Metallized polypropylene film capacitor
Metallized polypropylene film capacitors with a multilayer structure and efficient heat dissipation design solve the inductive effect problem of wound capacitors in high-frequency environments, thereby improving high-frequency performance and enhancing the reliability and efficiency of the capacitors.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-06
- Publication Date
- 2026-04-10
AI Technical Summary
Existing metallized polypropylene film capacitors suffer from poor filtering performance in high-frequency environments due to the inductive effect caused by their wound structure, failing to meet the high-frequency performance requirements of modern electronic devices.
The metallized polypropylene film capacitor with a multilayer structure includes a main body, a low-inductance electrode assembly, a heat dissipation assembly, and a package housing. It utilizes copper-silver alloy materials and a high-efficiency heat dissipation design to reduce the equivalent series inductance and improve heat dissipation performance.
It significantly reduces the equivalent series inductance, improves the performance and reliability of the capacitor in high-frequency environments, and increases the charging and discharging efficiency and service life of the capacitor.
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Figure CN224110140U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to capacitor technical field especially relates to a kind of metallized polypropylene film capacitors. BACKGROUND
[0002] Capacitor is indispensable basic element in electronic circuit, is composed of two mutual close conductor and middle insulating medium, can store and release electric energy, and working principle is based on the accumulation and release of electric charge on conductor, in circuit, the use of capacitor is more extensive.
[0003] The prior art, there are often the following defects: the existing metallized polypropylene film capacitor mostly utilizes the structure of winding, the equivalent series inductance of traditional winding structure's metallized polypropylene film capacitor is larger due to inductance effect generated by winding under high-frequency environment, thereby affecting the filtering effect of capacitor to high-frequency signal, unable to meet the requirement of modern electronic equipment to high-frequency performance.
[0004] Therefore, the utility model provides a kind of metallized polypropylene film capacitor. UTILITY MODEL CONTENT
[0005] The utility model aims at solving the defect that the inductance effect generated by the metallized polypropylene film capacitor with winding structure in prior art affects the filtering effect of capacitor to high-frequency signal, and proposes a kind of metallized polypropylene film capacitor.
[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of metallized polypropylene film capacitor, including main body, low inductance electrode assembly, heat dissipation component and packaging shell, the main body includes metallized polypropylene film and metal electrode layer, the main body is composed of the alternately stacked of multiple layers of metallized polypropylene film and metal electrode layer, the electrode material of low inductance electrode assembly adopts copper-silver alloy.
[0007] The effect reached by the above-mentioned components is: compared with traditional winding structure, this laminated structure greatly reduces the equivalent series inductance, the metallized polypropylene film has good electrical performance and insulation performance, can effectively store electric energy, and the metal electrode layer is responsible for conducting current, through the optimization design of the laminated structure of main body, low inductance electrode assembly, the high-efficiency heat dissipation of heat dissipation component and the protection and auxiliary heat dissipation effect of packaging shell, the metallized polypropylene film capacitor has excellent performance under high-frequency environment, can effectively solve the heat dissipation problem, improve the service life and reliability of capacitor, copper-silver alloy has good conductivity and lower resistance, reduces the energy loss in current transmission process, improves the charge and discharge efficiency of capacitor, so that capacitor can respond to signal change more quickly in circuit, improves its overall performance.
[0008] Preferably, the low-inductance electrode assembly is welded on the main body, and the low-inductance electrode assembly adopts a planar electrode.
[0009] The low-inductance electrode assembly with a planar electrode structure reduces the inductance in the current transmission path, further reduces the overall equivalent series inductance, and improves the performance of the capacitor in a high-frequency environment.
[0010] Preferably, the heat dissipation assembly is arranged between the main body and the packaging shell, and the heat dissipation assembly comprises heat dissipation fins and heat-conducting silica gel, the heat dissipation fins are made of high-thermal-conductivity aluminum alloy, and the heat-conducting silica gel is filled between the heat dissipation fins and the main body and the packaging shell.
[0011] The heat dissipation assembly improves the heat dissipation effect during use of the capacitor.
[0012] Preferably, the surface of the heat dissipation fin is provided with a plurality of heat dissipation fins.
[0013] The heat dissipation fins increase the heat dissipation area of the heat dissipation fins, thereby improving the heat dissipation effect of the capacitor.
[0014] Preferably, the packaging shell is made of ceramic material with insulation and heat dissipation properties.
[0015] The packaging shell made of ceramic material not only protects the main body, the low-inductance electrode assembly and the heat dissipation assembly inside from being eroded by the external environment, but also assists heat dissipation to dissipate the heat transferred by the heat dissipation fins.
[0016] Preferably, the surface of the packaging shell is coated with a heat dissipation coating layer composed of heat dissipation ceramic powder and an organic binder.
[0017] The application of the heat dissipation coating layer enhances the heat dissipation performance of the packaging shell, and the heat dissipation assembly can dissipate heat more efficiently, ensuring that the capacitor can maintain a relatively low temperature in a high-power working state and improving the reliability of the capacitor.
[0018] Preferably, the surface of the packaging shell is provided with a mounting groove in a rectangular ring structure, and the heat dissipation fins are glued to the inner side of the mounting groove by means of silicone grease.
[0019] The mounting groove facilitates stable installation of the heat dissipation fins and avoids the phenomenon that the heat dissipation fins are easily shaken with the packaging shell under the action of external force, thereby improving the stability of the capacitor after installation of the heat dissipation assembly.
[0020] In summary:
[0021] 1. The utility model discloses a through the optimization design of the laminated structure and low inductance electrode structure of main part, greatly reduced equivalent series inductance, the performance of capacitor under high frequency environment is improved significantly.
[0022] 2. The utility model discloses the synergistic heat dissipation design of heat dissipation subassembly and package shell, effectively solved the heat dissipation problem of capacitor. BRIEF DESCRIPTION OF DRAWINGS
[0023] Fig. 1 It is the three-dimensional structure schematic diagram of the utility model;
[0024] Fig. 2 It is the exploded structure schematic diagram of the utility model;
[0025] Fig. 3 It is the section of main part in the utility model.
[0026] Legend: 1, main part; 11, metallized polypropylene film; 12, metal electrode layer; 2, low inductance electrode assembly; 3, heat dissipation subassembly; 31, heat dissipation fin; 32, heat dissipation fin; 33, heat-conducting silica gel; 4, package shell; 5, pin; 6, mounting groove; 7, heat dissipation coating. DETAILED DESCRIPTION
[0027] Referring to Figs. 1-3 The utility model provides a technical scheme: a kind of metallized polypropylene film capacitor, including main body 1, low inductance electrode assembly 2, heat dissipation subassembly 3 and package shell 4.
[0028] The specific setting and effect of its whole are described below.
[0029] In the embodiment: main body 1 includes metallized polypropylene film 11 and metal electrode layer 12, main body 1 is composed of multiple metallized polypropylene film 11 and metal electrode layer 12 alternately stacked, and the electrode material of low inductance electrode assembly 2 adopts copper-silver alloy. Compared with traditional winding structure, this laminated structure greatly reduces equivalent series inductance, the metallized polypropylene film 11 has good electrical performance and insulation performance, can effectively store electric energy, and the metal electrode layer 12 is responsible for conducting current. Through the optimization design of the laminated structure of main body 1, low inductance electrode assembly 2, the efficient heat dissipation of heat dissipation subassembly 3 and the protection and auxiliary heat dissipation effect of package shell 4, the metallized polypropylene film capacitor has excellent performance under high frequency environment, and the service life and reliability of capacitor are improved. The copper-silver alloy has good conductivity and low resistance, reduces energy loss in the current transmission process, improves the charge and discharge efficiency of capacitor, so that the capacitor can respond to signal changes more quickly in the circuit, and the overall performance is improved.
[0030] Specifically, the low-inductance electrode assembly 2 is welded on the main body 1, and the low-inductance electrode assembly 2 adopts a planar electrode. The low-inductance electrode assembly 2 with a planar electrode structure reduces the inductance in the current transmission path, further reduces the overall equivalent series inductance, and improves the performance of the capacitor in a high-frequency environment. The heat dissipation assembly 3 is arranged between the main body 1 and the packaging shell 4, and the heat dissipation assembly 3 includes heat dissipation fins 31 and heat-conductive silica gel 33. The heat dissipation fins 31 are made of aluminum alloy with high thermal conductivity, and the heat-conductive silica gel 33 is filled between the heat dissipation fins 31 and the main body 1 and the packaging shell 4. The arrangement of the heat dissipation assembly 3 improves the heat dissipation effect during the use of the capacitor. The surface of the heat dissipation fins 31 is provided with a plurality of heat dissipation fins 32. The arrangement of the heat dissipation fins 32 increases the heat dissipation area of the heat dissipation fins 31, thereby improving the heat dissipation effect of the capacitor. The packaging shell 4 is made of ceramic material with insulation and heat conduction properties. The ceramic material packaging shell 4 not only protects the internal main body 1, low-inductance electrode assembly 2 and heat dissipation assembly 3 from being eroded by the external environment, but also assists heat dissipation to dissipate the heat transferred by the heat dissipation fins 31. The surface of the packaging shell 4 is coated with a layer of heat dissipation coating 7, which is composed of heat dissipation ceramic powder and organic binder. The application of the heat dissipation coating 7 enhances the heat dissipation performance of the packaging shell 4, and assists the heat dissipation assembly 3 to dissipate heat more efficiently, ensuring that the capacitor can maintain a relatively low temperature under high-power working conditions and improving the reliability of the capacitor. The surface of the packaging shell 4 is provided with a mounting groove 6, which is in the form of a rectangular ring. The heat dissipation fins 31 are glued to the inner side of the mounting groove 6 by means of silicone grease. By arranging the mounting groove 6, the stable installation of the heat dissipation fins 31 is facilitated, and the phenomenon that the heat dissipation fins 31 are easily shaken with the packaging shell 4 under the action of external force is avoided, thereby improving the stability of the capacitor after the heat dissipation assembly 3 is installed.
[0031] When the capacitor is connected to the circuit, the metalized polypropylene film 11 and the metal electrode layer 12 of the main body 1 store and release electrical energy. During high-frequency signal transmission, the low-inductance electrode assembly 2 reduces the inductance effect and energy loss by virtue of its optimized design and low-resistance copper-silver alloy electrode, ensuring stable transmission of signals. The heat generated during the operation of the capacitor is first conducted to the heat dissipation fins 31 by the main body 1, and then quickly transferred to the heat dissipation fins 31 through the efficient heat conduction of the heat-conductive silica gel 33. The heat dissipation fins 32 of the heat dissipation fins 31 increase the heat dissipation area, dissipating heat to the surrounding air. At the same time, the packaging shell 4 and the heat dissipation coating 7 on its surface also assist heat dissipation, ensuring that the capacitor operates within an appropriate temperature range.
[0032] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication。For ordinary skilled person in the art, the above-mentioned terms can be understood by the specific meaning in the utility model through specific circumstances.
Claims
1. A metallized polypropylene film capacitor comprising a main body (1), a low inductive electrode assembly (2), a heat dissipation assembly (3) and a package case (4), characterized in that: The main body (1) comprises a metalized polypropylene film (11) and a metal electrode layer (12), the main body (1) is composed of the metalized polypropylene film (11) and the metal electrode layer (12) which are alternately stacked, and the electrode material of the low-inductance electrode assembly (2) is a copper-silver alloy.
2. A metalized polypropylene film capacitor according to claim 1, characterized in that: The low-inductance electrode assembly (2) is welded on the main body (1), and the low-inductance electrode assembly (2) adopts a planar electrode.
3. A metalized polypropylene film capacitor according to claim 1, wherein: The heat dissipation assembly (3) is arranged between the main body (1) and the packaging shell (4), the heat dissipation assembly (3) comprises heat dissipation fins (31) and heat conductive silica gel (33), the heat dissipation fins (31) are made of an aluminum alloy material with high thermal conductivity, and the heat conductive silica gel (33) is filled between the heat dissipation fins (31) and the main body (1) and the packaging shell (4).
4. A metalized polypropylene film capacitor according to claim 3, characterized in that: The surface of the heat dissipation fin (31) is provided with a plurality of heat dissipation fins (32).
5. A metalized polypropylene film capacitor according to claim 1, wherein: The packaging shell (4) is made of a ceramic material with insulation and heat conduction properties.
6. A metalized polypropylene film capacitor according to claim 1, wherein: The surface of the packaging shell (4) is coated with a heat dissipation coating layer (7), and the heat dissipation coating layer (7) is composed of heat dissipation ceramic powder and an organic binder.
7. A metalized polypropylene film capacitor according to claim 3, wherein: The surface of the packaging shell (4) is provided with a mounting groove (6), the mounting groove (6) is a rectangular ring structure, and the heat dissipation fin (31) is glued to the inner side of the mounting groove (6) by means of silica grease.