Original silicon wafer decrystallization detection device

Abstract

The utility model relates to a decrystallization detection device for an original silicon wafer. The decrystallization detection device comprises a photographing assembly and a light source assembly, the light source assembly includes a first light source, a second light source and a diffusion plate. A diffusion plate is arranged vertically below the first light source and the second light source. A first column and a second column are arranged at two horizontal ends of the light source assembly. The first stand column and the second stand column are connected above the light source assembly in the vertical direction through a mounting plate. And a photographing assembly is mounted on the mounting plate. Whether the original silicon wafer is decrystallized or not can be reflected in different brightness display modes on the image of the original silicon wafer of which the image is acquired by the device disclosed by the utility model. According to the utility model, by using a special lighting scheme, the decrystallization defect of an original silicon wafer can be obviously highlighted in an image acquired by the photographing assembly, so that the visual inspection of subsequent operators is facilitated, and the detection accuracy is improved.

Description

Technical Field

[0001] This utility model relates to silicon wafer decrystallization detection, belonging to the photovoltaic production field, and particularly to a device for detecting silicon wafer decrystallization. Background Technology

[0002] Solar energy is an inexhaustible, clean, and environmentally friendly ideal energy source. Converting solar energy into electricity through photovoltaic cells is an important way to utilize solar energy. In the cell production process, it is necessary to select and monitor the raw silicon wafers after cutting the silicon material, promptly removing defective wafers to reduce subsequent production resource input and avoid waste. During production, various factors such as impacts during cutting and transportation often lead to decrystalline defects at the edges of the raw silicon wafers. Because the raw silicon wafers are made of metallic silicon, with a smooth surface and very strong reflective properties, decrystalline defects are structural gaps that also exhibit strong reflective properties. Therefore, conventional area array cameras combined with dome light sources are not very effective at highlighting these defects, resulting in high detection difficulty and low accuracy.

[0003] Therefore, this utility model proposes a silicon wafer desiccant detection device to solve the problems existing in the prior art.

[0004] Furthermore, on the one hand, there are differences in understanding among those skilled in the art; on the other hand, the applicant studied a large number of documents and patents when making this utility model, but due to space limitations, not all details and contents were listed in detail. However, this does not mean that this utility model does not have the features of these prior art. On the contrary, this utility model has all the features of the prior art, and the applicant reserves the right to add relevant prior art to the background art. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a silicon wafer descaling detection device, comprising a photographic assembly and a light source assembly. The light source assembly includes a first light source, a second light source, and a diffuser plate. The diffuser plate is positioned vertically below the first and second light sources. A first column and a second column are positioned at the horizontal ends of the light source assembly. The first and second columns are connected vertically above the light source assembly via a mounting plate. The photographic assembly is mounted on the mounting plate.

[0006] According to a preferred embodiment, a base plate for connecting the first light source and the second light source is provided at their vertical ends. The base plate has a slit corresponding to the diffuser plate.

[0007] According to a preferred embodiment, the photographic component is arranged on the mounting plate in the direction of the slit.

[0008] According to a preferred embodiment, at least two intermediate light-blocking plates are provided between the first light source and the second light source and between the upper base plate of the light source and the diffuser plate.

[0009] According to a preferred embodiment, at least two intermediate light-blocking plates are joined together. At least one intermediate light-blocking plate is inclined at the end away from the diffuser plate toward the position of the first light source or the second light source.

[0010] According to a preferred embodiment, a first detection end plate connecting the first light source and the first column is provided at the end of the first light source near the first column. A second detection end plate connecting the second light source and the second column is provided at the end of the second light source near the second column.

[0011] According to a preferred embodiment, at least two diffuser plates are disposed vertically below the first light source and the second light source. A mounting pad is disposed between the at least two diffuser plates.

[0012] According to a preferred embodiment, a third column is further provided on the first column at the vertically downward end of the first light source. A fourth column is further provided on the second column at the vertically downward end of the second light source.

[0013] According to a preferred embodiment, the first light source and the second light source are inclined toward the axis of the light source assembly.

[0014] According to a preferred embodiment, the horizontal length of the light source assembly is equal to the distance between the upper base plate of the light source assembly and the photographic assembly. Attached Figure Description

[0015] Figure 1 This is a simplified structural diagram of a preferred embodiment of the silicon wafer desiccant detection device provided by this utility model;

[0016] Figure 2 This is a simplified exploded view of a preferred embodiment of the silicon wafer desiccant detection device provided by this utility model;

[0017] Figure 3 This is a simplified structural diagram of a light source assembly according to a preferred embodiment of the present invention;

[0018] Figure 4 This is a simplified exploded view of the light source assembly according to a preferred embodiment of the present invention;

[0019] Figure 5 This is a simplified exploded view of the light source assembly according to another preferred embodiment of the present invention;

[0020] Figure 6This is a simplified schematic diagram of a preferred embodiment of the silicon wafer desiccation detection device provided by this utility model for use in the normal area of ​​a silicon wafer;

[0021] Figure 7 This is a simplified schematic diagram of a preferred embodiment of the silicon wafer desiccation detection device provided by this utility model for use in the silicon wafer desiccation area;

[0022] Figure 8 This is a simplified schematic diagram of the slit opening of the diffuser plate according to a preferred embodiment of the present invention;

[0023] Figure 9 This is a simplified schematic diagram of a first light source, a second light source, and a diffuser plate according to a preferred embodiment of the present invention.

[0024] List of reference numerals

[0025] 100: Photographic component; 200: Light source component; 201: First light source; 202: Second light source; 203: Diffuser plate; 204: Upper base plate of light source; 205: Middle light-blocking plate; 206: Mounting pad; 301: First column; 302: Second column; 303: Mounting plate; 304: First detection end plate; 305: Second detection end plate; 306: Third column; 307: Fourth column. Detailed Implementation

[0026] The following is a detailed explanation with reference to the accompanying drawings.

[0027] Example 1

[0028] This utility model provides a silicon wafer descaling detection device, including a photographic assembly 100 and a light source assembly 200. For example... Figure 1 and Figure 2 As shown, the light source assembly 200 includes a first light source 201, a second light source 202, and a diffuser plate 203. The diffuser plate 203 is disposed vertically below the first light source 201 and the second light source 202. A first column 301 and a second column 302 are disposed at the horizontal ends of the light source assembly 200. The first column 301 and the second column 302 are connected vertically above the light source assembly 200 via a mounting plate 303. A photographic assembly 100 is mounted on the mounting plate 303. Preferably, the photographic assembly 100 can be a line scan camera. The photographic assembly 100 is used for image acquisition. Preferably, the raw silicon wafer can be placed vertically below the light source assembly 200 via a conveying mechanism. More preferably, the raw silicon wafer can be conveyed through the diffuser plate 203 vertically below and aligned with its slit, thereby enabling the photographic assembly 100 to acquire an image.

[0029] Due to the presence of diffuser plate 203, such as Figure 6As shown, if the image of the original silicon wafer located in the slit of the diffuser plate 203, acquired by the imaging component 100, is a normal area, the smooth surface of the original silicon wafer will reflect the light emitted by the light source component 200 specularly. Since the imaging component 100, the light source component 200, and their internal components are all perpendicular to each other, the light emitted through the diffuser plate 203 will not enter the lens of the imaging component 100 due to specular reflection. Therefore, the normal area of ​​the original silicon wafer will have lower brightness in the image acquired by the imaging component 100.

[0030] like Figure 7 As shown, if the image of the original silicon wafer located at the slit in the diffuser plate 203, acquired by the imaging component 100, is a region with crystal detachment defects, this region has unevenness on the surface structure of the silicon wafer. Although specular reflection exists, the directions of reflection are different. Therefore, this region with crystal detachment defects will refract the light emitted by the light source component 200 into the imaging component 100. Consequently, the region with crystal detachment defects will appear brighter in the image acquired by the imaging component 100. The device of this invention effectively highlights the crystal detachment defects of the original silicon wafer in the image, facilitating subsequent inspection.

[0031] In summary, the silicon wafer image captured by the device of this invention can be displayed in the image with different brightness levels to indicate whether the silicon wafer has undergone crystal detachment. This invention, through the use of a special lighting scheme, can clearly highlight the crystal detachment defects of the silicon wafer in the image captured by the imaging component 100, thereby facilitating visual inspection by subsequent operators and improving the accuracy of the inspection.

[0032] According to a preferred embodiment, such as Figure 3 and Figure 4 As shown, a light source upper base plate 204 is provided at the vertical end of the first light source 201 and the second light source 202, connecting the first light source 201 and the second light source 202. The light source upper base plate 204 has a slit corresponding to the diffuser plate 203. The first light source 201 and the second light source 202 are inclined towards the axis of the light source assembly 200. Preferably, the first light source 201 and the second light source 202 can be line scan light sources. The light source upper base plate 204 splices the first light source 201 and the second light source 202 together, thereby forming a light source fixed on both sides of the slit in the diffuser plate 203. Figure 8 and Figure 9 As shown, in this invention, the spacing of the slits in the diffuser plate 203 is preferably 5mm. Therefore, the length of the first light source 201 and the second light source 202 after splicing is preferably 300mm, the width is preferably 105mm, and the height is not limited. This invention adopts a dual-light source illumination scheme, effectively revealing the desiccant defects of the original silicon wafer in the image acquired by the imaging component 100, reducing false alarms and missed detections, improving detection accuracy and effectiveness, and reducing costs and increasing efficiency for users.

[0033] According to a preferred embodiment, the photographic assembly 100 is mounted on the mounting plate 303 facing the slit. The photographic assembly 100 is directly and vertically aligned with the slit of the diffuser plate 203, thereby acquiring an image at the slit. Preferably, the horizontal length of the light source assembly 200 is equal to the distance between the upper base plate 204 of the light source assembly 200 and the photographic assembly 100. Preferably, the distance between the photographic assembly 100 and the vertical top of the first light source 201 and the second light source 202 is preferably 300 mm. Thus, the camera scanning area of ​​the photographic assembly 100 of this invention passes through the 5 mm slit between the first light source 201 and the second light source 202.

[0034] According to a preferred embodiment, a first detection end plate 304 connecting the first light source 201 and the first column 301 is provided at one end of the first light source 201 near the first column 301. A second detection end plate 305 connecting the second light source 202 and the second column 302 is provided at one end of the second light source 202 near the second column 302. The first detection end plate 304 and the second detection end plate 305 can fix the light source assembly 200, thereby stabilizing the image acquired by the subsequent imaging assembly 100 and improving detection accuracy.

[0035] According to a preferred embodiment, a third column 306 is further provided on the first column 301, located at the vertically downward end of the first light source 201. A fourth column 307 is further provided on the second column 303, located at the vertically downward end of the second light source 202. Thus, the photographic component 100 and the light source component 200 of this invention are combined into a detection module, which can be installed above the cell transport track, allowing several silicon wafers to pass vertically downward through the opening of the light source component 200. More preferably, the bottom of the light source component 200 is preferably 10mm away from the silicon wafer being photographed. More preferably, the silicon wafer can be transported on the cell transport track, and when the silicon wafer is about to pass the photographing point, it will trigger a corresponding position sensor. This position sensor can be integrated into the light source component 200 or disposed on a column. The position sensor transmits a signal to the photographic component 100, thereby the photographic component 100 begins to acquire images, and simultaneously sends a lighting signal to the light source component 200 to illuminate the first light source 201 and the second light source 202. The camera module 100 uploads the acquired images to a host computer. The host computer analyzes and processes the images to obtain detection results, which are then sent to automated equipment for the removal of downgraded films. The host computer can also display the results to operators for their instructions on removing downgraded films.

[0036] Example 2

[0037] This embodiment is a further supplement to the above embodiments, and describes another specific implementation of the light source assembly 200. For example... Figure 2 and Figure 5 As shown, preferably, at least two intermediate light-blocking plates 205 are disposed between the first light source 201 and the second light source 202, and between the upper base plate 204 and the diffuser plate 203. Preferably, the at least two intermediate light-blocking plates 205 are joined together. There is a gap between the at least two intermediate light-blocking plates 205. Preferably, the gap is greater than or equal to 5 mm. This allows light passing through the slit in the diffuser plate 203 to enter the photographic assembly 100 through the light-blocking plate 205, and the light-blocking plate 205 filters out excess light that cannot enter the photographic assembly 100. At least one intermediate light-blocking plate 205 is inclined at one end away from the diffuser plate 203 toward the first light source 201 or the second light source 202. The inclined opening of the intermediate light-blocking plate 205 optimizes the light propagation path, ensuring that light that can enter the photographic assembly 100 is not blocked, while light that cannot enter the photographic assembly 100 is blocked, thus achieving the effect of light blocking.

[0038] According to a preferred embodiment, at least two diffuser plates 203 are disposed vertically below the first light source 201 and the second light source 202. A mounting pad 206 is disposed between the at least two diffuser plates 203. The mounting pad 206 facilitates the installation of the diffuser plates 203 and is also beneficial for the subsequent addition of sensors, such as position sensors.

[0039] Throughout the text, the features indicated by “preferred” are only optional and should not be construed as mandatory. Therefore, the applicant reserves the right to abandon or delete the relevant preferred features at any time.

[0040] It should be noted that the specific embodiments described above are exemplary. Those skilled in the art can devise various solutions inspired by the disclosure of this utility model, and these solutions all fall within the scope of this utility model and its protection. Those skilled in the art should understand that this utility model specification and its drawings are illustrative and not intended to limit the scope of the claims. The protection scope of this utility model is defined by the claims and their equivalents.

Claims

1. A device for detecting the crystal removal of original silicon wafers, characterized in that, It includes a photographic assembly (100) and a light source assembly (200). The light source assembly (200) includes a first light source (201), a second light source (202), and a diffuser plate (203). The diffuser plate (203) is disposed vertically below the first light source (201) and the second light source (202). The light source assembly (200) has a first column (301) and a second column (302) at its horizontal ends. The first column (301) and the second column (302) are connected vertically above the light source assembly (200) by a mounting plate (303). The photographic assembly (100) is mounted on the mounting plate (303).

2. The silicon wafer desiccant detection device according to claim 1, characterized in that, The first light source (201) and the second light source (202) are provided with a light source upper base plate (204) connecting the first light source (201) and the second light source (202) at their vertical ends, wherein, The upper base plate (204) of the light source is provided with a slit corresponding to the diffuser plate (203).

3. The silicon wafer desiccant detection device according to claim 2, characterized in that, The photographic component (100) is mounted on the mounting plate (303) in a direction toward the slit.

4. The silicon wafer desiccant detection device according to claim 3, characterized in that, At least two intermediate light-blocking plates (205) are provided between the first light source (201) and the second light source (202) and between the upper base plate (204) of the light source and the diffuser plate (203).

5. The silicon wafer desiccant detection device according to claim 4, characterized in that, At least two of the aforementioned intermediate light-blocking plates (205) are joined together, wherein, At least one of the intermediate light-blocking plates (205) is tilted toward the first light source (201) or the second light source (202) at one end away from the diffuser plate (203).

6. The silicon wafer desiccant detection device according to claim 5, characterized in that, The first light source (201) is provided with a first detection end plate (304) connecting the first light source (201) and the first column (301) at one end near the first column (301), and the second light source (202) is provided with a second detection end plate (305) connecting the second light source (202) and the second column (302) at one end near the second column (302).

7. The silicon wafer desiccant detection device according to claim 5, characterized in that, At least two diffuser plates (203) are disposed vertically below the first light source (201) and the second light source (202), wherein, A mounting pad (206) is provided between at least two of the diffuser plates (203).

8. The silicon wafer desiccant detection device according to claim 7, characterized in that, The first column (301) is also provided with a third column (306) located at the vertical lower end of the first light source (201), and the second column (302) is also provided with a fourth column (307) located at the vertical lower end of the second light source (202).

9. The silicon wafer desiccant detection device according to claim 8, characterized in that, The first light source (201) and the second light source (202) are inclined toward the axis of the light source assembly (200).

10. The silicon wafer desiccant detection device according to claim 9, characterized in that, The horizontal length of the light source assembly (200) is equal to the distance between the upper base plate (204) of the light source assembly (200) and the photographic assembly (100).

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