Novel lead frame
By introducing a symmetrical left and right pin layout in the TSSOP packaging technology, the problem of signal path crossing is solved, enabling flexible and efficient switching between power and ground signals, and improving the performance of electronic products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-07
AI Technical Summary
In existing TSSOP packaging technology, the pin design leads to signal path intersections, which cannot meet the diverse needs of power and ground signal connections, thus affecting the performance optimization of electronic products.
A novel lead frame design is adopted, with left and right pins added to the left and right sides of the metal frame to connect to the chip, forming a symmetrical layout. Combined with highly conductive copper alloy material and precision stamping and etching process, it ensures the flexibility and efficiency of signal switching.
It enhances the signal transfer capability of the lead frame, avoids the risk of crossover lines, and enables flexible and efficient transfer of power and ground signals, meeting the diverse needs of complex circuits and improving the performance of electronic products.
Smart Images
Figure CN224098157U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to TSSOP packaging technical field especially relates to a novel lead frame. BACKGROUND
[0002] In the TSSOP packaging technical field, the existing TSSOP product framework adopts the design way of having the pin on the upper and lower two sides. With the continuous enrichment and complexification of electronic product function, the demand of customer to power signal and ground signal connection is increasingly diversified and fine. The traditional pin design exposes obvious limitation in the actual production application process, and in the complex circuit design, the upper and lower two side pins are difficult to avoid signal path intersection, leading to connection conflict, and the requirement of customer in power signal and ground signal connection cannot be fully satisfied, thereby further improving and optimizing the overall performance of electronic product, and a new design is urgently needed to improve this situation. SUMMARY
[0003] The utility model discloses a novel lead frame to solve the technical problems in the prior art.
[0004] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a novel lead frame, comprising: metal frame and chip;
[0005] The upper side and the lower side of the metal frame are provided with upper pins and lower pins connected with the chip;
[0006] The left side and the right side of the metal frame are provided with left pins and right pins connected with the chip.
[0007] As a further description of the above technical scheme:
[0008] The upper pin and the lower pin form symmetrical layout.
[0009] As a further description of the above technical scheme:
[0010] The left pin and the right pin form symmetrical layout.
[0011] The utility model has the advantages that: the novel lead frame provided by the utility model greatly enhances the signal switching capacity of the lead frame by adding left pins and right pins connected with the chip on the left side and the right side of the metal frame, avoids the risk of crossing lines, and compared with the traditional TSSOP product pin design, can more flexibly and efficiently realize the switching of power signal and ground signal. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 The utility model provides a novel lead frame structure schematic diagram.
[0013] Legend:
[0014] 1, metal frame; 2, chip; 3, upper pin; 4, lower pin; 5, left pin; 6, right pin. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor fall within the protection scope of the utility model.
[0016] Referring to Figure 1 The utility model provides an embodiment: a novel lead frame, comprising: metal frame 1 and chip 2,
[0017] The upper side and the lower side of the metal frame 1 are equipped with the upper pin 3 and the lower pin 4 connected with the chip 2.
[0018] The left side and the right side of the metal frame 1 are equipped with the left pin 5 and the right pin 6 connected with the chip 2.
[0019] The upper pin 3 and the lower pin 4 form symmetrical positions.
[0020] The left pin 5 and the right pin 6 form symmetrical positions.
[0021] In the novel lead frame disclosed by the utility model, the metal frame 1 selects copper alloy and other metal materials with high conductivity and excellent mechanical properties, and is processed by using advanced precision stamping and etching process. The design of the metal frame 1 follows strict size precision and structure stability requirements, and aims to build stable and adaptive bearing architecture for the chip 2 and the subsequent connected pins.
[0022] Chip 2, as the core electronic component of the entire lead frame, needs to be precisely placed in the pre-set position of the metal frame 1 through advanced semiconductor packaging technology. During this process, it is crucial to ensure reliable electrical and mechanical connections between chip 2 and metal frame 1. Through high-precision wire bonding technology or other reliable connection methods verified by the industry, the upper pins 3 and lower pins 4 of the metal frame 1 are connected to the chip 2 respectively. The layout of the upper pins 3 and lower pins 4 needs to strictly comply with the established circuit design rules to ensure uniform pin spacing and meet electrical performance specifications, thereby achieving stable and efficient signal transmission. The left pins 5 and right pins 6 are also connected to the chip 2 according to the above process standards. After completing the connection process of all pins and the chip 2, a comprehensive and strict electrical performance test and mechanical performance test of the entire assembly is required. According to the industry's common test standards, professional testing equipment is used to carefully check the connection quality between each pin and the chip 2, ensuring that there are no potential problems such as virtual welding and short circuits, thereby ensuring that the lead frame meets the quality requirements and can be normally put into production and application.
[0023] Working principle: When the electronic product is in operation, chip 2, as the core unit of signal generation and processing, will generate various power signals and ground signals according to the functional requirements of the electronic product. These signals are first transmitted to the corresponding pins through the internal connection path between the chip 2 and the pins. Taking the upper pins 3 as an example, when chip 2 generates a specific power signal, the signal will be quickly transmitted to the upper pins 3 along the established electrical connection path. Due to the large number of upper pins 3 and their regular layout, different types of power signals can be accurately distributed to the corresponding external circuit modules according to the circuit design. The working mechanism of the lower pins 4 is similar to that of the upper pins 3, and they bear the transmission task of another part of the power signals and ground signals.
[0024] In this process, the left pins 5 and right pins 6 play a key role in signal switching. In complex circuit systems, when faced with diversified signal switching requirements, the signals generated by chip 2 can be flexibly switched through left pins 5 and right pins 6. For example, in a complex circuit scenario, if a specific power signal needs to be transmitted to a circuit module with special functions located on the left side of chip 2, the signal can be transmitted to the target module through left pins 5 using the good conductivity of metal frame 1, achieving precise signal connection. Similarly, right pins 6 can also switch signals to the relevant circuit parts on the right side of chip 2 in a similar manner. This multi-directional pin layout design enables the new lead frame to flexibly and efficiently switch power signals and ground signals in complex electronic product circuit systems, fully meeting customers' diversified signal connection needs and providing a solid guarantee for the stable and reliable operation of electronic products.
[0025] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.
Claims
1. A novel lead frame, characterized in that: include: Metal frame (1) and chip (2); The metal frame (1) has an upper pin (3) and a lower pin (4) on its upper and lower sides that are connected to the chip (2); The metal frame (1) has a left pin (5) and a right pin (6) on its left and right sides, respectively, which are connected to the chip (2).
2. The novel lead frame according to claim 1, characterized in that: The upper pin (3) and the lower pin (4) form a symmetrical layout.
3. A novel lead frame according to claim 2, characterized in that: The left pin (5) and the right pin (6) form a symmetrical layout.