Computer mainboard detection mechanism

Abstract

The utility model discloses a computer mainboard detection mechanism which comprises a box body capable of being opened and closed, an electric leakage detection assembly arranged in the box body and a material leakage detection assembly arranged outside the box body, the electric leakage detection assembly comprises a placing platform, a power connection platform and an elastic part, and the elastic part is connected between the placing platform and the power connection platform. And a plurality of power connection columns are arranged on the placement platform. The electric leakage detection assembly and the material leakage detection assembly are integrated in the box body, so that an operator can place a mainboard to be detected in the box body, detect whether material leakage occurs on the mainboard or not through the detection head, open the box body and press the mainboard on the placing platform, so that the mainboard moves downwards to be in contact with the power connection platform; according to the mainboard electric leakage detection device, whether the mainboard leaks electricity or not is judged according to the numerical value displayed on the current and voltage detection device, so that electric leakage detection and material leakage detection are integrated, the production cost of the mainboard is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of motherboard testing technology, and in particular to a computer motherboard testing mechanism. Background Technology

[0002] Computer motherboards undergo a series of rigorous automated and manual testing processes before leaving the factory to ensure that their functions, performance, and reliability meet standards.

[0003] Traditional computer motherboard testing typically separates component leakage detection from current leakage detection, which prolongs the motherboard manufacturing process and increases production costs. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a computer motherboard testing mechanism that solves the problem that in traditional computer motherboard testing, the detection of material leakage and leakage current are separated, which leads to the extension of the computer motherboard's factory process.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a computer motherboard testing mechanism for detecting leakage of materials and current on the motherboard, comprising an openable and closable housing, a leakage detection component disposed inside the housing, and a leakage detection component disposed outside the housing. The leakage detection component comprises a placement platform, a power receiving platform, and an elastic part. The elastic part is connected between the placement platform and the power receiving platform. The placement platform is provided with multiple power receiving posts.

[0006] The leakage detection component includes multiple detection heads and multiple display units adapted to the multiple detection heads. The display units are set on the power-connected platform, and the platform is provided with a port for the corresponding display unit.

[0007] During the leakage detection, the mainboard is placed on the placement platform, and the power terminals are connected to the components on the mainboard. The box is closed so that the detection end of the detection head corresponds to the components on the mainboard, so as to detect whether the components on the mainboard are missing and display the detection results on the display.

[0008] During leakage detection, open and close the enclosure and press the main board on the platform to connect the power connection post and the power connection platform, supply power to the main board, and determine whether there is leakage by the values ​​displayed on the current and voltage detection device located next to the enclosure.

[0009] Furthermore, the enclosure includes a lower box and an upper cover connected by a hinge on one side. The top of the upper cover is made of transparent glass. The detection head is located on the top of the upper cover. The leakage current detection component is located in the inner cavity of the lower box. The lower end face of the power connection platform is provided with a support column connected to the bottom wall of the lower box.

[0010] Furthermore, the upper surface of the platform is provided with a receiving slot for the motherboard and an extension slot connected to the receiving slot, and the port and power connection post are both located in the receiving slot.

[0011] Furthermore, a matching extension piece is provided at the upper part of one corner of the receiving groove, and buffer pads are provided at the four corners and / or the lower part of the side wall of the receiving groove.

[0012] Furthermore, a buffer layer is laid on the inner wall of the extension sheet.

[0013] Furthermore, the power connection posts are divided into two types: large posts and small posts, and are compatible with the components on the main board placed on the platform.

[0014] Furthermore, the detection head is a fiber optic sensor.

[0015] Furthermore, the elastic part is a spring, and the elastic part extends into the support column that supports the power connection platform, with the side wall of the elastic part fitting against the inner wall of the support column.

[0016] Furthermore, the display element is a color-changing light.

[0017] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, by integrating the leakage detection component and the material leakage detection component into the housing, the operator can place the motherboard to be tested inside the housing and use the detection head to detect whether there is material leakage on the motherboard. Then, the housing is opened and the motherboard is pressed on the platform, causing the motherboard to move down and contact the power connection platform, so that the power connection post is connected to the power supply and the motherboard is powered. The value displayed on the current and voltage detection device is used to determine whether the motherboard is leaking current. In this way, leakage detection and material leakage detection are integrated, reducing the production cost of the motherboard and improving production efficiency.

[0018] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a perspective view of Embodiment 1 of this utility model.

[0020] Figure 2 This is a connection diagram of the motherboard and the placement platform of Embodiment 1 of this utility model.

[0021] Figure 3 This is a utility model Figure 1 Side profile diagram.

[0022] Figure 4 This is a utility model Figure 1 Enlarged view of point A.

[0023] Explanation of reference numerals in the attached diagram:

[0024] Motherboard 1;

[0025] Box body 10, lower box body 11, upper cover 12;

[0026] Leakage detection component 20, placement platform 21, through port 211, receiving groove 212, extension groove 213, power connection platform 22, support column 221, elastic part 23, power connection post 24;

[0027] Leakage detection component 30, detection head 31, display component 32;

[0028] Current and voltage detection device 40, extension sheet 50, buffer layer 51, buffer pad 60. Detailed Implementation

[0029] Please refer to Figure 1-4 As shown, it illustrates the specific structure of a preferred first embodiment of the present invention, which is a computer motherboard testing mechanism. It includes an openable and closable housing 10, a leakage current detection component 20 disposed inside the housing 10, and a material leakage detection component 30 disposed outside the housing 10. The leakage current detection component 20 includes a placement platform 21, a power receiving platform 22, and an elastic part 23. The elastic part 23 is connected between the placement platform 21 and the power receiving platform 22. The placement platform 21 is provided with a plurality of power receiving posts 24.

[0030] The leakage detection assembly 30 includes multiple detection heads 31 and multiple display elements 32 adapted to the multiple detection heads 31. The display elements 32 are disposed on the power connection platform 22, and the placement platform 21 is provided with a corresponding port 211 for the display elements 32.

[0031] During the leakage detection, the main board 1 is placed on the placement platform 21, so that the power terminal 24 is connected to the components on the main board 1. The box 10 is closed so that the detection end of the detection head 31 corresponds to the components on the main board 1, so as to detect whether the components on the main board 1 are missing and display the detection result through the display 32.

[0032] During leakage current detection, the enclosure 10 is opened and closed, and the motherboard 1 on the placement platform 21 is pressed down, so that the power connection post 24 and the power connection platform 22 are connected to supply power to the motherboard 1. The value displayed on the current and voltage detection device 40 located next to the enclosure 10 is used to determine whether there is a leakage current. This method is different from existing computer motherboard testing mechanisms, which are divided into leakage current detection and material leakage detection, and these two processes require different personnel or equipment. This computer motherboard testing mechanism integrates the leakage current detection component 20 and the material leakage detection component 30 within the housing 10. This allows operators to place the motherboard 1 to be tested inside the housing 10 and use the detection head 31 to check for material leakage on the motherboard. After opening the housing 10, the motherboard 1 is pressed onto the placement platform 21, causing it to move down and contact the power connection platform 22. This allows the power connection post 24 to conduct electricity and supply power to the motherboard 1. The current and voltage detection device 40 then displays the values ​​to determine whether the motherboard 1 is leaking current. This integration of leakage current detection and material leakage detection reduces the production cost of the motherboard 1 and improves production efficiency.

[0033] Specifically, the housing 10 includes a lower box 11 and an upper cover 12 connected by a hinge on one side. The top of the upper cover 12 is made of transparent glass. The detection head 31 is located on the top of the upper cover 12. The leakage current detection component 20 is located inside the lower box 11. The lower end face of the power connection platform 22 is provided with a support column 221 connected to the bottom wall of the lower box 11. Because the lower box 11 and the upper cover 12 are connected by a hinge, the upper cover 12 can be opened and closed on the lower box 11. When testing the main board 1, the upper cover 12 is opened and the main board 1 is placed on the placement platform 21. Then, the upper cover 12 is moved so that it overlaps with the lower box 11. At this time, the top of the upper cover 12 is made of transparent glass, so that the detection head 31 on it can be aligned with the main board 1 on the placement platform 21. The detection head 31 is used to detect the components on the main board 1 to determine whether there is a shortage of material on the upper end face of the main board 1.

[0034] Specifically, the upper surface of the placement platform 21 is provided with a receiving slot 212 for the motherboard 1 and an extension slot 213 communicating with the receiving slot 212. The through-hole 211 and the power connection post 24 are both located within the receiving slot 212. The opening of the receiving slot 212 ensures that the motherboard 1 placed on the placement platform 21 will not move left or right during the testing process, and ensures that the testing head 31 and the power connection post 24 can contact the corresponding components of the motherboard 1 to ensure testing accuracy. In addition, the opening of the extension slot 213 next to the receiving slot 212 makes it convenient for the operator to remove the motherboard 1 located in the receiving slot 212 after the motherboard 1 has been tested.

[0035] Specifically, an extension piece 50 is provided at the upper part of one corner of the receiving groove 212, and buffer pads 60 are provided at the four corners and / or the lower part of the side walls of the receiving groove 212. Because the receiving groove 212 is compatible with the motherboard 1, the motherboard 1 will not move during testing. However, if the motherboard 1 is misaligned when the operator places it into the receiving groove 212, it needs to be moved to fit into the receiving groove 212. At this time, the motherboard 1 may wear out due to the friction caused by the movement. Therefore, an extension piece 50 is added at one corner of the receiving groove 212. Because the extension piece 50 corresponds to the corner of the receiving groove 212, the operator can align one corner of the motherboard 1 with the extension piece 50 before placing the motherboard 1 into the receiving groove 212, so as to avoid the above situation.

[0036] It should be noted that the buffer pad 60 is designed to cushion the impact of the motherboard 1 under inertial force when it is placed in the receiving slot 212, so as to prevent the motherboard 1 from being damaged due to impact when it comes into contact with the power terminal 24.

[0037] Specifically, a buffer layer 51 is laid on the inner wall of the extension piece 50. The buffer layer 51 can be a sandblasted layer, which makes the inner wall of the extension piece 50 uneven, thereby reducing the falling speed of the main board 1 moving along the extension piece 50.

[0038] The power connection post 24 is divided into two types: large post and small post, and is compatible with the components on the motherboard 1 placed on the placement platform 21.

[0039] The detection head 31 is an optical fiber sensor.

[0040] The elastic part 23 is a spring, and the elastic part 23 extends into the support column 221 that supports the power connection platform 22, with the side wall of the elastic part 23 fitting against the inner wall of the support column 221.

[0041] Display element 32 is a color-changing light.

[0042] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A computer motherboard testing mechanism for detecting material leakage and electrical leakage of a motherboard (1), characterized in that: It includes an openable and closable box (10), a leakage detection component (20) disposed inside the box (10), and a material leakage detection component (30) disposed outside the box (10). The leakage detection component (20) includes a placement platform (21), a power receiving platform (22), and an elastic part (23). The elastic part (23) is connected between the placement platform (21) and the power receiving platform (22). The placement platform (21) is provided with multiple power receiving posts (24). The leakage detection component (30) includes multiple detection heads (31) and multiple display components (32) adapted to the multiple detection heads (31). The display components (32) are disposed on the power connection platform (22), and the placement platform (21) is provided with a port (211) corresponding to the display components (32). During the leakage detection, the main board (1) is placed on the placement platform (21), so that the power terminal (24) is connected to the components on the main board (1), and the box (10) is closed so that the detection end of the detection head (31) corresponds to the components on the main board (1) to detect whether the components on the main board (1) are missing and the detection result is displayed by the display (32). During leakage detection, the box (10) is opened and closed and the main board (1) on the placement platform (21) is pressed to connect the power connection post (24) and the power connection platform (22) to supply power to the main board (1). The leakage is determined by the value displayed on the current and voltage detection device (40) located next to the box (10).

2. The computer motherboard detection mechanism of claim 1, wherein: The housing (10) includes a lower box (11) and an upper cover (12) connected by a hinge on one side. The top of the upper cover (12) is made of transparent glass. The detection head (31) is located on the top of the upper cover (12). The leakage detection component (20) is located in the inner cavity of the lower box (11). The lower end face of the power connection platform (22) is provided with a support column (221) connected to the bottom wall of the lower box (11).

3. The computer motherboard detection mechanism of claim 1, wherein: The upper surface of the placement platform (21) is provided with a receiving groove (212) adapted to the motherboard (1) and an extension groove (213) connected to the receiving groove (212). The opening (211) and the power connection post (24) are both located in the receiving groove (212).

4. The computer motherboard detection mechanism of claim 3, wherein: The upper part of one corner of the receiving groove (212) is provided with a matching extension piece (50), and the lower part of the four corners and / or side walls of the receiving groove (212) is provided with a buffer pad (60).

5. The computer motherboard detection mechanism of claim 4, wherein: The inner wall of the extension piece (50) is covered with a buffer layer (51).

6. The computer motherboard detection mechanism of claim 1, wherein: The multiple power connection posts (24) are divided into two types: large posts and small posts, and are compatible with the components on the motherboard (1) placed on the placement platform (21).

7. The computer motherboard detection mechanism of claim 1, wherein: The detection head (31) is an optical fiber sensor.

8. The computer motherboard detection mechanism of claim 2, wherein: The elastic part (23) is a spring, and the elastic part (23) extends into the support column (221) supporting the power connection platform (22), and the side wall of the elastic part (23) is in contact with the inner wall of the support column (221).

9. A computer motherboard testing mechanism according to claim 1, characterized in that: The display element (32) is a color-changing lamp.

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