Split type ceramic fragmentation plate
By using a split ceramic wafer plate design, a large-area adhesive surface and a locking support structure, the problem of loosening when clamping solar silicon wafers is solved, resulting in higher silicon wafer stability and reduced costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2026-04-07
AI Technical Summary
When existing ceramic wafer plates clamp solar silicon wafers, the bottom patch is prone to loosening due to the large force and heat, resulting in the silicon wafer falling off or getting scratched. In addition, the existing connection method is costly.
Design a split ceramic plate with a structure that uses a large-area second bonding surface and a locking support platform to engage with the chuck. The fixation and support of the patch are increased by the combination of elliptical through holes, bosses and grooves. Zirconia material is used to reduce costs.
It improves the stability of silicon wafer clamping, reduces loosening, lowers product costs, and enhances structural strength and ease of installation.
Smart Images
Figure CN224098134U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of solar silicon wafer clamping technology, specifically to a split ceramic wafer plate. Background Technology
[0002] In the production process of solar silicon wafers, the wafers need to go through processes such as cutting, polishing, and cleaning. Because solar silicon wafers are thin and brittle, they are very easy to be scratched or damaged during the displacement process. At this time, special clamps are needed for clamping and conveying. Ceramic wafer slitting plates are often used in conjunction with robotic arms to clamp and transfer solar silicon wafers, thereby reducing damage to the solar silicon wafers.
[0003] A ceramic wafer slab consists of a main body and two sets of identical wafers. The wafers are usually connected to the two sides of the main body by adhesive or thread. However, during the process of the ceramic wafer slab clamping the silicon wafer, the bottom wafer has to bear the weight of the silicon wafer itself. As a result, the bottom wafer is subjected to greater force than the top wafer. If the adhesive part of the wafer is heated too much, the bottom wafer will loosen under the weight and heat, resulting in a lack of firmness. This can lead to the solar silicon wafer falling off or getting scratched. Utility Model Content
[0004] The purpose of this invention is to solve the aforementioned problems in the existing technology.
[0005] To achieve the above objectives, this utility model can be implemented through the following technical solution: a split-type ceramic plate, comprising:
[0006] The main body has a bonding portion, which has a first adhesive surface and a second adhesive surface. The area of the second adhesive surface is larger than that of the first adhesive surface. A first through hole is provided on the bonding portion.
[0007] A first patch, the first patch abutting against the second adhesive surface;
[0008] The second patch abuts against the first adhesive surface;
[0009] Both the first patch and the second patch are provided with a second through hole;
[0010] The locking component includes a support platform and a chuck. The support platform passes through the first through hole and the second through hole and engages with the chuck to fix the first patch and the second patch onto the bonding portion.
[0011] In this embodiment of the utility model, both the first through hole and the second through hole are elliptical, and an elliptical extension is provided on the support platform, the elliptical extension cooperating with the first through hole and the second through hole.
[0012] In this embodiment of the utility model, an arc-shaped interface is provided on both the first adhesive surface and the second adhesive surface, and the arc-shaped interface abuts against the first patch or the second patch;
[0013] The bonding part has a notch or groove, which mates with the first patch or the second patch.
[0014] In this embodiment of the utility model, the notch is square, circular, triangular or trapezoidal, and at least one set of the notch is provided.
[0015] In this embodiment of the utility model, the first patch is provided with a first protrusion, and the second patch is provided with a second protrusion. The first protrusion and the second protrusion are engaged and abut against each other in the notch groove.
[0016] The height of the first boss is higher than that of the second boss.
[0017] In this embodiment of the utility model, both the first patch and the second patch have inclined portions at their ends, and the upper plane of the inclined portion of the first patch is flush with the upper plane of the inclined portion of the second patch.
[0018] In this embodiment of the utility model, the inclined portion is provided with an inclined surface, and the inclined surface of the first patch and the inclined surface of the second patch form an inclined angle, the angle of which ranges from 4° to 12°.
[0019] In this embodiment of the utility model, the chuck includes a support portion and a triangular portion connected in sequence, and the triangular portion is provided with a fitting surface that fits against the support platform.
[0020] In this embodiment of the utility model, the connection between the support portion and the triangular portion is provided with a groove.
[0021] In this embodiment of the utility model, a recessed platform is provided at the second through hole of both the first patch and the second patch.
[0022] Compared with the prior art, the advantages of this application are: when clamping and transferring solar silicon wafers, the first patch is placed at the bottom of the silicon wafer. Since the first patch has a larger bonding surface than the second patch and is connected to the main body through a locking member, the load-bearing capacity of the first patch is greater than that of the second patch. This improves the clamping and support effect on the silicon wafer during transportation and reduces the phenomenon of patch loosening. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the overall parts assembly in this utility model;
[0024] Figure 2 This is a schematic diagram of the exploded disassembly structure of the integral parts in this utility model;
[0025] Figure 3 This is a half-section planar schematic diagram of the overall parts assembly in this utility model;
[0026] Figure 4 This utility model Figure 3 A magnified view of a section at point A in the middle;
[0027] Figure 5 This is a schematic diagram of the structure of the first patch and the second patch being separated on the main body in Embodiment 2 of this utility model;
[0028] Figure 6 This is a plan view of the square notch groove in the bonding part of the main body of this utility model;
[0029] Figure 7 This is a plan view of the trapezoidal notch groove in the bonding part of the main body of this utility model;
[0030] Figure 8 This is a planar schematic diagram of the circular notch groove in the bonding part of the main body of this utility model;
[0031] Figure 9 This is a planar schematic diagram of the triangular notch groove in the bonding part of the main body of this utility model.
[0032] Explanation of reference numerals in the attached figures:
[0033] 1. Main body; 11. Adhesive part; 12. First through hole; 13. Notch groove; 14. First adhesive surface; 15. Arc-shaped interface; 16. Second adhesive surface; 2. Locking part; 21. Chuck; 211. Grinding boss; 22. Elliptical extension; 23. Support platform; 24. Support part; 25. Groove; 26. Triangular part; 27. Adhesive surface; 28. Glue filling gap; 3. First patch; 31. First boss; 4. Second patch; 41. Second boss; 51. Second through hole; 52. Recess; 53. Inclined part; 54. Upper plane; 55. Inclined surface; 56. Inclined angle. Detailed Implementation
[0034] The following are specific embodiments of the present invention, and the technical solution of the present invention will be further described in conjunction with the accompanying drawings.
[0035] like Figure 1-9 As shown, a split-type ceramic plate includes:
[0036] The main body 1 has a bonding part 11. The bonding part 11 has a first adhesive surface 14 and a second adhesive surface 16. The area of the second adhesive surface 16 is larger than that of the first adhesive surface 14. A first through hole 12 is provided on the bonding part 11.
[0037] First patch 3, first patch 3 abuts against second adhesive surface 16;
[0038] The second patch 4 abuts against the first adhesive surface 14;
[0039] Both the first patch 3 and the second patch 4 are provided with a second through hole 51;
[0040] The locking component 2 includes a support platform 23 and a chuck 21. The support platform 23 passes through the first through hole 12 and the second through hole 51 and engages with the chuck 21 so that the first patch 3 and the second patch are fixed on the bonding part 11.
[0041] Specifically, the main body 1 supports the first patch 3 and the second patch 4, both of which are 1.1mm thick, while the thickness of the bonding part 11 is 0.8mm, for a total assembly thickness of 3mm. The installation process is as follows: Adhesive is evenly applied to the inner surfaces of the first patch 3 and the second patch 4. The first patch 3 then abuts against the second bonding surface 16, and the second patch 4 abuts against the first bonding surface 14. After curing, the adhesive on the first through hole 12 and the second through hole 51 is removed. Then, the support platform 23 is passed through the first through hole 12 and the second through hole 51 and engaged with the chuck 21, thus completing the assembly of the ceramic wafer plate. This ceramic wafer plate improves the support effect for the solar silicon wafers and reduces loosening. Furthermore, the support platform 23 is riveted to the chuck 21 to fix the first patch 3 and the second patch 4 to the main body 1. After assembly, the chuck 21 will have polished bosses (such as...). Figure 4 As shown in the diagram, at this point, a grinding machine is needed to smooth it. Simultaneously, after the support platform 23 and the first patch 3 or the chuck 21 and the second patch 4 are installed, a certain gap will exist. This gap is filled with adhesive gap 28. Adhesive is filled into the adhesive gap 28, and after cooling and solidification, it improves the connection and fixing effect between the chuck 21 and the support platform 23. Furthermore, it should be further explained that the material of the ceramic segmented plate in this application is changed from the overall zirconium oxide material to zirconium oxide material for the first patch 3 and the second patch 4, while the remaining parts are printed with alumina material. Because the cost of zirconium oxide material is much higher than that of alumina material, this arrangement can greatly reduce the cost of the product without changing its strength. Secondly, the area of the second adhesive surface 16 on the bonding part 11 is larger than that of the first adhesive surface 14 on the bonding part 11, and the corresponding length of the first patch 3 is also longer than that of the second patch 4. This arrangement can increase the overall structural strength of the ceramic segmented plate.
[0042] As a further embodiment provided by this utility model, the first through hole 12 and the second through hole 51 are both elliptical, and the support platform 23 is provided with an elliptical extension 22. The elliptical extension 22 cooperates with the first through hole 12 and the second through hole 51, and the elliptical extension 22 plays a supporting role to support the first patch 3 and the second patch 4, so that the two are more firmly installed on the main body 1, and the first through hole 12 and the second through hole 51 are located on the same axis.
[0043] As a further embodiment of this utility model, both the first adhesive surface 14 and the second adhesive surface 16 are provided with arc-shaped interfaces 15. The arc-shaped interfaces 15 abut against the first patch 3 or the second patch 4. The bonding part 11 is provided with a notch 13. The notch 13 cooperates with the first patch 3 or the second patch 4. When adhesive is applied to the first patch 3 and the second patch 4, the two are bonded to the corresponding arc-shaped interfaces 15 one by one. Then, the patch is made to cooperate with the notch 13 along the arc-shaped interface 15. This improves the ease of installation and positioning effect, thereby reducing the phenomenon of uneven adhesive due to multiple assembly after the first patch 3 or the second patch 4 is misaligned.
[0044] As a further embodiment of this utility model, the notch 13 is square, round, triangular or trapezoidal, and at least one set of notch 13 is provided, and multiple notch 13 can also be provided, to facilitate the flow of adhesive, so that the first patch 3 and the second patch 4 are more firmly installed on the main body 1, and various different shapes and types of notch 13 can be used to accommodate patches of different sizes.
[0045] As a further embodiment of this utility model, a first protrusion 31 is provided on the first patch 3, and a second protrusion 41 is provided on the second patch 4. The first protrusion 31 and the second protrusion 41 are engaged in the notch groove 13 and abut against each other. The height of the first protrusion 31 is higher than that of the second protrusion 41, thereby improving the connection effect between the main body 1 and the second patch 4, and also restricting the movement direction of the first patch 3 and the second patch 4 relative to the main body 1, reducing the phenomenon of loosening of the first body and the second body.
[0046] As a further embodiment of this utility model, the ends of the first patch 3 and the second patch 4 are provided with inclined portions 53. The upper plane 54 of the inclined portion 53 of the first patch 3 is flush with the upper plane 54 of the inclined portion 53 of the second patch 4. Since the length of the first patch 3 is longer than that of the second patch 4, when the first patch 3 and the second patch 4 are fully assembled onto the bonding portion 11, the upper plane 54 of the first patch 3 is parallel to the upper plane 54 of the second patch 4, thereby facilitating the clamping of the solar silicon wafer.
[0047] As a further embodiment of this utility model, the inclined portion 53 is provided with an inclined surface 55, and the inclined surface 55 of the first patch 3 and the inclined surface 55 of the second patch 4 form an inclined angle 56, the angle range of the inclined angle 56 being 4° to 12°, and the inclined angle 56 is as follows: Figure 3 As shown in section E, when the ceramic wafer plate clamps the solar silicon wafer, the tilt angle 56 can quickly and without damaging the surface of the silicon wafer allow it to be inserted between the first patch 3 and the second patch 4. The range of the tilt angle 56 can accommodate different silicon wafers and provide different bonding and clamping areas.
[0048] As a further embodiment of this utility model, the chuck 21 includes a support portion 24 and a triangular portion 26 connected in sequence. The triangular portion 26 is provided with a mating surface 27 that fits against the support platform 23. The support portion 24 is cylindrical and plays a guiding role for the chuck 21, while the triangular portion 26 enables the chuck 21 to engage with the support platform 23 to complete the assembly and locking.
[0049] As a further embodiment of this utility model, a groove 25 is provided at the connection between the support portion 24 and the triangular portion 26. When the chuck 21 is installed onto the support platform 23, since the locking member 2 is made of plastic, the triangular portion 26 will deform and retract into the groove 25 during the installation process. When the triangular portion 26 is fully inserted into the support platform 23, it will unfold, thereby fixing the chuck 21 onto the support platform 23, thereby fixing the first patch 3 and the second patch 4 onto the mating portion 11.
[0050] As a further embodiment of this utility model, a recessed platform 52 is provided at the second through hole 51 of the first patch 3 and the second patch 4. The recessed platform 52 is circular and matches the frustum on the support platform 23 and the chuck 21. There is a small gap between the recessed platform 25 and the support platform 23 or the chuck 21. The gap can be filled with colloid to improve the connection firmness of the locking component.
[0051] The above-described technical solution of this utility model addresses the problem that existing technical solutions are too simplistic and provides a solution that is significantly different from existing technologies. The parts not covered in this application's technical solution are the same as or can be implemented using existing technologies, and will not be described in detail here.
[0052] The technical solutions in the above embodiments have clearly and completely described the content of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
Claims
1. A split-type ceramic sheet, characterized in that, include: The main body has a bonding portion, which has a first adhesive surface and a second adhesive surface. The area of the second adhesive surface is larger than that of the first adhesive surface. A first through hole is provided on the bonding portion. A first patch, the first patch abutting against the second adhesive surface; The second patch abuts against the first adhesive surface; Both the first patch and the second patch are provided with a second through hole; A locking component, comprising a support platform and a chuck, wherein the support platform passes through the first through hole and the second through hole and engages with the chuck to fix the first patch and the second patch onto the bonding portion.
2. The split-type ceramic plate according to claim 1, characterized in that, Both the first through hole and the second through hole are elliptical, and the support platform is provided with an elliptical extension, which cooperates with the first through hole and the second through hole.
3. A split-type ceramic plate according to claim 1, characterized in that, Both the first adhesive surface and the second adhesive surface are provided with arc-shaped interfaces, and the arc-shaped interfaces abut against the first patch or the second patch; The bonding part has a notch or groove, which mates with the first patch or the second patch.
4. A split-type ceramic plate according to claim 3, characterized in that, The notch or slot can be square, circular, triangular, or trapezoidal, and at least one set of the notch or slot can be provided.
5. A split-type ceramic plate according to claim 3, characterized in that, The first patch has a first protrusion, and the second patch has a second protrusion. The first protrusion and the second protrusion engage with each other in the notch or groove. The height of the first boss is higher than that of the second boss.
6. A split-type ceramic plate according to claim 1, characterized in that, Both the first patch and the second patch have inclined portions at their ends, and the upper plane of the inclined portion of the first patch is flush with the upper plane of the inclined portion of the second patch.
7. A split-type ceramic plate according to claim 6, characterized in that, The inclined portion is provided with an inclined surface, and the inclined surface of the first patch and the inclined surface of the second patch form an inclined angle, the angle of which ranges from 4° to 12°.
8. A split-type ceramic plate according to claim 1, characterized in that, The chuck includes a support portion and a triangular portion connected in sequence, and the triangular portion is provided with a mating surface that fits against the support platform.
9. A split-type ceramic plate according to claim 8, characterized in that, The connection between the support portion and the triangular portion is provided with a groove.
10. A split-type ceramic plate according to claim 1, characterized in that, Both the first patch and the second patch have recessed platforms at their second through holes.