Semiconductor plastic packaging device

Abstract

The utility model discloses a semiconductor plastic packaging device, and relates to the field of semiconductor plastic packaging, the semiconductor plastic packaging device comprises a box body, and an inner cavity of the box body is provided with a heating conveying mechanism and an extrusion mechanism; the heating conveying mechanism comprises a heating bin fixedly mounted at the top of the inner surface of the box body, and a stirring barrel is arranged at the bottom of the inner surface of the box body; the extrusion mechanism comprises an L-shaped plate and a lower mold which are fixedly mounted at the bottom of the inner surface of the box body, an upper mold is arranged on one side of the L-shaped plate, a male sealing strip is fixedly mounted at the bottom of the upper mold, and a female sealing strip is fixedly connected to the top of the lower mold. Through the effect of the heating and conveying mechanism, plastic packaging raw materials can be melted into liquid, bubbles in the liquid raw materials can be discharged for the first time, the liquid raw materials are put into the stirring barrel, operation of the first motor is controlled, and the first motor drives the stirring rod to stir the raw materials in the inner cavity of the stirring barrel; the device has the effect of discharging bubbles in liquid raw materials for the first time.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor plastic package technical field, especially a semiconductor plastic package device. BACKGROUND

[0002] With the rapid development of electronic information technology, semiconductor devices are increasingly widely used in various fields, such as computers, communications, consumer electronics, automotive electronics, etc., in order to meet the market demand for high performance, miniaturization, high reliability of electronic products, semiconductor packaging technology is constantly evolving, and semiconductor plastic packaging as an important packaging method has the effect of protecting the chip from the interference of the external environment.

[0003] First, the block plastic sealing material is placed in the mold hole of the plastic sealing press, then the block plastic sealing material is heated at high temperature, so that the plastic sealing material is melted, then the injection head is used to extrude the melted plastic sealing material, and the melted plastic sealing material gradually covers the wafer from the bottom of the hole after entering the hole, and the wafer is completely covered and wrapped, and then the wafer is molded and solidified, so that the wafer is plasticized and sealed.

[0004] The existing semiconductor plastic packaging device, after the plastic sealing material is melted into a liquid state, a large number of bubbles are generated in the plastic sealing material, a large number of bubbles appear on the shell after plastic sealing and solidification, thereby reducing the product qualification rate, therefore, a semiconductor plastic packaging device is provided. UTILITY MODEL CONTENTS

[0005] (I) Technical problem solved

[0006] In view of the problems existing in the prior art, the utility model provides a semiconductor plastic packaging device.

[0007] (II) Technical scheme

[0008] In order to achieve the above purpose, the utility model is realized by the following technical scheme: a semiconductor plastic packaging device, comprising a box body, a heating conveying mechanism and an extrusion mechanism are arranged in the inner cavity of the box body.

[0009] As a preferred scheme of the semiconductor plastic packaging device, the heating conveying mechanism comprises a heating bin fixedly installed on the top of the inner surface of the box body, and a stirring barrel is arranged on the bottom of the inner surface of the box body.

[0010] As a preferred scheme of the semiconductor plastic packaging device, the extrusion mechanism comprises an L-shaped plate and a lower mold fixedly installed on the bottom of the inner surface of the box body, one side of the L-shaped plate is provided with an upper mold, the bottom of the upper mold is fixedly installed with a male sealing strip, and the top of the lower mold is fixedly connected with a female sealing strip.

[0011] As a preferred scheme of the semiconductor plastic packaging device, the inner surface bottom of the box is provided with a fixed plate, a sliding rod and a lead screw are arranged on one side of the fixed plate and the box, an injection molding gun is installed on the outer side of the lead screw through a threaded sleeve, and a second motor is fixedly connected to the outer side of the lead screw.

[0012] As a preferred scheme of the semiconductor plastic packaging device, the inner surface bottom of the box is provided with a fixed plate, a sliding rod and a lead screw are arranged on one side of the fixed plate and the box, an injection molding gun is installed on the outer side of the lead screw through a threaded sleeve, and a second motor is fixedly connected to the outer side of the lead screw.

[0013] As a preferred scheme of the semiconductor plastic packaging device, the inner surface bottom of the box is provided with a fixed plate, a sliding rod and a lead screw are arranged on one side of the fixed plate and the box, an injection molding gun is installed on the outer side of the lead screw through a threaded sleeve, and a second motor is fixedly connected to the outer side of the lead screw.

[0014] As a preferred scheme of the semiconductor plastic packaging device, the inner surface bottom of the box is provided with a fixed plate, a sliding rod and a lead screw are arranged on one side of the fixed plate and the box, an injection molding gun is installed on the outer side of the lead screw through a threaded sleeve, and a second motor is fixedly connected to the outer side of the lead screw.

[0015] As a preferred scheme of the semiconductor plastic packaging device, the inner surface bottom of the box is provided with a fixed plate, a sliding rod and a lead screw are arranged on one side of the fixed plate and the box, an injection molding gun is installed on the outer side of the lead screw through a threaded sleeve, and a second motor is fixedly connected to the outer side of the lead screw.

[0016] (Three) beneficial effects

[0017] The semiconductor plastic packaging device has the following beneficial effects:

[0018] 1. The heating conveying mechanism can melt the plastic packaging raw material into a liquid state, and can initially discharge the bubbles in the liquid raw material. The liquid raw material is placed in the stirring barrel, the operation of the first motor is controlled, and the first motor drives the stirring rod to stir the raw material in the inner cavity of the stirring barrel, thereby achieving the first bubble discharge effect.

[0019] 2. The extrusion mechanism can be used for plastic packaging of semiconductors. The semiconductor is placed in the inner cavity composed of the lower mold and the upper mold, the male sealing strip is completely inserted in the female sealing strip, and the sealing is formed. After the raw material is injected, the cover plate is completely covered on the hole of the upper mold, and the original internal bubbles are extracted. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0021] Figure 1 is a schematic diagram of the overall structure of the box body of the present application.

[0022] Figure 2 is a schematic diagram of the overall structure of the box body of the present application.

[0023] Figure 3 is a schematic diagram of the overall structure of the heating and conveying mechanism of the present application.

[0024] Figure 4 is a schematic diagram of the overall structure of the extrusion mechanism of the present application.

[0025] Figure 5 is a schematic diagram of the local structure of the extrusion mechanism of the present application.

[0026] In the figure: 1, box body; 2, heating and conveying mechanism; 201, stirring barrel; 202, heating bin; 203, fixed plate; 204, first motor; 205, stirring rod; 206, slide rod; 207, screw rod; 208, injection gun; 209, hose; 210, second motor; 3, extrusion mechanism; 301, L-shaped plate; 302, lower mold; 303, telescopic cylinder; 304, upper mold; 305, male sealing strip; 306, female sealing strip; 307, vacuum pump; 308, air cylinder; 309, U-shaped plate; 310, cover plate. DETAILED DESCRIPTION

[0027] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings of the embodiments of the present application.

[0028] Embodiment 1

[0029] Referring to Figure 1 , Figure 2 and Figure 3 , the first embodiment of the present application provides a semiconductor plastic packaging device, which comprises a box body 1, and the inner cavity of the box body 1 is provided with a heating and conveying mechanism 2 and an extrusion mechanism 3.

[0030] The heating and conveying mechanism 2 comprises a heating bin 202 fixedly installed on the top inner surface of the box body 1, and the bottom inner surface of the box body 1 is provided with a stirring barrel 201.

[0031] Specifically, the plastic sealing raw materials are manually fed into the heating bin 202, which has the function of heating the raw materials to melt them. The outlet end of the heating bin 202 is located above the stirring barrel 201, and the heated liquid raw materials flow into the stirring barrel 201 for standby.

[0032] The inner surface of the box body 1 is provided with a fixed plate 203, and the fixed plate 203 and one side of the box body 1 are provided with a sliding rod 206 and a lead screw 207. The outer side of the lead screw 207 is provided with an injection gun 208 through a threaded sleeve. One end of the lead screw 207 extends to the outside of the fixed plate 203 and is fixedly connected with a second motor 210.

[0033] Specifically, by controlling the operation of the second motor 210, the output end of the second motor 210 drives the lead screw 207 to rotate, and under the assistance of the sliding rod 206, the lead screw 207 can drive the injection gun 208 to move stably, which has the function of controlling the left and right movement of the injection gun 208.

[0034] The inner cavity of the stirring barrel 201 is provided with a stirring rod 205, and the top end of the stirring rod 205 is fixedly installed with a first motor 204. The bottom of the stirring barrel 201 is fixedly connected with a hose 209.

[0035] Specifically, by controlling the operation of the first motor 204, the first motor 204 drives the stirring rod 205 to rotate in the inner cavity of the stirring barrel 201, stirs the liquid raw materials heated by the heating bin 202, and discharges the bubbles in the raw materials.

[0036] The sliding rod 206 is fixedly installed on the opposite side of the fixed plate 203 and the box body 1, and the lead screw 207 is rotatably connected on the opposite side of the fixed plate 203 and the box body 1. The other end of the hose 209 is in communication with the injection gun 208.

[0037] Specifically, the injection gun 208 is provided with a self-suction function, so that the stirred raw materials can be injected into the extrusion mechanism 3 through the assistance of the hose 209 for plastic sealing.

[0038] Further, the granular plastic sealing raw materials are manually placed in the heating bin 202, and the heating components in the heating bin 202 heat them to a liquid state. At this time, the liquid raw materials are discharged downward and fall into the stirring barrel 201. The operation of the first motor 204 is controlled, and the first motor 204 drives the stirring rod 205 to stir the liquid raw materials in the inner cavity of the stirring barrel 201 to discharge the bubbles in the liquid raw materials for the first time. The operation of the second motor 210 is controlled to push the injection gun 208 to the predetermined position. Under the assistance of the hose 209, the raw materials in the second motor 210 are sucked into the injection gun 208, and are discharged from the output end of the injection gun 208 into the extrusion mechanism 3 for plastic sealing.

[0039] Example 2

[0040] Referring to Figure 2 、 Figure 4 and Figure 5 , the second embodiment of the utility model, this embodiment is based on the last embodiment, can extrude mechanism 3 of semiconductor plastic package.

[0041] Extrusion mechanism 3 includes the L-shaped plate 301 fixedly installed in the bottom of the inner surface of the box 1 and the lower die 302, and the upper die 304 is arranged on one side of the L-shaped plate 301, the bottom of the upper die 304 is fixedly installed with the male sealing strip 305, and the top of the lower die 302 is fixedly connected with the female sealing strip 306.

[0042] Specifically, first, the semiconductor is placed in the inner cavity formed by the lower die 302 and the upper die 304, then the liquid raw material is placed in the inner cavity from the top of the upper die 304, and the upper die 304 is completely pressed on the lower die 302, and the lower die 302 and the upper die 304 form a closed space under the cooperation of the male sealing strip 305 and the female sealing strip 306, so that the semiconductor can be plastic packaged.

[0043] The top of the upper die 304 is symmetrically provided with the telescopic cylinder 303, the top of the upper die 304 is fixedly installed with the air cylinder 308, the U-shaped plate 309 and the vacuum pump 307, and the output end of the air cylinder 308 is fixedly connected with the cover plate 310.

[0044] Specifically, the operation of the air cylinder 308 is controlled, the air cylinder 308 pushes the cover plate 310 to move in the U-shaped plate 309, the cover plate 310 is completely covered at the hole on the top of the upper die 304, the operation of the vacuum pump 307 is controlled, and the raw material at the bottom of the upper die 304 is slowly vacuumed, and the second raw material air emptying operation is carried out.

[0045] The male sealing strip 305 is movably inserted into the inside of the female sealing strip 306, the other end of the telescopic cylinder 303 is fixedly connected with the L-shaped plate 301, the cover plate 310 is movably inserted into the inside of the U-shaped plate 309, and the vacuum pump 307 is connected with the cover plate 310 through the pipeline.

[0046] Further, first, the semiconductor is placed in the inner cavity formed by the lower die 302 and the upper die 304, then the liquid raw material is placed in the inner cavity from the top of the upper die 304, and the upper die 304 is completely pressed on the lower die 302, and the lower die 302 and the upper die 304 form a closed space under the cooperation of the male sealing strip 305 and the female sealing strip 306, the operation of the air cylinder 308 is controlled, the air cylinder 308 pushes the cover plate 310 to move in the U-shaped plate 309, the cover plate 310 is completely covered at the hole on the top of the upper die 304, and the operation of the vacuum pump 307 is controlled, and the raw material at the bottom of the upper die 304 is slowly vacuumed.

[0047] Working principle: manually put the granular plastic packaging raw materials in the heating bin 202, the heating components in the heating bin 202 heat it to liquid state, at this time, the liquid raw materials are put down and fall into the stirring barrel 201, control the operation of the first motor 204, the first motor 204 drives the stirring rod 205 to stir the liquid raw materials in the inner cavity of the stirring barrel 201, to remove the bubbles in the liquid raw materials for the first time, control the operation of the second motor 210, push the injection gun 208 to the predetermined position, at this time, the semiconductor is placed in the inner cavity formed by the lower mold 302 and the upper mold 304, then the liquid raw materials are placed in the inner cavity from the top of the upper mold 304, and the upper mold 304 is completely pressed on the lower mold 302, under the cooperation of the male sealing strip 305 and the female sealing strip 306, the lower mold 302 and the upper mold 304 form a sealed space, the injection gun 208 is located at the hole of the upper mold 304 at this time, under the assistance of the hose 209, the raw materials are injected into the upper mold 304, control the operation of the air cylinder 308, the air cylinder 308 pushes the cover plate 310 to move in the U-shaped plate 309, the cover plate 310 completely covers the hole at the top of the upper mold 304, control the operation of the vacuum pump 307, slowly vacuumize the raw materials at the bottom of the upper mold 304, completely remove the bubbles in the raw materials, after plastic packaging, control the upper mold 304 to move upwards, take out the semiconductor plastic packaged in the lower mold 302.

[0048] It should be noted that in this text, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations.

Claims

1. A semiconductor plastic package comprising a case, characterized by: The inner cavity of the box is provided with a heating conveying mechanism and an extruding mechanism; The heating conveying mechanism comprises a heating bin fixedly installed on the top of the inner surface of the box, and a stirring barrel is arranged on the bottom of the inner surface of the box; The extruding mechanism comprises an L-shaped plate and a lower die fixedly installed on the bottom of the inner surface of the box, one side of the L-shaped plate is provided with an upper die, the bottom of the upper die is fixedly installed with a male sealing strip, and the top of the lower die is fixedly connected with a female sealing strip.

2. The semiconductor plastic package device according to claim 1, wherein: The bottom of the inner surface of the box is provided with a fixed plate, the fixed plate and one side of the box are provided with a sliding rod and a lead screw, the outer side of the lead screw is installed with an injection gun through a threaded sleeve, and one end of the lead screw extends to the outside of the fixed plate and is fixedly connected with a second motor.

3. The semiconductor plastic package device of claim 2, wherein: The stirring barrel is provided with a stirring rod in the inner cavity, the top end of the stirring rod is fixedly installed with a first motor, and the bottom of the stirring barrel is fixedly communicated with a hose.

4. The semiconductor plastic package device according to claim 3, wherein: The sliding rod is fixedly installed on the opposite side of the fixed plate and the box, the lead screw is rotatably connected on the opposite side of the fixed plate and the box, and the other end of the hose is in communication with the injection gun.

5. The semiconductor plastic package device according to claim 1, wherein: The top of the upper die is symmetrically provided with a telescopic cylinder, the top of the upper die is fixedly installed with an air cylinder, a U-shaped plate and a vacuum pump, and the output end of the air cylinder is fixedly connected with a cover plate.

6. The semiconductor plastic package device according to claim 5, wherein: The male sealing strip is movably inserted into the female sealing strip, the other end of the telescopic cylinder is fixedly connected with the L-shaped plate, the cover plate is movably inserted into the U-shaped plate, and the vacuum pump is connected with the cover plate through a pipeline.

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