. The operation of the first conveying mechanism can transport the silicon wafer baskets on the basket lifting mechanism into the interior of the fixed frame 2, so that the silicon wafer baskets can be subsequently transported to the required basket conveyor line. The second drive mechanism 20 drives the second conveying mechanism 21. The operation of the second conveying mechanism 21 can move the slider 30, thereby moving the fixed frame 2 along the length direction of the guide rail 3. At this time, the fixed frame 2 can transport the silicon wafer baskets to the basket conveyor line with fewer baskets according to the actual situation, so as to balance the number of silicon wafer baskets on multiple basket conveyor lines.

[0040] In the above embodiments, when the sorting device composed of guide rail 3, slider 30, fixed frame 2, conveying mechanism group and driving mechanism group is used in conjunction with flower basket lifting mechanism and flower basket transmission line, the number of flower basket lifting mechanism and flower basket transmission line previously required to be one-to-one can be greatly reduced. Specifically, the number of flower basket lifting mechanism does not need to be reduced, only the number of flower basket transmission line can be reduced to one group of two, which greatly reduces the cost of the equipment and does not reduce the conveying efficiency of silicon wafer flower basket.

[0041] In one embodiment, such as Figure 1 As shown, the guide rail 3 has a first fixing plate 10 located on the support frame 1 at its two ends; one of the first fixing plates 10 is provided with a first laser sensor 13 and is the transmitting end of the first laser sensor 13, and the other first fixing plate 10 is provided with a receiving end of the first laser sensor 13.

[0042] Specifically, there are two first laser sensors 13, located at opposite ends of the first fixed plate 10. One first laser sensor 13 is positioned near the basket lifting mechanism, while the other second laser sensor 14 is positioned near the basket transmission line. When the silicon wafer basket enters the fixed frame 2 from the basket lifting mechanism, it first blocks the laser beam 15 emitted by the transmitter of the first laser sensor 13 to the receiver on the other end of the first fixed plate 10. The receiver then transmits the signal to the first drive mechanism. Since it takes a certain amount of time for the silicon wafer basket to fully enter the fixed frame 2, the first drive mechanism stops operating after this time to prevent the first transmission mechanism from operating continuously and to transport the silicon wafer basket to the basket transmission line before it needs to enter the basket transmission line. When the silicon wafer basket needs to leave, the control terminal transmits a signal to the first drive mechanism, causing the first drive mechanism to run and drive the first conveyor mechanism. At this time, the silicon wafer basket on the first conveyor mechanism will block the laser beam 15 emitted by the first laser sensor 13 near one end of the basket's transmission line. The first laser sensor 13 will then transmit a signal to the first drive mechanism. After a certain period of time, the first drive mechanism will stop running.

[0043] In the above embodiment, when the silicon wafer basket is not moving within the fixed frame 2, the two first laser sensors 13 also have another beneficial effect: if a portion of the silicon wafer basket that is stopped moving within the fixed frame 2 extends beyond the fixed frame 2 when the first drive mechanism does not receive a signal from the control terminal, it will block the laser beam 15 emitted by one of the first laser sensors 13. This means that the silicon wafer basket is prone to shaking and falling when the slider 30 moves. Therefore, the first laser sensor 13 can also be used to detect whether the stopping position of the silicon wafer basket has a significant risk of shaking and falling. It is worth noting that the control terminal mentioned above is a conventional technical means for those skilled in the art, used to detect the received signals and provide corresponding operation signals to the corresponding components to assist in the transportation of the silicon wafer basket.

[0044] In one embodiment, such as Figure 1 As shown, each first fixed plate 10 is also provided with a second laser sensor 14; the inner bottom of the fixed frame 2 is symmetrically provided with mirror panels 29, the axis of symmetry between the two mirror panels 29 is perpendicular to the conveying direction of the second conveying mechanism 21, and the two mirror panels 29 are respectively used to reflect the laser beam 15 emitted by the second laser sensor 14.

[0045] In use, the second laser sensor 14 on the first fixed plate 10 emits a laser beam 15 through its transmitting end. The emission direction of the laser beam 15 is consistent with the movement direction of the slider 30. The laser beam 15 is reflected by the mirror panel 29 on the fixed frame 2, and the reflected laser beam 15 enters the receiving end of the second laser sensor 14 to detect whether there are foreign objects on the guide rail 3. When there are foreign objects on the guide rail 3, the laser beam 15 emitted by the second laser sensor 14 will be blocked by the foreign objects. The receiving end of the second laser sensor 14 will not receive a signal and will send a signal to the second drive mechanism to stop the operation of the second drive mechanism 20. This will stop the slider 30 from moving on the guide rail 3, preventing foreign objects from affecting the operation of the overall equipment. The second drive mechanism 20 will continue to operate after the foreign objects on the guide rail 3 are cleared.

[0046] In one embodiment, such as Figure 1 As shown, each first fixed plate 10 is provided with a first sliding groove 11 and a second sliding groove 12. The first sliding groove 11 is located above the second sliding groove 12. The first laser sensor 13 is slidably connected to the first fixed plate 10 through the first sliding groove 11, and the second laser sensor 14 is slidably connected to the first fixed plate 10 through the second sliding groove 12.

[0047] In use, the first laser sensor 13 can be slidably adjusted on the first fixed plate 10 via the first slide groove 11 to adapt to detecting the position of silicon wafer baskets of different sizes within the fixed frame 2. Similarly, the second laser sensor 14 is slidably adjusted on the second fixed plate 40 via the second slide groove 12. The purpose of the second slide groove 12 being lower than the first slide groove 11 is to avoid the required mirror panel 29 being too high, which would affect the movement of the silicon wafer basket within the fixed frame 2.

[0048] In one embodiment, such as Figure 3 and Figure 4 As shown, the bottom of the fixed frame 2 is also provided with two support plates 27, which are located at both ends of the first conveying mechanism; one of the support plates 27 is provided with a third laser sensor 270 and is the transmitting end of the third laser sensor 270, and the other support plate 27 is provided with a receiving end of the third laser sensor 270.

[0049] In use, the emitting end of the third laser sensor 270 emits a laser beam 15 toward the receiving end. When the silicon wafer basket enters the fixed frame 2 from the basket lifting mechanism, it is driven by the first conveying mechanism in the fixed frame 2. When the silicon wafer basket passes the laser beam 15 between the emitting end and the receiving end of the third laser sensor 270, the receiving end of the third laser sensor 270 transmits a signal to the second driving mechanism, causing the first driving mechanism to stop running, thereby stopping the first conveying mechanism and preventing the silicon wafer basket from being damaged if the first conveying mechanism continues to transport the silicon wafer basket.

[0050] In one embodiment, such as Figure 3-6 As shown, the inside of the fixing frame 2 is provided with multiple clamping components for clamping and fixing the silicon wafer basket.

[0051] The clamping assembly is divided into three groups. The first group of clamping assemblies is located at the bottom inner part of the fixed frame 2 and consists of a lifting cylinder 24 and a first clamping arm 240. Specifically, a second transition hole 23 is opened at the bottom of the fixed frame 2, and the lifting cylinder 24 is located in the second transition hole 23 and connected to the inner wall of the fixed frame 2 within the second transition hole 23. The purpose is to reduce the working height of the lifting cylinder 24. The first clamping arm 240 is set on the working end of the lifting cylinder 24. The first clamping arm 240 is L-shaped and is used to limit the position of the silicon wafer basket entering the first conveying mechanism for transport. This prevents the silicon wafer basket from shifting too much within the fixed frame 2 due to the continuous operation of the first conveying mechanism before entering the basket transport line, which would affect the subsequent transport of the silicon wafer basket.

[0052] The second clamping assembly is located on the inner wall of the fixed frame 2, near the inner top end of the fixed frame 2. It consists of a first cylinder 25, a second clamping arm 250, and a baffle 251. The second clamping arm 250 is located on the working end of the first cylinder 25. The baffle 251 is located on the inner top of the fixed frame 2, near the inner wall of the fixed frame 2 opposite to the first cylinder 25. The piston extension direction of the first cylinder 25 is consistent with the movement direction of the slider 30, and is used to apply clamping force to the upper part of the silicon wafer basket. Specifically, when the silicon wafer basket enters the fixed frame 2, the first cylinder 25 in the second clamping assembly operates, so that the working end of the first cylinder 25 cooperates with the baffle 251 to limit and clamp the silicon wafer basket.

[0053] The third clamping assembly is located on the inner wall of the fixed frame 2, near the bottom of the inner end of the fixed frame 2. It consists of a second cylinder 26 and two third clamping arms 260, located at opposite ends of the first conveying mechanism. One third clamping arm 260 is positioned on the working end of the second cylinder 26, while the other is positioned on the support plate 27. Together with the third clamping arm 260 on the working end of the second cylinder 26, they clamp the silicon wafer basket. The clamping direction of the third clamping assembly is the same as that of the second clamping assembly. The second clamping assembly clamps the upper part of the silicon wafer basket, while the third clamping assembly clamps the lower part of the silicon wafer basket.

[0054] It is worth noting that in the above embodiments, when the first cylinder 25 and the second cylinder 26 are not running, the clamping distance between the second clamping arm 250 and the baffle 251 and the clamping distance between the two third clamping arms 260 must be sufficient to allow the silicon wafer basket to pass through smoothly.

[0055] In one embodiment, such as Figure 1 and Figure 2 As shown, the bottom of the guide rail 3 is provided with multiple base plates 33, each base plate 33 is provided with multiple adjustment holes, and each adjustment hole is threaded with an adjustment screw for adjusting the height of the guide rail 3.

[0056] In use, multiple base plates 33 are spaced apart along the length of the guide rail 3 on its outer bottom. Each base plate 33 is detachably connected to the guide rail 3, such as by threaded connection. Each base plate 33 is fixed to the support frame 1 through a detachable connection to achieve the effect of fixing the guide rail 3 and preventing the guide rail 3 from shaking during operation, which would affect the conveying of the silicon wafer basket. Each base plate 33 is wider than the guide rail 3. The extra part of the base plate 33 is provided with multiple adjustment holes, and each adjustment hole contains an adjustment screw. This allows the base plate 33 to be connected to the support frame 1 through the adjustment screw, and also allows the height of the guide rail 3 to be adjusted to meet the actual conveying requirements on site.

[0057] In one embodiment, such as Figure 3 and Figure 4 As shown, the bottom of the fixed frame 2 is provided with a support block 28, the top of the support block 28 is provided with a support rod 280, and a roller 281 is sleeved on the support rod 280 for assisting in conveying the silicon wafer basket.

[0058] In use, there are four support blocks 28, divided into two groups of two. Both groups of support blocks 28 are located on the fixed frame 2, and are respectively close to the input and output ends of the first conveying mechanism. The two support blocks 28 in each group are located on the fixed frame 2 at both ends of the lifting cylinder 24, and the support rod 280 is set on the opposite surface of the two support blocks 28, and the support rod 280 does not rotate relative to the two support blocks 28. The roller 281 is sleeved on the support rod 280, so that the roller 281 can rotate on the support rod 280. The purpose is that when the silicon wafer basket moves in and out of the fixed frame 2, the contact area between the first conveying mechanism and the silicon wafer basket is small, which may cause the silicon wafer basket to move in and out of the fixed frame 2 unsmoothly. Therefore, in order to facilitate the transport of the silicon wafer basket, the roller 281 is added to assist the silicon wafer basket in moving in and out of the fixed frame 2 smoothly.

[0059] In one embodiment, such as Figure 7 As shown, the bottom of the fixed frame 2 is provided with a second fixed plate 40, and the second fixed plate 40 is provided with a tank chain 4 distributed along the conveying direction of the second conveying mechanism 21. The other end of the tank chain 4 is provided with a third fixed plate 41.

[0060] Both the second fixing plate 40 and the third fixing plate 41 are L-shaped plates. The second fixing plate 40 is fixed to the outer bottom of the fixing frame 2 by a threaded connection, and the third fixing plate 41 is fixed to the support frame 1 by a threaded connection. Both ends of the tank chain 4 are connected to the second fixing plate 40 and the third fixing plate 41 by threaded connections. The purpose of this is that when the slider 30 slides on the guide rail 3, the air pipes and cables used in various mechanisms within the sorting device can be centrally stored inside the tank chain 4, which protects and guides the air pipes and cables.

[0061] In one embodiment, such as Figure 3 As shown, the interior of the fixed frame 2 is equipped with reinforcing ribs.

[0062] In use, a reinforcing rib is provided on one of the inner walls of the fixed frame 2. Specifically, the reinforcing rib is a reinforcing plate 5, which is attached to the inner wall of the fixed frame 2 by means of bolt connection. The top and bottom of the reinforcing plate 5 are also in close contact with the inner top and inner bottom of the fixed frame 2, respectively, to enhance the support stability of the fixed frame 2.

[0063] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Without conflict, the embodiments and features described in the embodiments of this application can be arbitrarily combined with each other. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A sorting device for silicon wafer baskets, characterized in that, include: A support frame is provided with a guide rail, on which a slider is slidably connected. A fixed frame is provided at the top of the slider, and a first transition hole is provided at the bottom of the fixed frame. A conveying mechanism assembly includes a first conveying mechanism and a second conveying mechanism. The first conveying mechanism is located at the inner bottom of the fixed frame and is used to convey silicon wafer baskets. The second conveying mechanism is located on the guide rail and is used to drive the slider to slide. The conveying direction of the second conveying mechanism is perpendicular to the conveying direction of the first conveying mechanism. A driving mechanism assembly includes a first driving mechanism and a second driving mechanism. The first driving mechanism is located at the outer bottom of the fixed frame and is connected to the first conveying mechanism through the first transition hole, and is used to drive the first conveying mechanism to operate. The second driving mechanism is located at one end of the guide rail and is used to drive the second conveying mechanism to operate.

2. The silicon wafer basket sorting device according to claim 1, characterized in that, The guide rail has a first fixing plate on the support frame at each end; one of the first fixing plates is equipped with a first laser sensor and is the transmitting end of the first laser sensor, and the other first fixing plate is equipped with the receiving end of the first laser sensor.

3. The silicon wafer basket sorting device according to claim 2, characterized in that, Each of the first fixed plates is also provided with a second laser sensor; the inner bottom of the fixed frame is symmetrically provided with mirror panels, the axis of symmetry between the two mirror panels is perpendicular to the conveying direction of the second conveying mechanism, and the two mirror panels are respectively used to reflect the laser beam emitted by the second laser sensor.

4. The silicon wafer basket sorting device according to claim 3, characterized in that, Each of the first fixed plates is provided with a first sliding groove and a second sliding groove. The first sliding groove is located above the second sliding groove. The first laser sensor is slidably connected to the first fixed plate through the first sliding groove, and the second laser sensor is slidably connected to the first fixed plate through the second sliding groove.

5. The silicon wafer basket sorting device according to claim 3, characterized in that, The inner bottom of the fixed frame is also provided with two support plates, which are located at both ends of the first conveying mechanism; one of the support plates is provided with a third laser sensor and is the transmitting end of the third laser sensor, and the other support plate is provided with the receiving end of the third laser sensor.

6. The silicon wafer basket sorting device according to claim 4 or 5, characterized in that, The fixed frame is equipped with multiple clamping components inside for clamping and fixing the silicon wafer basket.

7. The silicon wafer basket sorting device according to claim 6, characterized in that, The guide rail has multiple base plates on its outer bottom, and each base plate has multiple adjustment holes. Each adjustment hole is threaded with an adjustment screw for adjusting the height of the guide rail.

8. The silicon wafer basket sorting device according to claim 6, characterized in that, The bottom of the fixed frame is provided with a support block, the top of the support block is provided with a support rod, and a roller is sleeved on the support rod to assist in conveying the silicon wafer basket.

9. The silicon wafer sorting device for baskets according to claim 6, characterized in that, The bottom of the fixed frame is provided with a second fixed plate, and the second fixed plate is provided with a tank chain distributed along the conveying direction of the second conveying mechanism. The other end of the tank chain is provided with a third fixed plate.

10. The silicon wafer basket sorting device according to claim 6, characterized in that, The fixed frame has reinforcing ribs inside.

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