High-speed high-density photoelectric hybrid backboard interface structure of VPX function module

Abstract

The utility model discloses a high-speed and high-density photoelectric hybrid backboard interface structure of a VPX function module, and a VPX module main body is integrated with a backboard MT optical signal connector used as an optical signal interface connected with the VPX module main body; the backboard high-speed electric signal connector is used as a high-speed electric signal interface connected with the VPX module main body; the backboard low-speed signal and power supply connector is used for respectively connecting a power supply interface and a low-speed signal interface of the VPX module main body; the reinforced structure shell is interlocked with the connectors through the convex clamping grooves and the concave clamping grooves; and the VPX module main body comprises a low-speed signal interface, a power interface, a high-speed electric signal interface, an optical signal interface, an optical module MT optical fiber and a processing chip. According to the utility model, the transmission performance of the VPX backboard system is significantly improved by improving the differential signal density and transmission rate of the electric signal connector and the mixed installation reinforcement design of the integrated optical signal connector.

Description

Technical Field

[0001] This utility model relates to the technical field of high-speed backplane interface design for VPX functional modules, specifically to a high-speed, high-density optoelectronic hybrid backplane interface structure for VPX functional modules. Background Technology

[0002] Since its first release, the VPX specification series has been continuously updated. Devices compliant with the VPX standard have gained recognition from users across various industries. Simultaneously, the application scenarios for VPX-compliant modules are showing a continuous upward trend, placing new demands on module functionality and performance, as well as higher requirements on the communication bandwidth and types of backplanes. Specifically, the high-speed electrical signal rates connecting modules to backplanes are constantly increasing, and the number of connections varies depending on the application. There are not only electrical signal connection requirements but also optical signal connection requirements, with the demand for both high-speed and high-quantity optical signals continuously increasing.

[0003] Currently, the third-generation connectors used in the VPX platform specification can support 32Gbps NRZ signals, but a single differential pair cannot support 100G applications. Multiple differential pairs of buses are required, such as 100GE, 200GE, and even 400GE network buses. To achieve internal bus interconnection, multiple pairs of differential signals are needed. For example, for 100GE and 200GE applications, 8 pairs of high-speed differential signals can complete the interconnection, while 400GE requires 16 pairs of high-speed differential signals. However, the increasing demand for differential pair interconnection has prompted backplane interconnection designs to develop towards having more differential pair channels, especially in central switching processing nodes where there is a greater demand for high-speed differential signals.

[0004] Meanwhile, the internal interconnection of the VPX platform tends to use low-cost electrical signals, while in some cases there is a need for optical channel interconnection, and the number of optical channels is constantly increasing, especially in wireless applications, where the connection bandwidth and number with the antenna array are increasing with the widespread application of digital signal processing technology. Utility Model Content

[0005] To address the aforementioned issues, the purpose of this invention is to design a high-speed, high-density optoelectronic hybrid backplane interface structure for VPX functional modules. By improving the differential signal density and transmission rate of the electrical signal connectors and integrating the hybrid reinforcement design of the optical signal connectors, a backplane interface integrating high-speed, high-density electrical signal connections and multi-channel optical signal connections is created. This enhances the transmission performance of the VPX backplane system and fills the future application needs in certain scenarios.

[0006] This was achieved through the following technical solutions:

[0007] A high-speed, high-density optoelectronic hybrid backplane interface structure for a VPX functional module includes: a VPX module body, a backplane MT optical signal connector, a backplane high-speed electrical signal connector, a backplane low-speed signal and power connector, and a reinforced housing; wherein, the VPX module body includes at least a low-speed signal interface, a power interface, a high-speed electrical signal interface, an optical signal interface, an optical module MT fiber, and a processing chip; the backplane MT optical signal connector connects to the optical signal interface of the VPX module body, and the optical module MT fiber within the VPX module body is connected to the optical fiber of the backplane via the backplane MT optical signal connector; the backplane high-speed telecommunications... The connector connects to the high-speed electrical signal interface of the VPX module body. The high-speed bus and low-speed bus of the processing chip inside the VPX module body are both connected to the backplane via the high-speed electrical signal connector on the backplane. The low-speed signal and power connectors on the backplane are connected to the power interface and low-speed signal interface of the VPX module body, respectively. The power supply and low-speed signal transmission of the VPX module body are both connected to the backplane via the low-speed signal and power connectors on the backplane. The reinforced structure shell is fixed and reinforced by interlocking with convex and concave slots between itself and the 8 backplane MT optical signal connectors, 4 backplane high-speed electrical signal connectors and 1 backplane low-speed signal and power connector.

[0008] This backplane interface structure integrates high-speed, high-density electrical signal interfaces and optical signal interfaces onto a single module. This allows the module to achieve both electrical and optical signal connections on one side of the backplane, and the number of electrical and optical connectors can be coordinated and adjusted according to different application scenarios.

[0009] Preferably, the number of backplane MT optical signal connectors and the number of backplane high-speed electrical signal connectors are one or more. By coordinating the configuration of the number of backplane MT optical signal connectors and backplane high-speed electrical signal connectors according to different application scenarios, the flexibility and versatility of this backplane interface application can be improved.

[0010] Preferably, each backplane MT optical signal connector is mounted on a reinforced structural housing, and each backplane MT optical signal connector contains an MT fiber optic head, supporting 48-core fiber optic connections. By installing an MT fiber optic head inside the backplane MT optical signal connector, multi-core optical signal connections can be achieved, enabling ultra-high density, ultra-large capacity optical signal communication and improving the input / output rate of optical signals.

[0011] Preferably, each backplane high-speed electrical signal connector is assembled from eight sheet-like structures that lead out four pairs of differential signals, for a total of 32 pairs of differential signals. By selecting a backplane high-speed electrical signal connector with 32 pairs of differential signals, the transmission rate of electrical signals can be further improved.

[0012] Preferably, each backplane high-speed electrical signal connector supports a single differential pair signal transmission rate of 56Gbps. By selecting a backplane high-speed electrical signal connector that supports a single differential pair signal transmission rate of 56Gbps, the transmission rate of the backplane high-speed electrical signal connector can be significantly improved.

[0013] Preferably, each backplane high-speed electrical signal connector occupies the same backplane area as half a full-width standard VPX connector. By allowing more differential signal pairs to be led out from each backplane high-speed electrical signal connector within the same size, the backplane high-speed electrical signal connector exhibits better insertion loss, return loss, and crosstalk performance.

[0014] Preferably, the high-speed electrical signal connector and the low-speed signal and power connector on the backplane are all crimped onto the PCB board of the VPX module body, and together with the backplane MT optical signal connector, they are mounted on the PCB board of the VPX module body to form a complete VPX ruggedized module. By mounting the high-speed electrical signal connector, the low-speed signal and power connector, and the MT optical signal connector on the PCB board of the VPX module body, a backplane interface integrating high-speed, high-density electrical signal connections and multi-channel optical signal connections can be integrated, filling the needs of future applications.

[0015] Preferably, the reinforced outer shell is designed with three positioning holes for blind insertion of the module. By designing positioning holes on the reinforced outer shell, accurate connection with the VPX module body can be achieved.

[0016] The advantages of this utility model compared with the prior art are:

[0017] The technical solution of this utility model, by improving the differential signal density and transmission rate of the electrical signal connector and the hybrid reinforcement design of the integrated optical signal connector, enables the backplane interface to have the characteristics of high electrical signal density and high speed. At the same time, by mixing the high-speed, high-density electrical signal interface and the optical signal interface on a single module, the module can realize both electrical signal connection and optical signal connection on one side of the backplane, thereby improving the transmission performance of the VPX backplane system. Furthermore, the number of electrical signal connectors and optical signal connectors can be coordinated and adjusted according to different application scenarios to meet the needs of future applications. Attached Figure Description

[0018] Figure 1 A schematic diagram of the high-speed, high-density optoelectronic hybrid backplane interface structure for the VPX functional module;

[0019] Explanation of reference numerals in the attached drawings: VPX module body 10, backplane MT optical signal connector 20, backplane high-speed electrical signal connector 30, backplane low-speed signal and power connector 40, and reinforced structural housing 50. Detailed Implementation

[0020] The technical solutions of the present invention will now be described in detail with reference to the accompanying drawings of the embodiments.

[0021] like Figure 1 The diagram shows a high-speed, high-density optoelectronic hybrid backplane interface structure for a VPX functional module. The diagram includes a VPX module body 10, eight backplane MT optical signal connectors 20, four backplane high-speed electrical signal connectors 30, one backplane low-speed signal and power connector 40, and a ruggedized housing 50. The eight backplane MT optical signal connectors 20 are mounted on the ruggedized housing 50. The four backplane high-speed electrical signal connectors 30 and the one backplane low-speed signal and power connector 40 are all press-fitted onto the PCB board of the VPX module body 10, and then mounted on the PCB board of the VPX module body 10 together with the eight backplane MT optical signal connectors 20, thus forming a complete VPX ruggedized module.

[0022] The backplane interface structure specifically includes the following:

[0023] The VPX module body 10 includes at least a low-speed signal interface, a power interface, a high-speed electrical signal interface, an optical signal interface, an optical module MT fiber, and a processing chip, which are used to interconnect with the backplane interface and to input and output various signals.

[0024] The backplane MT optical signal connector 20 connects to the optical signal interface of the VPX module body 10. The optical module MT fiber inside the VPX module body 10 is connected to the optical fiber of the backplane through the backplane MT optical signal connector 20 to realize the input and output of optical signals.

[0025] Among them, MT stands for Mechanical Transfer, which is a precision connection device used in optical fiber communication systems. It is mainly used to manufacture multi-core, multi-channel connectors. MT usually has multiple channels, each channel corresponding to an optical fiber, so that the backplane MT optical signal connector 20 can input and output optical signals through multiple optical fiber connections.

[0026] In this embodiment, eight backplane MT optical signal connectors 20 are arranged in a two-row, four-column matrix with equal spacing between each column. They are all mounted on the reinforced housing 50, and each MT connector 20 contains an MT fiber optic head, supporting 48-core fiber connections, for a total of 384-core fiber connections. This enables multi-core optical signal connections and improves the input / output rate of optical signals. Furthermore, the eight MT connectors 20 are grouped in pairs, and each pair has two corresponding positioning holes on the reinforced housing 50 to enable blind mating of the optical signal interface, ensuring a reliable connection between the VPX module body 10 and the backplane.

[0027] In this embodiment, the backplane MT optical signal connector 20 supports blind mating connection of the MT interface. The number of optical fibers that can be integrated by the MT interface is not directly related to this patent. Therefore, it can support common 8-core, 16-core, 24-core, and 48-core optical fibers as well as other uncommon optical fibers with MT interfaces. The specific number of optical fibers selected depends on the specific module circuit design, and this utility model does not impose any restrictions.

[0028] The high-speed electrical signal connector 30 on the backplane connects to the high-speed electrical signal interface of the VPX module body 10. The high-speed bus and low-speed bus of the processing chip inside the VPX module body 10 are both connected to the backplane through the high-speed electrical signal connector 30 on the backplane.

[0029] In this embodiment, four high-speed backplane electrical signal connectors 30 and one low-speed backplane signal and power connector 40 are all crimped onto the PCB board of the VPX module body 10, and then mounted on the PCB board of the VPX module body 10 together with eight backplane MT optical signal connectors 20 to form a complete VPX ruggedized module. This backplane interface can integrate high-speed, high-density electrical signal connections and multi-channel optical signal connections, filling the usage needs of some future applications.

[0030] Among them, the high-speed electrical signal connectors 30 on the backplane are arranged in rows and columns. Each high-speed electrical signal connector 30 on the backplane is assembled from 8 sheet structures that lead out 4 pairs of differential signals, for a total of 32 pairs of differential signals, thereby further improving the transmission rate of electrical signals. The 4 high-speed electrical signal connectors 30 on the backplane have a total of 128 pairs of differential signals. The differential signal density of the high-speed electrical signal connectors 30 on the backplane is increased, supporting a single differential pair signal transmission rate of 56Gbps, which significantly improves the transmission rate of the high-speed electrical signal connectors on the backplane.

[0031] Secondly, the four high-speed backplane electrical signal connectors 30 occupy the backplane space of two full-width standard VPX connectors, and the four high-speed backplane electrical signal connectors 30 have a total of 128 pairs of differential signals, which is twice the differential signal density of the standard VPX connector. Under the same size, the VPX half-width connector is assembled from eight sheet structures that lead out two pairs of differential signals, leading out a total of 16 pairs of differential signals. Two full-width standard VPX connectors can lead out a maximum of 64 pairs of differential signals. By leading out more pairs of differential signals under the same size, the high-speed backplane electrical signal connectors 30 have better insertion loss, return loss and crosstalk performance, thereby improving the transmission rate and enabling subsequent upgrades to higher speeds.

[0032] The backplane low-speed signal and power connector 40 is connected to the power interface and low-speed signal interface of the VPX module body 10, respectively. The power supply and low-speed signal transmission of the VPX module body 10 are both connected to the backplane through the backplane low-speed signal and power connector 40.

[0033] The reinforced structural housing 50 is fixed and reinforced by interlocking with the backplate MT optical signal connector 20, the backplate high-speed electrical signal connector 30 and the backplate low-speed signal and power connector 40 through convex and concave slots.

[0034] In this embodiment, the reinforced outer shell 50 can meet the requirements of special environments such as earthquake resistance. It is used to fix and reinforce the backplane MT optical signal connector 20, the backplane high-speed electrical signal connector 30, and the backplane low-speed signal and power connector 40. It also realizes the mixed assembly and reinforcement of the backplane MT optical signal connector 20 and the backplane high-speed electrical signal connector 30. At the same time, it is designed with 3 positioning holes for blind insertion of modules, which can realize accurate connection with the VPX module body.

[0035] In this embodiment, the number of backplane high-speed electrical signal connectors 30 and backplane MT optical signal connectors 20 used depends on the specific application. They can be coordinated and allocated within certain size limits in conjunction with the reinforced structural housing 50. For example, in a VPX system with a central switching capability, the demand for high-speed, high-density signals is relatively high. Eleven half-width connectors can be used, one of which is a backplane low-speed signal and power connector 40, and ten are backplane high-speed electrical signal connectors 30. Each backplane high-speed electrical signal connector 30 has 32 pairs of differential signals, for a total of 320 pairs of differential signals. There are also two backplane MT optical signal connectors 20, each with 48 optical fibers output, for a total of 96 optical fiber interconnects.

[0036] Meanwhile, if the node processing module of the VPX system has relatively low requirements for high-speed and high-density signals, it can use 5 half-width connectors, one of which is a backplane low-speed signal and power connector 40, and four of which are backplane high-speed electrical signal connectors 30; and 8 backplane MT optical signal connectors 20, to achieve a maximum of 128 pairs of differential signals and 384 fiber optic interconnects.

[0037] The backplane interface design method of this VPX functional module can be applied to the backplane interface design of VPX platform modules. The design itself is not strongly related to the characteristics of the VPX platform. Therefore, this utility model patent is applicable to the backplane design of VPX platform modules, the backplane interface design of VPX platform-based advanced modules, and modules on other standard or proprietary platforms.

[0038] In summary, this invention, by improving the differential signal density and transmission rate of the electrical signal connector and the hybrid reinforcement design of the integrated optical signal connector, enables the backplane interface to have high electrical signal density and high speed. Furthermore, by integrating high-speed, high-density electrical and optical signal interfaces onto a single module, the module can achieve both electrical and optical signal connections on one side of the backplane, improving the transmission performance of the VPX backplane system. Additionally, the number of electrical and optical signal connectors can be coordinated and adjusted according to different application scenarios, filling future usage needs and demonstrating significant advancements.

[0039] The above embodiments are only for illustrating the technical concept of this utility model and should not be used to limit the protection scope of this utility model. Any modifications made to the technical solution based on the technical concept proposed by this utility model shall fall within the protection scope of this utility model.

Claims

1. A high-speed, high-density optoelectronic hybrid backplane interface structure for a VPX functional module, characterized in that, include: The VPX module body (10), the backplane MT optical signal connector (20), the backplane high-speed electrical signal connector (30), the backplane low-speed signal and power connector (40), and the reinforced structural housing (50); The VPX module body (10) includes at least a low-speed signal interface, a power interface, a high-speed electrical signal interface, an optical signal interface, an optical module MT fiber, and a processing chip. The backplane MT optical signal connector (20) connects to the optical signal interface of the VPX module body (10), and the optical module MT fiber inside the VPX module body (10) is connected to the optical fiber of the backplane through the backplane MT optical signal connector (20); The high-speed electrical signal connector (30) on the backplane is connected to the high-speed electrical signal interface of the VPX module body (10). The high-speed bus and low-speed bus of the processing chip inside the VPX module body (10) are both connected to the backplane through the high-speed electrical signal connector (30). The backplane low-speed signal and power connector (40) is connected to the power interface and low-speed signal interface of the VPX module body (10) respectively. The power supply and low-speed signal transmission of the VPX module body (10) are both connected to the backplane through the backplane low-speed signal and power connector (40). The reinforced structural housing (50) is fixed and reinforced by interlocking with the backplate MT optical signal connector (20), the backplate high-speed electrical signal connector (30) and the backplate low-speed signal and power connector (40) through convex and concave slots.

2. The high-speed and high-density optoelectronic hybrid backplane interface structure of a VPX function module according to claim 1, wherein, The number of backplane MT optical signal connectors (20) is one or more, and the number of backplane high-speed electrical signal connectors (30) is one or more.

3. The high-speed and high-density optoelectronic hybrid backplane interface structure of a VPX function module according to claim 1, wherein, Each backplane MT optical signal connector (20) is mounted on a reinforced structural housing (50), and each backplane MT optical signal connector (20) has an MT fiber head installed inside, supporting 48-core fiber connections.

4. The high-speed and high-density optoelectronic hybrid backplane interface structure of a VPX function module according to claim 1, wherein, Each backplane high-speed electrical signal connector (30) is assembled from 8 sheet structures that lead out 4 pairs of differential signals, for a total of 32 pairs of differential signals.

5. The high-speed and high-density optoelectronic hybrid backplane interface structure of a VPX function module according to claim 4, wherein, Each backplane high-speed electrical signal connector (30) supports a single differential pair signal transmission rate of 56Gbps.

6. The high speed and high density hybrid optical and electrical backplane interface structure of a VPX functional module according to claim 1, wherein, Each backplane high-speed electrical signal connector (30) occupies the same backplane area as half a full-width standard VPX connector.

7. The high-speed and high-density hybrid optical and electrical backplane interface structure of a VPX functional module according to claim 1, wherein, The high-speed electrical signal connector (30) and the low-speed signal and power connector (40) of the backplane are both pressed onto the PCB board of the VPX module body (10) and are mounted on the PCB board of the VPX module body (10) together with the backplane MT optical signal connector (20) to form a complete VPX rugged module.

8. The high-speed and high-density hybrid optical and electrical backplane interface structure of a VPX function module according to claim 1, wherein, The reinforced outer shell (50) is designed with three positioning holes for blind insertion of modules.

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