Seasoning preservation box

Abstract

The utility model discloses a condiment fresh-keeping box, relates to refrigeration equipment technical field, the condiment fresh-keeping box includes box body, semiconductor refrigeration module and box cover, box body includes shell and liner, the liner is equipped with the open cavity that accommodates the condiment bottle. A clamping cavity is formed between the inner container and the shell, a baffle is arranged in the clamping cavity, the clamping cavity is divided into a refrigeration cavity and a heat dissipation cavity, the refrigeration cavity is close to the inner container, the heat dissipation cavity is close to the shell, the semiconductor refrigeration module is located in the clamping cavity and comprises a refrigeration sheet, a heat dissipation assembly and a cold dissipation assembly, the semiconductor refrigeration sheet is installed on the baffle, and the cold dissipation assembly is located in the refrigeration cavity. A refrigerating air inlet and a refrigerating air outlet which are communicated with the refrigerating cavity are formed in the side wall of the inner container, the box cover is connected through a hinge, and the containing cavity can be effectively sealed. According to the technical scheme provided by the utility model, the problems of mildewing and deterioration of seasonings in the storage process can be avoided, and the seasonings are convenient to take during cooking.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a condiment preservation box. Background Technology

[0002] The humid and hot kitchen environment in the south is prone to mold and cockroaches, especially condiments that have been used for a long time, which are particularly susceptible to mold growth. Many condiment packaging instructions clearly state that they should be refrigerated after opening. However, storing condiments in a large family refrigerator can easily cause various ingredients to absorb each other's odors, and it is also inconvenient to take them out whenever needed while cooking. Utility Model Content

[0003] The main purpose of this utility model is to provide a condiment preservation box, which aims to prevent condiments from becoming moldy or spoiled during storage and to make them easy to take out while cooking.

[0004] To achieve the above objectives, the condiment preservation box proposed in this utility model includes:

[0005] The box includes an outer shell and an inner liner disposed within the outer shell. The inner liner has a receiving cavity with an open top side for storing condiment bottles. A clamping cavity is provided between the inner liner and the outer shell. A baffle is provided in the clamping cavity to divide the clamping cavity into a cooling cavity and a heat dissipation cavity. The cooling cavity is disposed close to the inner liner, and the heat dissipation cavity is disposed close to the outer shell. A heat insulation pad is provided between the cooling cavity and the heat dissipation cavity.

[0006] A semiconductor cooling module is disposed in the cavity and includes a semiconductor cooling chip, a heat dissipation component, and a cooling distribution component. The semiconductor cooling chip passes through the baffle and the heat insulation pad. The cooling distribution component is disposed in the cooling cavity. A cooling air inlet corresponding to the cooling distribution component is opened on the side wall of the inner liner. A cooling air outlet communicating with the cooling cavity is also provided on the inner liner wall. The cold end of the semiconductor cooling chip abuts against the cooling distribution component. The heat dissipation component is disposed in the heat dissipation cavity. A heat dissipation hole communicating with the heat dissipation cavity is opened on the outer shell, and the heat dissipation component abuts against the hot end of the semiconductor cooling chip.

[0007] A lid, corresponding to the opening of the receiving cavity and connected to the box body via a hinge, is used to close the opening of the receiving cavity.

[0008] In one embodiment, the cooling assembly includes a cooling fan and a cooling fin, wherein the air inlet of the cooling fan is disposed opposite to the cooling air inlet, and the cooling fin is sandwiched between the semiconductor cooling chip and the cooling fan.

[0009] In one embodiment, there are two cooling air outlets, which are located on both sides of the cooling air inlet.

[0010] In one embodiment, the heat dissipation assembly includes a cooling fan and a heat-conducting plate, the heat-conducting plate being sandwiched between the thermoelectric cooler and the cooling fan.

[0011] In one embodiment, the heat dissipation hole includes a heat dissipation air inlet and a heat dissipation air outlet. The heat dissipation air inlet is provided corresponding to the air inlet end of the cooling fan and is located on the back of the housing. The heat dissipation air outlet is located on the left and right sides of the housing.

[0012] In one embodiment, the inner liner has a supporting step on its cavity wall, the supporting step extends along the left and right direction of the outer shell, and the supporting step and the outer shell enclose the cavity. The cavity has a tall seasoning bottle storage area and a short seasoning bottle storage area. The short seasoning bottle storage area is located on the horizontal step surface of the supporting step, and the tall seasoning bottle storage area is located on the bottom wall of the inner liner.

[0013] In one embodiment, the housing further includes a heat insulation layer disposed between the inner liner and the outer shell. The upper edge of the baffle is folded horizontally to form a first plate segment, which extends toward the end away from the cooling cavity and serves as the top plate of the heat dissipation cavity. The housing also includes a cooling cavity shell, which includes a first shell segment extending vertically and a second shell segment extending horizontally. The second shell segment is disposed at the bottom end of the cooling cavity and serves as the bottom plate of the cooling cavity. The first shell segment and the baffle together clamp the heat insulation pad. In the circumference of the receiving cavity, the heat insulation layer is sandwiched between the inner liner and the outer shell. In the circumference of the clamping cavity, the heat insulation layer is sandwiched between the second shell segment and the outer shell, and between the first plate segment and the inner liner. The baffle abuts against the end of the heat insulation layer.

[0014] In one embodiment, the inner liner is provided with a fence, which is provided corresponding to the vertical step surface of the supporting step.

[0015] In one embodiment, the condiment preservation cabinet further includes a temperature control module, which includes a temperature control button, a display screen, and an electronic control board. The electronic control board is electrically connected to the temperature control button, the display screen, and the semiconductor refrigeration module, respectively. The temperature control button and the display screen are exposed on the front of the outer casing.

[0016] In one embodiment, the condiment preservation cabinet further includes an abutment post located on the back of the outer shell for abutting against the wall on the back of the condiment preservation cabinet.

[0017] This invention utilizes a cavity to hold condiments. A semiconductor refrigeration module lowers the temperature within the cavity, thus preserving the condiments at a low temperature. The semiconductor refrigeration module includes a cooling component, and the inner liner has a cooling air inlet and a cooling air outlet. In other words, the condiment preservation box lowers the temperature within the cavity through air cooling. It should be noted that the cooling cavity and the heat dissipation cavity are two separate chambers. This ensures effective heat dissipation while preventing hot air from the heat dissipation cavity from entering the cooling cavity and affecting the cooling effect on the cavity. The compact arrangement of the cavity, cooling cavity, and heat dissipation cavity within the box helps reduce its size, allowing for suitable placement near the stovetop. This facilitates easy access to and return of condiments during cooking, reducing the inconvenience of repeatedly going to the refrigerator to retrieve and store condiments. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the structure of an embodiment of the condiment preservation box provided by this utility model;

[0020] Figure 2 for Figure 1 Another structural schematic diagram of the embodiment shown;

[0021] Figure 3 for Figure 1 A cross-sectional view of the embodiment shown;

[0022] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0023] Figure 5 Figure 1 Another structural schematic diagram of the embodiment shown.

[0024] Explanation of icon numbers:

[0025] 100. Cabinet; 11. Outer shell; 111. Abutment post; 12. Inner liner; 13. Receiving cavity; 131. Enclosure; 14. Supporting step; 141. Tall condiment bottle storage area; 142. Short condiment bottle storage area; 15. Clamping cavity; 16. Baffle; 161. Mounting hole; 162. Heat insulation pad; 163. First plate segment; 164. Second plate segment; 165. Third plate segment; 17. Refrigeration cavity; 171. Refrigeration air inlet; 172. Refrigeration air outlet; 173. Refrigeration cavity shell; 174. First shell segment; 175. Second shell segment; 18. Heat dissipation cavity; 181. Heat dissipation hole; 182. Heat dissipation air inlet; 183. Heat dissipation air outlet; 19. Insulation layer;

[0026] 200. Semiconductor cooling module; 21. Semiconductor cooling chip; 22. Heat dissipation component; 221. Cooling fan; 222. Heat-conducting plate; 23. Cooling assembly; 231. Cooling fan; 232. Heat-conducting plate;

[0027] 300. Box lid; 31. Hinges;

[0028] 400. Power supply module;

[0029] 500. Temperature control module; 51. Temperature control button; 52. Display screen.

[0030] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0032] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0033] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0034] Condiments are common kitchen items, classified into solid and liquid forms based on their physical properties. In the home, condiments are stored at room temperature. When condiments are in their intact packaging (i.e., unopened), they are sealed in bags or bottles and do not come into contact with air. Once used, the seal is broken, and the condiments come into contact with air. Due to moisture and bacteria in the air, the storage time of condiments is greatly reduced. Solid condiments may mold due to moisture, while liquid condiments may evaporate or spoil.

[0035] Storing condiment bottles in the refrigerator for low-temperature preservation helps extend the shelf life of condiments. However, a large number of condiments will take up a lot of space in the refrigerator, affecting the normal storage of vegetables or meats. In addition, it is inconvenient to go to the refrigerator to get condiments during the cooking process, and it also adds the step of putting the condiments back in the refrigerator when cleaning the kitchen after cooking, which increases the tedium.

[0036] This utility model proposes a condiment preservation box.

[0037] Please see Figures 1 to 5 In one embodiment of this utility model, the condiment preservation box includes:

[0038] The box 100 includes an outer shell 11 and an inner liner 12 disposed inside the outer shell 11. The inner liner 12 has a receiving cavity 13 with an open side for storing condiment bottles. A clamping cavity 15 is provided between the inner liner 12 and the outer shell 11. A baffle 16 is provided in the clamping cavity 15 to divide the clamping cavity 15 into a cooling cavity 17 and a heat dissipation cavity 18. The cooling cavity 17 is disposed close to the inner liner 12, and the heat dissipation cavity 18 is disposed close to the outer shell 11.

[0039] A semiconductor cooling module 200 is disposed in a cavity 15 and includes a semiconductor cooling chip 21, a heat dissipation component 22, and a cooling assembly 23. The semiconductor cooling chip 21 is disposed on a baffle 16, and the cooling assembly 23 is disposed in a cooling cavity 17. A cooling air inlet 171 corresponding to the cooling assembly 23 is provided on the side wall of the inner liner 12. A cooling air outlet 172 communicating with the cavity 15 is also provided on the wall of the inner liner 12. The cold end of the semiconductor cooling chip 21 abuts against the cooling assembly 23. The heat dissipation component 22 is disposed in a heat dissipation cavity 18. A heat dissipation hole 181 communicating with the heat dissipation cavity 18 is provided on the outer shell 11, and the heat dissipation component 22 abuts against the hot end of the semiconductor cooling chip 21.

[0040] The lid 300 corresponds to the opening of the receiving cavity 13 and is connected to the box body 100 via a hinge 31, and is used to close the opening of the receiving cavity 13.

[0041] The technical solution of this utility model uses a receiving cavity 13 to house condiments. The semiconductor refrigeration module 200 lowers the temperature inside the receiving cavity 13, thus preserving the condiments at a low temperature. The semiconductor refrigeration module 200 includes a cooling component 23, and the inner liner 12 has a cooling air inlet 171 and a cooling air outlet 172. In other words, the condiment preservation box lowers the temperature inside the receiving cavity 13 through air cooling. It should be noted that the cooling cavity 17 and the heat dissipation cavity 18 are two non-connected chambers. This ensures effective heat dissipation while preventing hot air from the heat dissipation cavity 18 from entering the cooling cavity 17 and affecting the cooling effect on the receiving cavity 13. The compact arrangement of the receiving cavity 13, cooling cavity 17, and heat dissipation cavity 18 within the box body 100 helps reduce the volume of the box body 100, making the condiment preservation box smaller and more suitable for placement near the stove for easy access to the condiments.

[0042] In one embodiment, the cooling assembly 23 includes a cooling fan 231 and a cooling fin 232. The air inlet of the cooling fan 231 is positioned opposite to the cooling air inlet 171, and the cooling fin 232 is sandwiched between the thermoelectric cooler 21 and the cooling fan 231. The cooling fin 232 can quickly conduct the low temperature of the cold end of the thermoelectric cooler 21. The cooling fan 231 draws in hot air from the housing cavity 13 through the cooling air inlet 171. The hot air flows through the cooling fin 232 and is cooled into cold air. The cold air returns to the housing cavity 13 from the cooling air outlet 172. This process is repeated, causing the temperature inside the housing cavity 13 to continuously decrease.

[0043] In one embodiment, two cooling air outlets 172 are provided, and are respectively located on opposite sides of the cooling air inlet 171. That is, the airflow in the cooling chamber 17 can flow evenly into the receiving chamber 13. In other embodiments, there may be only one cooling air outlet 172.

[0044] In one embodiment, the baffle 16 is provided with a mounting hole 161, and the thermoelectric cooler 21 is disposed in the mounting hole 161, so that the cold end of the thermoelectric cooler 21 extends into the cooling chamber 17 and the hot end of the thermoelectric cooler 21 extends into the heat dissipation chamber 18, and the circumferential direction of the thermoelectric cooler 21 is sealed to the mounting hole 161 by a heat insulation pad 162. That is, the heat insulation pad 162 can effectively prevent the temperature in the cooling chamber 17 from exchanging heat with the temperature in the heat dissipation chamber 18, and can prevent the airflow in the heat insulation chamber from flowing with the airflow in the cooling chamber 17.

[0045] In one embodiment, the heat dissipation assembly 22 includes a cooling fan 221 and a heat-conducting plate 222, with the heat-conducting plate 222 sandwiched between the thermoelectric cooler 21 and the cooling fan 221. Further, the heat dissipation hole 181 includes a heat dissipation inlet 182 and a heat dissipation outlet 183. The heat dissipation inlet 182 is located on the back of the housing 11, corresponding to the air inlet end of the cooling fan 221, and the heat dissipation outlet 183 is located on the left and right sides of the housing 11. The heat-conducting plate 222 can quickly transfer the high temperature of the hot end of the thermoelectric cooler 21 to the heat dissipation cavity 18. The cooling fan 221 draws outside air into the heat dissipation cavity 18 through the heat dissipation inlet 182 and delivers the air in the heat dissipation cavity 18 to the outside through the heat dissipation outlet 183. During the airflow, the heat inside the heat dissipation cavity 18 can be effectively carried away, thus effectively dissipating heat from the hot end of the thermoelectric cooler 21. Furthermore, the sidewall of the outer casing 11 with a heat dissipation air inlet 182 abuts against the cooling fan 221, so that the airflow drawn by the air inlet of the cooling fan 221 comes from the outside, which helps to improve the heat dissipation efficiency of the airflow in the heat dissipation cavity 18. In other embodiments, the heat dissipation air outlet 183 is located on the left or right side of the outer casing 11. In another embodiment, the heat-conducting plate 222 may not be provided.

[0046] In one embodiment, the inner liner 12 has a supporting step 14 on its cavity wall. The supporting step 14 extends along the left and right direction of the outer shell 11, and the supporting step 14 and the outer shell 11 enclose a cavity 15. That is, the cavity 15 extends along the left and right direction of the outer shell 11, and the cavity 15 is located below the horizontal step surface of the supporting step 14, which helps to further reduce the volume of the box 100. It should be noted that the cooling air inlet 171 and the cooling air outlet 172 are located on the vertical step surface of the supporting step 14. Because the height of condiment bottles for different condiments on the market varies, for example, bottles for soy sauce, vinegar, and cooking wine are taller, while bottles for sugar, salt, and chili sauce are shorter, and condiment bottles for the same condiment also vary in size, such as oyster sauce, and the larger bottles are often taller than the smaller ones, the height of the condiment bottles purchased by users is often inconsistent. Furthermore, the receiving cavity 13 is divided into a tall condiment bottle storage area 141 and a short condiment bottle storage area 142. The short condiment bottle storage area 142 is located on the horizontal step surface of the supporting step 14, while the tall condiment bottle storage area 141 is located on the bottom wall of the inner liner 12, which does not have the supporting step 14. When the condiment bottles are stored in the receiving cavity 13, the height of the mouth of the short condiment bottle is raised by the supporting step 14 to be similar to the height of the mouth of the tall condiment bottle, making it easier for the user to pick up and providing a more aesthetically pleasing visual effect. In other embodiments, the supporting step 14 may not be provided.

[0047] In one embodiment, the inner liner 12 is provided with a railing 131, which is positioned corresponding to the vertical step surface of the supporting step 14. That is, the railing 131 is located at the boundary between the tall condiment bottle storage area 141 and the short condiment bottle storage area 142, to prevent the short condiment bottle storage area 142 from accidentally falling off the horizontal step surface of the supporting step 14. Furthermore, the railing 131 does not obstruct airflow between the tall and short condiment bottle storage areas 141 and 142, thus not adversely affecting the storage of condiments within them. In other embodiments, the railing 131 may not be provided.

[0048] In one embodiment, the housing 100 is further provided with a heat insulation layer 19, which is disposed between the inner liner 12 and the outer shell 11. The upper edge of the baffle 16 is folded horizontally to form a first plate segment 163, which extends toward the end away from the cooling chamber 17 and serves as the top plate of the heat dissipation chamber 18. The housing 100 also includes a cooling chamber shell 173, which includes a first shell segment 174 extending vertically and a second shell segment 175 extending horizontally. The second shell segment 175 is disposed at the bottom end of the cooling chamber 17 and serves as the bottom plate of the cooling chamber 17. The first shell segment 175 and the baffle 16 together hold the heat insulation pad 162. In the circumference of the receiving cavity 13, the heat insulation layer 19 is sandwiched between the inner liner 12 and the outer shell 11. To prevent heat exchange between the receiving cavity 13 and the outside, an insulation layer 19 is sandwiched between the second shell section 175 and the outer shell 11 in the circumference of the cavity 15. That is, the insulation layer 19 surrounds the bottom wall of the cooling cavity 17 to prevent heat exchange between the cooling cavity 17 and the outside. The insulation layer 19 is also sandwiched between the first plate section 184 and the inner liner 12. That is, the insulation layer 19 wraps the top side of the heat dissipation cavity 18 to prevent heat exchange between the heat dissipation cavity 18 and the receiving cavity 13. The heat insulation pad 162 abuts against the end of the insulation layer 19. The heat insulation pad 162 and the insulation layer 19 form an insulation sleeve that wraps the receiving cavity 13 and the cooling cavity 17, so as to enhance the cooling effect of the cooling cavity 17 and the receiving cavity 13 and maintain the temperature stability inside the cooling cavity 17 and the receiving cavity 13. Furthermore, the insulation layer 19 is made of polyurethane foam, that is, the insulation layer 19 is integrally formed by foaming polyurethane liquid between the inner liner 12 and the outer shell 11, and the heat insulation pad 162 is made of aerogel felt, silicate foam, etc. Furthermore, the cooling chamber shell 173 is welded or riveted to the inner liner 12. In other embodiments, the insulation layer is made of foam plastic, that is, the insulation layer 19 is machined and formed during the production process, and then inserted between the inner liner 12 and the outer shell 11 during the assembly of the box 100. In another embodiment, the box 100 may also include insulation cotton, which is laid on the side walls of the inner liner 12 and the outer shell 11, and located on two adjacent sides between the side walls of the inner liner 12 and the outer shell 11.

[0049] In one embodiment, the lower edge of the baffle 16 folds out a second plate segment 164 and a third plate segment 165 in sequence. The second plate segment 164 extends horizontally, and the third plate segment 165 extends vertically. The second plate segment 164 and the third plate segment 165 abut against the insulation layer 19. Further, the condiment preservation box also includes a power module 400, which is disposed within the heat dissipation cavity 18 to supply power to the semiconductor cooling module 200. The second plate segment 164 and the third plate segment 165 increase the volume of the heat dissipation cavity 18, allowing it to accommodate the power module 400 without affecting the operation of the cooling fan 221. The second plate segment 164 and the third plate segment 165 can cover the sides of the power module 400 near the receiving cavity 13 and the cooling cavity 17. The insulation layer 19, which abuts against the second plate segment 164 and the third plate segment 165, prevents heat generated by the power module 400 from exchanging heat with the cooling cavity 17 and the receiving cavity 13. In other embodiments, the second plate segment 164 and the third plate segment 165 may not be provided.

[0050] In one embodiment, the condiment preservation cabinet further includes a temperature control module 500, which includes a temperature control button 51, a display screen 52, and an electronic control board. The electronic control board is electrically connected to the temperature control button 51, the display screen 52, and the semiconductor refrigeration module 200, respectively. The temperature control button 51 and the display screen 52 are exposed on the front of the outer casing 11. By pressing the temperature control button 51, the refrigeration temperature of the semiconductor refrigeration module 200 can be set, and the display screen 52 can display the current refrigeration temperature of the semiconductor refrigeration module 200. Furthermore, the temperature control module 500 also includes a temperature sensor, which is electrically connected to the electronic control board and located within the receiving cavity 13, to measure the temperature within the receiving cavity 13 and display the current temperature within the receiving cavity 13 on the display screen 52. In other embodiments, a temperature sensor may not be included.

[0051] In one embodiment, the condiment preservation cabinet further includes an abutment post 111, which is located on the back of the outer casing 11 and abuts against the wall on the back of the condiment preservation cabinet. The abutment post 111 provides sufficient opening space for the lid 300 and ensures that the heat dissipation air inlet 182 is not obstructed. In other embodiments, the abutment post 111 may not be provided.

[0052] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A condiment preserver comprising: include: The box includes an outer shell and an inner liner disposed within the outer shell. The inner liner has a receiving cavity with an open top side for storing condiment bottles. A clamping cavity is provided between the inner liner and the outer shell. A baffle is provided in the clamping cavity to divide the clamping cavity into a cooling cavity and a heat dissipation cavity. The cooling cavity is disposed close to the inner liner, and the heat dissipation cavity is disposed close to the outer shell. A heat insulation pad is provided between the cooling cavity and the heat dissipation cavity. A semiconductor cooling module is disposed in the cavity and includes a semiconductor cooling chip, a heat dissipation component, and a cooling distribution component. The semiconductor cooling chip passes through the baffle and the heat insulation pad. The cooling distribution component is disposed in the cooling cavity. A cooling air inlet corresponding to the cooling distribution component is opened on the side wall of the inner liner. A cooling air outlet communicating with the cooling cavity is also provided on the inner liner wall. The cold end of the semiconductor cooling chip abuts against the cooling distribution component. The heat dissipation component is disposed in the heat dissipation cavity. A heat dissipation hole communicating with the heat dissipation cavity is opened on the outer shell, and the heat dissipation component abuts against the hot end of the semiconductor cooling chip. A lid, corresponding to the opening of the receiving cavity and connected to the box body via a hinge, is used to close the opening of the receiving cavity.

2. The spice saver of claim 1 wherein, The cooling assembly includes a cooling fan and a cooling plate. The air inlet of the cooling fan is positioned opposite to the cooling air inlet, and the cooling plate is sandwiched between the semiconductor cooling chip and the cooling fan.

3. The spice saver of claim 2 wherein, The cooling air outlet is provided in two places, and is located on both sides of the cooling air inlet.

4. The spice saver of claim 1 wherein, The heat dissipation component includes a cooling fan and a heat-conducting plate, with the heat-conducting plate sandwiched between the semiconductor cooling chip and the cooling fan.

5. The spice saver of claim 4 wherein, The heat dissipation holes include a heat dissipation air inlet and a heat dissipation air outlet. The heat dissipation air inlet is located on the back of the housing, corresponding to the air inlet end of the cooling fan. The heat dissipation air outlets are located on the left and right sides of the housing.

6. The spice saver of claim 1, wherein, The inner liner has a support step on its cavity wall. The support step extends along the left and right direction of the outer shell and the support step and the outer shell enclose the cavity. The cavity has a tall seasoning bottle storage area and a short seasoning bottle storage area. The short seasoning bottle storage area is located on the horizontal step surface of the support step, and the tall seasoning bottle storage area is located on the bottom wall of the inner liner.

7. The spice saver of claim 6 wherein, The inner liner is equipped with a fence, which is set corresponding to the vertical step surface of the supporting step.

8. The spice saver of claim 1, wherein, The box also includes an insulation layer, which is located between the inner liner and the outer shell. The upper edge of the baffle is folded horizontally to form a first plate segment, which extends toward the end away from the cooling cavity and serves as the top plate of the heat dissipation cavity. The box also includes a cooling cavity shell, which includes a first shell segment extending vertically and a second shell segment extending horizontally. The second shell segment is located at the bottom of the cooling cavity and serves as the bottom plate of the cooling cavity. The first shell segment and the baffle together hold the heat insulation pad. In the circumference of the receiving cavity, the insulation layer is sandwiched between the inner liner and the outer shell. In the circumference of the clamping cavity, the insulation layer is sandwiched between the second shell segment and the outer shell, and between the first plate segment and the inner liner. The baffle abuts against the end of the insulation layer.

9. The spice saver of claim 1, wherein, The condiment preservation box also includes an abutment post, which is located on the back of the outer shell and is used to abut against the wall on the back of the condiment preservation box.

10. The flavor-saver of claim 1 wherein, The condiment preservation box also includes a temperature control module, which includes a temperature control button, a display screen, and an electronic control board. The electronic control board is electrically connected to the temperature control button, the display screen, and the semiconductor refrigeration module, respectively. The temperature control button and the display screen are exposed on the front of the outer shell.

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