Gateway equipment for Internet of Things

Abstract

The utility model provides gateway equipment for the Internet of Things, and belongs to the technical field of gateway equipment. The gateway equipment for the Internet of Things comprises a gateway equipment host, a bottom heat dissipation part and a flow guide housing. The heat conducting plate is fixed at the bottom of the gateway equipment host, the plurality of cooling fins are arranged along the direction of a flow guide hole of the gateway equipment host, the cooling fan is arranged at the bottom of the cooling fins, the bottom cover plate is sleeved outside the cooling fan, the bottom cover plate covers the bottom of the cooling fins, and the supporting leg pieces are arranged at two sides of the bottom of the cooling fins. And the fairing is arranged at one end of the gateway equipment host and is matched with the end part of the cooling fin. When the gateway equipment host is cooled, negative pressure is also generated in the flow guide housing, external air flows into the gateway equipment host from the heat dissipation holes in one end of the gateway equipment host, then enters the flow guide housing through the heat dissipation holes in the other end of the gateway equipment host, and is finally discharged by the heat dissipation fan, so that the cooling efficiency of the gateway equipment host can be further improved.

Description

Technical Field

[0001] This utility model relates to the field of gateway devices, and more specifically, to a gateway device for the Internet of Things. Background Technology

[0002] Gateways are an important component in network communication. As a bridge between different networks or systems, they are responsible for protocol conversion, data forwarding, and security control, ensuring seamless interaction between different networks or systems.

[0003] Current gateway devices are designed to be compact and efficient, occupying minimal space and making relocation and installation easier. The most common heat dissipation method for current gateway devices is through ventilation holes, which, combined with thermal fins, can improve heat dissipation performance. However, the heat dissipation effect is relatively limited. During prolonged use, if the external ambient temperature is high, the internal components of the gateway device may overheat, leading to malfunctions. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a gateway device for the Internet of Things, which aims to improve the relatively poor heat dissipation effect of existing gateway devices. During long-term use, if the external ambient temperature is high, the internal components of the network management device may become too hot, causing the device to malfunction.

[0005] This utility model is implemented as follows:

[0006] This utility model provides a gateway device for the Internet of Things, including a gateway device host, a bottom heat dissipation part, and a flow guide cover.

[0007] The bottom heat dissipation part includes a heat conduction plate, heat sink, bottom cover plate, cooling fan and support legs. The heat conduction plate is fixed to the bottom of the gateway device host. Multiple heat sinks are arranged along the direction of the air guide holes of the gateway device host. The cooling fan is installed at the bottom of the heat sink. The bottom cover plate is sleeved on the outside of the cooling fan and covers the bottom of the heat sink. The support legs are arranged on both sides of the bottom of the heat sink.

[0008] The airflow guide cover is installed at one end of the gateway device host and mates with the end of the heat sink.

[0009] In one embodiment of the present invention, the bottom heat dissipation portion further includes a side cover plate, which is disposed at the end of the heat sink away from the airflow guide cover.

[0010] In one embodiment of the present invention, the support leg includes a support plate and a support leg, the support leg being disposed at the bottom end of the support plate, and the top of the support plate being connected to a heat sink.

[0011] In one embodiment of the present invention, the support leg further includes an anti-slip sleeve, which is disposed at the bottom of the support leg.

[0012] In one embodiment of the present invention, the bottom heat dissipation portion further includes a first protective mesh, which is disposed at the bottom of the heat dissipation fan.

[0013] In one embodiment of this utility model, an exhaust fan is installed inside the air guide cover, and a fixing bracket is provided on the side of the exhaust fan and fixedly connected to the inner wall of the air guide cover.

[0014] In one embodiment of this utility model, a second protective net is provided on the side of the exhaust fan near the gateway device host.

[0015] In one embodiment of this utility model, the bottom of the bottom cover plate is provided with a groove, and the top of the cooling fan is connected to the groove.

[0016] The beneficial effects of this invention are as follows: The IoT gateway device obtained through the above design utilizes a cooling fan that rapidly circulates air within the cavity formed by the heat-conducting plate, heat sink, and bottom cover, allowing for rapid heat dissipation from the heat sink and improving the cooling effect of the gateway device host. During cooling fan operation, a negative pressure is also generated inside the airflow guide casing. External air flows into the gateway device host from one end of the heat dissipation hole, then enters the airflow guide casing through the heat dissipation hole at the other end, and is finally exhausted by the cooling fan, further improving the cooling efficiency of the gateway device host. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the IoT gateway device structure provided in this embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the bottom heat dissipation section provided for an embodiment of this utility model;

[0020] Figure 3 A schematic diagram of the support leg structure provided for an embodiment of this utility model;

[0021] Figure 4 A schematic diagram of the internal structure of the flow guide cover provided for an embodiment of this utility model.

[0022] In the diagram: 10 - Gateway device host; 20 - Bottom heat dissipation section; 210 - Heat conduction plate; 220 - Heat sink; 230 - Bottom cover plate; 240 - Cooling fan; 250 - Support leg; 251 - Support plate; 252 - Support leg; 253 - Anti-slip sleeve; 260 - Side cover plate; 270 - First protective mesh; 30 - Air guide cover; 310 - Exhaust fan; 320 - Fixing bracket; 330 - Second protective mesh. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0024] Example

[0025] Please see Figures 1-4 This utility model provides a gateway device for the Internet of Things, including a gateway device host 10, a bottom heat dissipation part 20, and a flow guide cover 30.

[0026] The heat generated by the gateway device host 10 can be quickly dissipated through the cooperation of the bottom heat dissipation part 20 and the air guide cover 30, so that the gateway device host 10 can have a good cooling effect and ensure that the gateway device host 10 can maintain a good operating condition during continuous operation.

[0027] The bottom heat dissipation section 20 includes a heat-conducting plate 210, heat sinks 220, a bottom cover plate 230, a cooling fan 240, and support legs 250. The heat-conducting plate 210 is fixed to the bottom of the gateway device host 10, and the multiple heat sinks 220 are arranged along the direction of the airflow holes of the gateway device host 10. The cooling fan 240 is installed at the bottom of the heat sink 220, and the bottom cover plate 230 is fitted over the cooling fan 240 and covers the bottom of the heat sink 220. The support legs 250 are arranged on both sides of the bottom of the heat sink 220. The airflow guide cover 30 is installed at one end of the gateway device host 10 and mates with the end of the heat sink 220.

[0028] The heat generated by the gateway device host 10 is conducted through the bottom heat conduction plate 210 to the heat sink 220 and quickly dissipated into the air. Simultaneously, the cooling fan 240 operates, creating rapid airflow within the cavity formed by the heat conduction plate 210, heat sink 220, and bottom cover 230, thus rapidly dissipating heat from the heat sink 220 and improving the cooling effect of the gateway device host 10. Furthermore, when the cooling fan 240 is running, a negative pressure is generated inside the airflow guide shroud 30. External air flows into the gateway device host 10 through the ventilation holes at one end, then enters the airflow guide shroud 30 through the ventilation holes at the other end, and is finally exhausted by the cooling fan 240, further improving the cooling efficiency of the gateway device host 10.

[0029] In a specific configuration, the bottom heat dissipation section 20 also includes a side cover plate 260, which is located at the end of the heat sink 220 away from the airflow guide cover 30. The side cover plate 260 seals one end of the cavity enclosed by the heat conduction plate 210, the heat sink 220, and the bottom cover plate 230. External air can only enter through the vent at one end of the gateway device host 10 and exit through the vent at the other end into the airflow guide cover 30, increasing the airflow and further improving the cooling effect of the gateway device.

[0030] Furthermore, the support leg 250 includes a support plate 251 and a support leg 252. The support leg 252 is disposed at the bottom end of the support plate 251, and the top of the support plate 251 is connected to the heat sink 220. The support leg 250 also includes an anti-slip sleeve 253, which is disposed at the bottom of the support leg 252. The anti-slip sleeve 253 can be a rubber sleeve with good anti-slip performance, used to prevent slipping and support the gateway device host 10.

[0031] Specifically, the bottom heat dissipation part 20 also includes a first protective mesh 270, which is located at the bottom of the cooling fan 240.

[0032] In the above specific embodiment, an exhaust fan 310 is installed inside the airflow guide housing 30, and a fixing bracket 320 is provided on the side of the exhaust fan 310 and fixedly connected to the inner wall of the airflow guide housing 30. A second protective net 330 is provided on the side of the exhaust fan 310 near the gateway device host 10. The installation of the exhaust fan 310 can increase the negative pressure state inside the airflow guide housing 30, that is, further increase the amount of air circulating inside the gateway device host 10, and further improve the cooling effect.

[0033] Furthermore, the bottom of the bottom cover plate 230 is provided with a slot, and the top of the cooling fan 240 is connected to the slot.

[0034] It should be noted that the specific models and specifications of the cooling fan 240 and exhaust fan 310 need to be selected and determined based on the actual specifications of the device. The specific selection calculation method adopts existing technology in this field, so it will not be described in detail here. The power supply and principle of the cooling fan 240 and exhaust fan 310 are clear to those skilled in the art, and will not be described in detail here.

[0035] The working principle of this IoT gateway device is as follows: During use, the heat generated by the gateway device host 10 is conducted through the bottom heat-conducting plate 210 to the heat sink 220 and quickly dissipated into the air. Simultaneously, the cooling fan 240 operates, creating rapid airflow within the cavity formed by the heat-conducting plate 210, heat sink 220, and bottom cover 230, thus rapidly dissipating heat from the heat sink 220 and improving the cooling effect of the gateway device host 10. Furthermore, when the cooling fan 240 is running, a negative pressure is generated inside the airflow guide cover 30. External air flows into the gateway device host 10 through the ventilation holes at one end, then enters the airflow guide cover 30 through the ventilation holes at the other end, and is finally exhausted by the cooling fan 240, further improving the cooling efficiency of the gateway device host 10.

[0036] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A gateway device for Internet of Things, characterized by, include The gateway device host (10) and the bottom heat dissipation part (20) include a heat conduction plate (210), a heat sink (220), a bottom cover plate (230), a heat dissipation fan (240) and support legs (250). The heat conduction plate (210) is fixed to the bottom of the gateway device host (10). Multiple heat sinks (220) are arranged along the direction of the air guide holes of the gateway device host (10). The heat dissipation fan (240) is installed at the bottom of the heat sink (220). The bottom cover plate (230) is sleeved on the outside of the heat dissipation fan (240) and covers the bottom of the heat sink (220). The support legs (250) are arranged on both sides of the bottom of the heat sink (220). A flow guide cover (30) is installed at one end of the gateway device host (10) and engages with the end of the heat sink (220).

2. The gateway device for Internet of Things according to claim 1, wherein The bottom heat dissipation part (20) also includes a side cover plate (260), which is disposed at the end of the heat sink (220) away from the flow guide cover (30).

3. The gateway device for Internet of Things as claimed in claim 1 wherein, The support leg (250) includes a support plate (251) and a support leg (252). The support leg (252) is disposed at the bottom end of the support plate (251), and the top of the support plate (251) is connected to the heat sink (220).

4. The gateway device for Internet of Things according to claim 3, wherein The support leg (250) also includes an anti-slip sleeve (253), which is disposed at the bottom of the support leg (252).

5. The gateway device for Internet of Things as claimed in claim 1 wherein, The bottom heat dissipation part (20) also includes a first protective mesh (270), which is disposed at the bottom of the heat dissipation fan (240).

6. The gateway device for Internet of Things according to claim 1, wherein An exhaust fan (310) is installed inside the air guide cover (30), and a fixing bracket (320) is provided on the side of the exhaust fan (310) and fixedly connected to the inner wall of the air guide cover (30).

7. The gateway device for Internet of Things according to claim 6, wherein The exhaust fan (310) is provided with a second protective net (330) on the side near the gateway device host (10).

8. A gateway device for the Internet of Things according to claim 1, characterized in that, The bottom cover plate (230) has a slot at its bottom, and the top of the cooling fan (240) is connected to the slot.

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