Capacitor and electronic device
By employing a carrier plate design and optimizing electrical connections through conductive vias and conductive layers in the capacitor, the problems of large size, high electrical lead resistance, and high equivalent series inductance of multilayer capacitors have been solved, achieving high performance of capacitors at high frequencies and improving the performance of electronic devices.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TRUSTCAP TECH CO LTD
- Filing Date
- 2024-11-07
- Publication Date
- 2026-05-15
AI Technical Summary
Multilayer capacitors have problems such as large size, high electrical lead resistance and high equivalent series inductance, which affect their performance at high frequencies.
The carrier board design is adopted. By setting positive lead, negative lead and auxiliary lead on the carrier board, the positive and negative terminals of the capacitor body are directly connected, which shortens the current flow path. The electrical connection is optimized by conductive vias and conductive layers, reducing electrical lead resistance and equivalent series inductance.
This reduces the size and power loss of capacitors, and improves the performance of capacitors at high frequencies and the overall performance of electronic devices.
Smart Images
Figure CN2024130649_15052026_PF_FP_ABST
Abstract
Description
Capacitors and electronic devices Technical Field
[0001] This application relates to the field of capacitor technology, and more specifically, to a capacitor and an electronic device. Background Technology
[0002] Capacitors, as electronic components that store electrical charge, are widely used in the circuits of various electronic devices.
[0003] Taking a multilayer capacitor as an example: Multilayer capacitors in related technologies include multiple capacitor units, which are stacked on positive and negative conductive terminals. The positive terminal of each capacitor unit is connected to the positive conductive terminal, and the negative terminal is connected to the negative conductive terminal. The multiple capacitor units are encapsulated using epoxy resin injection molding.
[0004] The aforementioned multilayer capacitors have the problems of large size, high electrical lead resistance, and high equivalent series inductance.
[0005] Summary of the Invention
[0006] The purpose of this application is to provide a capacitor and an electronic device that reduces the size of the capacitor, reduces electrical lead resistance and equivalent series inductance, and improves the performance of the electronic device.
[0007] In a first aspect, this application discloses a capacitor. The capacitor includes a carrier plate and a capacitor body.
[0008] The first side of the carrier plate in the thickness direction is provided with a positive lead-out terminal, a negative lead-out terminal and an auxiliary lead-out terminal.
[0009] The capacitor body is disposed on the second side along the thickness direction of the carrier plate. The first side and the second side are opposite each other along the thickness direction of the carrier plate. The capacitor body includes a positive terminal and a negative terminal. The positive terminal lead is connected to the positive terminal. The negative terminal lead and the auxiliary lead are both connected to the negative terminal.
[0010] Along the extension direction of the carrier plate, the distance between the auxiliary lead and the positive lead is less than the distance between the negative lead and the positive lead.
[0011] In some embodiments of this application, the negative electrode is located on one side of the capacitor body in the thickness direction.
[0012] The carrier plate is provided with a first conductive through hole. The first conductive through hole extends through the first side and the second side along the thickness direction of the carrier plate.
[0013] The negative lead and the auxiliary lead are connected to the first conductive through hole and are connected to the negative electrode through the first conductive through hole.
[0014] In some embodiments of this application, there are multiple first conductive vias, which are spaced apart along the extension direction of the carrier plate.
[0015] The negative lead and the auxiliary lead are respectively connected to different first conductive through holes.
[0016] In some embodiments of this application, the capacitor further includes a first conductive layer and a second conductive layer.
[0017] The first conductive layer is disposed on the first side of the carrier plate.
[0018] The second conductive layer is disposed on the second side of the carrier plate and is located between the capacitor body and the carrier plate; the second conductive layer is connected to the negative electrode.
[0019] The first conductive layer is electrically connected to the second conductive layer through a first conductive via.
[0020] An auxiliary lead is formed on the side of the first conductive layer closest to the positive lead, and a negative lead is formed on the side of the first conductive layer away from the positive lead.
[0021] In some embodiments of this application, the carrier plate includes an insulating portion and a conductive portion that are interconnected.
[0022] A positive lead is provided on the side of the insulation part that is away from the capacitor body.
[0023] The conductive part closest to the capacitor body is connected to the negative terminal. The portion of the conductive part near the positive terminal forms an auxiliary terminal, and the portion of the conductive part away from the positive terminal forms the negative terminal.
[0024] In some embodiments of this application, the capacitor further includes an insulating layer disposed on a first side of the carrier plate and located between the positive lead and the auxiliary lead.
[0025] In some embodiments of this application, the capacitor further includes a side negative electrode, which is disposed on the side of the capacitor and connected to the negative lead and / or auxiliary lead.
[0026] In some embodiments of this application, the positive electrode is disposed on the side of the capacitor body.
[0027] The capacitor includes a side positive electrode, which is connected to the positive lead and the positive terminal.
[0028] Alternatively, the carrier plate may also be provided with a second conductive via. The second conductive via extends through the first and second sides along the thickness direction of the carrier plate.
[0029] The positive electrode is connected to the positive electrode lead-out terminal through the second conductive through hole.
[0030] In some embodiments of this application, the capacitor body is composed of multiple capacitor units stacked along the thickness direction of the carrier plate.
[0031] The positive electrode structures of multiple capacitor units extend to the same side of the capacitor body to form the positive electrode of the capacitor body.
[0032] The negative electrode structures of multiple capacitor units are connected sequentially along the stacking direction, and the negative electrode of the capacitor body is formed by the negative electrode structure disposed on the adjacent side of the carrier plate.
[0033] In some embodiments of this application, the capacitor also includes a stop.
[0034] The capacitor unit comprises a positive electrode layer, a dielectric layer, and a negative electrode layer stacked sequentially.
[0035] Along the extension direction of the carrier plate, multiple first ends are disposed on the same side of the capacitor body to form the positive electrode of the capacitor body.
[0036] The positive electrode layer includes a first positive electrode portion and a second positive electrode portion. The second positive electrode portion is disposed on the side of the first positive electrode portion near the first end of the positive electrode layer.
[0037] A dielectric layer covers the outer periphery of the first positive electrode portion. A stop member is disposed on the second positive electrode portion. The stop member is a hydrophobic component.
[0038] The negative electrode layer is wrapped around the outer periphery of the dielectric layer.
[0039] In some embodiments of this application, the capacitor body further includes a conductive support.
[0040] The conductive support is located between two adjacent capacitor cells, connecting the positive electrode layers of the two adjacent capacitor cells, and is positioned near the first end of the positive electrode layer.
[0041] In some embodiments of this application, the capacitor body further includes a conductive connector. The conductive connector is located between two adjacent capacitor cells and connects the negative electrode layers of the two adjacent capacitor cells.
[0042] In some embodiments of this application, the capacitor further includes a package covering the side of the capacitor body away from the carrier plate and the side of the capacitor body.
[0043] The positive electrode structure is exposed on the side of the package.
[0044] When the capacitor includes a side positive electrode, both the side positive electrode and the side negative electrode are located on the outside of the package.
[0045] Along the extension direction of the carrier plate, the side positive electrode and the side negative electrode are located on opposite sides of the package.
[0046] Secondly, this application discloses an electronic device. The electronic device includes a capacitor.
[0047] Based on the above technical solutions, this application provides a capacitor and an electronic device. The capacitor includes a carrier plate and a capacitor body. A positive lead, a negative lead, and an auxiliary lead are provided on a first side in the thickness direction of the carrier plate. The capacitor body is disposed on a second side in the thickness direction of the carrier plate. The capacitor body includes a positive electrode and a negative electrode. The first side and the second side are opposite to each other along the thickness direction of the carrier plate. The positive lead is connected to the positive electrode. Both the negative lead and the auxiliary lead are connected to the negative electrode. Along the extension direction of the carrier plate, the distance between the auxiliary lead and the positive lead is less than the distance between the negative lead and the positive lead. The capacitor and electronic device in this application:
[0048] (1) The carrier plate serves as the base of the capacitor, providing mechanical support for the bottom of the capacitor body, preventing mechanical damage to the bottom of the capacitor body, reducing the protective thickness below the capacitor body, reducing the size of the capacitor, and increasing the number of capacitor units per unit volume in the capacitor.
[0049] (2) The positive lead is used for electrical connection with the positive terminal of the capacitor body; the negative lead and auxiliary lead are used for electrical connection with the negative terminal of the capacitor body. The carrier plate serves as the load-bearing structure and electrical lead, reducing the size of the capacitor and increasing the number of capacitor cells per unit volume.
[0050] (3) The positive and negative terminals of the capacitor body are directly led out through the carrier plate, which shortens the current flow path in the capacitor, reduces the electrical lead resistance of the capacitor, improves the performance of the capacitor at high frequency, and improves the performance of electronic equipment.
[0051] (4) The auxiliary lead is located between the positive lead and the negative lead. The negative terminal of the capacitor body is led out through the auxiliary lead, which shortens the current flow path in the capacitor, reduces the equivalent series inductance of the capacitor, reduces the power loss and heat generation of the capacitor, improves the performance of the capacitor at high frequencies, and improves the performance of electronic equipment. Attached Figure Description
[0052] Figure 1 is a schematic diagram of the structure of a capacitor in the related technology;
[0053] Figure 2 is a schematic diagram of the current flow in a capacitor in a related technology;
[0054] Figure 3 is a structural schematic diagram of the capacitor provided in Embodiment 1 of this application from a first perspective.
[0055] Figure 4 is a structural schematic diagram of the capacitor provided in Embodiment 1 of this application from a second perspective.
[0056] Figure 5 is a schematic diagram of current flow in the capacitor provided in Embodiment 1 of this application;
[0057] Figure 6 is a schematic diagram of the parameters of the equivalent series inductance in the capacitor provided in Embodiment 1 of this application;
[0058] Figure 7 is a schematic diagram of various parameters of the equivalent series inductance in the capacitor provided in Embodiment 1 of this application;
[0059] Figure 8 is a structural schematic diagram of the capacitor provided in Embodiment 2 of this application from a first perspective.
[0060] Figure 9 is a structural schematic diagram of the capacitor provided in Embodiment 2 of this application from a second perspective.
[0061] Figure 10 is a schematic diagram of the parameters of the equivalent series inductance in the capacitor provided in Embodiment 2 of this application;
[0062] Figure 11 is a schematic diagram of various parameters of the equivalent series inductance in the capacitor provided in Embodiment 2 of this application;
[0063] Figure 12 is a schematic diagram of the structure of the capacitor provided in Embodiment 3 of this application;
[0064] Figure 13 is a schematic diagram of the structure of the capacitor unit provided in the embodiment of this application;
[0065] Figure 14 is an enlarged view of region M in Figure 13.
[0066] Explanation of reference numerals in the attached figures: 10: Capacitor unit; 11: Positive electrode layer; 11a: First terminal; 12: Dielectric layer; 13: Negative electrode layer; 20: Positive conductive terminal; 30: Negative conductive terminal; 40: Epoxy resin; 100: Carrier plate; 110a: First conductive through-hole; 110b: Second conductive through-hole; 120: Insulating part; 130: Conductive part; 200: First conductive layer; 210: Positive lead-out terminal; 220: Negative lead-out terminal; 230: Auxiliary lead-out terminal; 300: Second conductive layer; 400: Insulating layer; 500: Capacitor body; 510: Stop; 600: Side negative electrode; 700: Side positive electrode; 800: Conductive support; 810: Conductive connector; 820: Encapsulation. Detailed Implementation
[0067] In related technologies, multilayer capacitors can achieve high capacitance values within a small volume, thus better meeting the miniaturization requirements of modern electronic devices. Referring to Figures 1 and 2, a multilayer capacitor includes multiple capacitor units 10, which are stacked on a positive conductive terminal 20 and a negative conductive terminal 30. The positive terminal of each capacitor unit 10 is connected to the positive conductive terminal 20, and the negative terminal is connected to the negative conductive terminal 30. The multiple capacitor units 10 are encapsulated by epoxy resin 40.
[0068] Capacitor cell 10 includes a positive electrode layer 11, a dielectric layer 12, and a negative electrode layer 13. The dielectric layer 12 covers a portion of the outer periphery of the positive electrode layer 11, and the negative electrode layer 13 covers the outer periphery of the dielectric layer 12. The portion of the positive electrode layer 11 not covered by the dielectric layer 12 and the negative electrode layer 13 forms the positive terminal of the capacitor cell 10. One positive electrode layer 11, one dielectric layer 12, and one negative electrode layer 13 form one capacitor cell 10. Multiple capacitor cells 10 are stacked. The negative electrode layers 13 between adjacent capacitor cells 10 are connected by conductive adhesive.
[0069] Referring to FIG1, the positive terminal of the positive electrode layer 11 of the plurality of capacitor units 10 is connected to one end of the positive conductive terminal 20 by bending. The other end of the positive conductive terminal 20 is bent along one side of the encapsulation layer formed by epoxy resin 40 and extends to the bottom of the encapsulation layer.
[0070] One end of the negative conductive terminal 30 is located between multiple capacitor cells 10 and connected to the negative electrode layer 13 of the capacitor cell 10. The other end of the negative conductive terminal 30 is bent along the other side of the encapsulation layer formed by the epoxy resin 40 and extends to the bottom of the encapsulation layer.
[0071] Referring to Figure 1, the bent positive conductive terminal 20 and the bent negative conductive terminal 30 form a "flower rack" structure.
[0072] The multilayer capacitors disclosed in the aforementioned related technologies have at least the following disadvantages:
[0073] (1) During the fabrication of the multilayer capacitor, multiple capacitor units 10 need to be encapsulated with epoxy resin 40. Both the top and bottom of the capacitor unit 10 need to be encapsulated with epoxy resin 40 to protect it. Along the thickness direction of the multilayer capacitor, this results in a large thickness of the multilayer capacitor encapsulated with epoxy resin 40, which in turn leads to a large size of the multilayer capacitor. At the same time, this also results in a small number of capacitor units 10 accommodated in the multilayer capacitor per unit volume.
[0074] (2) Since both the positive conductive terminal 20 and the negative conductive terminal 30 need to be bent, the design of the multilayer capacitor must ensure sufficient space to accommodate the bending of the positive conductive terminal 20 and the negative conductive terminal 30. Simultaneously, when bending the positive and negative terminals, it is necessary to avoid excessive internal stress in the positive and negative conductive terminals 20 and 30 due to excessively small bending angles. Therefore, the thickness and length of this multilayer capacitor with a "frame" structure are limited by the bending of the positive conductive terminal 20 and the negative conductive terminal 30, resulting in a large size for the multilayer capacitor.
[0075] (3) Since the positive terminal of capacitor unit 10 is led out through positive conductive terminal 20, and the negative terminal of capacitor unit 10 is led out through negative conductive terminal 30, the "bracket" structure formed by positive conductive terminal 20 and negative conductive terminal 30 has a long lead-out distance. As a result, the current flow path of the multilayer capacitor is relatively long, which leads to a larger electrical lead-out resistance. Since the increase in electrical lead-out resistance will cause additional power loss and heat generation, the higher wire lead-out resistance will cause the performance of the multilayer capacitor to degrade at high frequencies.
[0076] It's important to explain that in capacitors, electrical lead resistance typically refers to the resistance of the leads or terminals connecting the capacitor to the external circuit. Electrical lead resistance includes lead resistance, contact resistance, and electrode resistance. Lead resistance is caused by the inherent resistance of the capacitor's leads or terminals. Contact resistance is the contact resistance between the internal electrodes and the leads or terminals. Generally, the longer the current flow path in a multilayer capacitor, the greater the lead resistance, and consequently, the greater the electrical lead resistance.
[0077] (4) Since the positive conductive terminal 20 and the negative conductive terminal 30 are located on both sides of the epoxy resin 40 encapsulation layer, the current flow path of the multilayer capacitor is relatively long, which leads to a higher equivalent series inductance. A higher equivalent series inductance will increase the total impedance of the multilayer capacitor at high frequencies, reduce the filtering effect and transient response of the multilayer capacitor, and increase power loss.
[0078] It's important to explain that in capacitors, the equivalent series inductance (ESL) refers to the inductive characteristic exhibited by the capacitor in a circuit. Since inductance is caused by the magnetic field surrounding the conductor, a longer distance will create a larger magnetic field loop.
[0079] In view of this, this application provides a capacitor and an electronic device. The capacitor includes a carrier plate and a capacitor body. A positive lead, a negative lead, and an auxiliary lead are provided on a first side in the thickness direction of the carrier plate. The capacitor body is disposed on a second side in the thickness direction of the carrier plate. The first side and the second side are opposite to each other along the thickness direction of the carrier plate. The capacitor body includes a positive electrode and a negative electrode. The positive lead is connected to the positive electrode. Both the negative lead and the auxiliary lead are connected to the negative electrode. Along the extension direction of the carrier plate, the distance between the auxiliary lead and the positive lead is less than the distance between the negative lead and the positive lead. The capacitor and electronic device of this application:
[0080] (1) The carrier plate serves as the base of the capacitor, providing mechanical support to the bottom of the capacitor body and preventing mechanical damage to the bottom of the capacitor body. Compared with related technologies, the capacitor provided in this application embodiment does not require the use of epoxy resin to encapsulate the bottom of the capacitor body. The carrier plate in the capacitor provided in this application embodiment not only protects the bottom of the capacitor body, but also reduces the protective thickness below the capacitor body, thereby reducing the thickness of the capacitor, reducing the size of the capacitor, and increasing the number of capacitor units per unit volume in the capacitor.
[0081] (2) A positive lead, a negative lead, and an auxiliary lead are provided on the first side of the carrier plate in the thickness direction. The positive lead is connected to the positive terminal of the capacitor body for electrical connection; the negative lead is connected to the negative terminal of the capacitor body for electrical connection; and the auxiliary lead is connected to the negative terminal for providing electrical connection. The carrier plate serves as both the load-bearing structure and the electrical lead-out point. Since the positive and negative terminals of the capacitor body are directly led out through the carrier plate, the capacitor provided in this embodiment is no longer limited by the "frame" structure in related technologies, thus reducing the size of the capacitor and increasing the number of capacitor units per unit volume.
[0082] (3) By setting positive lead, negative lead and auxiliary lead on the carrier plate, the positive and negative terminals of the capacitor body are directly led out through the carrier plate, which shortens the current flow path in the capacitor, reduces the electrical lead resistance of the capacitor, improves the performance of the capacitor at high frequency, and improves the performance of electronic equipment.
[0083] (4) By designing an auxiliary lead-out terminal and setting the distance between the auxiliary lead-out terminal and the positive lead-out terminal to be less than the distance between the negative lead-out terminal and the positive lead-out terminal, and placing the auxiliary lead-out terminal between the positive lead-out terminal and the negative lead-out terminal, the negative terminal of the capacitor body can be led out through the auxiliary lead-out terminal, which shortens the current flow path in the capacitor, reduces the equivalent series inductance of the capacitor, reduces the power loss and heat generation of the capacitor, improves the performance of the capacitor at high frequencies, and improves the performance of electronic equipment.
[0084] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. It should be noted that the embodiments described in this application are only some embodiments of this application, not all embodiments of the technical solutions claimed in this application. The embodiments described below with reference to the accompanying drawings are merely exemplary and intended to explain this application, and should not be construed as limiting this application. Based on the various embodiments recorded in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0085] Firstly, embodiments of this application provide an electronic device. The electronic device includes a capacitor. The electronic device provided in this application can have various implementations, such as a smartphone, tablet computer, laptop computer, base station, router, switch, portable monitoring device, motor driver, etc.
[0086] Due to their versatility and reliability, capacitors have become an indispensable component of electronic devices. The following section provides a detailed introduction to the structure of capacitors.
[0087] Secondly, this application provides a capacitor, as shown in Figures 3 to 13, comprising a carrier plate 100 and a capacitor body 500. The carrier plate 100 serves as the substrate of the capacitor, providing the basis for mechanical support and electrical connection.
[0088] Referring to Figures 3 to 5, a positive electrode lead-out terminal 210, a negative electrode lead-out terminal 220, and an auxiliary lead-out terminal 230 are provided on the first side of the carrier plate 100 in the thickness direction. The thickness direction of the carrier plate 100 is shown as the Z direction in Figure 3. The positive electrode lead-out terminal 210 is connected to the positive electrode of the capacitor body 500 for electrical connection; the negative electrode lead-out terminal 220 is connected to the negative electrode of the capacitor body 500 for electrical connection of the negative electrode; and the auxiliary lead-out terminal 230 is connected to the negative electrode to provide electrical connection of the negative electrode.
[0089] The capacitor body 500 is disposed on the second side of the carrier plate 100 in the thickness direction. The first side and the second side are opposite to each other in the thickness direction of the carrier plate 100. The capacitor body 500 includes a positive electrode and a negative electrode. The positive electrode lead-out terminal 210 is connected to the positive electrode. The negative electrode lead-out terminal 220 and the auxiliary lead-out terminal 230 are both connected to the negative electrode.
[0090] In this embodiment, the carrier plate 100 not only protects the bottom of the capacitor body 500, but also reduces the protective thickness below the capacitor body 500, thereby reducing the thickness of the capacitor, reducing the size of the capacitor, and increasing the number of capacitor units 10 per unit volume in the capacitor.
[0091] While maintaining the same capacitor thickness, the capacitor provided in this embodiment increases the number of individual capacitor cells in the capacitor body 500. Conversely, while maintaining the same number of individual capacitor cells, the capacitor provided in this embodiment reduces the capacitor thickness.
[0092] Furthermore, referring to FIG4, a positive lead-out terminal 210, a negative lead-out terminal 220, and an auxiliary lead-out terminal 230 are provided on the carrier plate 100. The positive lead-out terminal 210 is connected to the positive terminal of the capacitor body 500 for electrical connection; the negative lead-out terminal 220 is connected to the negative terminal of the capacitor body 500 for electrical connection; and the auxiliary lead-out terminal 230 is connected to the negative terminal to provide electrical connection. The carrier plate 100 serves as both the carrier and the electrical lead-out terminal. The positive and negative terminals of the capacitor body 500 are directly led out through the carrier plate 100, reducing the size of the capacitor and increasing the number of capacitor units 10 per unit volume.
[0093] For example, when the thickness of the capacitor in the related art and the capacitor provided in the embodiment of this application are the same, the capacitor in the related art includes four capacitor units 10, while the number of capacitor units 10 in the embodiment of this application is five, and the capacity of the capacitor provided in the embodiment of this application is increased by 25%.
[0094] For example, when the thickness of the capacitor in the related art and the capacitor provided in the embodiment of this application are the same, the capacitor in the related art includes six capacitor units 10, while the number of capacitor units 10 in the embodiment of this application is seven, and the capacitance of the capacitor provided in the embodiment of this application is increased by 16.7%.
[0095] In some embodiments, the capacitor provided in this application has an effective width of 3.5 mm, an effective length of 5.85 mm, and an effective area of 20.475 mm². 2 Compared to related technologies, where the capacitor has an effective width of 3.4 mm, an effective length of 4.9 mm, and an effective area of 16.66 mm², this technology offers a significantly different solution. 2 The effective area of the capacitor provided in this application embodiment is increased by 23% compared to related technologies.
[0096] Referring to Figures 2 and 5, in this embodiment of the application, by providing a positive lead-out terminal 210, a negative lead-out terminal 220, and an auxiliary lead-out terminal 230 on the carrier plate 100, the positive and negative terminals of the capacitor body 500 are directly led out through the carrier plate 100, which shortens the current flow path in the capacitor, reduces the electrical lead-out resistance of the capacitor, improves the performance of the capacitor at high frequencies, and improves the performance of the electronic device.
[0097] Both the negative lead 220 and the auxiliary lead 230 are connected to the negative terminal of the capacitor body 500, which improves the redundancy and fault tolerance of the capacitor and increases its reliability.
[0098] By designing an auxiliary lead 230 and setting the distance between the auxiliary lead 230 and the positive lead 210 to be less than the distance between the negative lead 220 and the positive lead 210, and placing the auxiliary lead 230 between the positive lead 210 and the negative lead 220, the current flow path is shortened, the equivalent series inductance of the capacitor is reduced, the power loss and heat generation of the capacitor are reduced, the performance of the capacitor at high frequencies is improved, and the performance of electronic equipment is enhanced.
[0099] As one feasible implementation, the negative electrode is located on one side of the capacitor body in the thickness direction of 500.
[0100] The carrier plate 100 is provided with a first conductive through hole 110a. The first conductive through hole 110a extends through the first side and the second side along the thickness direction of the carrier plate 100.
[0101] The negative lead 220 and the auxiliary lead 230 are connected to the first conductive via 110a and, through the first conductive via 110a, to the negative terminal. The first conductive via 110a provides an electrical path from the negative lead 220 and the auxiliary lead 230 to the negative terminal. By directly connecting the first conductive via 110a to the negative lead 220 and the auxiliary lead 230 to the negative terminal of the capacitor body 500, the current flow path is shortened, the electrical lead resistance is reduced, and the equivalent series inductance is decreased. This design improves the high-frequency performance and response speed of the capacitor. The first conductive via 110a provides a low-impedance path, enhancing the current carrying capacity of the capacitor and enabling it to handle high-current applications more effectively.
[0102] By integrating a first conductive via 110a in the carrier plate 100, the thickness of the capacitor is reduced while achieving electrical connection.
[0103] For example, the thickness of the carrier plate 100 ranges from 0.25 to 0.30 mm.
[0104] Correspondingly, when the thickness of the carrier plate 100 is in the range of 0.25-0.30 mm, the carrier plate 100 can generally provide sufficient mechanical strength and rigidity. This helps protect the capacitor body 500 from mechanical stress and impact, and the appropriately thick carrier plate 100 can effectively support the formation of the first conductive via 110a and maintain its structural integrity. This is crucial for ensuring the reliability and stability of the electrical connection.
[0105] Conversely, when the thickness of the carrier plate 100 is greater than 0.30 mm, the excessively thick carrier plate 100 increases the overall size and weight of the capacitor, making it unsuitable for space-constrained or portable applications. An excessively thick carrier plate 100 may also lead to longer current paths, increased resistance and inductance, and negatively impact electrical performance.
[0106] Conversely, when the thickness of the carrier plate 100 is less than 0.25 mm, the excessively thin carrier plate 100 may not provide sufficient mechanical strength and is prone to bending or cracking during processing, assembly or use.
[0107] For example, the thickness of the carrier plate 100 can be 0.25 mm, 0.27 mm, or 0.30 mm.
[0108] For example, the carrier board 100 may be a printed circuit board (PCB).
[0109] In one feasible implementation, there are multiple first conductive vias 110a, which are spaced apart along the extension direction of the carrier plate 100. The extension direction of the carrier plate 100 is shown as X in FIG3.
[0110] The negative lead-out terminal 220 and the auxiliary lead-out terminal 230 are respectively connected to different first conductive through holes 110a.
[0111] In some embodiments, referring to FIG5, there are two first conductive vias 110a. The two first conductive vias 110a are spaced apart along the extending direction of the carrier plate 100. The negative electrode lead-out terminal 220 is connected to one first conductive via 110a. The auxiliary lead-out terminal 230 is connected to the other first conductive via 110a. The first conductive via 110a connected to the auxiliary lead-out terminal 230 is closer to the positive electrode lead-out terminal 210 than the first conductive via 110a connected to the negative electrode lead-out terminal 220.
[0112] In this embodiment, during capacitor use, current flows from the positive terminal 210 to the positive terminal of the capacitor body 500, then from the positive terminal to the negative terminal, and finally from the negative terminal to the auxiliary terminal 230. The direction of current flow is shown by the hollow arrow in Figure 5. This embodiment is referred to as Embodiment 1.
[0113] By placing the first conductive via 110a connected to the auxiliary lead 230 closer to the positive lead 210, the distance between the positive and negative terminals of the capacitor body 500 is reduced, the current path is shortened, and the equivalent series inductance is reduced.
[0114] Compared to related technologies, the capacitor provided in this application embodiment shortens the current path by about 50%, thereby reducing the equivalent series inductance by 50%.
[0115] In some embodiments, referring to Figures 8 and 9, there are two first conductive vias 110a. The two first conductive vias 110a are spaced apart along the extending direction of the carrier plate 100. The negative electrode lead-out terminal 220 is connected to one first conductive via 110a. The auxiliary lead-out terminal 230 is connected to the other first conductive via 110a. The first conductive via 110a connected to the auxiliary lead-out terminal 230 is closer to the positive electrode lead-out terminal 210 than the first conductive via 110a connected to the negative electrode lead-out terminal 220.
[0116] In this embodiment, during the use of the capacitor, current flows from the positive terminal 210 to the positive terminal of the capacitor body 500, then the current flowing through the positive terminal of the capacitor body 500 flows to the negative terminal of the capacitor body 500, and then the current flowing through the negative terminal flows to the negative terminal 220. This embodiment is referred to as Embodiment Two.
[0117] In this embodiment of the application, the equivalent series inductance is denoted as A, and the equivalent series inductance A satisfies:
[0118] Where K is a constant, L is the distance between the end of the positive lead 210 and the end of the negative lead 220, W is the width of the positive lead 210, and t is the height of the first conductive via 110a.
[0119] Referring to Figures 5 to 7, in Embodiment 1, the current flow path in the capacitor is: positive lead 210, positive terminal, negative terminal, auxiliary lead 230. The distance between the end of the positive lead 210 and the end of the auxiliary lead 230 is L1.
[0120] Referring to Figures 8 to 11, in Embodiment 2, the current flow path in the capacitor is: positive terminal 210, positive terminal, negative terminal, negative terminal 220. The distance between the end of the positive terminal 210 and the end of the negative terminal 220 is L2.
[0121] Comparing Embodiment 1 and Embodiment 2, it can be concluded that, assuming K is constant and the width W of the positive lead 210 and the height t of the first conductive via 110a are equal, the distance L1 between the end of the positive lead 210 and the end of the auxiliary lead 230 in Embodiment 1 is less than that in Embodiment 2, while the distance L2 between the end of the positive lead 210 and the end of the auxiliary lead 230 in Embodiment 2 is less. According to the equivalent series inductance formula, the equivalent series inductance in Embodiment 1 is less than that in Embodiment 2. Embodiment 1 shortens the current flow path in the capacitor, reduces the equivalent series inductance of the capacitor, reduces the power loss and heat generation of the capacitor, improves the performance of the capacitor at high frequencies, and improves the performance of electronic equipment.
[0122] It is understandable that there can be multiple first conductive vias 110a. For example, there can be 2, 3, or 4 first conductive vias 110a.
[0123] As one possible implementation, the capacitor also includes a first conductive layer 200 and a second conductive layer 300.
[0124] The first conductive layer 200 is disposed on the first side of the carrier plate 100.
[0125] The second conductive layer 300 is disposed on the second side of the carrier plate 100 and is located between the capacitor body 500 and the carrier plate 100; the second conductive layer 300 is connected to the negative electrode.
[0126] The first conductive layer 200 is electrically connected to the second conductive layer 300 through the first conductive via 110a.
[0127] An auxiliary lead 230 is formed on the side of the first conductive layer 200 near the positive lead 210, and a negative lead 220 is formed on the side of the first conductive layer 200 away from the positive lead 210.
[0128] For example, the first conductive via 110a connects the first conductive layer 200 and the second conductive layer 300 located on both sides of the carrier plate 100, reducing the distance between the positive terminal and the positive lead 210 of the capacitor body 500, and reducing the distance between the negative terminal and the negative lead 220 and the auxiliary lead 230 of the capacitor body 500. This reduces the electrical lead resistance of the electrical path and improves the high-frequency performance and response speed of the capacitor. Thus, the capacitor is suitable for rapidly changing current environments. Furthermore, the design of the first conductive layer 200 and the second conductive layer 300 helps increase the mechanical strength of the carrier plate 100 and also aids in heat dissipation of the capacitor.
[0129] By forming auxiliary leads 230 and negative leads 220 on the first conductive layer 200, flexible electrical connection options are provided to accommodate different circuit design requirements. This flexibility helps simplify the layout and design of the carrier board 100.
[0130] As one possible implementation, referring to FIG12, the carrier plate 100 includes an insulating portion 120 and a conductive portion 130 that are interconnected.
[0131] A positive lead 210 is provided on the side of the insulating part 120 away from the capacitor body 500.
[0132] The conductive portion 130 is connected to the negative terminal on the side closest to the capacitor body 500. The portion of the conductive portion 130 near the positive terminal 210 forms an auxiliary terminal 230, and the portion of the conductive portion 130 away from the positive terminal 210 forms a negative terminal 220.
[0133] For example, the insulating part 120 is used for electrical isolation, and a positive lead 210 is provided on the side of the insulating part 120 away from the capacitor body 500. The positive lead 210 is used to connect to the positive terminal of the capacitor body 500.
[0134] The conductive part 130 is directly connected to the negative terminal. This creates a shorter electrical path between the negative terminal and the negative lead-out terminal 220 and the auxiliary lead-out terminal 230 within the capacitor, reducing the electrical lead-out resistance. Simultaneously, since the positive terminal is connected to the positive lead-out terminal 210, and the negative terminal is connected to the negative lead-out terminal 220 or the auxiliary lead-out terminal 230, the equivalent series inductance of the capacitor is reduced. This improves the capacitor's high-frequency performance and response speed.
[0135] Meanwhile, the layout of the conductive portion 130 allows for a more uniform current distribution, reducing the risk of localized overheating and improving the reliability and lifespan of the capacitor. By forming auxiliary leads 230 and negative leads 220 on the conductive portion 130, flexible electrical connection options are provided to adapt to different circuit design needs. This flexibility helps simplify circuit board layout and design.
[0136] By providing the conductive part 130, the welding of the capacitor is reduced, the complexity of the connection is simplified, the capacitor manufacturing and assembly process is simplified, and the production efficiency is improved.
[0137] For example, the conductive part 130 includes a metal plate.
[0138] As one feasible implementation, the capacitor also includes an insulating layer 400 disposed on a first side of the carrier plate 100 and located between the positive lead 210 and the auxiliary lead 230. The insulating layer 400 is designed to provide electrical isolation for the capacitor, preventing electrical short circuits between the positive lead 210 and the auxiliary lead 230. The insulating layer 400 can reduce electromagnetic interference and crosstalk between the positive and auxiliary leads 230, improving the electrical performance of the capacitor. The introduction of the insulating layer 400 allows for a more compact lead layout without concerns about short circuits, thereby improving design flexibility and space utilization.
[0139] In some embodiments, an insulating varnish is provided between the positive lead 210 and the auxiliary lead 230. An insulating varnish is also provided between the auxiliary lead 230 and the negative lead 220.
[0140] In other embodiments, an insulating varnish is provided between the positive lead 210 and the negative lead 220. The insulating varnish covers the auxiliary lead 230.
[0141] For example, the insulating layer 400 may be an insulating varnish.
[0142] As one possible implementation, the capacitor also includes a side negative electrode 600, which is disposed on the side of the capacitor and connected to the negative lead 220 and / or the auxiliary lead 230.
[0143] For example, the side negative electrode 600 provides an additional electrical connection path. By adding the side negative electrode 600, the capacitor can distribute and carry current more efficiently, making it suitable for high-current applications and improving overall efficiency. The presence of the side negative electrode 600 enhances the redundancy of the electrical connection, improves the mechanical strength and electrical reliability of the capacitor, and reduces the risk of single point of failure.
[0144] In some embodiments, the side negative electrode 600 and the negative lead 220 are connected. During the use of the capacitor, current flows sequentially to the positive lead 210, the positive electrode, the negative electrode, the side negative electrode 600, and the negative lead 220.
[0145] In other embodiments, the side negative electrode 600 and the auxiliary lead 230 are connected. During the use of the capacitor, current flows sequentially to the positive lead 210, the positive electrode, the negative electrode, the side negative electrode 600, and the auxiliary lead 230.
[0146] In some other embodiments, the side negative electrode 600 is connected to both the negative lead-out terminal 220 and the auxiliary lead-out terminal 230. The capacitor has two current flow paths. During use, the current flows sequentially to the positive lead-out terminal 210, the positive terminal, the negative terminal, the side negative electrode 600, and the negative lead-out terminal 220. Simultaneously, the current flows sequentially to the positive lead-out terminal 210, the positive terminal, the negative terminal, the side negative electrode 600, and the auxiliary lead-out terminal 230.
[0147] In some embodiments, the positive electrode is disposed on the side of the capacitor body 500. Placing the positive electrode on the side of the capacitor body 500 can effectively utilize the external space of the capacitor.
[0148] The capacitor includes a side positive electrode 700, which is connected to the positive lead 210 and the positive electrode.
[0149] By directly connecting the positive lead 210 and the positive terminal through the side positive electrode 700, the current path can be shortened, and the connection stability between the positive terminal of the capacitor body 500 and the positive lead 210 can be improved.
[0150] In some embodiments, the carrier plate 100 is further provided with a second conductive via 110b. The second conductive via 110b extends through the first and second sides along the thickness direction of the carrier plate 100. The positive electrode is connected to the positive electrode lead-out 210 through the second conductive via 110b. By providing a dedicated second conductive via 110b for the positive electrode, the current path can be optimized, resistance and inductance can be reduced, thereby improving electrical performance. Furthermore, by designing different conductive vias for the positive and negative electrodes (and possibly the auxiliary lead-out 230), this design ensures that the electrical path of each electrode is independent, reducing mutual interference.
[0151] Compared to related technologies, the capacitor provided in this application embodiment has a capacitance increase of approximately 20%.
[0152] As one feasible implementation, the capacitor body 500 is composed of multiple capacitor units 10 stacked along the thickness direction of the carrier plate 100. By stacking multiple capacitor units 10, the total capacitance of the capacitor can be significantly increased within a limited volume, meeting higher capacitance requirements.
[0153] The positive electrode structures of multiple capacitor cells 10 extend towards the same side of the capacitor body 500, forming the positive electrode of the capacitor body 500. Since all positive electrode structures converge on the same side, the electrical connection becomes simpler and more direct. This reduces the need for complex internal wiring in the capacitor and lowers manufacturing complexity.
[0154] The negative electrode structures of multiple capacitor units 10 are connected sequentially along the stacking direction, and the negative electrode of the capacitor body 500 is formed by the negative electrode structure disposed on the adjacent side of the carrier plate 100.
[0155] The negative electrode structures of each capacitor cell 10 are connected sequentially in the stacking direction. This means that the negative electrode structure extends from one cell to the next, forming a continuous electrical path, reducing resistance and inductance when current flows. The stacked structure provides additional mechanical support, enhancing the structural stability of the capacitor and reducing the risk of failure due to mechanical stress.
[0156] As one possible implementation, as shown in FIG13, the capacitor further includes a stop 510.
[0157] The capacitor unit includes a positive electrode layer 11, a dielectric layer 12, and a negative electrode layer 13 stacked sequentially.
[0158] Along the extension direction of the carrier plate 100, a plurality of first ends 11a are disposed on the same side of the capacitor body 500 to form the positive electrode of the capacitor body 500.
[0159] The positive electrode layer 11 includes a first positive electrode portion and a second positive electrode portion; the second positive electrode portion is disposed on the side of the first positive electrode portion near the first end 11a of the positive electrode layer 11.
[0160] The dielectric layer 12 covers the outer periphery of the first positive electrode portion. A stop member 510 is disposed on the second positive electrode portion. The stop member 510 is a hydrophobic member.
[0161] The negative electrode layer 13 covers the outer periphery of the dielectric layer 12.
[0162] For example, during the fabrication of the capacitor cell 10, a dielectric layer 12 and a negative electrode layer 13 need to be coated around the positive electrode layer 11. However, the outer periphery of the positive electrode layer 11 is not completely covered by the negative electrode layer 13. The first positive electrode portion of the positive electrode layer 11 needs to be encapsulated by the dielectric layer 12 and the negative electrode layer. The second positive electrode portion of the positive electrode layer 11 does not need to be covered by the negative electrode layer 13. The second positive electrode portion of the positive electrode layer 11 is used to form the positive electrode structure.
[0163] A stop 510 is provided at the second positive electrode portion of the positive electrode layer 11. On one hand, the stop 510 acts as a physical barrier, helping to precisely position the coverage area of the negative electrode layer 13. By limiting the immersion position of the negative electrode layer 13 on the positive electrode layer coated with the dielectric layer, it can be ensured that it only covers the first positive electrode portion of the positive electrode layer 11, improving the accuracy of the negative electrode layer 13 covering the outer periphery of the positive electrode layer 11 and optimizing the geometry of the negative electrode layer 13. Exemplarily, the positive electrode layer 11 can be an aluminum layer. The dielectric layer 12 can be an alumina layer. The negative electrode layer 13 can be polyaniline.
[0164] Compared to related technologies, in the capacitor provided in this application embodiment, the positive electrode layer 11 does not need to be bent to form a positive electrode structure. In this application embodiment, the positive electrode layer 11 extends along the direction shown in X in FIG14 and is connected to the side positive electrode 700, which reduces the space occupied by the positive electrode layer 11 along the extension direction parallel to the carrier plate 100 (i.e., the direction shown in X in FIG14). In this way, more negative electrode layers 13 can be distributed in the capacitor along the extension direction parallel to the carrier plate 100, which improves the space utilization rate inside the capacitor and increases the capacitance of the capacitor.
[0165] For example, the stop 510 may be silicone.
[0166] As one possible implementation, as shown in FIG13, the capacitor body 500 further includes a conductive support 800.
[0167] The conductive support 800 is located between two adjacent capacitor cells 10, connects the positive electrode layer 11 of the two adjacent capacitor cells 10, and is disposed near the first end 11a of the positive electrode layer 11.
[0168] The conductive support 800 provides a low-resistance path to connect the positive electrode layers 11 of multiple capacitor cells 10, thereby reducing the impedance between adjacent capacitor cells 10 and lowering the electrical lead resistance. This helps improve the efficiency and frequency response of the capacitor. By connecting the positive electrode layers 11 of adjacent capacitor cells 10, the conductive support 800 helps achieve a uniform current distribution throughout the capacitor structure, reducing problems such as localized overheating and uneven current density.
[0169] Furthermore, since the positive electrode layer 11 is made of aluminum, which has low strength and is prone to deformation, a conductive support 800 is provided between the positive electrode layers of two adjacent capacitor units 10. This support can provide support for the positive electrode layer 11 at the first end 11a, preventing deformation at the positive electrode structure and enhancing the mechanical stability of the positive electrode layer 11.
[0170] In some embodiments, conductive supports 800 are provided at locations in two adjacent positive electrode layers that do not cover the negative electrode layer 13. Multiple conductive supports 800 are spaced apart along the extending direction of the positive electrode layer 11. The extending direction of the positive electrode layer 11 is shown as X in FIG14.
[0171] For example, the conductive support 800 can be a metal pad, such as an aluminum pad.
[0172] As one feasible implementation, referring to FIG14, the capacitor body 500 further includes a conductive connector 810. The conductive connector 810 is located between two adjacent capacitor cells 10 and connects the negative electrode layers of the two adjacent capacitor cells 10.
[0173] The conductive connector 810 is located between two adjacent capacitor cells 10 and is specifically used to connect the negative electrode structures of these cells to ensure electrical continuity. The negative electrode layers 13 between adjacent capacitor cells 10 are connected by the conductive connector 810.
[0174] For example, the conductive connector 810 includes silver paste and carbon paste.
[0175] For example, the area of the conductive connector 810 coated on the negative electrode layer 13 is equal to the area of the negative electrode layer 13. The smaller the difference between the coating area of the conductive connector 810 and the area of the negative electrode layer 13, the more optimized the conductive path, and the lower the impedance value after the conductive connector 810 and the negative electrode layer 13 are connected. However, the coating area of the conductive connector 810 should not be larger than the area of the negative electrode layer 13; otherwise, the excess portion may undergo adverse chemical reactions with other materials, affecting the stability and lifespan of the capacitor.
[0176] In some embodiments, the conductive connector 810 may be silver paste. Silver paste is conductive. It ensures efficient current transfer between capacitor cells 10, reduces resistance and power loss, and improves capacitor efficiency and high-frequency performance. Silver paste is also thermally conductive, aiding in effective heat dissipation, lowering the capacitor's operating temperature, and thus extending its lifespan.
[0177] In other embodiments, the conductive connector 810 may be carbon adhesive. Carbon adhesive is conductive. Carbon adhesive also has flexibility, enabling it to withstand mechanical stress and thermal expansion that may occur during capacitor use, reducing the risk of breakage and failure.
[0178] In one feasible implementation, the capacitor also includes a package 820, which covers the side of the capacitor body 500 opposite to the carrier plate 100 and the sidewalls of the capacitor body 500. The package 820 covers the top of the capacitor body 500, providing physical protection for the capacitor and preventing environmental factors such as moisture, dust, and mechanical damage from affecting the capacitor, thereby improving the capacitor's durability and reliability. The package 820 can be made of epoxy resin.
[0179] The positive electrode structure is exposed on the side of the package 820. This facilitates the connection of the positive electrode structure through the side positive electrode 700 and the positive lead 210, simplifying the installation and wiring process on the circuit board and improving assembly efficiency.
[0180] Both the positive side electrode 700 and the negative side electrode 600 are located on the outside of the package 820.
[0181] Along the extending direction of the carrier plate 100, the side positive electrode 700 and the side negative electrode 600 are located on opposite sides of the package 820.
[0182] Electrical isolation is ensured by arranging the positive side electrode 700 and the negative side electrode 600 on opposite sides of the package 820. This arrangement reduces the risk of short circuits and electromagnetic interference, improving the safety and electrical performance of the capacitor.
[0183] In some embodiments, during the use of the capacitor, firstly, the current flows through the positive lead-out terminal 210 to the side positive electrode 700, then the current flowing through the side positive electrode 700 flows to the positive structure of each capacitor unit 10, then the current flows to the negative structure of each capacitor unit 10, then the current flows to the conductive connector 810, then the current flows through the conductive connector 810 to the second conductive layer 300 on the second side of the carrier plate 100, and finally, the current flows through the second conductive layer 300 and the first conductive through-hole 110a to the auxiliary lead-out terminal 230.
[0184] In other embodiments, during the use of the capacitor, firstly, the current flows through the positive terminal 210 and the second conductive via 110b to the positive structure of the capacitor unit 10, then the current flows to the negative structure of each capacitor unit 10, then the current flows to the conductive connector 810, then the current flows through the conductive connector 810 to the second conductive layer 300 on the second side of the carrier plate 100, and finally the current flows through the second conductive layer 300 and the first conductive via 110a to the negative terminal 220.
[0185] In the description of the embodiments of this application, it should be understood that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. The terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "multiple" means two or more, unless otherwise precisely specified.
[0186] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0187] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
[0188] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. A capacitor, characterized in that, include: A carrier plate (100) is provided with a positive electrode lead-out terminal (210), a negative electrode lead-out terminal (220) and an auxiliary lead-out terminal (230) on a first side in the thickness direction; A capacitor body (500) is disposed on a second side of the carrier plate (100) in the thickness direction; the first side and the second side are opposite to each other in the thickness direction of the carrier plate (100); the capacitor body (500) includes a positive electrode and a negative electrode; the positive electrode lead-out terminal (210) is connected to the positive electrode, and the negative electrode lead-out terminal (220) and the auxiliary lead-out terminal (230) are both connected to the negative electrode; Along the extending direction of the carrier plate (100), the distance between the auxiliary lead-out end (230) and the positive lead-out end (210) is less than the distance between the negative lead-out end (220) and the positive lead-out end (210).
2. The capacitor according to claim 1, characterized in that, The negative electrode is located on one side of the capacitor body (500) in the thickness direction; The carrier plate (100) is provided with a first conductive through hole (110a), which extends through the first side and the second side along the thickness direction of the carrier plate (100). The negative electrode lead-out end (220) and the auxiliary lead-out end (230) are connected to the first conductive through hole (110a) and connected to the negative electrode through the first conductive through hole (110a).
3. The capacitor according to claim 2, characterized in that, There are multiple first conductive vias (110a), and the multiple first conductive vias (110a) are spaced apart along the extension direction of the carrier plate (100); The negative lead-out terminal (220) and the auxiliary lead-out terminal (230) are respectively connected to different first conductive through holes (110a).
4. The capacitor according to claim 2 or 3, characterized in that, Also includes: A first conductive layer (200) is disposed on the first side of the carrier plate (100); A second conductive layer (300) is disposed on the second side of the carrier plate (100) and located between the capacitor body (500) and the carrier plate (100); the second conductive layer (300) is connected to the negative electrode; The first conductive layer (200) is electrically connected to the second conductive layer (300) through the first conductive via (110a); The auxiliary lead (230) is formed on the side of the first conductive layer (200) near the positive lead (210), and the negative lead (220) is formed on the side of the first conductive layer (200) away from the positive lead (210).
5. The capacitor according to claim 2 or 3, characterized in that, The carrier plate (100) includes an insulating part (120) and a conductive part (130) that are connected to each other; The positive lead-out terminal (210) is provided on the side of the insulating part (120) away from the capacitor body (500); The conductive part (130) is connected to the negative electrode on the side near the capacitor body (500); the portion of the conductive part (130) near the positive electrode lead-out end (210) forms the auxiliary lead-out end (230); the portion of the conductive part (130) away from the positive electrode lead-out end (210) forms the negative electrode lead-out end (220).
6. The capacitor according to any one of claims 1-5, characterized in that, It also includes an insulating layer (400) disposed on the first side of the carrier plate (100) and located between the positive lead-out terminal (210) and the auxiliary lead-out terminal (230).
7. The capacitor according to any one of claims 1-6, characterized in that, It also includes a side negative electrode (600), which is disposed on the side of the capacitor and connected to the negative lead-out terminal (220) and / or the auxiliary lead-out terminal (230).
8. The capacitor according to claim 7, characterized in that, The positive electrode is disposed on the side of the capacitor body (500); The capacitor includes a side positive electrode (700), which is connected to the positive lead-out terminal (210) and the positive electrode; Alternatively, the carrier plate (100) may also be provided with a second conductive through hole (110b), which extends through the first side and the second side along the thickness direction of the carrier plate (100); The positive electrode is connected to the positive electrode lead-out terminal (210) through the second conductive through hole (110b).
9. The capacitor according to claim 8, characterized in that, The capacitor body (500) is composed of multiple capacitor units, which are stacked along the thickness direction of the carrier plate (100); The positive electrode structures of the plurality of capacitor units extend toward the same side of the capacitor body (500) to form the positive electrode of the capacitor body (500); The negative electrode structures of the plurality of capacitor units are connected sequentially along the stacking direction, and the negative electrode of the capacitor body (500) is formed by the negative electrode structure disposed on the adjacent side of the carrier plate (100).
10. The capacitor according to claim 9, characterized in that, It also includes a stop (510); The capacitor unit includes: a positive electrode layer (11), a dielectric layer (12) and a negative electrode layer (13) stacked sequentially; Along the extending direction of the carrier plate (100), a plurality of first ends (11a) are disposed on the same side of the capacitor body (500) to form the positive electrode of the capacitor body (500); The positive electrode layer (11) includes a first positive electrode portion and a second positive electrode portion; the second positive electrode portion is disposed on the side of the first positive electrode portion near the first end (11a) of the positive electrode layer (11); The dielectric layer (12) covers the outer periphery of the first positive electrode portion; the stop member (510) is disposed on the second positive electrode portion; the stop member (510) is a hydrophobic member; The negative electrode layer (13) covers the outer periphery of the dielectric layer (12).
11. The capacitor according to claim 10, characterized in that, The capacitor body (500) also includes a conductive support (800); The conductive support (800) is located between two adjacent layers of the capacitor unit, connects the positive electrode layer (11) of the two adjacent layers of the capacitor unit, and is disposed near the first end (11a) of the positive electrode layer (11).
12. The capacitor according to claim 10, characterized in that, The capacitor body (500) further includes a conductive connector (810), which is located between two adjacent capacitor cells and connects the negative electrode layer of the two adjacent capacitor cells.
13. The capacitor according to any one of claims 9-12, characterized in that, It also includes a package (820) that covers the side of the capacitor body (500) away from the carrier plate (100) and the side of the capacitor body (500). The positive electrode structure is exposed on the side of the package (820); When the capacitor includes a side positive electrode (700), both the side positive electrode (700) and the side negative electrode (600) are located on the outside of the package (820); along the extension direction of the carrier plate (100), the side positive electrode (700) and the side negative electrode (600) are located on opposite sides of the package (820).
14. An electronic device, characterized in that, The capacitor includes any one of claims 1-13.