High-frequency radiation unit and oscillator assembly

Abstract

The utility model relates to the technical field of communication, in particular to a high-frequency radiation unit and oscillator assembly, which comprises a PCB (printed circuit board), a high-frequency radiation unit and an oscillator assembly, the radiation oscillator comprises two positive electrode oscillator units, a positive electrode coupling area, two negative electrode oscillator units and a negative electrode coupling area, the positive electrode coupling area is connected with the two positive electrode oscillator units, the negative electrode coupling area is connected with the two negative electrode oscillator units, the positive electrode coupling area and the negative electrode coupling area intersect, and the positive electrode coupling area and the negative electrode coupling area intersect with each other. Each positive vibrator unit comprises a first vibrator part and a second vibrator part which are arranged from inside to outside along the diagonal line of the PCB and are connected with each other; the bonding pad comprises a feed bonding pad and a feed ground bonding pad; the copper foil layer is arranged on one side of the reverse side of the PCB; according to the high-frequency radiation unit disclosed by the invention, the integration level of a feed network is improved, and the miniaturization of the high-frequency radiation unit is realized while the frequency band bandwidth is ensured.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and in particular to a high-frequency radiation unit and oscillator assembly. Background Technology

[0002] With the development of the new generation of mobile communication 5G technology, the requirements for the integration and miniaturization of the oscillator assembly have also increased. In particular, in the PCB radiating unit of the existing oscillator assembly, when a frequency of 600MHz or higher is required, the area of ​​the substrate is relatively large, which will affect the assembly of the oscillator assembly. In addition, the PCB radiating unit currently mainly adopts the single-sided substrate copper-clad trace method, which has a relatively narrow frequency bandwidth.

[0003] It is evident that existing technologies still need improvement and enhancement. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a high-frequency radiation unit and an oscillator assembly to solve the problem that the existing oscillator assembly cannot meet the requirements of miniaturization and frequency band bandwidth limitation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-frequency radiating unit, comprising:

[0007] A PCB board, the PCB board comprising a substrate and two protective layers, the two protective layers respectively covering the front and back surfaces of the substrate;

[0008] A radiating oscillator is disposed on one side of the front of the PCB board. The radiating oscillator includes two positive pole oscillator units, a positive pole coupling region, two negative pole oscillator units, and a negative pole coupling region. The two positive pole oscillator units are arranged opposite each other along any diagonal direction of the PCB board. The positive pole coupling region connects the two positive pole oscillator units. The two negative pole oscillator units are arranged opposite each other along the other diagonal direction of the PCB board. The negative pole coupling region connects the two negative pole oscillator units. The positive pole coupling region and the negative pole coupling region intersect. The two positive pole oscillator units and the two negative pole oscillator units have the same structure. Each positive pole oscillator unit includes a first oscillator part and a second oscillator part arranged and connected from the inside to the outside along the diagonal of the PCB board.

[0009] The pads are located on the reverse side of the PCB board. The pads include power pads and ground pads. The power pads, the PCB board and the positive coupling area are respectively provided with a plurality of first through holes. The ground pads, the PCB board and the negative coupling area are respectively provided with a plurality of second through holes.

[0010] A copper foil layer is disposed on the reverse side of the PCB board.

[0011] As described above, in a high-frequency radiation unit, the first oscillator section includes an inner oscillator section and an outer oscillator section. Both the inner and outer oscillator sections are isosceles trapezoids in shape. The centerlines of both the inner and outer oscillator sections coincide with any diagonal of the PCB board. The lower bases of the inner and outer oscillator sections are of equal length and connected to each other. The height of the outer oscillator section is greater than the height of the inner oscillator section. The second oscillator section is rectangular in shape, and one side of the second oscillator section is of equal length to the upper base of the outer oscillator section and connected to each other.

[0012] In the high-frequency radiation unit described above, each of the positive electrode oscillator units has a third through hole in the middle, and the third through hole has an arc-shaped protrusion on the side near the positive electrode coupling region.

[0013] As described above, in a high-frequency radiation unit, the copper foil layer comprises two copper foil sheets arranged along the centerline of the positive electrode oscillator unit and the negative electrode oscillator unit on the same side.

[0014] As described above, in a high-frequency radiation unit, the positive electrode coupling region includes a first groove and a positive electrode feed plate. The first groove and the positive electrode feed plate are respectively disposed on opposite sides of the two positive electrode oscillator units. One end of the positive electrode feed plate is inserted into the first groove. A plurality of first through holes are arranged sequentially around the edge of the first groove. The positive electrode feed plate, the PCB board, and the feed pad are respectively provided with positive electrode soldering points.

[0015] As described above, in a high-frequency radiation unit, the negative electrode coupling region includes a second groove, a first negative electrode feed piece, and a second negative electrode feed piece. The second groove is disposed on one end of any negative electrode oscillator unit near the other negative electrode oscillator unit. The first negative electrode feed piece is disposed on the front side of the PCB board and inserted into the second groove. The second negative electrode feed piece is disposed on the back side of the PCB board. A plurality of second through holes are sequentially arranged around the edge of the second groove. The first negative electrode feed piece, the PCB board, and the ground pad are respectively provided with negative electrode soldering points. The first negative electrode feed piece, the PCB board, and the second negative electrode feed piece are respectively provided with fourth through holes. The second negative electrode feed piece, the PCB board, and the other negative electrode oscillator unit are respectively provided with fifth through holes.

[0016] The present invention also provides a transducer assembly, including a housing, a base, and a high-frequency radiation unit as described above, wherein the base is disposed inside the housing and the high-frequency radiation unit is mounted on the base.

[0017] Beneficial effects:

[0018] This utility model discloses a high-frequency radiating unit, including a PCB board, a radiating oscillator, solder pads, and a copper foil layer. The PCB board includes a substrate and two protective layers. The radiating oscillator is disposed on one side of the front of the PCB board. The radiating oscillator includes two positive pole oscillator units, a positive pole coupling region, two negative pole oscillator units, and a negative pole coupling region. The two positive pole oscillator units and the two negative pole oscillator units have identical structures. Each positive pole oscillator unit includes a first oscillator part and a second oscillator part arranged and connected from the inside to the outside along the diagonal of the PCB board. The oscillator section includes power feed pads and ground feed pads. A copper foil layer is disposed on the reverse side of the PCB board. The protective layer is a solder mask (green solder mask). The substrate provides mechanical support and electrical insulation. The protective layer prevents oxidation, mechanical damage, or environmental interference, shields against electromagnetic interference, and reduces frequency drift. Two positive oscillator units and the positive coupling region form a positive oscillator, and two negative oscillator units and the negative coupling region form a negative oscillator. The positive and negative oscillators form a specific electromagnetic field distribution, which is beneficial for signal transmission. The system transmits and receives signals, and the two positive and two negative pole units have identical structures. Each positive pole unit includes a first pole section and a second pole section arranged and connected from the inside to the outside along the diagonal of the PCB board. Since the wavelength of high-frequency signals is short, by arranging the first and second pole sections along the diagonal of the PCB board and adjusting the resonant frequency through physical length, the high-frequency radiating unit generates a fundamental resonance in the 3330-3800MHz frequency band. Simultaneously, the diagonally symmetrical layout enhances the high-frequency response. The directionality of the frequency signal is improved. Furthermore, the power feed pad corresponds to the positive electrode oscillator, and the ground feed pad 32 corresponds to the negative electrode oscillator. Electrical connection between the power feed pad and the positive electrode coupling region is achieved through the first through-hole, and electrical connection between the ground feed pad and the negative electrode coupling region is achieved through the second through-hole. This results in higher integration of the power feed. The copper foil layer adjusts the VSWR and intermodulation of the high-frequency radiation unit. This application discloses a high-frequency radiation unit that improves the integration of the power feed network, ensuring bandwidth while miniaturizing the high-frequency radiation unit. Attached Figure Description

[0019] Figure 1 A schematic diagram of the structure of the high-frequency radiation unit provided by this utility model;

[0020] Figure 2 Another structural schematic diagram of the high-frequency radiation unit provided by this utility model;

[0021] Figure 3 This is a schematic diagram of the oscillator assembly provided by this utility model;

[0022] Reference numerals: 1. PCB board; 11. Substrate; 12. Protective layer; 2. Radiating oscillator; 21. Positive oscillator unit; 211. First oscillator section; 212. Second oscillator section; 213. Inner oscillator section; 214. Outer oscillator section; 22. Positive coupling area; 221. First groove; 222. Positive feed plate; 223. Positive solder joint; 23. Negative oscillator unit; 24. Negative coupling area; 241. Negative coupling area; 242. First negative feed plate; 243. Second negative feed plate; 244. Negative solder joint; 245. Fourth through hole; 246. Fifth through hole; 25. Third through hole; 26. Arc-shaped protrusion; 3. Pad; 31. Feed pad; 32. Ground pad; 4. Copper foil layer; 5. First through hole; 6. Second through hole; 7. Outer shell; 8. Base. Detailed Implementation

[0023] This utility model provides a high-frequency radiation unit and an oscillator assembly. To make the purpose, technical solution and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments.

[0024] In the description of this utility model, it should be understood that the terms "top" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and should not be construed as limiting this utility model; in addition, the terms "installation" and "connection" should be interpreted broadly, and those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] like Figure 1-3 As shown in the figure, this application provides a high-frequency radiating element, comprising:

[0026] PCB board 1, the PCB board 1 includes a substrate 11 and two protective layers 12, the two protective layers 12 respectively covering the front and back surfaces of the substrate 11;

[0027] A radiating oscillator 2 is disposed on one side of the front side of the PCB board 1. The radiating oscillator 2 includes two positive pole oscillator units 21, a positive pole coupling region 22, two negative pole oscillator units 23, and a negative pole coupling region 24. The two positive pole oscillator units 21 are arranged opposite each other along any diagonal direction of the PCB board 1. The positive pole coupling region 22 connects the two positive pole oscillator units 21. The two negative pole oscillator units 23 are arranged opposite each other along the other diagonal direction of the PCB board 1. The negative pole coupling region 24 connects the two negative pole oscillator units 23. The positive pole coupling region 22 and the negative pole coupling region 24 intersect. The two positive pole oscillator units 21 and the two negative pole oscillator units 23 have the same structure. Each positive pole oscillator unit 21 includes a first oscillator part 211 and a second oscillator part 212 arranged and connected from the inside to the outside along the diagonal of the PCB board 1.

[0028] The pad 3 is located on the reverse side of the PCB board 1. The pad 3 includes a power supply pad 31 and a ground supply pad 32. The power supply pad 31, the PCB board 1 and the positive electrode coupling area 22 are respectively provided with a plurality of first through holes 5. The ground supply pad 32, the PCB board 1 and the negative electrode coupling area 24 are respectively provided with a plurality of second through holes 6.

[0029] Copper foil layer 4 is disposed on the reverse side of the PCB board 1.

[0030] This utility model discloses a high-frequency radiation unit, including a PCB board 1, a radiation vibrator 2, solder pads 3, and a copper foil layer 4. The PCB board 1 includes a substrate 11 and two protective layers 12. The radiation vibrator 2 is disposed on one side of the front of the PCB board 1. The radiation vibrator 2 includes two positive pole vibrator units 21, a positive pole coupling region 22, two negative pole vibrator units 23, and a negative pole coupling region 24. The two positive pole vibrator units 21 and the two negative pole vibrator units 23 have the same structure. Each positive pole vibrator unit 21 includes a first vibrator arranged and connected from the inside to the outside along the diagonal of the PCB board 1. The PCB board 1 has a sub-section 211 and a second oscillator section 212. The pads 3 include a power feed pad 31 and a ground feed pad 32. The copper foil layer 4 is disposed on the reverse side of the PCB board 1. The protective layer 12 is an solder mask layer. The substrate 11 provides mechanical support and electrical insulation. The protective layer 12 prevents oxidation, mechanical damage, or environmental interference, shields electromagnetic interference, and reduces frequency drift. Two positive oscillator units 21 and the positive coupling region 22 form a positive oscillator. Two negative oscillator units 23 and the negative coupling region 24 form a negative oscillator. The positive and negative oscillators form a specific... The electromagnetic field distribution is conducive to signal transmission and reception. Furthermore, the two positive pole oscillator units 21 and the two negative pole oscillator units 23 have identical structures. Each positive pole oscillator unit 21 includes a first oscillator section 211 and a second oscillator section 212 arranged and connected from the inside to the outside along the diagonal of the PCB board 1. Since the wavelength of high-frequency signals is short, by arranging the first oscillator section 211 and the second oscillator section 212 along the diagonal of the PCB board 1, the resonant frequency is adjusted by extending the physical length, so that the high-frequency radiation unit generates a fundamental resonance in the frequency band of 3330-3800MHz. Simultaneously, the diagonal... The linearly symmetrical layout enhances the directivity of high-frequency signals. Furthermore, the power feed pad 31 corresponds to the positive electrode oscillator, and the ground feed pad 32 corresponds to the negative electrode oscillator. The first through-hole 5 enables electrical connection between the power feed pad 31 and the positive electrode coupling region 22, while the second through-hole 6 enables electrical connection between the ground feed pad 32 and the negative electrode coupling region 24. This results in higher integration of the power feed. The copper foil layer 4 adjusts the VSWR and intermodulation of the high-frequency radiation unit. This application discloses a high-frequency radiation unit that improves the integration of the power feed network, ensuring bandwidth while miniaturizing the high-frequency radiation unit.

[0031] The first oscillator section 211 includes an inner oscillator section 213 and an outer oscillator section 214. Both the inner oscillator section 213 and the outer oscillator section 214 are isosceles trapezoids. The centerlines of both the inner oscillator section 213 and the outer oscillator section 214 coincide with any diagonal of the PCB board 1. The lower bases of the inner oscillator section 213 and the outer oscillator section 214 are of equal length and connected to each other. The height of the outer oscillator section 214 is greater than the height of the inner oscillator section 213. The second oscillator section 212 is rectangular in shape. One side of the second oscillator section 212 is of equal length to the upper base of the outer oscillator section 214 and connected to it. The inner oscillator section... The outer oscillator 213 and the inner oscillator 214 are configured as isosceles trapezoids with their centerlines coinciding with their diagonals to adjust the inductance and capacitance parameters of the high-frequency radiation unit, thereby affecting the resonant frequency. The height of the outer oscillator 214 is greater than that of the inner oscillator 213 to optimize the current distribution and adapt to the wavelength requirements of the high-frequency band. In addition, the second oscillator 212 is connected to the upper base of the outer oscillator 214 to expand the radiation area of ​​the high-frequency radiation unit and change the distribution characteristics of the radiation field. Combined with the rectangular structure, it can reduce impedance abrupt changes at high frequencies and optimize signal transmission. It has the advantages of accurate resonant frequency, wide operating bandwidth, and high radiation efficiency.

[0032] Each of the positive pole oscillator units 21 is provided with a third through hole 25 in the middle. The third through hole 25 is provided with an arc-shaped protrusion 26 on the side near the positive pole coupling region 22. This reduces the area of ​​the positive pole oscillator unit 21 and the negative pole oscillator unit 23 to adjust the standing wave, so that the high-frequency radiation unit has better matching performance in the high-frequency band, reduces signal reflection, and further improves radiation efficiency.

[0033] The copper foil layer 4 includes two copper foil sheets, which are arranged along the center line of the positive pole oscillator unit 21 and the negative pole oscillator unit 23 on the same side. This can reduce electromagnetic interference of high-frequency signals and improve signal purity. At the same time, it may help adjust the electromagnetic field distribution of the high-frequency radiation unit, making the radiation directionality of the high-frequency radiation unit better in the high-frequency band.

[0034] The positive coupling region 22 includes a first groove 221 and a positive feed plate 222. The first groove 221 and the positive feed plate 222 are respectively disposed on opposite sides of the two positive oscillator units 21. One end of the positive feed plate 222 is inserted into the first groove 221. A plurality of first through holes 5 are arranged sequentially around the edge of the first groove 221. The positive feed plate 222, the PCB board 1 and the feed pad 31 are respectively provided with positive solder points 223. The positive solder points 223 realize the electrical connection between the positive feed plate 222 and the feed pad 31. The plurality of first through holes 5 realize the electrical connection between the feed pad 31 and any of the positive oscillator units 21, thereby improving the reliability and stability of the positive signal transmission in the high frequency band and ensuring the normal operation of the high frequency radiation unit.

[0035] The negative electrode coupling region 24 includes a second groove 241, a first negative electrode feed piece 242, and a second negative electrode feed piece 243. The second groove 241 is disposed on one end of any negative electrode oscillator unit 23 near the other negative electrode oscillator unit 23. The first negative electrode feed piece 242 is disposed on the front side of the PCB board 1 and inserted into the second groove 241. The second negative electrode feed piece 243 is disposed on the back side of the PCB board 1. A plurality of second through holes 6 are sequentially arranged around the edge of the second groove 241. The first negative electrode feed piece 242, the PCB board 1, and the ground pad 32 are respectively provided with negative electrode soldering points 244. The first negative electrode feed piece 242, the PCB board 1, and the second negative electrode feed piece 243 are respectively provided with fourth through holes 245. The second negative electrode feed piece 243, the PCB board 1, and the ground pad 32 are respectively provided with fourth through holes 245. Another negative electrode oscillator unit 23 is provided with a fifth through hole 246. The electrical connection between the ground pad 32 and any of the negative electrode oscillator units 23 is realized through multiple second through holes 6. The negative electrode solder point 244 realizes the electrical connection between the first negative electrode feed piece 242 and the ground pad 32. The fourth through hole 245 realizes the electrical connection between the first negative electrode feed piece 242 and the second negative electrode feed piece 243. The fifth through hole 246 realizes the electrical connection between the second negative electrode feed piece 243 and another negative electrode oscillator unit 23. That is, by setting the second negative electrode feed piece 243 on the reverse side of the PCB board 1, the coupling areas of the positive electrode coupling area 22 and the negative electrode coupling area 24 intersect only, avoiding the coupling of too much area between the positive electrode oscillator and the negative electrode oscillator, which would affect the frequency, thus ensuring the performance of the high-frequency radiation unit.

[0036] This utility model also provides a corresponding oscillator assembly, including a housing 7, a base 8, and a high-frequency radiation unit as described above. The base 8 is disposed inside the housing 7, and the high-frequency radiation unit is mounted on the base 8. The housing 7 and the base 8 provide mechanical support and protection for the high-frequency radiation unit, ensuring that the high-frequency radiation unit can stably perform its high-frequency radiation function and improving the overall reliability and practicality.

[0037] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of this utility model, and all such substitutions or changes should fall within the protection scope of this utility model.

Claims

1. A high frequency radiation unit, characterized by include: PCB board (1), the PCB board (1) includes a substrate (11) and two protective layers (12), the two protective layers (12) respectively cover the front and back surfaces of the substrate (11); A radiating oscillator (2) is disposed on one side of the front of the PCB board (1). The radiating oscillator (2) includes two positive pole oscillator units (21), a positive pole coupling region (22), two negative pole oscillator units (23), and a negative pole coupling region (24). The two positive pole oscillator units (21) are arranged opposite each other along any diagonal direction of the PCB board (1). The positive pole coupling region (22) connects the two positive pole oscillator units (21), and the two negative pole oscillator units (23) are arranged opposite each other along any diagonal direction of the PCB board (1). The PCB board (1) is arranged opposite to each other along its other diagonal direction. The negative electrode coupling area (24) connects two negative electrode oscillator units (23). The positive electrode coupling area (22) intersects with the negative electrode coupling area (24). The two positive electrode oscillator units (21) and the two negative electrode oscillator units (23) have the same structure. Each positive electrode oscillator unit (21) includes a first oscillator part (211) and a second oscillator part (212) arranged and connected from the inside to the outside along the diagonal of the PCB board (1). The pad (3) is located on the reverse side of the PCB board (1). The pad (3) includes a power supply pad (31) and a ground supply pad (32). The power supply pad (31), the PCB board (1) and the positive electrode coupling area (22) are respectively provided with a plurality of first through holes (5). The ground supply pad (32), the PCB board (1) and the negative electrode coupling area (24) are respectively provided with a plurality of second through holes (6). A copper foil layer (4) is disposed on the reverse side of the PCB board (1).

2. A high frequency radiating element according to claim 1, characterised in that, The first oscillator (211) includes an inner oscillator (213) and an outer oscillator (214). Both the inner oscillator (213) and the outer oscillator (214) are isosceles trapezoids. The centerlines of the inner oscillator (213) and the outer oscillator (214) coincide with any diagonal of the PCB board (1). The lower bases of the inner oscillator (213) and the outer oscillator (214) are of equal length and connected to each other. The height of the outer oscillator (214) is greater than the height of the inner oscillator (213). The second oscillator (212) is rectangular in shape. One side of the second oscillator (212) is of equal length to the upper base of the outer oscillator (214) and connected to each other.

3. A high frequency radiating element according to claim 2, characterised in that, Each of the positive pole oscillator units (21) has a third through hole (25) in the middle, and the third through hole (25) has an arc-shaped protrusion (26) on the side near the positive pole coupling region (22).

4. A high-frequency radiation unit according to claim 1, characterized in that, The copper foil layer (4) includes two copper foil sheets, which are arranged along the center line of the positive pole oscillator unit (21) and the negative pole oscillator unit (23) on the same side.

5. A high frequency radiating element according to claim 1, characterised in that, The positive coupling region (22) includes a first groove (221) and a positive feed plate (222). The first groove (221) and the positive feed plate (222) are respectively disposed on opposite sides of the two positive oscillator units (21). One end of the positive feed plate (222) is inserted into the first groove (221). A plurality of first through holes (5) are arranged around the edge of the first groove (221) in sequence. The positive feed plate (222), the PCB board (1) and the feed pad (31) are respectively provided with positive solder points (223).

6. A high frequency radiating element according to claim 1, characterised in that, The negative electrode coupling region (24) includes a second groove (241), a first negative electrode feed piece (242), and a second negative electrode feed piece (243). The second groove (241) is located on one end of any negative electrode oscillator unit (23) near the other negative electrode oscillator unit (23). The first negative electrode feed piece (242) is located on the front side of the PCB board (1) and inserted into the second groove (241). The second negative electrode feed piece (243) is located on the back side of the PCB board (1). Multiple second through holes are also present. (6) The first negative electrode feed piece (242), the PCB board (1) and the ground pad (32) are arranged around the edge of the second groove (241) in sequence, and the negative electrode welding point (244) is provided for the first negative electrode feed piece (242), the PCB board (1) and the second negative electrode feed piece (243) are provided for the fourth through hole (245), and the second negative electrode feed piece (243), the PCB board (1) and the other negative electrode oscillator unit (23) are provided for the fifth through hole (246).

7. A transducer assembly, comprising: It includes a housing (7), a base (8), and a high-frequency radiation unit as described in any one of claims 1-6, wherein the base (8) is disposed inside the housing (7), and the high-frequency radiation unit is mounted on the base (8).

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