Rotation-adjustable chip testing device

Abstract

The utility model relates to the technical field of automation equipment, and discloses a chip testing device capable of being adjusted in a rotating mode, an upper cover is designed to be composed of a cover body, a rotating handle and a stud, so that the stud can move up and down in a threaded hole by rotating the rotating handle in a threaded adjusting mode, and therefore a spring floating mechanism is driven to move up and down. According to the utility model, the micro-scale accurate position adjustment is realized, the optimal contact state between the probe module and the chip test point is ensured, the adaptability and flexibility of the test are improved, the accuracy and reliability of the test result are further improved, and a more powerful guarantee is provided for the improvement of the production quality of the chip. In addition, the device has the advantages of labor saving and easiness in operation, and is suitable for wide-range popularization and application.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a chip testing device with rotation adjustment. Background Technology

[0002] BGA, or Ball Grid Array, is a widely used advanced packaging technology in the integrated circuit field. It uses an organic substrate as its packaging material. BGA packaging technology offers several significant advantages: First, it significantly reduces the package area, leading to more compact and lightweight electronic device designs. Second, BGA technology significantly enhances chip functionality by greatly increasing the number of pins, effectively meeting the high pin density requirements of complex circuit designs. Third, in printed circuit board soldering processes, BGA packaging has a self-centering characteristic, facilitating soldering operations and improving production efficiency and soldering quality. Furthermore, BGA packaging has gained widespread recognition and favor in the electronics manufacturing industry due to its high reliability, excellent electrical performance, and relatively low overall cost.

[0003] The chip manufacturing process is complex and meticulous, encompassing multiple key stages such as chip design, wafer fabrication, packaging, and rigorous testing. Although smart chips have been widely applied in numerous fields, significant leaps in yield and production capacity have not yet been achieved. Chip testing, as a core component of the manufacturing process, aims to comprehensively and thoroughly examine a range of key indicators, including chip performance and reliability, to obtain detailed data. This data provides a scientific basis for continuous improvement and optimization of the chip manufacturing process, ultimately aiming to increase yield.

[0004] However, in the current BGA chip testing process, although the spring floating mechanism equipped in the test equipment can provide a certain degree of horizontal floating range to compensate for the minor unevenness or misalignment that may exist between the probe module and the chip contact surface, the existing test equipment still has a significant drawback: that is, it cannot flexibly adjust the vertical position of the spring floating mechanism according to specific test requirements, thus making it difficult to ensure that the probe module can stably and accurately contact the test points of the chip.

[0005] Given the aforementioned problems, the need to improve and optimize existing technologies is particularly urgent.

[0006] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0007] This invention provides a chip testing device with rotational adjustment to solve the problems existing in the prior art.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A rotary-adjustable chip testing device, the device comprising a base, a top cover, a probe module, and a spring-floating mechanism; wherein,

[0010] The upper cover is mounted on the base in a hinged manner, allowing it to be flipped open.

[0011] The probe module is mounted on the base;

[0012] The spring floating mechanism is disposed on the side facing the base when the upper cover is closed on the base, and can contact the chip to be tested when the upper cover is closed on the base, so as to allow the chip to float in the horizontal direction;

[0013] The upper cover includes a cover body, a rotating handle, and a stud.

[0014] The cover is provided with threaded holes;

[0015] The stud passes through the threaded hole, and its upper end is fixedly connected to the rotating handle, while its lower end is connected to the spring floating mechanism.

[0016] By rotating the rotary handle, the stud can be moved up and down in the threaded hole, thereby driving the spring floating mechanism to move up and down.

[0017] Furthermore, in the rotary-adjustable chip testing device, the probe module is provided with a receiving slot for placing the chip, and can contact the chip placed in the receiving slot to establish an electrical connection.

[0018] Furthermore, in the rotary adjustment chip testing device, a handle limiting post is provided at the top of the stud;

[0019] There are two handle limiting posts, which are used to limit the rotation angle of the rotary handle in two directions.

[0020] Furthermore, in the rotary adjustable chip testing device, a guide pin hole is provided on the side of the upper cover facing the base when the upper cover is closed;

[0021] The base is provided with a guide pin that can mate with the guide pin hole.

[0022] Furthermore, in the rotary adjustment chip testing device, the upper cover is locked to the base by a fastening mechanism after being closed.

[0023] Furthermore, in the rotary adjustment chip testing device, the fastening mechanism includes a hook and a fastener;

[0024] The hook is provided on the upper cover;

[0025] The fastener is mounted on the base and can be adapted to engage with the hook.

[0026] Furthermore, in the rotary adjustment chip testing device, the formula for the torque of the rotary handle is:

[0027] ;

[0028] The formula for the force applied to the rotary handle is:

[0029] ;

[0030] Where T is the torque of the rotating handle; d is the nominal diameter of the stud, in mm; F1 is the downward force, in N; d2 is the pitch diameter of the stud, in mm; Φ is the thread helix angle; ρ v ρ is the equivalent friction angle of the thread. v= arctanμ v μ v D is the equivalent friction coefficient of the thread; μ is the friction coefficient between the nut and the supporting surface of the connected part; w d0 is the major diameter of the nut support surface; d0 is the diameter of the threaded hole; K is the tightening torque coefficient; F2 is the force applied to the rotary handle; and L1 is the lever arm.

[0031] Furthermore, in the rotary adjustment chip testing device, the spring floating mechanism includes a floating support base, a floating spring, and a floating block;

[0032] The floating support is disposed on the side facing the base when the upper cover is closed on the base;

[0033] A sliding groove is provided on the floating support base;

[0034] The floating spring is disposed in the groove, with one end abutting against the bottom of the groove and the other end abutting against the floating block.

[0035] Furthermore, in the rotating chip testing device, the floating block is a heat sink;

[0036] The floating block can contact the chip when the upper cover is closed on the base to dissipate heat from the chip.

[0037] Furthermore, in the rotary adjustment chip testing device, a thermally conductive layer is attached to the surface of the floating block that contacts the chip.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] This utility model provides a rotary adjustable chip testing device. By designing the upper cover as a unit consisting of a cover body, a rotating handle, and a stud, it allows for threaded adjustment. Rotating the handle moves the stud up and down within the threaded hole, thereby driving a spring-loaded floating mechanism to move up and down, achieving micron-level precise position adjustment. This ensures optimal contact between the probe module and the chip test points, improving the adaptability and flexibility of the test, and further enhancing the accuracy and reliability of the test results, providing a stronger guarantee for improving chip production quality. Furthermore, it is labor-saving and easy to operate, making it suitable for widespread application.

[0040] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of a rotary adjustable chip testing device (locking) provided in an embodiment of the present invention;

[0043] Figure 2 This is a schematic diagram of the structure of a rotary adjustable chip testing device (unlocked) provided in an embodiment of this utility model;

[0044] Figure 3 This is a schematic diagram (side sectional view) of a chip testing device with rotation adjustment provided in an embodiment of the present invention;

[0045] Figure 4 This is a schematic diagram of the structure of a rotary adjustable chip testing device (with the top cover and base separated) provided in an embodiment of this utility model;

[0046] Figure 5 This is a schematic diagram of the structure of the top cover provided in an embodiment of this utility model;

[0047] Figure 6This is a schematic diagram of the structure of the base and chip provided in this embodiment of the utility model;

[0048] Figure 7 This is a schematic diagram of the structure of the base and probe module provided in this embodiment of the utility model.

[0049] Figure label:

[0050] 1. Base, 2. Top cover, 3. Probe module, 4. Spring floating mechanism, 5. Guide pin hole, 6. Guide pin, 7. Hook, 8. Buckle, 9. Chip, 10. Receiving slot.

[0051] Cover 201, rotating handle 202, stud 203, handle limit post 204;

[0052] Floating support 401, floating spring 402, floating block 403, slide 404. Detailed Implementation

[0053] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended only as examples, not as limiting the scope of protection of this application.

[0054] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0055] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0056] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0057] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order between these entities or operations.

[0058] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0059] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0060] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0061] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0062] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0063] Please refer to Figure 1-7 This utility model embodiment provides a rotary adjustable chip testing device, which comprehensively includes multiple components such as a base 1, an upper cover 2, a probe module 3, and a spring floating mechanism 4. Specifically:

[0064] The upper cover 2, through a precisely designed hinge connection mechanism, can flexibly achieve flipping and closing actions on the base 1, ensuring the stability of the device structure and the convenience of operation.

[0065] The probe module 3 is fixedly mounted on the base 1 and is responsible for establishing the necessary electrical connection with the chip during the test.

[0066] The spring floating mechanism 4 is cleverly positioned on the side of the upper cover 2 facing the base 1 when the upper cover 2 is closed. When the upper cover 2 and the base 1 are tightly fitted together, this component can make contact with the chip 9 being tested and allow the chip 9 to have a certain floating range in the horizontal direction to adapt to different testing requirements.

[0067] The upper cover 2 is further subdivided into three main components: the cover body 201, the rotating handle 202, and the stud 203. The cover body 201 has a standard threaded hole through which the stud 203 passes. Its upper end is securely connected to the rotating handle 202, while its lower end is connected to the spring-floating mechanism 4. By manually rotating the rotating handle 202, the stud 203 can be driven to move up and down within the threaded hole of the cover body 201, thereby causing the spring-floating mechanism 4 to adjust vertically.

[0068] The innovation of this embodiment lies in the fact that the upper cover 2 adopts a composite structure consisting of a cover body 201, a rotating handle 202, and a stud 203. Utilizing a threaded adjustment mechanism, a simple rotation of the rotating handle 202 precisely controls the vertical displacement of the stud 203 and the connected spring floating mechanism 4, achieving micron-level precise positioning and adjustment. This design greatly optimizes the contact state between the probe module 3 and the test points of the chip 9 under test, significantly enhancing the adaptability and flexibility of the test, and greatly improving the accuracy and reliability of the test results, providing solid technical support for the continuous optimization of chip production quality. Furthermore, this device is also characterized by its ease of operation, labor-saving efficiency, and high effectiveness, possessing enormous potential for widespread application.

[0069] In one specific implementation of this embodiment, the probe module 3 is cleverly designed to include a receiving slot 10 specifically for supporting and fixing the chip 9. This design ensures that when the chip 9 is accurately placed inside the receiving slot 10, the probes in the probe module 3 can directly contact the corresponding contact points of the chip 9, thereby quickly and effectively establishing the necessary electrical connection.

[0070] Specifically, the shape, size, and position of the receiving slot 10 have been precisely calculated and designed to ensure a perfect match with the chip 9's shape, pin layout, and other key parameters, thereby achieving high-precision alignment between the probe and the chip contact point. This not only helps improve the accuracy of the test but also effectively reduces test errors caused by poor contact.

[0071] Meanwhile, the introduction of the receiving slot 10 further enhances the functionality and flexibility of the probe module 3, enabling the device to easily adapt to the testing needs of chips of different models and specifications. By simply adjusting the receiving slot 10 or replacing the probe module 3, compatibility and support for different chips can be achieved, greatly expanding the application range of the testing device.

[0072] In summary, this design innovation in this embodiment not only improves the performance of probe module 3, but also provides a more convenient and efficient operating experience for chip testing, laying a solid foundation for the continuous improvement of chip production quality.

[0073] Please refer to this again. Figure 2 To further understand the detailed design of the upper cover 2 structure in this embodiment. In this embodiment, a handle limiting post 204 is specially provided at the top of the stud 203. This design precisely limits the rotation angle of the rotating handle 202. The following is a detailed explanation of this design:

[0074] The stud 203, as a key component connecting the rotary handle 202 and the spring floating mechanism 4, has two additional handle limiting posts 204 on its top. The position and shape of these two limiting posts 204 are carefully designed to ensure that they can effectively limit the rotation angle of the rotary handle 202.

[0075] Specifically, two handle limiting posts 204 are located on either side of the top of the stud 203, and they engage with corresponding parts of the rotary handle 202. When the rotary handle 202 rotates to a certain angle, it contacts one of the limiting posts 204, thus preventing it from rotating further. In this way, the rotation angle of the rotary handle 202 in both directions is limited to a defined range.

[0076] The advantage of this design is that it effectively prevents the rotary handle 202 from rotating excessively, thereby affecting the stability and accuracy of the spring floating mechanism 4. At the same time, the limited rotation angle also allows the operator to more easily and accurately control the vertical movement distance of the stud 203 when rotating the rotary handle 202.

[0077] In summary, the design of setting a handle limiting post 204 on the top of the stud 203 in this embodiment is a practical and innovative solution.

[0078] Please refer to this again. Figure 4-5 This is to gain a deeper understanding of the connection and positioning method between the upper cover 2 and the base 1 in this embodiment. In this embodiment, to ensure that the upper cover 2 can be accurately and stably positioned when it is closed on the base 1, a guide pin hole 6 is provided on the side of the upper cover 2 facing the base 1, and a guide pin 5 that can cooperate with the guide pin hole 6 is correspondingly provided on the base 1. The following is a detailed description of this design:

[0079] When the upper cover 2 is closed onto the base 1, its side facing the base 1 is carefully designed to include guide pin holes 6. The position, size, and shape of these guide pin holes 6 are precisely calculated to ensure that they can perfectly match the guide pins 5 on the base 1.

[0080] The base 1, as the foundation of the chip testing device, has guide pins 5 arranged in its structure corresponding to the guide pin holes 6 of the upper cover 2. The positions of these guide pins 5 on the base 1 correspond one-to-one with the guide pin holes 6 of the upper cover 2. When the upper cover 2 is closed on the base 1, the guide pins 5 will be accurately inserted into the guide pin holes 6.

[0081] With the cooperation of guide pin 5 and guide pin hole 6, the upper cover 2 can be accurately positioned when it is closed on the base 1. This positioning method not only ensures a tight connection between the upper cover 2 and the base 1, but also prevents the upper cover 2 from shaking or shifting during the test, thereby ensuring the stability and accuracy of the chip testing device.

[0082] Furthermore, the cooperation between the guide pin 5 and the guide pin hole 6 makes the closing process of the upper cover 2 smoother and more convenient. The operator only needs to align the upper cover 2 with the base 1 and then press it down gently. The guide pin 5 will then naturally insert into the guide pin hole 6, completing the closing of the upper cover 2 and the base 1.

[0083] In summary, the design of the guide pin hole 6 on the upper cover 2 and the guide pin 5 on the base 1 in this embodiment is a practical and innovative connection and positioning method. It not only improves the stability and accuracy of the chip testing device but also provides operators with a more convenient and efficient closing experience.

[0084] In this specific embodiment, the closure and fixation between the upper cover 2 and the base 1 are achieved through a fastening mechanism. This fastening mechanism is not only simple and efficient in design and easy to operate, ensuring the stability and reliability of the testing device during the testing process, but also has a moderate locking force, which ensures that the upper cover 2 will not be accidentally opened due to external factors during the testing process, and also allows the upper cover 2 to be easily opened for maintenance and replacement of parts when needed.

[0085] Furthermore, the design of the locking mechanism should also take into account the need for easy disassembly and reuse. Therefore, even after multiple opening and closing operations, the locking mechanism can still maintain good working condition, providing users with a convenient and reliable testing device experience.

[0086] In summary, by employing a fastening mechanism to lock the upper cover 2 and the base 1, the testing device of this embodiment not only achieves tight closure and fixation, but also improves the convenience and reliability of operation.

[0087] Please refer to this again. Figure 3-5 To understand in detail the locking mechanism between the upper cover 2 and the base 1 in this embodiment, the fastening mechanism includes a hook 7 and a fastener 8. The following is a detailed description of this design:

[0088] When the upper cover 2 is closed onto the base 1, it is provided with latching elements 7 at its edges or specific locations. These latching elements 7 typically have a certain degree of elasticity and toughness, allowing them to deform under external force and return to their original shape after the external force is removed. The shape and size of the latching elements 7 are carefully designed to ensure that they can perfectly fit with the fasteners 8 on the base 1.

[0089] The base 1, serving as the supporting foundation for the chip testing device, has a latching element 8 positioned corresponding to the hook 7 on the upper cover 2. The latching element 8 typically has one or more grooves or protrusions that match the shape of the hook 7 on the upper cover 2, enabling a tight engagement.

[0090] When the upper cover 2 is placed on the base 1, the operator only needs to align the upper cover 2 with the base 1 and apply a certain pressure. The hook 7 will deform under the pressure and slide smoothly into the groove or protrusion of the fastener 8. Once the hook 7 and the fastener 8 are engaged, the upper cover 2 and the base 1 will be firmly locked together and will not be easily separated.

[0091] This locking mechanism design not only ensures a tight connection between the top cover 2 and the base 1, but also improves the overall stability and durability of the chip testing device. At the same time, the locking mechanism is very simple and convenient to operate; operators can easily close and lock the top cover 2 to the base 1 without using any tools or additional fasteners.

[0092] In summary, the design of the upper cover 2 and the base 1 locked together by a fastening mechanism in this embodiment is a practical and innovative connection method. It not only improves the stability and durability of the chip testing device but also provides operators with a more convenient and efficient experience in closing and locking the cover.

[0093] In one embodiment of this example, the torque of the rotating handle 202 and the calculation formula of the force applied to the rotating handle 202 are explained in detail to explain why this structure of pressing down by rotating the handle 202 is a labor-saving design.

[0094] First, the formula for the torque of the rotating handle 202 is:

[0095] ;

[0096] Next, the formula for the force applied to the rotating handle 202 is:

[0097] ;

[0098] Where T is the torque of the rotating handle 202; d is the nominal diameter of the stud 203, in mm; F1 is the downward force, in N; d2 is the mean diameter of the stud 203, in mm; Φ is the thread helix angle; ρ v ρ is the equivalent friction angle of the thread. v= arctan μ v μ v D is the equivalent friction coefficient of the thread; μ is the friction coefficient between the nut and the supporting surface of the connected part; w d0 is the major diameter of the nut support surface; d0 is the diameter of the threaded hole; K is the tightening torque coefficient; F2 is the force applied to the rotating handle 202; and L1 is the lever arm.

[0099] Understandably, this design saves effort primarily because it utilizes the lever principle. By increasing the length of the lever arm L1, the force F2 applied to the rotating handle 202 can be significantly reduced while maintaining the same torque T. Thus, the operator only needs to use a smaller force to rotate the handle 202, thereby moving the stud 203 up and down, which in turn drives the spring floating mechanism 4 to press down or lift.

[0100] In summary, the rotary handle 202 design in this embodiment achieves a labor-saving structure through reasonable torque and force calculation formulas and the use of the lever principle. This design not only allows operators to more easily control the up-and-down movement of the spring floating mechanism, but also improves work efficiency and comfort.

[0101] Please refer to this again. Figure 3 and 5To gain a more detailed understanding of one specific implementation method in this embodiment, the spring floating mechanism 4 is carefully designed to include three key components: a floating support 401, a floating spring 402, and a floating block 403. The structural layout and functional characteristics will be described in detail below.

[0102] First, the floating support 401 is securely mounted on the side of the upper cover 2 facing the base 1 when the upper cover 2 is closed on the base 1. This position ensures that when the upper cover 2 is closed with the base 1, the floating support 401 can be accurately positioned and support the subsequent floating mechanism, providing a stable support foundation for the chip 9 testing.

[0103] A groove 404 is specially designed on the floating support 401. This groove not only provides a sliding track for the floating block 403, but also restricts its direction and range of movement, ensuring that the floating block 403 can move smoothly along a predetermined path when subjected to force.

[0104] Next, the floating spring 402 is cleverly placed within the groove 404. One end of the floating spring 402 is in close contact with the bottom of the groove 404, while the other end abuts against the floating block 403. This design allows the floating spring 402 to provide corresponding elastic force according to the deformation of the floating block 403 when it is subjected to external force, thereby enabling the floating block 403 to float slightly in the horizontal direction.

[0105] In summary, the spring floating mechanism 4 in this embodiment, through the ingenious combination of the floating support 401, the floating spring 402, and the floating block 403, achieves slight horizontal floating support for the chip 9. This design not only effectively compensates for minor unevenness or misalignment between the contact surfaces of the probe module 3 and the chip 9, but also ensures that the probe module 3 can stably and accurately contact the test points of the chip 9, further improving the reliability and accuracy of chip testing.

[0106] In one specific embodiment of this invention, the floating block 403 in the spring floating mechanism 4 is specially designed and innovated, and is configured to function as a heat dissipation block. This design will be described in detail below:

[0107] In this embodiment, the floating block 403 not only provides floating support but also has a heat dissipation function. This means that, while maintaining its original floating characteristics, the material selection and structural design of the floating block 403 take into account the heat dissipation requirements.

[0108] When the top cover 2 is closed on the base 1, the floating block 403 will make close contact with the chip 9. This contact not only ensures that the probe module can stably and accurately contact the test points of the chip 9, but also provides an effective heat dissipation path for the chip 9. Through the heat dissipation design of the floating block 403, the chip 9 can dissipate the heat generated during the test, thereby avoiding the impact of overheating on chip performance and ensuring the accuracy and reliability of the test results.

[0109] In summary, the floating block 403 in this embodiment, designed as a heat sink, not only supports the slight horizontal floating of the chip 9 but also provides heat dissipation, further enhancing the performance and practicality of the chip testing device. This innovative design helps improve the efficiency and accuracy of chip testing, providing strong support for the production and testing of integrated circuits.

[0110] In a specific and detailed embodiment of this invention, to further enhance the functional effect of the floating block 403 as a heat sink, a thermally conductive layer is specially attached to the surface of the floating block 403 that contacts the chip 9. The following is a detailed description of this design:

[0111] The floating block 403, as an important component of the spring floating mechanism 4, needs to provide stable floating support and effectively help the chip 9 dissipate heat when it comes into contact with the chip 9. To achieve this goal, a layer of material with high thermal conductivity, namely a thermally conductive layer, is attached to the surface of the floating block 403 that is in direct contact with the chip 9.

[0112] The selection and design of this thermal conductive layer took into account several factors, including its thermal conductivity, heat resistance, and compatibility with the chip and floating block materials. The high thermal conductivity of the thermal conductive layer ensures that the heat generated by the chip 9 can be quickly and effectively transferred to the floating block 403, and then dissipated into the surrounding environment through the floating block 403.

[0113] By attaching a thermally conductive layer, the heat dissipation capability of the floating block 403 is further enhanced, enabling chip 9 to remain within a relatively stable temperature range during chip testing, thus avoiding performance degradation or testing errors caused by overheating. At the same time, this design also improves the reliability and durability of the chip testing device, providing strong support for long-term, continuous testing operations.

[0114] In summary, the design of attaching a thermally conductive layer to the contact surface between the floating block 403 and the chip 9 in this embodiment is a practical and innovative solution that effectively improves the heat dissipation performance of the chip testing device.

[0115] Although this application frequently uses terms such as "top cover" and "base," the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0116] This utility model provides a rotary adjustable chip testing device. By designing the upper cover as consisting of a cover body, a rotating handle, and a stud, it allows for threaded adjustment. Rotating the handle moves the stud up and down within the threaded hole, thereby driving a spring-loaded floating mechanism to move up and down, achieving micron-level precise position adjustment. This ensures optimal contact between the probe module and the chip test points, improving the adaptability and flexibility of the test, and further enhancing the accuracy and reliability of the test results, providing a stronger guarantee for improving chip production quality. Furthermore, it has the advantages of being labor-saving and easy to operate, making it suitable for widespread application.

[0117] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A chip testing device with rotational adjustment, characterized in that, The device includes a base (1), a top cover (2), a probe module (3), and a spring floating mechanism (4); wherein, The upper cover (2) is mounted on the base (1) in a flip-close manner via a hinge mechanism; The probe module (3) is mounted on the base (1); The spring floating mechanism (4) is disposed on the side facing the base (1) when the upper cover (2) is closed on the base (1), and can contact the chip to be tested when the upper cover (2) is closed on the base (1) to allow the chip to float in the horizontal direction; The upper cover (2) includes a cover body (201), a rotating handle (202), and a stud (203); The cover (201) is provided with threaded holes; The stud (203) passes through the threaded hole, and its upper end is fixedly connected to the rotating handle (202), and its lower end is connected to the spring floating mechanism (4); By rotating the rotary handle (202), the stud (203) can be moved up and down in the threaded hole, thereby driving the spring floating mechanism (4) to move up and down.

2. The chip testing device with rotational adjustment according to claim 1, characterized in that, The probe module (3) is provided with a receiving slot (10) for placing the chip, and can contact the chip placed in the receiving slot (10) to establish an electrical connection.

3. The chip testing device with rotational adjustment according to claim 1, characterized in that, The top of the stud (203) is provided with a handle limiting post (204). There are two handle limiting posts (204), which are used to limit the rotation angle of the rotary handle (202) in two directions.

4. The chip testing device with rotational adjustment according to claim 1, characterized in that, When the upper cover (2) is closed on the base (1), a guide pin hole (5) is provided on the side facing the base (1); The base (1) is provided with a guide pin (6) that can cooperate with the guide pin hole (5).

5. The chip testing device with rotational adjustment according to claim 1, characterized in that, After the upper cover (2) is closed with the base (1), it is locked by a fastening mechanism.

6. The chip testing apparatus for rotation adjustment according to claim 5, characterized in that, The fastening mechanism includes a hook (7) and a fastener (8); The hook (7) is provided on the upper cover (2); The buckle (8) is disposed on the base (1) and can be adapted to engage with the hook (7).

7. The chip testing apparatus for rotation adjustment according to claim 1, characterized in that, The formula for the torque of the rotating handle (202) is: ； The formula for the force applied to the rotary handle (202) is: ； Wherein, T is the torque of the rotating handle (202); d is the nominal diameter of the stud (203), in mm; F1 is the downward force, in N; d2 is the mean diameter of the stud (203), in mm; Φ is the thread helix angle; ρ v ρ is the equivalent friction angle of the thread. v= arctan μ v μ v D is the equivalent friction coefficient of the thread; μ is the friction coefficient between the nut and the supporting surface of the connected part; w d0 is the major diameter of the nut support surface; d0 is the diameter of the threaded hole; K is the tightening torque coefficient; F2 is the force applied to the rotating handle (202); and L1 is the lever arm.

8. The chip testing apparatus for rotation adjustment according to claim 1, characterized in that, The spring floating mechanism (4) includes a floating support (401), a floating spring (402), and a floating block (403). The floating support (401) is disposed on the side facing the base (1) when the upper cover (2) is closed on the base (1); A groove (404) is provided on the floating support (401). The floating spring (402) is disposed in the groove (404), with one end abutting against the bottom of the groove (404) and the other end abutting against the floating block (403).

9. The chip testing apparatus for rotation adjustment according to claim 8, characterized in that, The floating block (403) is a heat dissipation block; The floating block (403) can contact the chip when the upper cover (2) is closed on the base (1) to dissipate heat from the chip.

10. The chip testing apparatus for rotation adjustment according to claim 9, characterized in that, A thermally conductive layer is attached to the surface of the floating block (403) that contacts the chip.

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