Chip packaging body conveying and collecting device

Abstract

The utility model discloses a chip packaging body conveying and collecting device which comprises a bottom plate, one side of the outer wall of the top of the bottom plate is provided with a mounting seat through bolts, the top of the mounting seat is provided with a shunting assembly, and the other side of the outer wall of the top of the bottom plate is provided with a detection assembly. The detection assembly comprises a base, mounting grooves are formed in the two sides of the outer wall of the top of the base, pressure sensors are mounted on the inner walls of the bottoms of the mounting grooves through bolts, and placement seats attached to the pressure sensors are placed in the mounting grooves. Through the arranged detection assembly, when the chip packaging bodies fall into the storage box, the storage box can apply certain pressure to the placement base, by means of the structural design, the device can accurately detect the chip packaging bodies reaching the specified weight number, meanwhile, through cooperation of a motor and a rotating plate, the detection accuracy is improved, and the detection efficiency is improved. The device can be used for efficiently collecting and processing chip packaging bodies with specified weights.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip package body technical field especially, relates to a chip package body conveying collection device. BACKGROUND

[0002] Chip package body is the process that the completed semiconductor chip (bare chip or wafer) is encapsulated in a protective shell through a series of process steps to provide physical protection, electrical connection and heat management, and the main purpose of encapsulation is to ensure that the chip can work stably and reliably in practical application, and it is convenient to connect with other circuits or systems, and the package not only protects the chip from the influence of the external environment, but also bears multiple functions such as signal transmission, heat dissipation and mechanical support, and is an indispensable key link in the semiconductor industry chain.

[0003] However, in the commonly seen device in the market, the material is directly conveyed by the conveying belt during operation, and this device has a defect in actual use, that is, it cannot effectively detect the classified and collected chip package body, but this point does not affect the use and popularization of the device, therefore, a chip package body conveying collection device is urgently needed to solve the above problems. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in the prior art and provides a chip package body conveying collection device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A chip package body conveying collection device, comprising a bottom plate, a mounting seat is installed on one side of the top outer wall of the bottom plate through bolts, a shunt assembly is arranged on the top of the mounting seat, and a detection assembly is arranged on the other side of the top outer wall of the bottom plate.

[0007] The detection assembly comprises a base, installation grooves are formed on the top outer wall of the base on both sides, pressure sensors are installed on the bottom inner wall of the installation groove through bolts, a placing seat that is combined with the pressure sensor is placed in the installation groove, a sliding groove is formed on the top outer wall of the placing seat, a sliding seat is arranged in the sliding groove, and a storage seat is placed on the top outer wall of the sliding seat.

[0008] Preferably, the base is installed on one side of the top outer wall of the bottom plate through bolts, and the placing seat is slidingly connected to the inside of the sliding groove.

[0009] Preferably, the shunt assembly comprises a top seat, an equipment groove is formed on one side of the top inner wall of the top seat, and the equipment groove is in a horizontal structure.

[0010] Preferably, multiple electric cylinders are bolted to the top inner wall of the equipment slot, and a connecting seat is bolted to the top inner wall of the top seat. The output end of the multiple electric cylinders is bolted to a push plate that is slidably connected to the inside of the connecting seat.

[0011] Preferably, a rotating plate is movably mounted on one side of the connecting seat via a rotating shaft, and a motor is bolted to the top outer wall of one side of the connecting seat. The motor is connected to the rotating plate via a coupling.

[0012] Preferably, guide seats are bolted to the outer walls on both sides of the top seat, and the guide seats are bolted to the side away from the connecting seat.

[0013] Preferably, the top seat is equipped with an electric conveyor belt located directly below the connecting seat.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. With the set detection components, when the chip package falls into the storage box, the storage box will apply a certain pressure to the placement seat. With this structural design, the device can accurately detect the number of chip packages that reach the specified weight. At the same time, through the coordinated operation of the motor and the rotating plate, the device can efficiently collect and process chip packages of the specified weight.

[0016] 2. Through the set diversion component, when the motor is started, the motor can drive the rotating plate to rotate. During the rotation of the rotating plate, it will move accordingly. This unique structural design enables the device to quickly and accurately transfer chip packages of a specified weight to the inside of another storage seat when one storage seat collects them. At the same time, through the ingenious combination of multiple electric cylinders and push plates, the device can further improve the precise collection function of chip packages. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a chip package conveying and collecting device proposed in this utility model;

[0018] Figure 2 This is a schematic diagram of the planar structure of the detection component of a chip package conveying and collecting device proposed in this utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the equipment slot of a chip package conveying and collecting device proposed in this utility model;

[0020] Figure 4 This is a schematic diagram of the rotating plate and guide seat structure of a chip package conveying and collecting device proposed in this utility model;

[0021] Figure 5 This is a schematic diagram of the top seat of a chip package conveying and collecting device proposed in this utility model.

[0022] In the diagram: 1. Base plate, 2. Mounting seat, 3. Detection component, 31. Base, 32. Mounting slot, 33. Pressure sensor, 34. Placement seat, 35. Slide rail, 36. Slide block, 37. Storage seat, 4. Diverting component, 41. Top seat, 42. Equipment slot, 43. Multi-section electric cylinder, 44. Push plate, 45. Connecting seat, 46. Rotating plate, 47. Motor, 48. Guide seat, 5. Electric conveyor belt. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Please also see Figures 1 to 4 A chip package conveying and collecting device includes a base plate 1, a mounting base 2 is bolted to one side of the top outer wall of the base plate 1, a diversion component 4 is provided on the top of the mounting base 2, and a detection component 3 is provided on the other side of the top outer wall of the base plate 1.

[0027] The detection component 3 includes a base 31. Mounting grooves 32 are formed on both sides of the top outer wall of the base 31. A pressure sensor 33 is bolted to the bottom inner wall of the mounting groove 32. A placement seat 34, which is in contact with the pressure sensor 33, is placed inside the mounting groove 32. A sliding groove 35 is formed on the top outer wall of the placement seat 34. A slide block 36 is provided inside the sliding groove 35. A storage seat 37 is placed on the top outer wall of the slide block 36. When material falls into the storage seat 37, the weight of the storage seat 37 increases, transmitting pressure to the slide block 36. The slide block 36 can transmit the pressure to the placement seat 34, which in turn transmits the pressure to the pressure sensor 33. The pressure sensor 33 detects the weight of the chip package. The base 31 is bolted to one side of the top outer wall of the base plate 1. The placement seat 34 is slidably connected to the inside of the sliding groove 35. When the slide block 36 is pulled, it can slide inside the sliding groove 35.

[0028] See Figure 3 , Figure 4 and Figure 5 The diversion assembly 4 includes a top seat 41. A device slot 42 is formed on one side of the inner top wall of the top seat 41. The device slot 42 is horizontally distributed and provides an installation position for the multi-section electric cylinder 43, ensuring that the multi-section electric cylinder 43 can only operate inside the device slot 42. The multi-section electric cylinder 43 is bolted to the inner top wall of the device slot 42. A connecting seat 45 is bolted to the inner top wall of the top seat 41. A push plate 44, which is slidably connected to the inside of the connecting seat 45, is bolted to the output end of the multi-section electric cylinder 43. When the multi-section electric cylinder 43 is activated, it operates inside the device slot 42, and during its operation, it drives the push plate 44. The push plate 44 slides inside the connecting seat 45. A rotating plate 46 is movably mounted on one side of the connecting seat 45 via a rotating shaft. A motor 47 is bolted to the top outer wall of one side of the connecting seat 45. The motor 47 is connected to the rotating plate 46 via a coupling. When the motor 47 is started, it will drive the rotating plate 46 to rotate using the coupling, so that the chip package can be quickly replaced after collection. Guide seats 48 are bolted to the outer walls of both sides of the top seat 41. The guide seats 48 are bolted to the side away from the connecting seat 45. The guide seats 48 can prevent the chip package from getting stuck on the side adjacent to the rotating plate 46 and the top seat 41.

[0029] See Figure 1 and Figure 4 An electric conveyor belt 5 is installed inside the top seat 41. The electric conveyor belt 5 is located directly below the connecting seat 45. When the electric conveyor belt 5 is started, it can drive the material to be conveyed.

[0030] The following are several preferred embodiments or application embodiments to help those skilled in the art better understand the technical content of this utility model and the technical contributions made by this utility model compared with the prior art:

[0031] Example 1

[0032] A chip package conveying and collecting device includes a base plate 1, a mounting base 2 is bolted to one side of the top outer wall of the base plate 1, a diversion component 4 is provided on the top of the mounting base 2, and a detection component 3 is provided on the other side of the top outer wall of the base plate 1.

[0033] The detection component 3 includes a base 31. Mounting grooves 32 are formed on both sides of the top outer wall of the base 31. A pressure sensor 33 is mounted on the bottom inner wall of the mounting groove 32 via bolts. A placement seat 34, which is in contact with the pressure sensor 33, is placed inside the mounting groove 32. A sliding groove 35 is formed on the top outer wall of the placement seat 34. A sliding block 36 is disposed inside the sliding groove 35. A storage seat 37 is placed on the top outer wall of the sliding block 36. When material falls into the storage seat 37, the weight of the storage seat 37 increases, transmitting pressure to the sliding block 36. The sliding block 36 can transmit the pressure to the placement seat 34, which in turn transmits the pressure to the pressure sensor 33. The pressure sensor 33 detects the weight of the chip package.

[0034] The base 31 is bolted to the top outer wall of the base plate 1. The placement seat 34 is slidably connected to the inside of the slide groove 35. When the slide seat 36 is pulled, it can slide inside the slide groove 35. The diversion assembly 4 includes a top seat 41. A device slot 42 is opened on one side of the top inner wall of the top seat 41. The device slot 42 is horizontally distributed and provides an installation position for the multi-section electric cylinder 43, so that the multi-section electric cylinder 43 can only operate inside the device slot 42. The multi-section electric cylinder 43 is bolted to the top inner wall of the device slot 42. A connecting seat 45 is bolted to the top inner wall of the top seat 41. The output end of the multi-section electric cylinder 43 is bolted to a push plate 44 slidably connected to the inside of the connecting seat 45. When the multi-section electric cylinder 43 is started, it will run inside the device slot 42 and drive the push plate during its operation. The push plate 44 moves up and down and slides inside the connecting seat 45. A rotating plate 46 is movably mounted on one side of the connecting seat 45 via a rotating shaft. A motor 47 is bolted to the top outer wall of one side of the connecting seat 45. The motor 47 is connected to the rotating plate 46 via a coupling. When the motor 47 is started, it will drive the rotating plate 46 to rotate using the coupling, so that the chip package can be quickly replaced after collection. Guide seats 48 are bolted to the outer walls of both sides of the top seat 41. The guide seats 48 are bolted to the side away from the connecting seat 45. The guide seats 48 can prevent the chip package from getting stuck on the side adjacent to the rotating plate 46 and the top seat 41. An electric conveyor belt 5 is installed inside the top seat 41. The electric conveyor belt 5 is located directly below the connecting seat 45. When the electric conveyor belt 5 is started, it can drive the material for conveying and processing.

[0035] Working principle: In use, the chip package is first placed on the surface of the electric conveyor belt 5. Then, by starting the electric conveyor belt 5, the chip package will move. When the chip package contacts the turntable 46, the chip package will move to one side of the connecting seat 45. During the continuous movement of the chip package, it will fall into the storage seat 37. As the chip package continues to fall, the weight of the storage seat 37 will increase, transmitting gravity to the slide 36. The slide 36 can then transmit gravity to the placement seat 34, which in turn transmits gravity to the pressure sensor 33. The pressure sensor 33 detects the weight of the chip package. When the weight of the chip package reaches a specified value, one of the multi-section electric cylinders 43 is activated and drives the push plate 44 to move downward. During the downward movement of the push plate 44, the push plate 44 will block the chip package. During the activation of the multi-section electric cylinder 43, the motor 47 will also be activated. The motor 47 will drive the rotating plate 46 to move, so that the rotating plate 46 is attached to the inner wall of the top seat 41 on the other side. Finally, by pulling the slide 36, the slide 36 can slide inside the slide groove 35, which makes it easier for the operator to take out the storage seat 37.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A chip package conveying and collecting device, comprising a base plate (1), characterized in that, A mounting base (2) is bolted to one side of the top outer wall of the base plate (1), a diversion component (4) is provided on the top of the mounting base (2), and a detection component (3) is provided on the other side of the top outer wall of the base plate (1). The detection component (3) includes a base (31), and mounting grooves (32) are provided on both sides of the top outer wall of the base (31). A pressure sensor (33) is installed on the bottom inner wall of the mounting groove (32) by bolts. A placement seat (34) that fits against the pressure sensor (33) is placed in the mounting groove (32). A sliding groove (35) is provided on the top outer wall of the placement seat (34). A sliding block (36) is provided inside the sliding groove (35). A storage seat (37) is placed on the top outer wall of the sliding block (36).

2. The chip package conveying and collecting device according to claim 1, characterized in that, The base (31) is bolted to the top outer wall of the base plate (1), and the placement seat (34) is slidably connected to the inside of the groove (35).

3. The chip package conveying and collecting device according to claim 1, characterized in that, The diversion component (4) includes a top seat (41), and a device slot (42) is provided on one side of the top inner wall of the top seat (41). The device slot (42) is distributed in a horizontal structure.

4. The chip package conveying and collecting device according to claim 3, characterized in that, Multiple electric cylinders (43) are bolted to the top inner wall of the equipment slot (42), and a connecting seat (45) is bolted to the top inner wall of the top seat (41). The output end of the multiple electric cylinders (43) is bolted to a push plate (44) that is slidably connected to the inside of the connecting seat (45).

5. A chip package conveying and collecting device according to claim 4, characterized in that, A rotating plate (46) is movably mounted on one side of the connecting seat (45) via a rotating shaft. A motor (47) is bolted to the top outer wall of one side of the connecting seat (45). The motor (47) is connected to the rotating plate (46) via a coupling.

6. The chip package conveying and collecting device according to claim 3, characterized in that, Guide seats (48) are bolted to the outer walls on both sides of the top seat (41), and the guide seats (48) are bolted to the side away from the connecting seat (45).

7. A chip package conveying and collecting device according to claim 3, characterized in that, An electric conveyor belt (5) is provided inside the top seat (41), and the electric conveyor belt (5) is located directly below the connecting seat (45).

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